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CN2681354Y - A highly effective white light LED structure - Google Patents

A highly effective white light LED structure Download PDF

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Publication number
CN2681354Y
CN2681354Y CNU2003201172445U CN200320117244U CN2681354Y CN 2681354 Y CN2681354 Y CN 2681354Y CN U2003201172445 U CNU2003201172445 U CN U2003201172445U CN 200320117244 U CN200320117244 U CN 200320117244U CN 2681354 Y CN2681354 Y CN 2681354Y
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lead frame
white light
led
layer
led structure
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宋文洲
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SHENZHEN LONGGANG DISTRICT HENGGANG GUANGTAI ELECTRONICS PLANT
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SHENZHEN LONGGANG DISTRICT HENGGANG GUANGTAI ELECTRONICS PLANT
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Abstract

一种高效白光LED结构,涉及高亮度发白光LED结构技术,本技术包括导线架,设有开口的封装腔并置于导线架上的LED封装外壳,设于封装腔内的LED元件,将LED封住的荧光粉层及环氧树脂层,还有与LED元件相接的引出导线;所述的LED元件与荧光粉层之间设有一层由扩散粉组成的扩散层;LED元件、扩散粉层、荧光粉层及环氧树脂层依次设于导线架上。本技术结构简单,亮度高。

A high-efficiency white light LED structure, which relates to high-brightness white light emitting LED structure technology, the technology includes a lead frame, a packaging cavity with an opening and an LED package shell placed on the lead frame, an LED element located in the package cavity, and an LED The sealed phosphor layer and epoxy resin layer, and the lead-out wires connected to the LED element; a diffusion layer composed of diffusion powder is arranged between the LED element and the phosphor layer; the LED element, the diffusion powder layer, fluorescent powder layer and epoxy resin layer are sequentially arranged on the lead frame. The technology has simple structure and high brightness.

Description

一种高效白光LED结构A high-efficiency white LED structure

技术领域technical field

本实用新型涉及LED结构,特别涉及高亮度发白光LED结构。The utility model relates to an LED structure, in particular to a high-brightness white light-emitting LED structure.

背景技术Background technique

发光二极管已是常用器件,有各种颜色,多做为指示发光器件使用,随着环保及节能要求,作为高效率的发光二极管的用途越来越受人们的重视,特别是作为具有照明作用的发光二极管,更是非常重要的。现有技术中白光LED的结构有:一种光将红、绿、蓝三色光混光成为白光;另一种是在封装蓝光LED时在环氧树脂里加入荧光粉,高亮度的蓝光LED激发荧光粉放射出黄光,利用蓝光与黄光为互补色光,混光成为高亮度白光LED。还有一种是利用紫外光源直接激发荧光材料,使其发出荧光,再借此荧光激发其它荧光材料,亦使其发出荧光,并调配前述荧光材料的混合比例,使其得到白光。以上这些结构相对来说荧光粉沉淀于LED封装装置时不够均匀,从而导致了高亮度蓝光LED激发荧光粉形成黄光后混光成高亮度白光LED的时候常会有杂色和光圈的情形,白光的均匀性不够。Light-emitting diodes are commonly used devices, with various colors, and are mostly used as indicating light-emitting devices. With the requirements of environmental protection and energy saving, people pay more and more attention to the use of high-efficiency light-emitting diodes, especially as lighting devices. Light-emitting diodes are even more important. The structure of the white light LED in the prior art is as follows: one kind of light mixes red, green and blue light into white light; Phosphor powder emits yellow light, using blue light and yellow light as complementary color light, the mixed light becomes high-brightness white light LED. Another method is to use ultraviolet light source to directly excite fluorescent materials to make them emit fluorescence, and then use this fluorescence to excite other fluorescent materials to make them emit fluorescence, and adjust the mixing ratio of the above-mentioned fluorescent materials to obtain white light. The above structures are relatively uneven when the phosphor powder is deposited on the LED packaging device, which leads to the phenomenon of variegated colors and apertures when the high-brightness blue LED excites the phosphor powder to form yellow light and then mixes the light into a high-brightness white LED. uniformity is not enough.

技术内容technical content

本实用新型目的是针对现有技术的不足设计一种结构简单,可在高亮度蓝光LED激发黄光后混光成高亮度白光的LED结构。The purpose of the utility model is to design an LED structure which is simple in structure and can mix the light into high-brightness white light after the high-brightness blue LED excites the yellow light.

本实用新型的目的可通过以下技术方案实现,The purpose of this utility model can be realized through the following technical solutions,

一种高效白光LED结构,包括导线架,设有开口的封装腔并置于导线架上的LED封装外壳,设于封装腔内的LED元件,将LED封住的荧光粉层及环氧树脂层,还有与LED元件相接的引出导线;所述的LED元件与荧光粉层之间设有一层由扩散粉组成的扩散层;LED元件、扩散粉层、荧光粉层、及环氧树脂层依次设于导线架上。A high-efficiency white light LED structure, comprising a lead frame, a package cavity provided with an opening and an LED package shell placed on the lead frame, an LED element arranged in the package cavity, a phosphor layer and an epoxy resin layer for sealing the LED , there is also a lead wire connected to the LED element; a diffusion layer composed of diffusion powder is provided between the LED element and the phosphor layer; the LED element, the diffusion powder layer, the phosphor layer, and the epoxy resin layer Set on the lead frame in turn.

高效白光LED结构的导线架上可设有封装外壳,封装外壳中设有封装腔,所述LED元件、扩散粉层、荧光粉层及环氧树脂层依次设于封装腔内。The lead frame of the high-efficiency white light LED structure can be provided with an encapsulation shell, and the encapsulation shell is provided with an encapsulation cavity, and the LED element, the diffusion powder layer, the fluorescent powder layer and the epoxy resin layer are sequentially arranged in the encapsulation cavity.

高效白光LED结构中所述设于封装外壳中的封装腔为圆柱形、方形、喇叭口形或不规则形结构。In the structure of the high-efficiency white light LED, the encapsulation cavity provided in the encapsulation shell is cylindrical, square, trumpet-shaped or irregular.

高效白光LED结构中所述的扩散粉为二氧化矽或氧化矽,扩散粉层与荧光粉层之间互有掺杂。其形成方法是将荧光粉与扩散粉混合静置,由于比重不同自然形成扩散粉下,荧光粉上,中间之间有掺杂的层状结构。The diffusion powder mentioned in the high-efficiency white LED structure is silicon dioxide or silicon oxide, and the diffusion powder layer and the phosphor layer are doped with each other. The formation method is to mix the fluorescent powder and the diffusing powder and let it stand. Due to the difference in specific gravity, a doped layered structure is naturally formed between the bottom of the diffusing powder, the top of the phosphor, and the middle.

高效白光LED结构中所述与LED相接的引出导线与设于导线架外部的导电片相接。In the high-efficiency white light LED structure, the lead-out wire connected to the LED is connected to the conductive sheet arranged outside the lead frame.

高效白光LED结构中所述导电片设于导线架的底部或侧面,可以平贴于导线架的外部,也可以垂直于导线架外部为插脚状。In the high-efficiency white LED structure, the conductive sheet is arranged on the bottom or side of the lead frame, and can be flatly attached to the outside of the lead frame, or can be perpendicular to the outside of the lead frame in the shape of a pin.

本实用新型技术进步在于,结构简单,白光色泽均匀,亮度高,可用于照明使用。The technical progress of the utility model lies in that the structure is simple, the white light has uniform color and luster, and the brightness is high, and it can be used for lighting.

附图说明Description of drawings

图1为现有技术结构示意图;Fig. 1 is a schematic structural diagram of the prior art;

图2为本实用新型结构示意图;Fig. 2 is a structural representation of the utility model;

具体实施方法Specific implementation method

一种高效白光LED结构,包括导线架8,设有开口的封装腔30并置于导线架上的LED封装外壳3,设于封装腔30内的LED元件1,将LED封住的荧光粉层7及环氧树脂层4及与LED元件1相接的引出导线6。特别之处在于,所述的LED元件1与荧光粉层7之间设有一层由扩散粉组成的扩散层5。LED元件1、扩散粉层5、荧光粉层7及环氧树脂层4设于导线架1上,这种方式发光面积较大。A high-efficiency white LED structure, comprising a lead frame 8, a package cavity 30 with an opening and an LED package shell 3 placed on the lead frame, an LED element 1 arranged in the package cavity 30, and a phosphor layer for sealing the LED 7 and the epoxy resin layer 4 and the lead wire 6 connected with the LED element 1 . What is special is that a diffusion layer 5 composed of diffusion powder is provided between the LED element 1 and the phosphor layer 7 . The LED element 1, the diffusion powder layer 5, the fluorescent powder layer 7 and the epoxy resin layer 4 are arranged on the lead frame 1, and the luminous area is larger in this way.

高效白光LED结构还可以是,在导线架8上设有封装外壳3,封装外壳中设有封装腔30,所述LED元件1、扩散粉层5、荧光粉层7及环氧树脂层4依次设于封装腔30内。封装腔可为圆柱形结构,喇叭口形结构,方形结构或不规则形状的任何结构。为便于插接或压接,高效白光LED结构,所述与LED相接的引出导线与设于导线架外部的导电片9相接。导电片设于导线架8的底部或侧面。The high-efficiency white light LED structure can also be that an encapsulation shell 3 is provided on the lead frame 8, and an encapsulation cavity 30 is arranged in the encapsulation shell, and the LED element 1, the diffusion powder layer 5, the phosphor layer 7 and the epoxy resin layer 4 are sequentially Set in the package cavity 30 . The package cavity can be a cylindrical structure, a trumpet-shaped structure, a square structure or any structure with an irregular shape. In order to facilitate insertion or crimping, the high-efficiency white light LED structure, the lead-out wire connected to the LED is connected to the conductive sheet 9 provided outside the lead frame. The conductive sheet is disposed on the bottom or side of the lead frame 8 .

Claims (9)

1、一种高效白光LED结构,包括导线架,设有开口的封装腔并置于导线架上的LED封装外壳,设于封装腔内的LED元件,将LED封住的荧光粉层及环氧树脂层,还有与LED元件相接的引出导线;其特征在于,所述的LED元件与荧光粉层之间设有一层由扩散粉组成的扩散层;LED元件、扩散粉层、荧光粉层、及环氧树脂层依次设于导线架上。1. A high-efficiency white light LED structure, comprising a lead frame, a package cavity with an opening and an LED package shell placed on the lead frame, an LED element located in the package cavity, a phosphor layer for sealing the LED, and epoxy resin. Resin layer, also has the lead-out lead that connects with LED element; It is characterized in that, be provided with a layer of diffusion layer that is made up of diffusion powder between described LED element and phosphor layer; LED element, diffusion powder layer, phosphor layer , and the epoxy resin layer are sequentially arranged on the lead frame. 2、根据权利要求1所述的一种高效白光LED结构,其特征在于,导线架上设有封装外壳,封装外壳中设有封装腔,所述LED元件、荧光粉层及环氧树脂层依次设于封装腔内。2. A high-efficiency white light LED structure according to claim 1, characterized in that an encapsulation shell is provided on the lead frame, and an encapsulation cavity is provided in the encapsulation shell, and the LED element, phosphor layer and epoxy resin layer are sequentially located in the package cavity. 3、根据权利要求1所述的一种高效白光LED结构,其特征在于,所述设于封装封装腔内的扩散粉层及荧光粉层之间有相互掺杂。3. A high-efficiency white light LED structure according to claim 1, characterized in that the diffusion powder layer and the phosphor layer disposed in the packaging cavity are doped with each other. 4、根据权利要求2所述的一种高效白光LED结构,其特征在于,所述设于封装外壳中的封装腔为圆柱形或喇叭口形或方形或不规则形结构。4. A high-efficiency white light LED structure according to claim 2, characterized in that, the package cavity provided in the package shell is a cylindrical or trumpet-shaped or square or irregular structure. 5、根据权利要求2所述的一种高效白光LED结构,其特征在于,所述设于封装外壳中的扩散粉层为二氧化矽或氧化矽。5. A high-efficiency white light LED structure according to claim 2, characterized in that, the diffusion powder layer provided in the packaging shell is silicon dioxide or silicon oxide. 6、根据权利要求1所述的一种高效白光LED结构,其特征在于,所述与LED相接的引出导线与设于导线架外部的导电片相接。6. A high-efficiency white light LED structure according to claim 1, characterized in that the lead-out wire connected to the LED is connected to the conductive sheet provided outside the lead frame. 7、根据权利要求7所述的一种高效白光LED结构,其特征在于,所述导电片设于导线架的底部或侧面。7. A high-efficiency white LED structure according to claim 7, wherein the conductive sheet is arranged on the bottom or side of the lead frame. 8、根据权利要求7所述的一种高效白光LED结构,其特征在于,所述设于导线架外部的导电片平贴于导线架外部。8. A high-efficiency white light LED structure according to claim 7, wherein the conductive sheet arranged outside the lead frame is flatly attached to the outside of the lead frame. 9、根据权利要求7所述的一种高效白光LED结构,其特征在于,所述设于导线架外部的导电片垂直于导线架外部,为插脚状。9. A high-efficiency white light LED structure according to claim 7, characterized in that, the conductive sheet arranged on the outside of the lead frame is perpendicular to the outside of the lead frame and is pin-shaped.
CNU2003201172445U 2003-10-22 2003-10-22 A highly effective white light LED structure Expired - Lifetime CN2681354Y (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100497476C (en) * 2006-07-12 2009-06-10 李学霖 Organic fluorescent resin for white light LED
CN102064244A (en) * 2010-11-09 2011-05-18 杭州杭科光电有限公司 Layered encapsulating method of high-power LED (Light-Emitting Diode)
CN102194983A (en) * 2011-04-26 2011-09-21 深圳市瑞丰光电子股份有限公司 Surface mounting light-emitting diode (LED) with high sealing property and production method thereof
CN102593115A (en) * 2012-03-15 2012-07-18 深圳市丽晶光电科技股份有限公司 LED surface-mounted device and manufacturing method thereof
CN102272954B (en) * 2008-11-13 2016-02-03 行家光电有限公司 Systems and methods for forming thin film phosphor layers in phosphor converted light emitting devices
CN109564963A (en) * 2017-01-26 2019-04-02 株式会社Lg化学 Micro LED and display device including the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100497476C (en) * 2006-07-12 2009-06-10 李学霖 Organic fluorescent resin for white light LED
CN102272954B (en) * 2008-11-13 2016-02-03 行家光电有限公司 Systems and methods for forming thin film phosphor layers in phosphor converted light emitting devices
CN102064244A (en) * 2010-11-09 2011-05-18 杭州杭科光电有限公司 Layered encapsulating method of high-power LED (Light-Emitting Diode)
CN102064244B (en) * 2010-11-09 2012-08-22 杭州杭科光电有限公司 Layered encapsulating method of high-power LED (Light-Emitting Diode)
CN102194983A (en) * 2011-04-26 2011-09-21 深圳市瑞丰光电子股份有限公司 Surface mounting light-emitting diode (LED) with high sealing property and production method thereof
CN102593115A (en) * 2012-03-15 2012-07-18 深圳市丽晶光电科技股份有限公司 LED surface-mounted device and manufacturing method thereof
CN109564963A (en) * 2017-01-26 2019-04-02 株式会社Lg化学 Micro LED and display device including the same
CN109564963B (en) * 2017-01-26 2021-04-16 株式会社Lg化学 Micro LED and display device including the same

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Granted publication date: 20050223