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CN2678144Y - Light-emitting diode light source module structure - Google Patents

Light-emitting diode light source module structure Download PDF

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Publication number
CN2678144Y
CN2678144Y CNU2003201167292U CN200320116729U CN2678144Y CN 2678144 Y CN2678144 Y CN 2678144Y CN U2003201167292 U CNU2003201167292 U CN U2003201167292U CN 200320116729 U CN200320116729 U CN 200320116729U CN 2678144 Y CN2678144 Y CN 2678144Y
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light
source module
emitting diode
module structure
heat dissipation
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Expired - Fee Related
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CNU2003201167292U
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Chinese (zh)
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汪秉龙
庄峰辉
柯庆鸿
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Harvatek Corp
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Harvatek Corp
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Abstract

A light source module structure of light emitting diode is prepared as setting light emitting diode set at internal side of heat radiation conductor with light reflector to reflect light of light emitting diode set, connecting two ends of heat conduction pipe to light emitting diode set and heat radiation conductor with light reflector separately for conducting and radiating heat generated by light emitting diode to raise luminous efficiency and service life.

Description

发光二极管光源模块结构Light-emitting diode light source module structure

技术领域technical field

本实用新型涉及一种发光二极管光源模块结构,尤指可传导并发散发光二极管的热量的发光二极管光源模块结构。The utility model relates to a light emitting diode light source module structure, in particular to a light emitting diode light source module structure capable of conducting and emitting the heat of the light emitting diode.

背景技术Background technique

请参阅图1所示,其中公知的发光二极管光源模块包括一固持体10a、一连接件20a、一光反射罩体30a、一导电筒体40a、透明盖体50a及多个发光二极管60a,其中该固持体10a形成一凹穴11a,且该光反射罩体30a设置于该凹穴11a内,并且该固持体20a及该光反射罩体30a其分别具有连通的第一穿孔12a,并使该连接件20a延伸穿过该等第一穿孔12a,且该连接件20a的二端凸环22a夹置该固持体10a及该光反射罩体30a的第一穿孔12a周缘,且该连接件20a具有一第二穿孔21a,以使该导电筒体40延伸入该第二穿孔21a,且该导电筒体40a的一端部具有一向外延伸的外斜环面41a,并使该导电筒体40a的外斜环面41a容置于该光反射罩体30a的内侧中心部,以使该等发光二极管60a电连接于该导电筒体40a的外斜环面41a,藉以导电发光并藉由光反射罩体30a反射于一方向。Please refer to FIG. 1, wherein the known light emitting diode light source module includes a holder 10a, a connector 20a, a light reflection cover 30a, a conductive cylinder 40a, a transparent cover 50a and a plurality of light emitting diodes 60a, wherein The holder 10a forms a recess 11a, and the light reflection cover 30a is disposed in the recess 11a, and the holder 20a and the light reflection cover 30a respectively have a communicating first through hole 12a, and make the light reflection cover 30a communicate with each other. The connecting piece 20a extends through the first through holes 12a, and the two-end protruding rings 22a of the connecting piece 20a sandwich the periphery of the first through hole 12a of the holder 10a and the light reflecting cover 30a, and the connecting piece 20a has A second through hole 21a, so that the conductive cylinder 40 extends into the second through hole 21a, and one end of the conductive cylinder 40a has an outwardly extending outer inclined ring surface 41a, and the outer surface of the conductive cylinder 40a The inclined ring surface 41a is accommodated in the inner center of the light reflecting cover 30a, so that the light emitting diodes 60a are electrically connected to the outer inclined ring surface 41a of the conductive cylinder 40a, so as to conduct light and emit light through the light reflecting cover. 30a is reflected in one direction.

但是,公知的发光二极管光源模块仍具有缺陷,例如其发光二极管于发光时仍会产生热量,尤其作为照明设备时,其发光亮度需加倍地增加,以致于需加倍地提高输入电流以达到增加亮度的目的,因此使其发热量也同时倍数增加,而公知的发光二极管光源模块仍无法将其高热量作有效的疏散,而导致发光二极管的结构在热效应下,产生发光效率严重衰减,同时,长期使发光二极管的结构处于高温状态下,其寿命因此严重缩短。However, the known light emitting diode light source module still has defects, for example, the light emitting diode still generates heat when it emits light, especially when it is used as a lighting device, its luminous brightness needs to be doubled, so that the input current needs to be doubled to increase the brightness Therefore, the calorific value is also multiplied at the same time, but the known light emitting diode light source module still cannot effectively evacuate its high heat, which leads to the structure of the light emitting diode under the thermal effect, resulting in a serious attenuation of luminous efficiency. At the same time, the long-term The structure of the light-emitting diode is exposed to high temperature, and its lifetime is thus severely shortened.

发明内容Contents of the invention

本实用新型的其一目的,在于提供一种发光二极管光源模块结构,增加散热组件,以传导疏散发光二极管的热量。One purpose of the present invention is to provide a light emitting diode light source module structure, adding heat dissipation components to conduct and evacuate the heat of the light emitting diodes.

本实用新型的其二目的,在于提供一种发光二极管光源模块结构,藉以增加其使用寿命及加发光效率。依据前述实用新型目的,本实用新型提供一种发光二极管光源模块结构,其包括:一具有光反射罩的散热导体;一具有发光二极管发光组,其组装于该具有光反射罩的散热导体的光反射罩内侧,藉以反射该具有发光二极管发光组的光线;及一导热管,其一端连接于该具有发光二极管发光组及其另一端连接该具有光反射罩的散热导体,藉以传导该具有发光二极管发光组的热量。The second purpose of the present invention is to provide a light emitting diode light source module structure, so as to increase its service life and increase luminous efficiency. According to the purpose of the aforementioned utility model, the utility model provides a light emitting diode light source module structure, which includes: a heat dissipation conductor with a light reflection cover; The inner side of the reflector, so as to reflect the light of the light-emitting group with LED; The heat of the glowing group.

也就是说,本实用新型为一种发光二极管光源模块结构,其包括一具有光反射罩的散热导体、一集热载体、一导热管、一电路基板及多个发光二极管,其中该具有光反射罩的散热导体的一端的内侧形成半椭球面的开放端,另一端内侧形成收缩的容置部,该集热载体的一端延伸入该容置部,且固设其上,且另一端形成截头角锥状,其位于开放端的内侧,该导热管的一端连接于该集热载体,另一端弯折延伸连接于该具有光反射罩的散热导体,该电路基板环设于该集热载体的截头角锥状锥面,该等发光二极管电连接于该电路基板,俾可传导疏散发光二极管的热量,且因此增加发光二极管使用寿命及加发光效率。That is to say, the utility model is a light emitting diode light source module structure, which includes a heat dissipation conductor with a light reflection cover, a heat collecting carrier, a heat pipe, a circuit substrate and a plurality of light emitting diodes, wherein the light reflection cover The inner side of one end of the heat dissipation conductor of the cover forms an open end of a semi-ellipsoid, and the inner side of the other end forms a shrinking accommodation portion, one end of the heat collecting carrier extends into the accommodation portion, and is fixed on it, and the other end forms a cut-off It is in the shape of a head pyramid, which is located inside the open end. One end of the heat pipe is connected to the heat collecting carrier, and the other end is bent and extended to connect to the heat dissipation conductor with a light reflection cover. The circuit board is arranged around the section of the heat collecting carrier The pyramid-shaped conical surface, the light-emitting diodes are electrically connected to the circuit substrate, so as to conduct and disperse the heat of the light-emitting diodes, and thus increase the service life of the light-emitting diodes and increase the luminous efficiency.

为了使能进一步了解本实用新型的特征及技术内容,请参阅以下有关本实用新型的详细说明及附图,然而所附附图仅提供参考与说明,并非用来对本实用新型加以限制。In order to further understand the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the accompanying drawings are only for reference and illustration, and are not intended to limit the present utility model.

附图说明Description of drawings

图1为公知的发光二极管光源模块结构;Fig. 1 is the structure of known LED light source module;

图2为本实用新型的发光二极管光源模块结构;Fig. 2 is the light emitting diode light source module structure of the utility model;

图3为本实用新型的截头四角锥体展开状的电路基板(一);Fig. 3 is the circuit substrate (1) that the truncated quadrangular pyramid of the present utility model expands;

图4为本实用新型的截头四角锥体展开状的电路基板(二);Fig. 4 is the circuit substrate (two) of the truncated quadrangular pyramid of the utility model expanded shape;

图5为本实用新型的截头六角锥体展开状的电路基板。Fig. 5 is a circuit substrate in the expanded form of a truncated hexagonal pyramid of the present invention.

其中,附图标记说明如下:Wherein, the reference signs are explained as follows:

固持体10a                            光反射罩体10Holder 10a Light reflection cover 10

凹穴11a                              开放端11Recess 11a Open end 11

第一穿孔12a                          容置部12First perforation 12a Accommodating portion 12

连接件20a                          穿孔13Connecting piece 20a Perforation 13

第二穿孔21a                        散热导体20The second through hole 21a heat dissipation conductor 20

凸环22a                            凹部21Convex ring 22a Concave portion 21

光反射罩体30a                      具有发光二极管发光组30The light reflection cover 30a has a light-emitting diode light-emitting group 30

导电筒体40a                        集热载体31Conductive cylinder 40a Heat collecting carrier 31

外斜环面41a                        凹孔32Outer inclined ring surface 41a Concave hole 32

透明盖体50a                        电路基板35Transparent cover 50a Circuit substrate 35

发光二极管60a                      矩形板36LED 60a Rectangular plate 36

梯形板37                           六角板38Trapezoidal plate 37 Hexagonal plate 38

发光二极管39                       导热管40Light-emitting diode 39 heat pipe 40

具有光反射罩的散热导体50Heat dissipation conductor 50 with light reflector

具体实施方式Detailed ways

请参阅图2至图5所示,本实用新型为一种发光二极管光源模块结构,其包括一具有光反射罩的散热导体50、一具有发光二极管发光组30及一导热管40,其中该具有发光二极管发光组30组装于该具有光反射罩的散热导体50的光反射罩内侧,该导热管40的一端连接于该具有发光二极管发光组30及另一端连接该具有光反射罩的散热导体50,如此可使该具有发光二极管发光组30产生的热量藉由该导热管40传导至该具有光反射罩的散热导体50,且藉由该具有光反射罩的散热导体50发散该具有发光二极管发光组30产生的热量,以增加该具有发光二极管发光组30的发光效率及使用寿命。Please refer to Fig. 2 to Fig. 5, the utility model is a light emitting diode light source module structure, which includes a heat dissipation conductor 50 with a light reflection cover, a light emitting diode light emitting group 30 and a heat pipe 40, wherein the The light-emitting diode light-emitting group 30 is assembled on the inside of the light-reflecting cover of the heat-dissipating conductor 50 with the light-reflecting cover. In this way, the heat generated by the light-emitting group 30 with light-emitting diodes can be conducted to the heat-dissipating conductor 50 with a light reflector through the heat pipe 40, and the heat-dissipating conductor 50 with a light reflector can dissipate the light emitted by the light-emitting diode The heat generated by the group 30 is used to increase the luminous efficiency and service life of the light-emitting group 30 with LEDs.

请参阅图2所示,其中具有光反射罩的散热导体50包括散热导体20及光反射罩体10,该散热导体20环设于该光反射罩体10的外侧,且该导热管40的一端连接于该散热导体20,该光反射罩体10的一端内侧形成半椭球反射面的开放端11,另一端内侧形成收缩的容置部12,且该具有发光二极管发光组30位于该开放端11的中心部,且延伸固设于该容置部12,该光反射罩体10的一端部具有一穿孔13,且连通于该容置部12,且该导热管40的一端连接于该具有发光二极管发光组30,另一端延伸该穿孔13,并连接于该散热导体20;该散热导体20与该光反射罩体10的外侧壁为相似形状,且环设于该光反射罩体10的外侧,并于其侧壁下端部向内形成一凹部21,以容置该导热管40的一端。Please refer to Fig. 2, wherein the heat dissipation conductor 50 having a light reflection cover includes a heat dissipation conductor 20 and a light reflection cover body 10, the heat dissipation conductor 20 is arranged around the outside of the light reflection cover body 10, and one end of the heat pipe 40 Connected to the heat dissipation conductor 20, the inner side of one end of the light reflection cover 10 forms an open end 11 of a semi-ellipsoidal reflective surface, and the inner side of the other end forms a contracted accommodating portion 12, and the light-emitting group 30 with a light-emitting diode is located at the open end 11, and extended and fixed in the accommodating portion 12, one end of the light reflection cover 10 has a through hole 13, and is communicated with the accommodating portion 12, and one end of the heat pipe 40 is connected to the accommodating portion 13 with The other end of the light-emitting diode light-emitting group 30 extends the through hole 13 and is connected to the heat dissipation conductor 20; and a recess 21 is formed inwardly at the lower end of the side wall to accommodate one end of the heat pipe 40 .

再,请参阅图2所示,其中该具有发光二极管发光组30包括一集热载体31、一电路基板35及多个发光二极管39,其该集热载体31具有二端,其后端组装于该光反射罩体20内侧,且该集热载体31的后端具有一凹孔32,且该导热管40延伸入该凹孔32内,并固设于其上,另该等发光二极管39电连接于该电路基板35上,电路基板设置于该集热载体的前端,并且该集热载体31的前端形成截头角锥体状,且容置于该光反射罩体10的内侧中心部,请参阅图2至图5所示,该电路基板35形成该集热载体31的截头锥端的截头锥面展开状,因此当该截头锥为截头四角锥体时,其该电路基板35展为一矩形板36及分别接于该矩形板36四侧的四梯形板37,或形成多个连接呈一列的梯形板37,当该截头锥体为截头六角锥体时,该电路基板35展为一六角形板38及分别接于该六角板38侧边的六梯形板37,因此可包覆该集热载体的截头角锥端,以固着发光二极管39并传导电力。Again, please refer to shown in Fig. 2, wherein this has light-emitting diode light-emitting group 30 and comprises a heat-collecting carrier 31, a circuit board 35 and a plurality of light-emitting diodes 39, and its this heat-collecting carrier 31 has two ends, and its rear end is assembled on The inner side of the light reflection cover 20, and the rear end of the heat collecting carrier 31 has a concave hole 32, and the heat pipe 40 extends into the concave hole 32, and is fixed on it, and the light emitting diodes 39 are electrically Connected to the circuit substrate 35, the circuit substrate is arranged on the front end of the heat collection carrier, and the front end of the heat collection carrier 31 forms a truncated pyramid shape, and is accommodated in the inner center of the light reflection cover 10, please 2 to 5, the circuit substrate 35 forms the frustum of the frustum end of the heat collecting carrier 31. Therefore, when the frustum is a truncated quadrangular pyramid, the circuit substrate 35 Expand into a rectangular plate 36 and four trapezoidal plates 37 respectively connected to the four sides of the rectangular plate 36, or form a plurality of trapezoidal plates 37 connected in a row, when the truncated cone was a truncated hexagonal pyramid, the circuit The substrate 35 is expanded into a hexagonal plate 38 and six trapezoidal plates 37 respectively connected to the sides of the hexagonal plate 38, so that the truncated pyramid end of the heat collecting carrier can be covered to fix the LED 39 and conduct electricity.

如此藉由该集热载体31承载电路基板35及发光二极管39,藉以收集该等发光二极管39发光所产生的热量,因此再藉由该导热管40传导其热量至该散热导体20,因此减低该发光二极管39的累积热量,以致于增加该发光二极管39的发光效率及增加其使用寿命。In this way, the heat-collecting carrier 31 carries the circuit board 35 and the light-emitting diodes 39, so as to collect the heat generated by the light-emitting diodes 39, and then conduct the heat to the heat-dissipating conductor 20 through the heat-conducting pipe 40, thereby reducing the The accumulated heat of the LED 39 increases the luminous efficiency and service life of the LED 39 .

综上所述,本实用新型的发光二极管光源模块结构,可传导疏散发光二极管的热量,并且增加其使用寿命及加发光效率。To sum up, the light emitting diode light source module structure of the present invention can conduct and evacuate the heat of the light emitting diode, and increase its service life and increase luminous efficiency.

以上所述仅为本实用新型的较佳可行实施例,非因此拘限本实用新型的专利范围,因此,凡运用本实用新型的说明书及附图内容所作的等效结构变化,均同理都包含于本实用新型的范围内。The above description is only a preferred feasible embodiment of the utility model, not restricting the scope of the patent of the utility model, therefore, all equivalent structural changes made by using the description of the utility model and the contents of the accompanying drawings are all the same. Included in the scope of the present utility model.

Claims (12)

1. LED light-source module structure is characterized in that it comprises:
One has the heat dissipation conductor of light reflecting cover;
One has the lumination of light emitting diode group, and it is assembled in the light reflecting cover inboard of this heat dissipation conductor with light reflecting cover, and this has the light of lumination of light emitting diode group the light reflecting cover inner reflection; And
One heat pipe, one end are connected in this to have lumination of light emitting diode group and the other end thereof and connects and use the heat dissipation conductor with light reflecting cover that conduction has the heat of lumination of light emitting diode group.
2. LED light-source module structure as claimed in claim 1, it is characterized in that, this inboard of an end with heat dissipation conductor of light reflecting cover forms the open end of semielliptical reflecting surface, the inboard holding part that shrinks that forms of the other end, and this has the central part that the lumination of light emitting diode group is positioned at this inboard, open end, and extension is fixedly arranged on this holding part.
3. LED light-source module structure as claimed in claim 2, it is characterized in that, this end with heat dissipation conductor of light reflecting cover has a perforation, and be communicated in this holding part, one end of this heat pipe is connected in this and has the lumination of light emitting diode group, the other end extends this perforation, and is connected in the heat dissipation conductor that this has light reflecting cover.
4. LED light-source module structure as claimed in claim 1, it is characterized in that, this heat dissipation conductor with light reflecting cover comprises heat dissipation conductor and light reflecting cover body, and this heat dissipation conductor is located on the outside of this light reflecting cover body, and an end of this heat pipe is connected in this heat dissipation conductor.
5. LED light-source module structure as claimed in claim 4 is characterized in that, this heat dissipation conductor inwardly forms a recess in sidewall, with an end of ccontaining this heat pipe.
6. LED light-source module structure as claimed in claim 1 is characterized in that, this has the lumination of light emitting diode group and comprises:
One thermal-arrest carrier has two ends, and its rear end is assembled in the light reflecting cover inboard of this heat dissipation conductor with light reflecting cover, and connects an end of this heat pipe;
One circuit substrate, it is arranged at the front end of this thermal-arrest carrier; And
A plurality of light-emitting diodes, it is electrically connected on this circuit substrate.
7. LED light-source module structure as claimed in claim 6 is characterized in that, it is pyramidal that an end of this thermal-arrest carrier forms butt.
8. LED light-source module structure as claimed in claim 7 is characterized in that, the butt conical surface that this circuit substrate forms this frustum launches shape.
9. LED light-source module structure as claimed in claim 7 is characterized in that, this circuit substrate comprises a hexagonal plate and be connected to six trapezoidal plates of this hexagonal plate side respectively that it coats the butt pyramid end of this thermal-arrest carrier.
10. LED light-source module structure as claimed in claim 7 is characterized in that, this circuit substrate comprises a rectangular slab and be connected to four trapezoidal plates of these rectangular slab four sides respectively that it coats the butt pyramid end of this thermal-arrest carrier.
11. LED light-source module structure as claimed in claim 7 is characterized in that, this circuit substrate comprises the trapezoidal plate of a plurality of connection one row, and it coats the butt pyramid end of this thermal-arrest carrier.
12. LED light-source module structure as claimed in claim 6 is characterized in that, the end that this thermal-arrest carrier connects this heat pipe forms shrinkage pool, and this heat pipe extends in this shrinkage pool, and sets firmly thereon.
CNU2003201167292U 2003-11-20 2003-11-20 Light-emitting diode light source module structure Expired - Fee Related CN2678144Y (en)

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CNU2003201167292U CN2678144Y (en) 2003-11-20 2003-11-20 Light-emitting diode light source module structure

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Application Number Priority Date Filing Date Title
CNU2003201167292U CN2678144Y (en) 2003-11-20 2003-11-20 Light-emitting diode light source module structure

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100547820C (en) * 2006-09-06 2009-10-07 立德电子股份有限公司 Semiconductor light source device
US8546834B2 (en) 2006-04-21 2013-10-01 Samsung Electronics Co., Ltd. LED package
CN101802687B (en) * 2007-09-14 2014-02-12 奥斯兰姆有限公司 Lighting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8546834B2 (en) 2006-04-21 2013-10-01 Samsung Electronics Co., Ltd. LED package
CN100547820C (en) * 2006-09-06 2009-10-07 立德电子股份有限公司 Semiconductor light source device
CN101802687B (en) * 2007-09-14 2014-02-12 奥斯兰姆有限公司 Lighting device

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