CN2517017Y - Combined cooling fins - Google Patents
Combined cooling fins Download PDFInfo
- Publication number
- CN2517017Y CN2517017Y CN 01275411 CN01275411U CN2517017Y CN 2517017 Y CN2517017 Y CN 2517017Y CN 01275411 CN01275411 CN 01275411 CN 01275411 U CN01275411 U CN 01275411U CN 2517017 Y CN2517017 Y CN 2517017Y
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- plate body
- dissipation fin
- openings
- combined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000003247 decreasing effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 abstract description 2
- 239000010439 graphite Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型涉及一种组合式散热鳍片,它由铝、铜或石墨等导热材料裁制而成的板体,该板体一侧是冲制数道间隔的开口,该板体另一侧设有一连结部,该数道开口的余料并向上弯折,以形成数道散热鳍片,该板体的开口并与另一板体的开口相互交错,以方便两板体可相互插置,并借以形成一整体的散热鳍片,该连结部亦可加大尺寸以方便直接置放于不同的光电发热组件上使用,以此提高整体散热鳍片的散热适用性;借由两板体相互插置形成的完整散热鳍片,可有效降低制造成本,并可依电子发热组件外型而弯折贴附,进而大幅提高散热的效率。
The utility model relates to a combined heat dissipation fin, which is a plate body cut from heat-conducting materials such as aluminum, copper or graphite. One side of the plate body is punched with a plurality of spaced openings, and the other side of the plate body is provided with a connecting portion. The surplus material of the plurality of openings is bent upward to form a plurality of heat dissipation fins. The openings of the plate body are interlaced with the openings of another plate body so that the two plates can be inserted into each other to form an integral heat dissipation fin. The connecting portion can also be enlarged in size so as to be directly placed on different photoelectric heating components for use, thereby improving the heat dissipation applicability of the integral heat dissipation fin. The complete heat dissipation fin formed by inserting the two plates into each other can effectively reduce the manufacturing cost, and can be bent and attached according to the appearance of the electronic heating component, thereby greatly improving the heat dissipation efficiency.
Description
技术领域technical field
本实用新型涉及一种组合式散热鳍片,尤其是指一种可增加与电子发热组件的接触面积,还可依光电发热组件外型而配合弯折改变的散热鳍片。The utility model relates to a combined heat dissipation fin, in particular to a heat dissipation fin which can increase the contact area with an electronic heating component and can also be bent and changed according to the shape of the photoelectric heating component.
背景技术Background technique
随着科技的进步,电子器物(如计算机主机、个人数字助理器等)的执行速度愈来愈快,但相对于电子器物内所产生的温度亦越来越高,为了将电子器物内所产生的温度有效散发于系统之外,达到维持电子器物内的各组件在容许温度之下运作,散热系统已成为目前电子器物内所不可缺少的主要配件。With the advancement of technology, the execution speed of electronic devices (such as computer hosts, personal digital assistants, etc.) is getting faster and faster, but the temperature generated in electronic devices is also getting higher and higher. The temperature is effectively dissipated outside the system to maintain the operation of each component in the electronic device below the allowable temperature. The heat dissipation system has become an indispensable main part of the current electronic device.
请参阅图1所示,它为一种公知散热器的立体示意图,它由铝或铜等金属材料冲制数道呈弯折状的散热器10,该散热器10可与一电子发热组件(图略)胶合,借以帮助电于发热组件所产生的温度有效散发于系统之外,达到维持电子发热组件在容许温度之下运作。Please refer to shown in Fig. 1, it is a stereogram of a kind of known radiator, it punches the
但是,上述公知散热器10由于间隔数道凹槽101,故,导致减少与电子发热组件胶合的面积,进而降低该散热器10的散热效果。However, the above-mentioned
请参阅图2所示,它为另一种公知散热器的立体分解图,它由铝或铜等金属材料冲制成数片“匚”型板体111及凹、凸相配合的卡扣件112组合而成的散热器11,该散热器11可与一电子发热组件(图略)胶合,借以帮助电子发热组件所产生的温度有效散发干系统之外,达到维持电子发热组件在容许温度之下运作。Please refer to Fig. 2, which is a three-dimensional exploded view of another known radiator, which is punched out of metal materials such as aluminum or copper into several pieces of "匚"-shaped boards 111 and concave and convex matching buckles. 112 combined radiator 11, the radiator 11 can be glued with an electronic heating component (not shown), so as to help the temperature generated by the electronic heating component to be effectively dissipated outside the dry system, so as to maintain the electronic heating component within the allowable temperature down operation.
但是,上述公知散热器11虽增加与电子发热组件胶合面积,但由于该凹、凸相配合的卡扣件112相互卡扣,导致整体的散热器11无法弯折,而现今电子发热组件因越来越多元化,诸如热管等电子发热组件,因该散热器11无法弯折,导致降低该散热器11的使用性。However, although the above-mentioned known heat sink 11 increases the bonding area with the electronic heating component, because the concave and convex buckle parts 112 are engaged with each other, the overall heat sink 11 cannot be bent. With more and more diversification, the heat sink 11 cannot be bent due to electronic heating components such as heat pipes, which reduces the usability of the heat sink 11 .
于是,由上可知,上述公知的组合式散热鳍片,在实际的使用上,显然具有不便与缺点存在,而可待加以改善。Therefore, it can be seen from the above that the above-mentioned known combined heat dissipation fins obviously have inconvenience and disadvantages in actual use, and can be improved.
发明内容Contents of the invention
本实用新型的目的在于提出一种由至少一具有多道间隔开口的板体所组成的组合式散热鳍片,它可增加与散热组件的接触面积,提高散热效率,从而解决了现有技术所存在的问题。The purpose of this utility model is to propose a combined heat dissipation fin composed of at least one plate body with multiple interval openings, which can increase the contact area with the heat dissipation component and improve the heat dissipation efficiency, thus solving the problems of the prior art. Existing problems.
本实用新型所采用的技术方案在于它由至少一片的板体所构成,该板体一侧是冲制数道间隔的开口,另一侧设有一连结部,该数道开口的余料并向上弯折,以形成数道直立式片体的散热鳍片,并借此达到良好的散热效率。The technical solution adopted by the utility model is that it is composed of at least one piece of plate body. One side of the plate body is punched with several intervals of openings, and the other side is provided with a connecting part. Bending to form several vertical heat dissipation fins, thereby achieving good heat dissipation efficiency.
本实用新型的优点在于:The utility model has the advantages of:
(1)该板体的开口余料是向上弯折,以形成数道散热鳍片,借以减低该两板体的余料消耗,有效降低该板体的材料成本。(1) The remaining material of the opening of the board is bent upwards to form several heat dissipation fins, thereby reducing the consumption of the remaining material of the two boards and effectively reducing the material cost of the board.
(2)可依发热组件外型而弯折改变,提高完整的散热鳍片的适用性,达到大幅降低生产成本。(2) It can be bent and changed according to the shape of the heating element, which improves the applicability of the complete heat dissipation fin and greatly reduces the production cost.
(3)可增加与发热组件的接触面积,并提供发热组件更快速散热的效果。(3) It can increase the contact area with the heating component, and provide the effect of faster heat dissipation of the heating component.
附图说明Description of drawings
图1为一种公知散热器的立体示意图;Fig. 1 is a perspective view of a known radiator;
图2为另一种公知散热器的立体分解图;Fig. 2 is a three-dimensional exploded view of another known radiator;
图3为本实用新型的立体分解图;Fig. 3 is a three-dimensional exploded view of the utility model;
图4为本实用新型的立体组合图;Fig. 4 is the three-dimensional assembly drawing of the present utility model;
图5为本实用新型的使用状态图(一);Fig. 5 is the use state figure (1) of the utility model;
图6为本实用新型的使用状态图(二);Fig. 6 is the use state figure (2) of the utility model;
图7为本实用新型另一实施例的立体分解图。Fig. 7 is a three-dimensional exploded view of another embodiment of the present invention.
具体实施方式Detailed ways
现在结合上述各附图来进一步说明本实用新型的较佳具体实施例。请参阅图3所示,本实用新型由铝、铜或石墨等导热材料裁制而成的板体20,该板体一侧由冲床等机器冲制数道间隔的开口21,该板体20另一侧设有一连结部22,该数道开口21的余料并向上弯折,以形成数道散热鳍片211,向上弯折的散热鳍片211并可减低该板体20的余料消耗,借以降低该板体20的材料成本。Now further illustrate preferred specific embodiments of the present utility model in conjunction with above-mentioned each accompanying drawing. See also shown in Fig. 3, the
请参阅图3至图5所示,该板体20的开口21并与另一板体20的开口21相互交错,以方便两板体20可相互插置,并借以形成完整的散热鳍片30,该完整的散热鳍片30可以导热胶(图略)与发热组件(图略)胶合,以帮助发热组件产生的温度可有效散发于系统之外,达到维持发热组件在容许温度之下运作,该散热鳍片30的连结部22可依发热组件(图略)面积增加或缩减(如图7所示),以符合该散热鳍片30的实用性。Please refer to FIG. 3 to FIG. 5 , the opening 21 of the
请参阅图6所示,该板体20的连结部22是方便使用者弯折,以配合不同的发热组件等外型使用,借以提高该完整的散热鳍片30的适用性,避免不同的发热组件即须开发不同散热鳍片30的费用,有效达到大幅降低生产成本。Please refer to FIG. 6 , the connecting
综上所述,当知本实用新型的组合式散热鳍片已具产业利用性、新颖性与进步性,又本实用新型的创新构造亦不曾见于同类产品及公开使用。To sum up, it should be known that the combined cooling fins of the present utility model have industrial applicability, novelty and progress, and the innovative structure of the utility model has never been seen in similar products and public use.
但以上所述的仅为本实用新型的较佳可行实施例,并非因此即拘限本实用新型的实施范围,故举凡运用本实用新型说明书及附图内容所作的等效结构变化,或直接或间接运用于其它相关的技术领域均同理皆包含于本实用新型权利要求书的保护范围。But the above-mentioned are only preferred feasible embodiments of the present utility model, and do not limit the scope of implementation of the present utility model, so all the equivalent structural changes made by using the utility model description and accompanying drawings, either directly or directly Indirect applications to other related technical fields are all included in the protection scope of the claims of the utility model.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01275411 CN2517017Y (en) | 2001-11-29 | 2001-11-29 | Combined cooling fins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01275411 CN2517017Y (en) | 2001-11-29 | 2001-11-29 | Combined cooling fins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2517017Y true CN2517017Y (en) | 2002-10-16 |
Family
ID=33679848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01275411 Expired - Fee Related CN2517017Y (en) | 2001-11-29 | 2001-11-29 | Combined cooling fins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2517017Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100353227C (en) * | 2004-11-19 | 2007-12-05 | 友达光电股份有限公司 | Flat panel display and its backlight assembly |
| US7489513B2 (en) | 2006-06-02 | 2009-02-10 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| WO2009140900A1 (en) * | 2008-05-23 | 2009-11-26 | 华为技术有限公司 | Heat radiating system of enclosure structure |
| CN103687435A (en) * | 2012-08-31 | 2014-03-26 | 技嘉科技股份有限公司 | heat sink |
| CN109688250A (en) * | 2019-01-17 | 2019-04-26 | 深圳市晶久瑞电子科技有限公司 | Solar recharging ink screen mobile phone |
-
2001
- 2001-11-29 CN CN 01275411 patent/CN2517017Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100353227C (en) * | 2004-11-19 | 2007-12-05 | 友达光电股份有限公司 | Flat panel display and its backlight assembly |
| US7489513B2 (en) | 2006-06-02 | 2009-02-10 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| WO2009140900A1 (en) * | 2008-05-23 | 2009-11-26 | 华为技术有限公司 | Heat radiating system of enclosure structure |
| CN103687435A (en) * | 2012-08-31 | 2014-03-26 | 技嘉科技股份有限公司 | heat sink |
| CN109688250A (en) * | 2019-01-17 | 2019-04-26 | 深圳市晶久瑞电子科技有限公司 | Solar recharging ink screen mobile phone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |