CN2590327Y - Circuit Board Frame Clamp with Anti-Board Bending Points - Google Patents
Circuit Board Frame Clamp with Anti-Board Bending Points Download PDFInfo
- Publication number
- CN2590327Y CN2590327Y CN 02292814 CN02292814U CN2590327Y CN 2590327 Y CN2590327 Y CN 2590327Y CN 02292814 CN02292814 CN 02292814 CN 02292814 U CN02292814 U CN 02292814U CN 2590327 Y CN2590327 Y CN 2590327Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- frame shape
- hole
- shape clamp
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005452 bending Methods 0.000 title claims abstract description 30
- 238000005476 soldering Methods 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 7
- 230000002265 prevention Effects 0.000 description 19
- 238000005516 engineering process Methods 0.000 description 8
- 238000007667 floating Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a circuit board frame type anchor clamps with prevent board bending pressure point, wherein the circuit board is equipped with the surface adhesion subassembly of back welding, stitch subassembly and a plurality of through hole, and frame type anchor clamps include a loading board at least, can bear the weight of the circuit board, and its surface is equipped with at least one shielding and an at least fretwork hole, wherein the shielding can shield the surface adhesion subassembly of circuit board back welding, and the fretwork hole can expose the stitch subassembly, and a plurality of prevent board bending pressure point, locate on the frame type anchor clamps and combine together with the through hole of circuit board, wherein prevent the combination of board bending pressure point and through hole and can avoid producing the gap between frame type anchor clamps and circuit board, make the stitch subassembly of circuit board when carrying out the wave soldering process, the surface adhesion subassembly of back welding can not cause because of soldering tin overflow and drop.
Description
Technical field
The utility model relates to a kind of support circuit plate and carries out the circuit board frame shape clamp of welding production process by the tin stove, is meant a kind of circuit board frame shape clamp with plate bending prevention pressure points especially.
Background technology
Significantly lifting along with the flourish and operating characteristics of integrated circuit encapsulation technology not only makes multimedia computer extensively be subjected to consumer's favor, more quickens popularizing of computer and relevant peripheral product.Yet, lifting along with the integrated circuit operation performance, it is short and small frivolous that product tends to, impel the volume of various spare parts to become more and more littler, make surface sticking assembly (SMD) become one of primary clustering of circuit board, its main characteristic is significantly to save the space, particularly at the surface sticking assembly of board design backing run, more can effectively utilize the space, and the layout of associated circuit board becomes meticulousr, complicated, cause the manufacturing process such as plug-in unit, scolding tin of circuit board to run into suitable difficulty.Circuit board is in the production process of assembling at present, scolding tin processing procedure for stitch assembly pin mainly all is to utilize wave soldering (wave soldering) mode, it is to utilize pump with the liquid tin of the tin furnace interior fusion microscler tin ripple of upwards kicking up, the circuit board of carrying when oblique rising is when contacting by the tin stove and with the tin ripple, liquid tin will enter the hole, fill out tin at the pin place of chip, and form solder joint at this place.
See also shown in Figure 4, frame shape clamp schematic diagram for known technology, wherein this circuit board 10 is provided with surface sticking assembly 11, stitch assembly 12 and a plurality of through hole 13 of backing run, this frame shape clamp 14 comprises a loading plate 15, be to cooperate the shape size of circuit board 10 and design, but bearer circuit plate 10, and frame shape clamp 14 housings are provided with a plurality of fixedly pressure points 16, circuit board 10 can be fixed on this loading plate 15.And in above-mentioned loading plate 15, be provided with at least one shielding 17; this shielding 17 can be covered the surface sticking assembly 11 of this circuit board backing run; surface sticking assembly 11 with the protection backing run is not influenced by scolding tin in the wave soldering program and comes off; and be provided with at least one hole 18 of engraving; this is engraved hole 18 and the pin of stitch assembly 12 can be come out, and utilizes and engraves the welding procedure that stitch assembly 12 pins can be carried out in hole 18.
Yet; see also shown in Figure 5; when circuit board passes through the tin stove; owing to be under the high temperature; and circuit board 10 is different with the coefficient of expansion that frame shape clamp 14 is heated; so circuit board 10 can produce the curved phenomenon of nonsynchronous plate with frame shape clamp 14; particularly when circuit board 10 is big more; the situation of plate bending deformation can be serious more; except being easy to cause the stitch assembly 12 floating parts of circuit board and the situation of inclination; carry out maintenance test and need expend a large amount of man-hours; and circuit board 10 and the curved phenomenon of frame shape clamp 14 nonsynchronous plates; can produce slit 20 at the two; make the shielding 17 of frame shape clamp can not cover the surface sticking assembly 11 of circuit board backing run effectively, so, when scolding tin welds by the pin of engraving the 18 pairs of stitch assemblies 12 in hole; scolding tin regular meeting has influence on backing run surface sticking assembly 11 by slit 20, and makes backing run surface sticking assembly 11 come off.In known technology, in order to improve above-mentioned situation, often use briquetting to be pressed on the circuit board, desire to make circuit board and frame shape clamp to produce synchronous distortion, but the weight of briquetting can be quickened the frame shape clamp deformed damaged, make the life-span of frame shape clamp reduce.
Therefore; need research and development and improvement on the processing procedure, so that circuit board is in the process of wave soldering, with the situation minimizing of floating part of the stitch assembly of circuit board and inclination; and protect the surface sticking assembly of backing run effectively, with the welding quality that promotes circuit board and reduce human cost.
Summary of the invention
The purpose of this utility model is for a kind of circuit board frame shape clamp with plate bending prevention pressure points is provided, these anchor clamps can make circuit board and frame shape clamp combine closely, when preventing by the tin stove, scolding tin overflow and infiltrate the slit of the two, and cause the surface sticking assembly of backing run to come off.
Another purpose of the present utility model is to provide a kind of circuit board frame shape clamp with plate bending prevention pressure points, circuit board and frame shape clamp are combined closely, with floating part of the stitch assembly that reduces circuit board or the probability that tilts to take place, reducing maintenance time, and the qualification rate that promotes product.
The purpose of this utility model can realize by following measure:
A kind of circuit board frame shape clamp with plate bending prevention pressure points, this circuit board are provided with surface sticking assembly, stitch assembly and a plurality of through hole of backing run, and this frame shape clamp comprises:
The loading plate of one this circuit board of carrying, its surface be provided with at least one surface sticking assembly that covers the circuit board backing run shielding and at least one this stitch assembly can be exposed engrave the hole; And this frame shape clamp also comprises:
A plurality of plate bending prevention pressure points are located on the loading plate of described frame shape clamp and with the through hole of this circuit board and are combined.Wherein this plate bending prevention pressure points can be avoided producing the slit between this frame shape clamp and this circuit board with combining of this through hole, the stitch assembly that makes this circuit board is when carrying out the wave soldering processing procedure, and the surface sticking assembly of this backing run can not cause because of the scolding tin overflow and come off.
This plate bending prevention pressure points is a bolt.
The utility model has following advantage compared to existing technology:
Utilize the circuit board frame shape clamp with plate bending prevention pressure points of the present utility model, circuit board and frame shape clamp are combined closely, make between the two and can not produce the slit, so can prevent by the tin stove time, the surface sticking assembly of backing run causes because of the scolding tin overflow and comes off.And, because the two combine closely of circuit board and frame shape clamp also can avoid circuit board and frame shape clamp to produce nonsynchronous plate bending deformation, and then reduce the floating part of stitch assembly of circuit board or the probability that tilts to take place, can reduce maintenance time, and the qualification rate that promotes product.Utilize circuit board frame shape clamp plate bending prevention pressure points of the present utility model in addition; can substitute the briquetting in the known technology fully; be out of shape so can avoid frame shape clamp to be subjected to the influence of briquetting weight; therefore increased the life-span of frame shape clamp; can protect the surface sticking assembly of backing run again; reduce maintenance time, promoted the qualification rate of product.
Description of drawings
Fig. 1 is the circuit board frame shape clamp decomposing schematic representation with plate bending prevention pressure points of the present utility model;
Fig. 2 is the circuit board frame shape clamp assembling schematic diagram with plate bending prevention pressure points of the present utility model;
Fig. 3 is the circuit board frame shape clamp profile with plate bending prevention pressure points of the present utility model;
Fig. 4 is the frame shape clamp decomposing schematic representation of known technology;
Fig. 5 is the frame shape clamp profile of known technology.
Embodiment
The utility model is also incited somebody to action in conjunction with the accompanying drawings, and embodiment is described in further detail:
See also shown in Fig. 1,2, it is the circuit board frame shape clamp schematic diagram with plate bending prevention pressure points of the present utility model, wherein this circuit board 30 is provided with surface sticking assembly 32, stitch assembly 34 and a plurality of through hole 36 of backing run, this frame shape clamp 40 comprises a loading plate 42, be to cooperate the shape size of circuit board 30 and design, but bearer circuit plate 30, and frame shape clamp 40 housings are provided with a plurality of fixedly pressure points 44, circuit board 30 can be fixed on this loading plate 42.And in above-mentioned loading plate 42, be provided with at least one shielding 46; this shielding 46 can be covered the surface sticking assembly 32 of this circuit board backing run; surface sticking assembly 32 with the protection backing run is not influenced by scolding tin in the wave soldering program and comes off; and be provided with at least one hole 48 of engraving; this is engraved hole 48 and the pin of stitch assembly can be come out; the welding procedure that stitch assembly 34 pins can be carried out in hole 48 is engraved in utilization, and a plurality of plate bending prevention pressure points 50 is located on the loading plate 42, and combines with the through hole 36 of circuit board.
The execution mode of the plate bending prevention pressure points on the circuit board frame shape clamp of the present utility model is with respect to the position of the through hole of circuit board screw thread to be set at the loading plate of frame shape clamp, utilizes bolt that circuit board and frame shape clamp are combined closely again.
See also shown in Figure 3, it is the circuit board frame shape clamp profile that the utlity model has plate bending prevention pressure points, utilize the circuit board frame shape clamp with plate bending prevention pressure points of the present utility model, the two combines closely can to make circuit board 30 and frame shape clamp 40, except avoiding the two to produce nonsynchronous plate bending deformation, make the stitch assembly 34 of circuit board float parts, or the probability that tilts to take place reduces, circuit board 30 and frame shape clamp 40 can be combined closely because of plate bending prevention pressure points 50 again, make and do not have the slit between the two, so, in the time of can preventing that circuit board from passing through the tin stove, the tin that overflows infiltrates the slit and causes the surface sticking assembly 32 of backing run to come off.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02292814 CN2590327Y (en) | 2002-12-16 | 2002-12-16 | Circuit Board Frame Clamp with Anti-Board Bending Points |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02292814 CN2590327Y (en) | 2002-12-16 | 2002-12-16 | Circuit Board Frame Clamp with Anti-Board Bending Points |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2590327Y true CN2590327Y (en) | 2003-12-03 |
Family
ID=33750997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02292814 Expired - Fee Related CN2590327Y (en) | 2002-12-16 | 2002-12-16 | Circuit Board Frame Clamp with Anti-Board Bending Points |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2590327Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102740609A (en) * | 2011-04-13 | 2012-10-17 | 纬创资通股份有限公司 | Printed circuit board, supporting jig and positioning method |
| WO2021056779A1 (en) * | 2019-09-25 | 2021-04-01 | 烟台台芯电子科技有限公司 | Device for reducing deformation of large-area copper sheet after welding |
-
2002
- 2002-12-16 CN CN 02292814 patent/CN2590327Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102740609A (en) * | 2011-04-13 | 2012-10-17 | 纬创资通股份有限公司 | Printed circuit board, supporting jig and positioning method |
| CN102740609B (en) * | 2011-04-13 | 2015-06-10 | 纬创资通股份有限公司 | Printed circuit board, supporting jig and positioning method |
| WO2021056779A1 (en) * | 2019-09-25 | 2021-04-01 | 烟台台芯电子科技有限公司 | Device for reducing deformation of large-area copper sheet after welding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: MINGSHUO COMPUTER(SUZHOU ) CO., LTD.; PATENTEE Free format text: FORMER OWNER: HUASHUO COMPUTER CO LTD Effective date: 20081107 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20081107 Address after: No. 233, Jin Feng Road, Suzhou, Jiangsu Province, zip code: 215011 Co-patentee after: Pegatron Corporation Patentee after: Ming Shuo computer (Suzhou) Co., Ltd. Address before: Postcode of Taiwan, Taipei: Patentee before: Huashuo Computer Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031203 Termination date: 20111216 |