CN2584388Y - Chip cutting machine - Google Patents

Abstract

The utility model relates to a chip cutting device without cooling. The device includes: a wafer positioning system, a dragging system, a control panel, a display system, and a television monitoring system; it is characterized in that it also includes a wafer cutting system. The wafer cutting system is composed of a high-speed DC motor, a diamond blade fixture, a speed measuring device and a speed control device for the high-speed DC motor. The speed control device of the high-speed DC motor includes: a light baffle plate with a light hole, a digital frequency meter, a sensor and a potentiometer, and the speed of the motor is controlled by adjusting the power supply voltage through the potentiometer. The cutting speed and traveling speed of the device can be adjusted, successfully solving the problem of cutting wafers without cooling, and the utility model has a reasonable preparation structure, easy operation, safe use, and low cost. It provides a new type of cutting equipment for conductive devices, and also provides a new type of cutting equipment for the semiconductor industry and solar cell industry.

Description

A wafer cutting machine

technical field

The utility model relates to a wafer cutting device, in particular to a cooling-free wafer cutting device.

Background technique

A commonly used wafer cutting device uses a high-speed pneumatic rotating shaft to drive a diamond blade. Because the wafer to be cut has high hardness and is easy to break, common wafer cutting machines use high-speed rotating blades (for example, 300,000 rpm), which generate a lot of heat during cutting, and forced cooling is required. To cool the high-speed blade, water, oil and other cooling methods are usually used to prevent the diamond grinding wheel from burning. However, some wafers are easily damaged by coolant, such as gemstone wafers with high-temperature superconducting thin films, various high-temperature superconducting devices, etc., so they cannot be cut by conventional methods.

Contents of the invention

The purpose of the utility model is to solve the contradiction that the commonly used cutting device must adopt forced cooling and the cooling liquid will damage some wafers, so as to provide a new non-cooling wafer cutting device.

The purpose of this utility model is achieved in that the utility model has no cooling wafer cutting device, as shown in Fig. 1 and Fig. 2, comprises: wafer positioning system, dragging system, control panel, display system, TV monitoring system; Its characteristic It is: it also includes a wafer cutting system; the four parts of the crystal positioning system, the dragging system, the crystal cutting system and the camera are installed on one side of the device, and there is a door on the side, wherein the dragging system and the Y in the crystal positioning system The direction moving table is fixedly connected, the crystal cutting system is fixed above the wafer positioning system by a bracket, and the camera is installed on the upper left of the frame; the control panel and display are installed on the other side of the device.

The crystals include: gem slices, single crystal silicon slices, quartz, glass, ceramics, superconducting thin films and superconducting devices.

The crystal positioning system is a four-dimensional mobile platform, which is composed of an X-direction mobile platform, a Y-direction mobile platform, a Z-direction mobile platform and a rotation angle mobile platform. The Y-direction mobile platform is fixed on the frame, and the X-direction mobile platform is fixed on the Y-direction mobile platform. On the mobile platform in the direction of Z, the mobile platform in the Z direction is fixed on the mobile platform in the X direction, and the mobile platform in the rotation angle is fixed on the mobile platform in the Z direction.

The wafer cutting system includes: a high-speed DC motor, a diamond blade fixture, a speed measuring device and a speed control device for the high-speed DC motor; a light barrier in the speed measuring device of the high-speed DC motor, a high-speed DC motor, a diamond blade fixture, and a , The anti-back cover is coaxially fixed on the shaft sleeve of the motor shaft.

The power of the high-speed DC motor is greater than 10W, and the speed is 10000-18000 rpm.

The blade fixture is composed of a front chuck, a rear chuck and a blade, and the beating and left-right swing of the fixture during rotation should be less than 0.05 mm.

The speed measuring device and the speed control device of the high-speed DC motor are composed of a light baffle with a light hole, a digital frequency meter, a sensor and a potentiometer. The light baffle is coaxially fixed on the tail of the motor shaft, and the sensor passes through a concave The bracket is fixed on both sides of the light baffle, and the sensor is electrically connected with the digital frequency meter.

The sensor includes: a pair of light emitting diodes; the pair of diodes are respectively placed on both sides of the light shielding plate.

The utility model has the following advantages:

(1) The utility model adopts the medium-speed cutting method, which successfully solves the problem of cutting wafers without cooling, and ensures that the cutting objects will not be polluted and damaged;

(2) The cutting speed and traveling speed of the utility model can be adjusted to meet the needs of different cutting objects;

(3) The utility model has reasonable preparation structure, easy operation, safe use and low cost.

In a word, the utility model not only provides a new type of cutting equipment for high-temperature superconducting thin film wafers and various high-temperature superconducting devices, but also provides a new type of cutting equipment for the semiconductor industry and the solar cell industry.

Description of drawings

Fig. 1, the structure diagram of the utility model without cooling wafer cutting machine

Fig. 2. Schematic diagram of the wafer cutting system in the non-cooling wafer cutting machine of the present invention

Figures indicate:

1. Rack 2. Display 3. Control panel

4. Diamond blade 5. Rotation angle moving table 6. Z direction moving table

7. X-direction mobile platform 8. Y-direction mobile platform 9. Motor shaft

10. Shaft sleeve 11. Anti-back cover 12. Chuck

13. Light baffle 14. Light hole 15. Motor

Specific Embodiments Embodiment 1

Make a wafer cutting system in a non-cooling wafer cutting machine, as shown in Figure 2, at first, the shaft sleeve 10 is installed on the motor shaft, then, the diamond blade 4, the anti-return cover 11 and the chuck 12 are installed on the shaft sleeve 10, the light baffle 13 is coaxially fixed on the tail of the motor shaft, the sensor is fixed on both sides of the light baffle through a concave bracket, and the sensor is electrically connected with the digital frequency meter. In this embodiment, a DC motor with a power greater than 10W and an adjustable rotational speed of 10,000-18,000 rpm is used; an ST/C digital frequency meter is electrically connected to an infrared light-emitting diode pair to form a rotational speed measurement system; the motor power supply adopts a voltage Adjustable DC stabilized voltage source, the maximum current is 3 amps, and the voltage range is 10-18 volts. The potentiometer on the motor power supply controls the speed of the motor by adjusting the power supply voltage. Example 2

Utilize the wafer cutting system that embodiment 1 makes, make a non-cooling wafer cutting machine, as shown in Figure 1, crystal positioning system, dragging system, crystal cutting system and video camera four parts are installed on the left side of this device, this side There is a door, which is closed when the cutting machine is working. The wafer device is on the crystal positioning system, and the drag system is composed of a small low-speed DC motor and a belt speed reduction wheel. The crystal positioning system is fixed on the drag system, and its Y-direction translation platform 8 is connected with the belt speed reduction wheel. The crystal cutting system is fixed above the wafer positioning system by a bracket; the TV monitoring system uses SP-709 TV monitor 2 and SP-926PA camera, and the camera is installed at the left end of the fixed bracket of the crystal cutting system; the control panel 3 and the display 2 mounted on the right side of the unit. Among them, the wafer positioning system uses a four-degree-of-freedom wafer cutting table, which consists of a X-direction translation table 7 (stroke 100mm, moving speed ≤ 0.1mm/s, center load 10kg) model 01TS, and a Y-direction translation table 8 (model 02TSM12). Stroke 50mm, manual speed control), model 02TV021 Z direction lifting platform 6 (stroke 13mm, manual speed control) and model 02RM0141 θ angle precision rotary table 5 (range 360 degrees, minimum reading 2'), X direction The translation platform 7 uses a digital method to display the displacement result, the base of the Z-direction lifting platform 6 is positioned by a spiral micrometer rod, and the angular precision rotary table 5 is positioned by a vernier.

Claims (7)

1, a kind of nothing cooling wafer cutter sweep, this device comprises: wafer orientation system, dragging system, control panel, display system, TV monitor system; Wherein, wafer orientation system, dragging system and three parts of video camera are installed in a side of this device, this side has one, dragging system is fixedlyed connected with the Y direction travelling carriage in the wafer orientation system, video camera is installed in the upper left side in the frame, and control panel and display are installed in the opposite side of this device; It is characterized in that: comprise that also one is fixed on the wafer diced system of the top of wafer orientation system, this system comprises: the speed measuring device and the speed-controlling device of high speed direct current generator, blade jig, high speed direct current generator; Light barrier in the speed measuring device of high speed direct current generator, high speed direct current generator, blade jig, anti-back lid be coaxial to be fixed on the axle sleeve of motor shaft.

2, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: the wafer that is cut comprises: jewel sheet, monocrystalline silicon piece, quartz, glass, pottery, superconducting thin film and superconductive device.

3, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: described wafer orientation system is four-dimensional travelling carriage, form by directions X travelling carriage, Y direction travelling carriage, Z direction lifting platform and angle of rotation travelling carriage, Y direction travelling carriage is fixed on the frame, the directions X travelling carriage is fixed on the Y direction travelling carriage, Z direction lifting platform is fixed on the directions X travelling carriage, and the angle of rotation travelling carriage is fixed on the Z direction lifting platform.

4, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: the power of described high speed direct current generator is 10000-18000 rev/min greater than 10W, rotating speed.

6, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: described blade jig, form by preceding chuck, back chuck and diamond blade, before diamond blade is fixed between chuck and the back chuck, jig takes place in rotation beats and swings less than 0.05mm.

7, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: the speed measuring device of described high speed direct current generator and speed-controlling device, form by the light barrier that has a light hole, digital frequency meter, sensor and potentiometer, the coaxial afterbody that is fixed on motor shaft of light barrier, sensor is fixed on the light barrier both sides by a female bracket, and sensor is electrically connected with digital frequency meter.

8, according to the described nothing cooling of claim 7 wafer cutter sweep, it is characterized in that: described sensor comprises: a pair of light emitting diode; This places the light barrier both sides respectively to diode.