CN2560019Y

CN2560019Y - Pump type radiator

Info

Publication number: CN2560019Y
Application number: CN 02230319
Authority: CN
Inventors: 王勤文
Original assignee: Individual
Current assignee: Individual
Priority date: 2002-04-01
Filing date: 2002-04-01
Publication date: 2003-07-09
Anticipated expiration: 2012-04-01

Abstract

The utility model discloses a pump-type radiator, which is a cooling system specially used for dissipating the heat generated by the central microprocessor (CPU) of a desktop computer when it is working. In addition to effectively avoiding the limited heat dissipation area of the known open heat dissipation fins, so that the heat dissipation capacity cannot be concentrated, it also breaks through the known open heat dissipation fins that are solid materials and transfer heat in a heat conduction manner, and the speed is much slower than the heat generated by the central microprocessor when it is working by the heat convection cycle. The overall structure of the utility model is composed of an outer ring heat conductor formed in a cylindrical ring shape, heat dissipation fins in the outer ring heat conductor, a pump and a fan, so that it has a heat dissipation function of forced fluid flow, which can effectively dissipate heat in a circulating manner, increase the heat dissipation area and completely discharge heat energy from the computer.

Description

Pump formula heating radiator

Technical field

The utility model relates to a kind of pump formula heating radiator, especially refer to that a kind of central microprocessor that is exclusively used in desktop PC produces the cooling system of heat when working, has the heat sinking function of forcing fluid to flow, can strengthen heat sinking function, avoid heat-sinking capability to concentrate, can effectively heat energy thoroughly be discharged computing machine in modes such as circulating heat radiation, increasing area of dissipations.

Background technology

Passed through in Millennium epoch in 2000, development in science and technology is swift and violent, all daily lifes, office, leisure ... Deng, all closely related with development of science and technology, and the progress of science and technology mainly finds expression in the invention of computing machine, especially, the central microprocessor that computing machine possessed (CPU) influence power is infiltrated among personal lifestyle already fully.

Because the quick upgrading of computer industry, make computing machine have more powerful operation capacity, and the processing speed of central microprocessor also increases day by day, but the heat that it produced also increases thereupon, therefore, for keep central microprocessor can be under the temperature of its permission operate as normal, designed the radiating fin that many kinds increase area of dissipations, adapt to the higher central microprocessor of thermal value.

Yet, the thermal source heat dissipation problem that is produced in the central microprocessor utilization at present, under the lifting again and again of processing speed, the heat sinking function of traditional heat-dissipating fin becomes and more and more can not satisfy the demand.

As shown in Figure 1, known desktop PC, the type of cooling of general central microprocessor 6 all adopts the radiating fin 2 ' of open vertical type, and the thermal source that computing machine body central microprocessor 6 is produced is dissipated to radiating fin 2 ' by bottom surface 1 ' row, and a fan 4 heat radiations of arranging in pairs or groups.

Or as shown in Figure 2, the radiating fin 2 of circle distribution " with central cylindrical heat conductor 1 " be the center, the fan 4 of arranging in pairs or groups reaches whole heat sinking function to the circumference distribution.

Just, above-mentioned known radiating fin, the efficient of heat radiation is connected to an enclosed planar because of radiating fin with respect to the fan another side, and the heat-sinking capability in the finite space can't concentrate, and What is more, known open radiating fin, the heat that produces of discharging because of open radiating fin is a solid matter, is conducted heat with heat exchange pattern, the heat of generation when speed is much slower than the thermal convection circulation institute central microprocessor that discharge and operates is so its radiating efficiency is not good.

If deeply inquire into the real practicality of heat radiation instrument of this known computer main frame, defective is heavy for a long time really, except that the problem with aforementioned actual use general character, especially for the problem that prolongs organism life-span, can not reach effect really.

So, the property improved of the above-mentioned defective of the present utility model people's thoughts, the spy concentrates on studies and cooperates theoretical utilization, proposes a kind of reasonable in design and effectively improve the utility model of above-mentioned defective finally.

Summary of the invention

Fundamental purpose of the present utility model, be to provide a kind of pump formula heating radiator, for a kind of enclosure space is concentrated heat radiation, and has the heat sinking function of forcing fluid to flow, both can strengthen heat sinking function, avoid heat-sinking capability to concentrate, can effectively dispel the heat, strengthen area of dissipation in a looping fashion and heat energy thoroughly be discharged function such as computing machine, more increased convenience of the present utility model and radiating efficiency.

To achieve the above object, the utility model provides a kind of pump formula heating radiator, includes: an outer shroud heat conductor, have hollow position in it, and be provided with liquid coolant in this hollow position; The even number radiating fin is positioned at this outer shroud heat conductor; And a pump, being connected with the hollow location-appropriate of this outer shroud heat conductor, the liquid circulation that can drive in this hollow position flows, and thermal source is shifted rapidly, has the moving heat sinking function of forced fluid flow.

Aforesaid pump formula heating radiator, be characterized in that the outer shroud heat conductor comprises a pedestal bottom surface and a ring-type wall, the accommodation space of ring-type wall inner edge tool hollow, accommodation space is through to outer shroud heat conductor two ends, and radiating fin is positioned at the accommodation space of outer shroud heat conductor.

Aforesaid pump formula heating radiator is characterized in that outer shroud heat conductor one end is provided with a fan.

Aforesaid pump formula heating radiator is characterized in, pump is to share a motor with fan to drive.

Aforesaid pump formula heating radiator is characterized in, radiating fin is to penetrate by outer shroud heat conductor internal face is prominent, and gathers to the radiation of the center of circle of outer shroud heat conductor.

Aforesaid pump formula heating radiator is characterized in, pump is to adopt to include mode and be installed in the radiating fin.

Aforesaid pump formula heating radiator is characterized in that pump has a motor, this motor driven pump operation.

Aforesaid pump formula heating radiator is characterized in that pump also can be adopted external mode and be installed in outer shroud heat conductor outside.

Aforesaid pump formula heating radiator is characterized in, pump is to be connected with pipe-connecting mode with the hollow position of outer shroud heat conductor with pipeline.

Aforesaid pump formula heating radiator is characterized in, pump also can be connected with snap fit with the hollow position of outer shroud heat conductor by joint.

The beneficial effect of above technical scheme is, strengthened heat dissipation, avoids heat-sinking capability to concentrate, and can effectively dispel the heat, strengthen area of dissipation in a looping fashion and heat energy is thoroughly discharged computing machine, more increased the convenience and the radiating efficiency that use.

Below in conjunction with the drawings and specific embodiments the utility model is further specified.

Description of drawings

Fig. 1 is the stereoscopic synoptic diagram of known radiating subassembly;

Fig. 2 is the stereoscopic synoptic diagram of another kind of known radiating subassembly;

Fig. 3 is the front elevation of the utility model first embodiment;

Fig. 4 is the side view of the utility model first embodiment;

Fig. 5 is the front elevation of the utility model second embodiment;

Fig. 6 is the side view of the utility model second embodiment;

Fig. 7 is the front elevation of the utility model the 3rd embodiment;

Fig. 8 is the side view of the utility model the 3rd embodiment.

Embodiment

In Fig. 3 and Fig. 4, the utility model provides a kind of pump formula heating radiator, including an outer shroud heat conductor 1, even number radiating fin 2, a pump 3 and a fan 4 combines, and be positioned at central microprocessor 6 tops, drive liquid coolant 13 with pump 3 and flow, the heat that is produced during 6 work of circulation heat radiation central microprocessor.

Outer shroud heat conductor 1, be to make with the good material of thermal conductivity, comprise a pedestal bottom surface 11 and a ring-type wall 10, wherein ring-type wall 10 is that a cylinder (post) ring-type is shaped, the accommodation space of ring-type wall 10 inner edge tool hollows, the accommodation space of hollow also is through to outer shroud heat conductor 1 two ends, and ring-type wall 10 inner loop are provided with a hollow position 12, can pour into liquid coolant 13 in this hollow position 12, to strengthen the heat conduction and the refrigerating function of outer shroud heat conductor 1.

Radiating fin 2 is positioned at the accommodation space of outer shroud heat conductor 1, be to penetrate by outer shroud heat conductor 1 internal face is prominent, and gather to the radiation of the center of circle of outer shroud heat conductor 1, and be reserved with the space that is enough to install pump 3 in radiating fin 2 centers, the radiating fin 2 of present embodiment is the radiant type design, be not the radiant type design but do not limit, can do other suitable equivalence yet and change.

Pump 3 can adopt the mode of including to be installed in the radiating fin 2, and this pump 3 has a motor 30, can borrow this motor 30 driving pumps 3 runnings, and this pump 3 also can be shared a motor with fan 4.This pump 3 also is connected with the hollow position 12 of outer shroud heat conductor 1 with pipeline 31 and pipeline 32, so that the liquid coolants 13 that driven in the hollow position 12 by pump 3 circulate.

Fan 4 is ring-type wall 10 1 ends that are arranged at outer shroud heat conductor 1, can rotate by drive fan 4 and produce air current flow, in order to assist radiating fin 2 heat radiations, this pump 3 can use motor separately with fan 4, or both share a motor, promptly this pump 3 and fan 4 can use the motor of two ends force-output shaft, so as to reducing cost and reducing the motor installing space; Form pump formula heating radiator of the present utility model by above-mentioned forming.

In Fig. 3 and Fig. 4, pump formula heating radiator of the present utility model, be to utilize suitable fastener 5 to be arranged at central microprocessor 6 tops, also can be connected with suitable heat pipe (figure slightly) in outer shroud heat conductor 1 two ends, the thermal source that when central microprocessor 6 operates, is produced, pedestal bottom surface 11 through outer shroud heat conductor 1 conducts heat to ring-type wall 10, rotation by fan 4 produces air current flow, in order to assist radiating fin 2 heat radiations, the liquid coolant 13 that can borrow pump 3 to drive in the hollow position 12 circulates simultaneously, the thermal source that central microprocessor 6 produces is shifted rapidly, and, waste heat is imported radiating fin 2 with the recycle design radiator structure of similar thermal convection.

Simultaneously, the rotation of fan 4 more can be strengthened the function of gas forced flow, the radiating fin 2 of will flowing through, order about hot gas and cold air and produce forced flow, cold air flows into via the A direction, hot gas flows out via the B direction, in the hope of making cold and hot gas forced flow, so that make it have the moving heat sinking function of forced fluid flow, both can strengthen heat sinking function, avoid heat-sinking capability to concentrate, can effectively dispel the heat, strengthen area of dissipation in a looping fashion and heat energy is thoroughly discharged computing machine, more increased convenience of the present utility model and efficient.

In addition, another embodiment has been shown in Fig. 5 and Fig. 6, pump 3 of the present utility model also can be adopted external mode and be installed in outer shroud heat conductor 1 outside, this pump 3 is to be connected with pipe-connecting mode with the hollow position 12 of outer shroud heat conductor 1 with

pipeline

33 and 34, so that the liquid coolants 13 that drive in the hollow position 12 by pump 3 circulate.

In addition, in the 3rd embodiment of Fig. 7 and Fig. 8, pump 3 of the present utility model also adopts external mode to be installed in outer shroud heat conductor 1 outside, this pump 3 is to be connected with snap fit with the hollow position 12 of outer shroud heat conductor 1 with

joint

35 and 36, so that the liquid coolants 13 that drive in the hollow position 12 by pump 3 circulate.

In sum, the utility model is a rare novel product in fact, has practicality on the industry, novelty and progressive, meets novel patented claim important document fully.

The above only is a preferable possible embodiments of the present utility model, is not so limits claim of the present utility model, and equivalent structures that all utilization the utility model instructionss and accompanying drawing content have been done change, and all in like manner are included in the scope of the present utility model.

Claims

1. A pump radiator, characterized in that it comprises:

An outer ring heat conductor, which has a hollow position, and the hollow position is provided with cooling liquid;

a plurality of cooling fins located in the outer ring heat conductor; and

A pump is properly connected with the hollow part of the outer ring heat conductor to drive the cooling liquid in the hollow part to circulate.

2. The pump radiator according to claim 1, wherein the outer ring heat conductor comprises a bottom surface of a base and an annular wall surface, and the inner edge of the annular wall surface has a hollow accommodation space for accommodating The placement space runs through to the two ends of the outer ring heat conductor, and the heat dissipation fins are located in the accommodation space of the outer ring heat conductor.

3. The pump radiator according to claim 1, wherein a fan is arranged at one end of the outer ring heat conductor.

4. The pump radiator according to claim 3, wherein the pump is driven by a motor shared with the fan.

5. The pump radiator according to claim 1, wherein the heat dissipation fins protrude from the wall surface of the heat conductor of the outer ring, and radiate toward the center of the heat conductor of the outer ring.

6. The pump radiator according to claim 1, characterized in that, the pump is installed in the heat dissipation fins in a built-in manner.

7. The pump radiator according to claim 1, wherein the pump has a motor, and the motor drives the pump to operate.

8. The pump radiator according to claim 1, wherein the pump is externally connected to the outer ring heat conductor.

9. The pump radiator as claimed in claim 8, characterized in that the pump is connected to the hollow part of the outer ring heat conductor by means of connecting pipes.

10. The pump radiator according to claim 8, characterized in that the pump is connected to the hollow part of the heat conductor of the outer ring by means of clamping.