CN2559100Y - Assembly component ceramic substrate - Google Patents

Abstract

The utility model relates to an equipment subassembly base plate, especially indicate an equipment subassembly ceramic substrate, this ceramic substrate has the appearance hole of predetermined quantity, be provided with functional electronic component on the other ceramic substrate in appearance hole, the downthehole packing of above-mentioned appearance has the conducting resin, the conducting resin has good adhesion and electric conductivity with the ceramic substrate, can supply follow-up electrode lug or electrode pin to use, can conduct electronic component's signal simultaneously, the design of prefabricated appearance hole conducting resin can make the follow-up equipment process of subassembly reduce and reduce cost, the one deck protective layer has on this functional electronic component, can protect electronic component and electronic component wire electrode and the contact zone of appearance hole conducting resin, improve subassembly life-span and the qualification rate.

Description

Assembly component ceramic substrate

Technical field:

The utility model relates to an assembly assembly substrate, in particular to an assembly assembly ceramic substrate with excellent mechanical strength and good signal conduction performance.

Background technique:

As electronic products continue to become "thin, thin, and small", the precision and size of various components and processing equipment used in them are becoming increasingly strict, and they are developing in the direction of ultra-precision, high-density, high-speed, intelligent, and miniaturization. Compared with screen printing, the film thickness is more than 5 μm-10 μm, while the film thickness produced by semiconductor compatible manufacturing processes such as physical vapor deposition technology (PVD) or chemical vapor deposition technology (CVD) is only between 0.01 μm and 1 μm. , the difference between the two is 10 times or even 100 times. This is also the reason why screen printing technology and semiconductor integration technology are distinguished by thick film and thin film. membrane technology. The thick film is made by using the screen frame with a 1:1 pattern as the master, and the scraper squeezes the ink through the master, directly prints the pattern on the ceramic substrate, and then goes through drying, sintering and other production processes. The thin film is produced by using the physical vapor deposition technology (PVD), which has been used for a long time for semiconductors, including sputtering (Sputter Deposition), evaporation (Evaporation) and other production processes, and chemical vapor deposition technology (CVD) to generate thin films. Due to these production processes Cloth-like screen printing has area-selective coating characteristics, and the required pattern usually needs to be formed by subsequent photolithography (Photo Lithography) technology. Just as active components such as ICs can be used to manufacture complex circuits with high component density by semiconductor integration technology, thin-film passive composite components are combined with the thin-film manufacturing process of generating resistive layers, dielectric layers, metal layers and conductive layers, and forming resistance, capacitance, and inductance. The photolithographic etching process of the pattern is made. Compared with the thick film production process that requires high-temperature sintering, the production process of the thin film can be controlled below 400°C, and the production process can be adjusted according to the characteristics of the substrate used, so that the thin film passive assembly can be produced in different product applications. on different substrates. The available substrates include silicon chips, alumina ceramic substrates, glass substrates, and even CB substrates. This feature also makes thin-film composite passive components applicable to a wide range of applications. However, the surface roughness of the substrate should be below Ra<0.3μm, especially when making capacitors. If the roughness is too high, the thin film dielectric layer is easy to penetrate the hillock of the bottom electrode, forming a short circuit or causing a breakdown voltage. low phenomenon. Similarly, if the surface roughness of the component substrate is too high, it is easy to cause an increase in noise at high frequencies and reduce high-frequency characteristics. This is something that needs to be paid attention to when selecting a substrate. Take resistors as an example: Resistors are divided into traditional resistors and chip resistors according to their size. Since electronic products are designed to be light and thin, the requirements for internal components are also miniaturized. Therefore, manufacturers are turning to the production of chip resistors. Chip resistors are divided into thick film production process and thin film production process due to different production process methods. Currently, most Taiwanese manufacturers use thick film production process and use screen printing technology to print oxide on alumina substrate. Due to the stability of this technology Low temperature coefficient and high temperature coefficient must constantly use high temperature sintering process, so the cost is higher than thin film. As one of the three passive components, the resistor is an important electronic component in electronic and electrical products, and its main function is to adjust the voltage and current in the circuit. The resistors currently produced can be roughly divided into four categories: carbon film resistors, metal carbon film resistors or metal oxide film resistors, ceramic resistors, and variable resistors. Among them, ceramic resistors include chip resistors, chip row resistors, and array resistors. Depending on the manufacturing process, it can be divided into thick film ceramic resistors and thin film ceramic resistors. Thick-film ceramic resistors are made by printing special conductive coatings, dielectric value insulating coatings, and resistive coatings as single or network lines on ceramic substrates, and then cutting them after baking at a certain temperature; thin-film ceramic resistors are based on Vacuum coating technology evenly coats the resistance value on the ceramic substrate. Because of the advantages of high precision, high stability, wide adjustable range of resistivity, and low temperature coefficient of thin film ceramic resistors, it is an active development direction for many manufacturers. The alumina ceramic substrate is mainly used on ceramic resistors as a support for the conductive coating in the resistor. The production process is to use a pure alumina ceramic substrate to print a high-quality metal thick film conductor, and the outer layer is coated with a glass glaze protection body. , the quality and stability of uniform crystals are produced, and the alumina ceramic substrate used has high temperature resistance and stable substrate characteristics, so it is still an alternative. However, since the ceramic surface is usually not very flat, it is desired to dispose functional electronic components on the uneven ceramic substrate. The mechanical strength of the combination will be insufficient, and it must be packaged again in other manufacturing processes. In addition to increasing the cost, the packaging process will also affect the quality of the electronic components produced (such as poor signal conduction), and the overall pass rate of the product cannot be achieved. Improve, this is the biggest shortcoming of prior art.

Invention content:

The purpose of the utility model is to overcome the above defects, and provide a ceramic substrate for assembly components, which has excellent mechanical strength, good signal conductivity, and high yield of products.

In order to achieve the above purpose, the utility model is realized through the following technical scheme: the ceramic substrate of the assembled component has a predetermined number of cavities on the ceramic substrate, functional electronic components are arranged on the ceramic substrate next to the cavities, and the cavities are filled with conductive There is a layer of protective layer on the functional electronic component, and the pin metal or the bump electrode can be connected on the conductive glue, and the ceramic substrate can also be a glass substrate.

Compared with the prior art, the utility model has the following advantages:

1. Excellent bonding mechanical strength;

2. Good signal conductivity;

3. High qualification rate of products;

4. Reduce production costs;

5. More controllable production process.

Description of drawings:

Fig. 1 is a cross-sectional view of Embodiment 1 of the ceramic substrate of the assembly assembly of the present invention.

Fig. 2 is the implementation state of Embodiment 1 of the ceramic substrate of the utility model assembly assembly

Sectional view.

Fig. 3 is the implementation status of Embodiment 1 of the ceramic substrate assembly assembly of the present invention

state front view.

Fig. 4 ceramic substrate of the assembly assembly of the utility model is the implementation state of embodiment 1

side view.

Fig. 5 is a section of another embodiment of the ceramic substrate of the assembly assembly of the present invention

picture.

1-ceramic substrate 2-hole

3-Functional electronic components 4-Conductive adhesive

5-protective layer 6-pin metal

7- Cutting line

Detailed ways:

Below in conjunction with accompanying drawing and embodiment the utility model is described further.

First please refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4, the assembly assembly ceramic substrate that the utility model refers to mainly includes ceramic substrate 1 (glass substrate also can be); Functional electronic components 3, such as resistors, inductors, capacitors, etc., are arranged on the surface of the ceramic substrate next to the cavity 2, which may be thick film electronic components or thin film electronic components. The above-mentioned cavity 2 is filled with conductive glue 4, which can be silver glue, metal glue, glass conductive glue, etc., which have both conductive and fixing functions. The conductive glue 4 and the ceramic substrate 1 have good adhesion and conductivity. It can be used for subsequent electrode bumps or electrode pins, and can conduct signals of electronic components at the same time. The design of the prefabricated hole conductive adhesive can reduce the subsequent assembly process of the components and reduce the cost, so as to bond the above-mentioned functional electronic components 3 and the ceramic substrate 1, in addition to increasing the adhesion between the above-mentioned functional electronic components 3 and the ceramic substrate 1 In addition, it also has the function of conducting the signal of the functional electronic component 3. The functional electronic component 3 has a layer of protection layer 5, which not only protects the electronic component 3, but also protects the contact area between the lead electrode of the electronic component and the conductive glue in the hole. There is a pin metal 6 (such as solder balls) on the top of the conductive adhesive 3 , and no other packaging is required except for solder ball bonding of the pin metal 6 or fabrication of bump electrodes.

What Fig. 5 shows is another embodiment of the utility model. There is an unbroken cutting line 7 at the lower end of the cavity 2 of the ceramic substrate 1. After the functional electronic components are loaded on the ceramic substrate, the ceramic substrate 1 can be broken from the cavity 2 through the cutting line 7, and the broken part can be reassembled. Processing, that is, forming electronic components with conductive electrodes at the left and right ends, can also improve the mechanical strength, signal transmission ability and product qualification rate of the product.

Claims (5)

1. A ceramic substrate for assembly components, mainly comprising a ceramic substrate, characterized in that: a predetermined number of holes are arranged on the ceramic substrate, and functional electronic components are arranged on the ceramic substrate next to the holes. 2. The ceramic substrate according to claim 1, wherein the cavity is filled with conductive glue. 3. The ceramic substrate according to claim 1, wherein a protective layer is provided on the functional electronic component. 4 . The ceramic substrate according to claim 2 , wherein pin metal or bump electrodes can be connected to the top of the conductive adhesive. 5. The ceramic substrate according to claim 1, wherein the lower end of the cavity has an unbroken cutting line.

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