CN2558190Y - Heat sink fastener - Google Patents

Abstract

A radiator fixing device includes a fixing frame and a fixing frame. The fixing frame includes a main body and a first positioning column and a second positioning column protruding from the main body, the top of the first positioning column is provided with a ring groove, and the center of the top of the second positioning column is provided with a screw hole; The frame includes a pressing part and a first fixing part and a second fixing part extending from the pressing part, the first fixing part and the second fixing part are provided with fixing holes; the base of the radiator is provided with positioning hole, after the first positioning column and the second positioning column of the fixing frame pass through these positioning holes, the fixing hole of the first fixing part is engaged in the ring groove of the first positioning column to fix the first fixing part, using a The screw passes through the fixing hole of the second fixing part and then is screwed into the screw hole of the second positioning column to fix the second fixing part. In this way, the fixing frame and the fixing frame clamp and fix the radiator to the chip surface of a circuit board.

Description

Radiator Fixture

【Technical field】

The utility model relates to a heat sink fixing device, in particular to a heat sink fixing device which clamps and fixes the heat sink to the chip surface of a circuit board through a fixing frame and a fixing frame.

【technical background】

The CPU is the nerve center of the computer to process information. Whether the overall performance of the computer can be improved depends largely on the performance of the CPU. Therefore, the introduction of high-frequency and high-speed CPUs has become an inevitable trend. However, high frequency and high speed will make the CPU generate more and more heat, further increasing the internal temperature of the computer, which seriously threatens the stability of the CPU operation. In order to ensure the normal operation of the CPU, it must be discharged in time. For this reason, the industry often installs heat sinks directly on the surface of the CPU to absorb the heat generated by the CPU.

It is known that there are many ways to install the heat sink on the CPU. Among them, the widely used fixing method is to provide barbs on the periphery of the heat sink and a flange on the periphery of the connector that fixes the CPU. The barb of the heat sink is fastened to the flange of the CPU connector to fix it. However, the fastening method of the barb and the flange must use a large force to press the heat sink on the CPU. If the operation is careless, excessive force or The direction deviation is easy to damage the precision CPU. Therefore, the heat sink must be carefully and slowly installed on the CPU during assembly, thus reducing the assembly efficiency.

In order to improve assembly efficiency, some companies use simple metal sheets to fix the heat sink, such as the fixing device disclosed in Taiwan Patent Application No. 87221090. The metal sheet is provided with a pressing part, and hooks extend along the two ends of the pressing part. Use the hooks at both ends to extend into the preset card holes of the heat sink, and hook the protruding hooks or grooves on both sides of the CPU connector, so that the metal sheet produces a bending elastic effect and presses against the heat sink. However, in this assembly method, a special tool is needed to assist the operation so that the hook of the metal sheet and the groove of the CPU connector can be engaged or released, and the operation is relatively inconvenient. Moreover, the structure of the metal sheet is too thin and fragile. When clamping the radiator, the clamping force will be insufficient and uneven. Moreover, the metal shrapnel is prone to fatigue and permanent deformation when used for a long time, which affects the clamping effect.

【Content of invention】

The purpose of the utility model is to provide a radiator fixing device with simple buckling operation, labor-saving, firm buckling and uniform buckling force.

The purpose of the utility model is achieved through the following technical solutions: the radiator fixing device of the utility model is used for fixing a radiator to the chip surface of a circuit board, which includes a fixing frame and a fixing frame. Wherein the radiator includes a base, and the base is provided with positioning holes at appropriate positions; the fixing frame includes a main body and a first positioning column and a second positioning column protruding from the main body, the first positioning column The top is provided with a ring groove, and the center of the second positioning column is provided with a screw hole; the fixed frame includes a pressing part and a first fixing part and a second fixing part extending from the pressing part, the first fixing part and the second fixing part Fixing holes are provided on the second fixing part, the fixing hole of the first fixing part is composed of a round hole and a slot connected with the round hole, the fixing hole of the second fixing part is in the shape of a slot, wherein the The first positioning column and the second positioning column pass through the positioning hole of the radiator base, and the slot-shaped fixing hole of the first fixing part is engaged with the ring groove of the first positioning column to fix the first fixing part. The screw passes through the slit-shaped fixing hole of the second fixing part and then screwed into the screw hole of the second positioning column to fix the second fixing part. In this way, the fixing frame and the fixing frame clamp and fix the heat sink to the chip of the circuit board surface.

The advantage of the radiator fixing device of the utility model is that fast positioning can be realized by using the positioning column and the positioning hole, and there is no need to use a large force to press the radiator before fixing the radiator, so the chip will not be damaged; moreover, the radiator Each part of the metal shrapnel in the pressing part of the fixing frame is in contact with the radiator, so that the pressure on the chip can be ensured to be balanced; finally, the screw locking structure is adopted to increase the bonding force between the fixing frame and the fixing frame, thereby improving the combination of the radiator fixing device fixed stability.

【Description of drawings】

The utility model will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

Fig. 1 is a three-dimensional exploded view of the radiator fixing device of the present invention.

Fig. 2 is a three-dimensional combined view of the radiator fixing device and the circuit board of the present invention.

【Detailed ways】

Please refer to Fig. 1, the radiator fixing device of the present utility model comprises a fixing frame 20 and a fixing frame 30, and it is used for fixing a radiator 10 to the chip 50 surface on the circuit board 40 and assisting the chip 50 to dissipate heat, the circuit board 40 is provided with a through hole 42 at each of the four corners of the chip 50 .

The heat sink 10 includes a base 12 and heat dissipation fins 14 vertically extending upward from the base 12 . The base 12 is provided with positioning holes 16 corresponding to the through holes 42 of the circuit board 40 .

The fixing frame 20 includes a main body 22 in the shape of a cross, an opening 222 runs through the center of the main body 22, and two first positioning posts 24 and two second positioning posts 26 protrude vertically upwards from the four corners thereof. The height of the positioning column 24 is higher than that of the second positioning column 26. The first positioning column 24 and the second positioning column 26 can pass through the through hole 42 of the circuit board 40 and be accommodated in the positioning hole 16 of the heat sink 10. A ring groove 242 with a smaller diameter is formed on the top of the first positioning post 24 , and a threaded hole 262 is formed in the center of the top of the second positioning post 26 , and the thread length of the screw hole 262 is a certain value. The fixing frame 20 is equipped with a buffer pad 28 around the opening 222 and at the bottom of the first positioning column 24 and the second positioning column 26, and the buffer pad 28 can prevent the circuit board from being damaged when the fixing frame 20 is combined with the circuit board 40. 40, and can play the role of insulation.

The fixing frame 30 is formed by bending a metal elastic sheet, which includes an H-shaped pressing portion 32, and the pressing portion 32 is bent downward from the four corner ends on both sides to form two first fixing portions 34 and two second fixing portions. Two fixing portions 36 , the first fixing portion 34 and the second fixing portion 36 are L-shaped. The first fixing portion 34 on one side is provided with a fixing hole 340 at its base, and the fixing hole 340 consists of a round hole 342 on the inner side and a slot 344 connected to the round hole 342 on the outer side. The diameter of the hole 342 is slightly larger than the diameter of the first positioning post 24, and the width of the slot 344 is between the diameter of the first positioning post 24 and the diameter of the ring groove 242 of the first positioning post 24. The round hole 342 of the fixing part 34 allows the first positioning post 24 to pass through; the second fixing part 36 on the other side offers a slot-shaped fixing hole 362 at its bottom edge, and the width of the fixing hole 362 is wider than that of the second positioning column. The diameter of the post 26 is small but larger than the diameter of the threaded hole 262 .

The radiator fixing device of the present invention further includes a screw 264 matching with the screw hole 262 of the second positioning post 26 , and the screw 264 has a threaded portion 266 .

Please refer to FIG. 1 and FIG. 2 together. When assembling, the first positioning column 24 and the second positioning column 26 of the fixing frame 20 should pass through the through hole 42 of the circuit board 40, and then the positioning hole 16 of the heat sink 10 should be Align the through hole 42 of the circuit board 40 and allow the first positioning post 24 and the second positioning post 26 to pass through the positioning hole 16, and then place the heat sink 10 on the surface of the chip 50. At this time, the first positioning post 24 and the top of the second positioning post 26 are all exposed on the upper side of the substrate 12 of the heat sink 10, and then the round hole 342 of the first fixing part 34 of the fixing frame 30 is encased in the first positioning post 24 and the round hole 342 is positioned at the first position. Position the ring groove 242 of the positioning column 24, and then push the fixing frame 30 so that the slot 344 of the first fixing part 34 is engaged in the ring groove 242 of the first positioning column 24, so that the first fixing of the fixing frame 30 The portion 34 is fixed, but at this time the fixing frame 30 has not exerted force on the radiator 10 . Then, the fixing frame 30 is tightened on the other side, and the threaded portion 266 of the screw 264 passes through the slot-shaped fixing hole 362 of the second fixing portion 36 and is further screwed into the screw hole 262 of the second positioning post 26, like this, The second fixing portion 36 of the fixing frame 30 is also fixed. When the screw 264 is screwed into the threaded hole 262, the screw 264 slowly presses the second fixing portion 36 of the fixing frame 30, and the H-shaped pressing portion 32 of the fixing frame 30 gradually exerts force on the radiator 10 evenly to push it pressed onto the upper surface of the chip 50 .

In the above embodiment, the height of the second positioning column 26 is lower than that of the first positioning column 24, and the diameter of the second positioning column 26 is larger than the width of the slot-shaped fixing hole 362 of the second fixing part 36. The center of the top of the positioning column 26 is provided with a screw hole 262. During assembly, the second positioning column 26 is located below the second fixing portion 36 of the fixing frame 30, and the second fixing portion 36 is fixed by cooperating with the screw 264. It can be understood that Ground, the outer surface of the top of the second positioning post can also be provided with threads, and the second fixing part of the fixing frame can be fixed by cooperating with a nut. At this time, the second positioning post and the first positioning post have the same height, and the second positioning column can pass through the slot-shaped fixing hole of the second fixing part to cooperate with the nut.

Claims (9)

1. A heat sink fixing device for fixing the heat sink to the chip surface of the circuit board, the circuit board is provided with through holes at the four corners of the chip, and the base of the heat sink is provided with positioning holes corresponding to the through holes of the circuit board, The radiator fixing device includes a fixing frame and a fixing frame, and the fixing frame includes a main body part, at least one first positioning post and a second positioning post protruding from the main body part, the top of the first positioning post is provided with a clip part, the fixing frame includes a pressing part, the pressing part extends at least a first fixing part and a second fixing part, the first fixing part and the second fixing part are respectively provided with fixing holes, the first fixing part of the fixing frame A positioning column and a second positioning column correspond to the through hole passing through the circuit board and the positioning hole of the radiator base, and it is characterized in that: the fixing hole of the first fixing part includes a round hole and a slot communicating with the round hole , the first positioning column further passes through the round hole, so that the slot is engaged with the locking part of the first positioning column, and the top of the second positioning column is provided with a screw lock part, and the screw lock part is connected with a screw lock device The fixing frame is matched and locked, so that the heat sink is clamped and fixed on the chip surface of the circuit board by the fixing frame and the fixing frame. 2. The radiator fixing device according to claim 1, wherein the fixing frame is formed by bending a metal elastic sheet, and its main body is H-shaped. 3 . The radiator fixing device according to claim 2 , wherein the first fixing portion and the second fixing portion of the fixing frame are respectively bent and extended downward from the four corners on both sides of the H-shaped pressing portion. 4 . 4 . The radiator fixing device as claimed in claim 3 , wherein the fixing hole of the second fixing part is disposed on the bottom edge of the second fixing part and is in the shape of a slot. 5 . The radiator fixing device as claimed in claim 4 , wherein a ring groove is formed on the locking portion of the first positioning post. 6 . 6 . The radiator fixing device according to claim 5 , wherein a screw hole is provided at the center of the top of the screw lock portion of the second positioning post. 7 . 7. The radiator fixing device as claimed in claim 6, wherein the length of the screw hole is a certain value, and the screw hole can be matched with a screw. 8 . The radiator fixing device according to claim 7 , wherein the width of the slot-shaped fixing hole of the second fixing portion of the fixing frame is between the diameter of the second positioning post and the diameter of the screw hole. 9 . The radiator fixing device as claimed in claim 5 , wherein the screw lock portion of the second positioning post is provided with threads on the top outer surface, and the threads can cooperate with a nut. 10 .

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