CN2463961Y

CN2463961Y - Heat tube electronic element radiator

Info

Publication number: CN2463961Y
Application number: CN 01214043
Authority: CN
Inventors: 童明伟
Original assignee: Individual
Current assignee: Individual
Priority date: 2001-01-30
Filing date: 2001-01-30
Publication date: 2001-12-05
Anticipated expiration: 2011-01-30

Abstract

The utility model relates to a parallel flow heat pipe radiator for cooling electronic element and electrical element with high heat generation density, which is composed of a heat collecting block, a plurality of parallel flow pipes, a louver fin sheet, a pressure equalizing pipe and a working medium. The lower part of the parallel flow heat pipe shares the heat collecting block which is taken as the heating section of a heat pipe, the top of the parallel flow heat pipe is communicated with the pressure equalizing pipe, and the liquid resistance and the noise of a gravity heat pipe are avoided. The utility model has the characteristics of light weight and large heat dissipating capacity.

Description

The parallel flow heat pipe electronic component radiator

The utility model relates to a kind of electronics of high heat generation density, parallel flow heat pipe electronic component radiator of electric component cooling of making.

Existing known electronics, the electric component type of cooling have natural cooling metal solid shape material radiator, and air forces the entity shape material radiator and the water-filled radiator of the cooling of flowing.First kind only depends on the free convection of air to cool off entity shape material surface, and the heat walked of loosing is extremely low; Though second kind of employing forces to flow heat dissipation capacity is improved greatly, but correspondingly the shape of radiator will adopt complicated dendroid, the volume and weight of shape material also will increase with the increase of heat dissipation capacity, particularly is subjected to the restriction of material thermal conductivity, and its maximum heat dissipation capacity also has a limit; Though the third water-filled radiator radiating effect is fine, to some high voltage installations, high-precision equipment because the conductivity of water and disabled.

The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, provide a kind of volume little, in light weight, the heat that adopts air to force to flow and produced when electronics, electric component work can efficiently, be promptly taken away in cooling makes that it is long-term under the working temperature that allows, normal, safety, a kind of parallel flow heat pipe electronic component radiator of working efficiently.

The purpose of this utility model is to utilize the superior heat conductivity of hot pipe technique to realize in conjunction with the efficient heat transfer technology of concurrent flow pipe and louvered fin.Particularly: the parallel flow heat pipe electronic component radiator is that oval flat metal tube lower end weldering more than two or two is tied on same end cap as the rectangle hollow heat-collecting block of heat pipe bringing-up section, flat metal tube is parallel to each other, thickness of pipe wall 0.2～2mm, axial ratio is generally 5～15, long axis length is usually between 10～60mm, its length is decided on heat dissipation capacity, connects with Z-shaped ultra-thin louvered fin between per two of concurrent flow pipe, forms air flow channel.The long limit outer wall weldering knot of the corner of Z-shaped fin and concurrent flow pipe, at the top of each concurrent flow pipe with a pressure-equalizing pipe UNICOM, to keep the isostasy at its top.Heat-collecting block is to be formed by metallic channel and top bridge welding system, and metallic channel is the groove shape body of indent, and bottom outer wall is polished very smoothly, and fineness requires

More than, tightly cooperate with cover plate.Through hole is opened in quantity and position by the concurrent flow pipe on the cover plate, so that each concurrent flow pipe inserts in the corresponding through hole, the topping up pipe of φ 4～φ 8 is housed also on the cover board.After above-mentioned each parts were assembled, welding required each weld seam tightly not leak in the lump.The parallel pipe height is generally 10～200mm, and the implementation of port of the parallel flow heat pipe electronic radiation device that finishes from assembling weldering knot vacuumizes, a certain amount of working medium of filling again, behind the soldering and sealing topping up pipe the parallel flow heat pipe electronic component radiator.The material that this radiator uses is copper or aluminium normally, uses pure water to be working medium during with copper material, uses the potassium dichromate aqueous solution of acetone or 0.1%～1.2% concentration to be working medium during with aluminium.

Owing to used the utility model, the electronics of high heat generation density, electric component also can maintain long-term work under the safe temperature, and radiator itself is in light weight, and volume is urinated in installing in electronic instrument.

Below in conjunction with drawings and Examples the utility model further is illustrated.

Fig. 1 is a parallel flow heat pipe electronic component radiator structure chart.

Fig. 2 is I-I cutaway view.

Fig. 3 is an A portion partial enlarged drawing.

Fig. 4 is a B portion partial enlarged drawing.

Among the figure: 1. metallic channel 2. cover plates 3. concurrent flow pipes 4. louvered fins

5. pressure-equalizing pipe 6. working medium 7. topping up pipes 8. fans

Fig. 1 also is the parallel flow heat pipe radiator structure chart of making for the III cpu chip of running quickly.Chip is close to the bottom of metallic channel (1), the heat of its product is passed to the working medium (6) in the groove by the bottom land wall and is made it boiling, the steam that produces enters respectively in each concurrent flow pipe (3), and self-contained latent heat is transferred to louvered fin (4), taken away by the cold wind of blowing over by this fin by fan (8).Condense into liquid after the steam heat radiation, return in the metallic channel (1) at action of gravity lower edge concurrent flow inside pipe wall, the heat that chip is produced that circulating that working medium is gone round and begun again like this distributes, and keeps chip and works for a long time and stably in normal temperature range.The top of each concurrent flow pipe is respectively managed the top pressure balance with a pressure-equalizing pipe (5) UNICOM to keep, and produces flooding when avoiding certain concurrent flow pipe liquid return and sends liquid hammer sound, noises such as boil.

Claims

1. parallel flow heat pipe electronic component radiator, form by heat-collecting block, several concurrent flow pipes, louvered fin, pressure-equalizing pipe, topping up pipe and fans, it is characterized in that several the shared heat-collecting blocks of concurrent flow pipe as the heat pipe bringing-up section, and concurrent flow pipe top is welded with the louvered fin of zigzag with a pressure-equalizing pipe UNICOM between the concurrent flow pipe.

2. parallel flow heat pipe electronic component radiator according to claim 1 is characterized in that when making with aluminum material, the working medium of using is the potassium dichromate aqueous solution of acetone or 0.1%～1.2%.

3. parallel flow heat pipe electronic component radiator according to claim 1 is characterized in that louvered fin has a considerable amount of shutters by aluminium matter strip, and folded then or zigzag also welds the corner of fin and concurrent flow pipe range limit outer wall.