CN2394329Y - Flip Chip Package Structure of Light Emitting Diodes - Google Patents

Abstract

A flip chip package structure of LED comprises LED and circuit board, wherein the electrode of LED has solder ball formed by wire welder and connected with the corresponding electrode on the circuit board. The back of the solder ball extends with wiring, and the LED is of flip chip structure and is mounted on a circuit board by a support block, the wiring naturally hangs down and contacts with the corresponding electrode. The utility model discloses can use and have the routing equipment to carry out flip chip mounting of emitting diode promptly to save the cost, also can use the utility model discloses a flip chip packaging structure is glued to the diode, can be rapid carry out flip chip mounting of emitting diode, improve production speed.

Description

Flip Chip Package Structure of Light Emitting Diodes

The utility model relates to a flip-chip package structure of a light emitting diode.

Light-emitting diodes have been widely used in computer peripherals, displays, and instrument indications because of their long life, small size, low power consumption, and monochromatic light-emitting characteristics. Furthermore, since light emitting diodes are widely used, the packaging structure of light emitting diodes is more important.

In recent years, in order to improve the luminous efficiency of light-emitting diodes, flip-chip technology is gradually used in the packaging of light-emitting diodes. Referring to FIG. 1 , it is a cross-sectional view of a commonly used light-emitting diode packaged on a circuit board using flip-chip technology. Referring to this figure, a soldering pad 102 corresponding to the LED chip 200 is formed on a printed circuit board 100, and then a bump 104 is formed on the soldering pad 102, and the LED chip 200 is turned over so that its electrode 202 is placed on the bump , the electrical connection between the LED chip 200 and the printed circuit board 100 can be completed. Since no electrodes are provided on the upper side of the LED chip 200, the light emitted in this direction will not be hindered by the electrodes, so the LEDs packaged using this flip-chip technology will have higher luminous efficiency.

However, in the above-mentioned common packages, since the bumps 104 have to be prepared separately, the manufacturing process is more complicated and the cost of materials will be increased. Moreover, the formation and placement of the bumps 104 still require the purchase of additional characteristic equipment, and the packaging cost will also increase.

The purpose of the utility model is to provide a flip-chip packaging structure of light-emitting diodes, which can carry out flip-chip packaging of light-emitting diodes only by using existing packaging equipment on site, so as to achieve the effect of reducing costs.

The purpose of this utility model is achieved like this: a light-emitting diode flip-chip packaging structure, which includes a light-emitting diode and its installed circuit board, with a solder ball formed by a wire bonding machine on the electrode of the light-emitting diode, and the solder ball and the circuit board connected to the corresponding electrodes.

There are wires extending behind the solder balls, and the light emitting diode is a flip-chip structure and installed on a circuit board by a support block, and the wires hang down naturally to contact with the corresponding electrodes.

To sum up, the diode flip-chip packaging structure of the utility model can be used for flip-chip installation of light-emitting diodes with existing wire-bonding equipment to save costs; the diode flip-chip packaging structure of the utility model can also be used to quickly Flip-chip mounting of light-emitting diodes can increase production speed.

Below in conjunction with accompanying drawing and specific embodiment, the utility model is described further.

Figure 1 is a schematic diagram of a commonly used light-emitting diode package;

Fig. 2 is a schematic diagram of a preferred specific embodiment of the present utility model;

Fig. 3 is the schematic diagram that the chip of Fig. 2 is installed on the printed circuit board;

Fig. 4 is another preferred specific embodiment schematic diagram of the utility model;

FIG. 5 is a schematic diagram of the chip of FIG. 4 mounted on a printed circuit board.

Referring to FIG. 2 , it is a schematic diagram of a light emitting diode package according to a preferred embodiment of the present invention. On the electrode 202 of an LED chip 200, solder balls 300 can be formed by using a wire bonding machine. Referring to FIG. 3 again, the light emitting diode chip 200 with solder balls 300 is turned over so that the solder balls 300 are placed on the solder pads 102 of the printed circuit board 100, and then the solder balls 300 are bonded to the solder pads 102 using eutectic bonding or other methods. The pads 102 are electrically combined to complete the electrical connection between the LED chip 200 and the printed circuit board 100 .

Because in this packaging structure, the solder balls 300 can be formed only by a common wire bonding machine, and there is no need to purchase additional devices to form the bumps, so the packaging cost can be saved. Furthermore, since a general wire bonder can form solder balls at a very high speed, the packaging time can be shortened.

Referring to FIG. 4 , it is a schematic diagram of a light emitting diode package according to another preferred embodiment of the present invention. On the electrodes 202 of an LED chip 200 , solder balls 300 and wires 302 extending from the wires 302 can be formed by using a wire bonding machine. Referring again to FIG. 5 , the light emitting diode chip 200 with solder balls 300 and wiring 302 is turned over, and a supporting block 304 is used to support the light emitting diode chip 200 on the welding pad 102 of a printed circuit board 100 to form the wiring 302 and the welding pad. The pads 102 are electrically combined to complete the electrical connection between the LED chip 200 and the printed circuit board 100 .

Claims (2)

1, a kind of composite packing structure of light-emitting diode, it comprise light-emitting diode with and the circuit board installed, it is characterized in that: have by seam welder on the electrode of light-emitting diode and form soldered ball, soldered ball is connected with counter electrode on the circuit board.

2, the composite packing structure of light-emitting diode as claimed in claim 1, it is characterized in that: be extended with wiring behind the described soldered ball, and light-emitting diode is flip chip structure and utilizes a back-up block to be installed in a circuit board that described wiring is hung down naturally and contacted with described counter electrode.

Images