CN223803207U - Surface layer structure of electroplating jig - Google Patents
Surface layer structure of electroplating jigInfo
- Publication number
- CN223803207U CN223803207U CN202423015824.4U CN202423015824U CN223803207U CN 223803207 U CN223803207 U CN 223803207U CN 202423015824 U CN202423015824 U CN 202423015824U CN 223803207 U CN223803207 U CN 223803207U
- Authority
- CN
- China
- Prior art keywords
- layer
- titanium
- electroplating
- vacuum
- base metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
本实用新型公开了一种电镀治具的表层结构，所述的电镀治具包括基体金属和电解退镀防护层，电解退镀防护层覆盖在基体金属的外表面。本实用新型的电镀治具在基体金属的外表面覆盖了电解退镀防护层，在电镀治具进行退镀时，可以保护基体金属不被腐蚀，延长电镀治具的使用寿命。
This utility model discloses a surface structure of an electroplating fixture, comprising a base metal and an electrolytic stripping protective layer, the electrolytic stripping protective layer covering the outer surface of the base metal. The electroplating fixture of this utility model, by covering the outer surface of the base metal with an electrolytic stripping protective layer, can protect the base metal from corrosion during stripping, thus extending the service life of the electroplating fixture.
Description
[ Technical field ]
The present disclosure relates to electroplating tools, and particularly to a surface structure of an electroplating tool.
[ Background Art ]
The electroplating jig is a key tool for fixing and supporting a workpiece to be electroplated and ensuring that the workpiece can be uniformly plated in the electroplating process. The electroplating jig mainly comprises a clamp, a hanging tool, a basket tool, a frame tool and the like.
In the circuit board and hardware industry, the material of the electroplating jig is usually 316 stainless steel. For example, the application number is: the invention of CN202310602948.3 discloses an electroplating hanger and a method for improving copper plating uniformity of a DPC ceramic substrate, relates to the field of ceramic substrate electroplating processing, and aims to solve the problem of uneven copper plating of the conventional ceramic substrate, and the technical scheme is as follows: the electroplating hanger comprises a frame formed by integrally cutting a stainless steel material, wherein the frame is fixedly connected with a conductive rod and a hook, a plurality of ceramic substrate loading areas are arranged in the frame, and each ceramic substrate loading area is provided with at least two conductive steps for supporting and conducting a ceramic substrate; and a limiting device is arranged on the frame corresponding to each conductive step and used for fixing the ceramic substrate. The whole frame is not encapsulated, the stainless steel frame is plated with metal copper while providing a workpiece conductive path, and the copper layer on the surface of the hanger is thicker and thicker, so that the product quality is affected, and the function of the hanger is possibly disabled.
The copper layer on the surface of the hanger is removed by two methods, namely chemical stripping and electrolytic stripping:
Chemical stripping dissolves copper layer from the surface of the workpiece by chemical reaction. The advantage of this method is that it is relatively simple to operate and does not require complex equipment. Common electroless plating solutions include nitric acid, sulfuric acid solutions, etc., and have the disadvantage of generating a large amount of chemical waste liquid, which needs to be properly treated to avoid environmental pollution.
The electrolytic stripping is to utilize electrochemical principle to make copper layer on workpiece fall off. Typically, the workpiece is used as an anode and a suitable electrolyte (e.g., a copper sulfate-containing solution) is used to reduce the copper layer into the electrolyte by the action of an electric current. The electrolytic stripping has the advantages that the stripping degree can be controlled more accurately, and the generated waste liquid can be used for recycling copper resources through further treatment, so that the influence on the environment is small.
The corrosion of electrolytic stripping to the stainless steel hanger is larger than that of chemical stripping, but no matter which stripping method is adopted, the stainless steel hanger can be corroded to a certain extent, so that the service life of the electroplating hanger is reduced.
[ Summary of the invention ]
The utility model aims to solve the technical problem of providing a surface layer structure of an electroplating jig which can not corrode the base metal of a hanger during deplating.
In order to solve the technical problems, the technical scheme adopted by the utility model is that the surface layer structure of the electroplating jig comprises a base metal and an electrolytic stripping protective layer, wherein the electrolytic stripping protective layer is covered on the outer surface of the base metal.
The surface layer structure of the electroplating jig comprises a copper plating layer serving as a conductive layer, wherein the copper plating layer covers the outer surface of the base metal, and the electrolytic stripping protective layer covers the outer surface of the copper plating layer.
The surface layer structure of the electroplating jig is characterized in that the electrolytic stripping protective layer is a vacuum plating titanium layer or a vacuum sputtering titanium layer.
The surface layer structure of the electroplating jig comprises an intermediate bonding layer, wherein the intermediate bonding layer is positioned between a vacuum plating titanium layer or a vacuum sputtering titanium layer and a copper plating layer.
The surface layer structure of the electroplating jig is characterized in that the middle bonding layer is a nickel plating layer or a chromium plating layer.
The surface layer structure of the electroplating jig comprises a titanium oxide layer on the outer surface of the vacuum-plated titanium layer or the vacuum-sputtered titanium layer.
The surface layer structure of the electroplating jig has the thickness of the electrolytic stripping protective layer of 1-5 mu m and the thickness of the copper plating layer of 10-500 mu m.
According to the electroplating jig disclosed by the utility model, the outer surface of the base metal is covered with the electrolytic stripping protective layer, so that the base metal can be prevented from being corroded when the electroplating jig is subjected to stripping, and the service life of the electroplating jig is prolonged.
[ Description of the drawings ]
The utility model will be described in further detail with reference to the drawings and the detailed description.
Fig. 1 is a cross-sectional view of a surface layer structure of a plating jig according to embodiment 1 of the present utility model.
Fig. 2 is a cross-sectional view of the surface structure of the electroplating jig according to embodiment 2 of the present utility model.
Detailed description of the preferred embodiments
The surface structure of the electroplating jig according to embodiment 1 of the present utility model is shown in fig. 1, and the electroplating jig comprises a base metal 1, a copper plating layer 2 as a conductive layer, and an electrolytic stripping protective layer 3, wherein the electrolytic stripping protective layer 3 covers the outer surface of the base metal 1.
The copper plating layer 2 is electroplated on the outer surface of the base metal 1, and the protective layer of the copper plating layer 2 covers the outer surface of the conductive layer. The electrolytic stripping protective layer 3 is a vacuum plating titanium layer or a vacuum sputtering titanium layer.
The thickness of the electrolytic stripping protective layer 3 is 1-5 mu m, and the thickness of the copper plating layer 2 is 10-50 mu m.
The conductivity of pure copper is about 48 times that of 316 stainless steel. The conductivity directly influences the electroplating energy consumption, and the adoption of a copper plating layer as a conductive layer of a surface layer can greatly reduce the energy consumption.
The anodic dissolution potential refers to the potential at which the surface of a material begins to dissolve when it is used as an anode in a particular electrolyte. The more positive the anodic dissolution potential (i.e., the greater the number), the less the dissolution tendency of the material in the electrolyte, and the better the corrosion resistance.
The anodic dissolution potential of copper is about +0.3 to +0.4V, approaching the cathodic precipitation potential, and is suitable as a soluble anode. And copper does not form a significant passivation film in the copper sulfate solution. Copper on the surface layer of the electroplating jig is used as an anode in the stripping process to perform oxidation reaction, and copper ions are released to enter electrolyte and are gradually consumed.
The dissolution potential of the titanium anode is +2.0 to +3.0V. Within this range, the titanium anode does not dissolve significantly, and appears as an inert anode. The passivation film of titanium is dense and has extremely high stability to strong acid electrolyte.
Specifically, in neutral or acidic electrolyte, the anodic dissolution potential of titanium is high, and anodic dissolution is not easy to occur. In alkaline electrolyte, a dense oxide film (TiO 2) is formed on the surface of titanium, and the film can further improve the corrosion resistance of titanium.
Titanium is used as an electrolytic protection layer of the electroplating jig, the structural integrity of the electroplating jig can be maintained in the electrolytic process, and the high anodic dissolution potential of titanium means that the titanium is not easy to dissolve in electrolyte, so that the long-term use of the jig is ensured. The passivation film is easy to form in the electrolyte, and the film can further prevent the dissolution of the titanium and improve the corrosion resistance of the titanium.
The electroplating jig of the embodiment 1 of the utility model has the following advantages:
1) The service life of the electroplating jig can be prolonged, namely, the service life of the electroplating jig can be remarkably prolonged because titanium is not easy to be corroded by electrolyte.
2) The stability and corrosion resistance of titanium ensure the high-efficiency electrolytic process and reduce unnecessary side reactions.
3) The maintenance cost is reduced, namely, the maintenance and replacement frequency of the jig is reduced by the titanium protective layer, and the overall maintenance cost is reduced.
4) The structure of the electroplating jig can adopt a composite structure with steel as a framework, copper plating on the surface and titanium plating. Since the base metal no longer requires the corrosion resistance of 316 stainless steel, the base metal is selected over a wider range and cost is more advantageous.
The surface structure of the electroplating jig of embodiment 2 of the utility model is shown in fig. 2, and on the basis of embodiment 1, embodiment 2 further comprises an intermediate bonding layer 4, wherein the intermediate bonding layer 4 is positioned between the vacuum vapor plating titanium layer or the vacuum sputtering titanium layer and the copper plating layer 2, and the intermediate bonding layer 4 is a nickel plating layer or a chromium plating layer, so that the adhesion force between the vapor plating titanium layer or the vacuum sputtering titanium layer and the copper plating layer 2 can be increased. The outer surface of the vacuum-evaporated titanium layer or the vacuum-sputtered titanium layer can also comprise a titanium oxide layer 5, and the titanium oxide layer 5 can further improve the hardness and corrosion resistance of the surface of the electroplating jig.
Claims (7)
1. The surface layer structure of the electroplating jig comprises a base metal and is characterized by comprising an electrolytic stripping protective layer, wherein the electrolytic stripping protective layer covers the outer surface of the base metal.
2. The surface layer structure of the plating jig according to claim 1, comprising a copper plating layer as a conductive layer, the copper plating layer covering an outer surface of the base metal, and the electrolytic stripping protective layer covering an outer surface of the copper plating layer.
3. The surface layer structure of the electroplating jig according to claim 1 or 2, wherein the electrolytic stripping protective layer is a vacuum-plated titanium layer or a vacuum-sputtered titanium layer.
4. A surface layer structure of a plating jig according to claim 3, comprising an intermediate bonding layer between a vacuum-deposited titanium layer or a vacuum-sputtered titanium layer and a copper plating layer.
5. The surface structure of the electroplating jig according to claim 4, wherein the intermediate bonding layer is a nickel plating layer or a chromium plating layer.
6. A surface structure of a plating jig according to claim 3, wherein an outer surface of the vacuum-evaporated titanium layer or the vacuum-sputtered titanium layer comprises a titanium oxide layer.
7. The surface layer structure of the electroplating jig according to claim 2, wherein the thickness of the electrolytic stripping protective layer is 1-5 μm and the thickness of the copper plating layer is 10-500 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202423015824.4U CN223803207U (en) | 2024-12-05 | 2024-12-05 | Surface layer structure of electroplating jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202423015824.4U CN223803207U (en) | 2024-12-05 | 2024-12-05 | Surface layer structure of electroplating jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223803207U true CN223803207U (en) | 2026-01-16 |
Family
ID=98382734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202423015824.4U Active CN223803207U (en) | 2024-12-05 | 2024-12-05 | Surface layer structure of electroplating jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223803207U (en) |
-
2024
- 2024-12-05 CN CN202423015824.4U patent/CN223803207U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102888625B (en) | Non-ferrous metal electrodeposition palisading type positive plate | |
| CA1105878A (en) | Method for stripping tungsten carbide from titanium or titanium alloy substrates | |
| Chen et al. | Influence of F-doped β-PbO2 conductive ceramic layer on the anodic behavior of 3D Al/Sn Rod Pb− 0.75% Ag for zinc electrowinning | |
| CN101054701A (en) | Method of increasing electroplating evenness | |
| US7943032B2 (en) | Anode used for electroplating | |
| CN104611731A (en) | Fence-type aluminum bar lead alloy anode plate for non-ferrous metal electrodeposition and preparation method of fence-type aluminum bar lead alloy anode plate | |
| CN103233250B (en) | A kind of thick layer gold gold finger galvanizing method | |
| CN105154914A (en) | Preparation method of carbon fiber composite anode material | |
| CN202830195U (en) | Fence-shaped anode plate for electro-deposition of nonferrous metals | |
| CN223803207U (en) | Surface layer structure of electroplating jig | |
| CN112048744B (en) | Process for improving platinum plating uniformity on surface of titanium substrate | |
| CN104099658A (en) | Auxiliary anode for use in acid zinc-nickel alloy electroplating | |
| CN109023420A (en) | A kind of nickel electrodeposition aluminum-base composite anode and preparation method thereof | |
| CN101565850A (en) | Removing liquid of chromium nitride film layer and removing method of film layer | |
| CN110724980B (en) | Local chromium plating method for stainless steel bolt | |
| JPH10510586A (en) | Method of making a corrosion-resistant and wear-resistant oxide layer with locally reduced layer thickness on a metal surface of a workpiece | |
| CN116275326B (en) | Tool electrode for improving electrolytic machining stray corrosion and use method thereof | |
| KR100853996B1 (en) | Surface treatment method of metal body based on magnesium | |
| JPH0885894A (en) | Electrode | |
| CN112251753A (en) | Electrolytic regeneration method for acidic etching waste liquid of printed circuit board | |
| CN117089912B (en) | Horizontal clamping type electroplating device | |
| JP3566023B2 (en) | Electrode for fluorine-containing liquid electrolysis | |
| JP2938164B2 (en) | Electrode for electrolysis and method for producing the same | |
| JPH0156153B2 (en) | ||
| KR950013598B1 (en) | Surface treatment method of aluminum or aluminum alloy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |