CN223207303U - Heat radiation structure and electronic equipment - Google Patents

Abstract

The utility model provides a heat dissipation structure and an electronic device. The heat dissipation structure includes: a base; a mainboard, which is arranged on the base, the mainboard has a first side and a second side, and a chip is arranged on the first side; a heat sink, which is arranged on the first side of the mainboard, the heat sink is connected to the mainboard and/or the base, and a plurality of bends are arranged on the heat sink, forming an installation space between the heat sink and the chip; a radiator, which is arranged in the installation space and connected to the chip; a thermal insulation pad, which is arranged between the top of the radiator and the heat sink. By extending the heat sink to the top of the radiator and arranging the thermal insulation pad between the top of the radiator and the heat sink, the heat dissipation area (heat dissipation performance) of the heat sink can be increased, thereby effectively dissipating the heat generated by the mainboard. At the same time, thermal isolation between the heat sink and the radiator can be achieved, thereby reducing heat transfer between the heat sink and the radiator, ensuring heat dissipation efficiency while maintaining temperature balance among various components.

Description

Heat radiation structure and electronic equipment

Technical Field

The present utility model generally relates to the field of heat dissipation technologies for electronic devices, and in particular, to a heat dissipation structure and an electronic device.

Background

Along with the development of scientific technology, the more and more delicate electronic products are made, the more and more functions are provided, the lower the price of the products is, the higher the pressure of the production cost is, and therefore, excellent structural product design is required, so that the manufacturing process and the assembling process of the products are simple, the production efficiency is improved, the labor cost is reduced, and the high-quality and low-cost products are realized.

With the continued increase in performance of electronic devices, heat dissipation issues become particularly critical as it directly affects the performance and long-term reliability of the device. In some electronic devices, a plurality of electronic components are integrated on a circuit board, and a dedicated heat sink is usually provided for high-power electronic components (e.g., chips) to dissipate heat, and a heat sink is provided for low-power electronic components (e.g., resistors, capacitors, etc.) to dissipate heat uniformly. However, since the size of the heat sink is limited by the internal space of the device, it may not provide sufficient surface area to effectively dissipate the heat generated by numerous electronic components. This condition can lead to overheating of the equipment, which in turn can lead to instability of the system, shortened equipment life, and even failure.

The matters in the background section are only those known to the inventors and do not, of course, represent prior art in the field.

Disclosure of utility model

In view of one or more of the drawbacks of the prior art, the present utility model provides a heat dissipating structure, comprising:

a base;

the main board is arranged on the base body and is provided with a first side and a second side, and the first side is provided with a chip;

The heat dissipation plate is arranged on the first side of the main board, is connected with the main board and/or the base body, is provided with a plurality of bends, and forms an installation space between the heat dissipation plate and the chip;

the radiator is arranged in the installation space and connected with the chip, and a preset interval is arranged between the radiator and the radiating plate;

and the heat insulation pad is arranged between the top of the radiator and the heat dissipation plate.

According to one aspect of the utility model, the heat dissipation plate comprises a first plate section, a second plate section, a third plate section and a fourth plate section which are sequentially connected through bending, wherein the second plate section, the third plate section, the fourth plate section and the chip form the installation space.

According to one aspect of the utility model, the insulation pad is connected between the heat sink and the third plate section.

According to one aspect of the utility model, the fourth plate section is provided with a first buckle, the base body is provided with a second buckle, and the first buckle is in clamping fit with the second buckle.

According to one aspect of the utility model, the heat dissipation plate further comprises a fifth plate section and/or a sixth plate section, wherein the fifth plate section is connected with the first plate section through bending, and the sixth plate section is connected with the first plate section through bending.

According to one aspect of the utility model, one or more connecting plate segments are connected to the first plate segment, which connecting plate segments are screwed to the base body.

According to one aspect of the utility model, the thermal insulation pad comprises a silica gel pad, a ceramic pad, an aerogel pad, or a polyurethane pad.

According to one aspect of the utility model, the heat sink is a heat sink fin or a heat pipe.

According to one aspect of the utility model, the base body has a receiving cavity, and the main board is disposed in the receiving cavity.

The embodiment of the utility model also provides electronic equipment, which comprises the heat dissipation structure.

Compared with the prior art, the embodiment of the utility model provides the heat radiation structure and the electronic equipment, and the heat radiation area (heat radiation performance) of the heat radiation plate can be improved by extending the heat radiation plate to the top of the heat radiator and arranging the heat insulation pad between the top of the heat radiator and the heat radiation plate, so that heat generated by the main board is effectively dispersed. Meanwhile, thermal isolation between the radiating plate and the radiator can be realized, so that heat transfer between the radiating plate and the radiator is reduced, and the temperature balance of each component is maintained while the radiating efficiency is ensured. In addition, the radiating plate can also play a fixing role on the radiator, and screws are not required to be used for fixing the radiator, so that the structure is simplified, and the cost is reduced.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 illustrates a cross-sectional view of a heat dissipating structure according to one embodiment of the present utility model;

FIG. 2 shows a schematic diagram of a heat dissipating structure according to one embodiment of the present utility model;

fig. 3 shows a schematic view of a heat sink according to an embodiment of the utility model.

In the figure, 100 parts of a heat dissipation structure, 110 parts of a base body, 111 parts of a screw column, 112 parts of a second buckle, 120 parts of a main board, 121 parts of a chip, 130 parts of a heat dissipation plate, 131 parts of a first plate section, 132 parts of a second plate section, 133 parts of a third plate section, 134 parts of a fourth plate section, 135 parts of a fifth plate section, 136 parts of a sixth plate section, 137 parts of a connecting plate section, 138 parts of a first buckle, 140 parts of a heat sink, 150 parts of a heat insulation pad.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, or communicable with each other, directly connected, indirectly connected via an intermediary, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.

Fig. 1 shows a cross-sectional view of a heat dissipating structure 100 according to an embodiment of the present utility model, fig. 2 shows a schematic view of the heat dissipating structure 100 according to an embodiment of the present utility model, and is described in detail below in connection with fig. 1.

As shown in fig. 1 and 2, the heat dissipation structure 100 includes a base 110, a main board 120, a heat dissipation plate 130, a heat sink 140, and a heat insulation pad 150. The base 110 is used to provide mounting locations (space) for other components, ensuring the stability and integrity of the heat dissipation structure 100. The motherboard 120 may be a circuit board on which various electronic components may be disposed as desired. The motherboard 120 may be secured to the base 110 by screw connection, snap connection, adhesive, welding, or other connection means. The main board 120 has a first side and a second side (which may also be referred to as an upper side and a lower side), and a chip 121 is disposed on the first side of the main board 120, and the heat sink 140 is connected to the chip 121. The heat sink 140 can absorb heat generated by the chip 121 and dissipate the heat to the surrounding environment through a larger surface area of the heat sink, thereby preventing the chip 121 from being too high in temperature and avoiding performance degradation or damage of the chip 121 due to overheating. The heat dissipation plate 130 is disposed on the first side of the motherboard 120 and is connected with the motherboard 120 and/or the substrate 110, and the heat dissipation plate 130 can absorb heat generated by the motherboard 120 and various electronic components except for the chip 121 on the motherboard 120, and dissipate the heat to the surrounding environment through a larger surface area thereof, so as to prevent the motherboard 120 and the electronic components from being too high in temperature, and avoid performance degradation or damage of the motherboard 120 and the electronic components caused by overheating. As shown in fig. 1 and 2, a plurality of bends are provided on the heat dissipation plate 130, which is at least partially located above the chip 121, to form a mounting space between the heat dissipation plate 130 and the chip 121. The heat sink 140 is positioned in the installation space, and a predetermined interval is provided between the heat sink 140 and the heat sink 130 to prevent direct heat transfer between the heat sink 130 and the heat sink 140. The heat insulation pad 150 is disposed between the top of the heat sink 140 and the heat dissipation plate 130, so as to reduce heat transfer between the heat dissipation plate 130 and the heat sink 140, and simultaneously make the heat dissipation plate 130 perform a fixing function on the heat sink 140, so that screws are not required to be used for fixing the heat sink 140, which is beneficial to simplifying the structure and reducing the cost.

Fig. 3 illustrates a schematic view of a heat dissipation plate according to an embodiment of the present utility model, and as shown in fig. 2 and 3, the heat dissipation plate 130 may include a first plate segment 131, a second plate segment 132, a third plate segment 133, and a fourth plate segment 134 connected in sequence by bending, wherein an installation space is formed between the second plate segment 132, the third plate segment 133, the fourth plate segment 134, and the chip 121. Optionally, the first plate segment 131 is substantially parallel to the third plate segment 133, the second plate segment 132 is substantially parallel to the fourth plate segment 134, and the second plate segment 132, the third plate segment 133, and the fourth plate segment 134 form an approximately "U" shaped structure that is inverted on the chip 121 and forms the mounting space together with the chip 121.

According to an embodiment of the present utility model, as shown in fig. 3, the heat dissipation plate 130 may further include a fifth plate segment 135 and/or a sixth plate segment 136, and the fifth plate segment 135 and the sixth plate segment 136 are respectively connected to the first plate segment 131 by bending. By providing the fifth plate segment 135 and/or the sixth plate segment 136, the heat dissipation area of the heat dissipation plate 130 can be further enlarged, so as to improve the heat dissipation performance of the heat dissipation plate 130, further effectively disperse the heat generated by the motherboard 120, and avoid the heat accumulation on the motherboard 120. Optionally, the fifth plate section 135 and the second plate section 132 are respectively located at two ends of the first plate section 131, and the fifth plate section 135 and the second plate section 132 are parallel to each other. Optionally, a sixth plate segment 136 is connected to one side of the first plate segment 131.

According to one embodiment of the present utility model, as shown in fig. 1 to 3, the heat insulation pad 150 may be one of a silica gel pad, a ceramic pad, an aerogel pad, a polyurethane pad, or a combination of a plurality of silica gel pads, ceramic pads, aerogel pads, polyurethane pads. Optionally, a heat insulating pad 150 is connected between the heat sink 140 and the third plate segment 133. Optionally, the heat insulation pad 150 is adhered between the heat sink 140 and the third plate segment 133 by an adhesive to prevent the heat insulation pad 150 from falling out between the heat sink 140 and the heat dissipation plate 130. Meanwhile, the heat insulation pad 150 is fixed by using the adhesive, so that the use of mechanical fixing pieces can be reduced, the assembly process is simplified, and the cost is reduced.

According to one embodiment of the present utility model, as shown in fig. 1 and 2, the base 110 may be a housing having a receiving cavity in which the motherboard 120 is disposed. The housing may be fully enclosed to provide overall protection and sealing, or semi-enclosed to allow air circulation and heat exchange. The utility model does not limit the sealing degree of the shell body in particular, and aims to provide diversified solutions so as to adapt to different application requirements and environmental conditions. In some embodiments, the substrate 110 may be a base, etc., which is not limited to the present utility model.

According to an embodiment of the present utility model, as shown in fig. 1 to 3, one or more screw posts 111 are provided on a base 110, and a heat dissipation plate 130 is fixed to the screw posts 111 by screws. Optionally, one or more connecting plate segments 137 are connected to the first plate segment 131 of the heat dissipation plate 130, and the connecting plate segments 137 overlap the corresponding screw posts 111 and are fixed by screws. Through fixing the heat dissipation plate 130 on the screw column 111, the heat dissipation plate 130 can be precisely positioned, so that the heat dissipation plate 130 (the first plate segment 131) is precisely attached to the first side of the main board 120 (or the heat dissipation plate 130 (the first plate segment 131) is kept at a preset distance from the main board 120), and then the heat dissipation plate 130 can absorb heat generated by the main board 120 and various electronic components except the chip 121 on the main board 120 and dissipate the heat to the surrounding environment through a larger surface area of the heat dissipation plate.

According to an aspect of the present utility model, as shown in fig. 1 and 3, a first buckle 138 may be disposed on the fourth plate segment 134, and a second buckle 112 may be disposed on the base 110, where the first buckle 138 is in a snap fit with the second buckle 112, so as to improve the installation stability of the heat dissipation plate 130, further improve the fixing effect of the heat dissipation plate 130 on the heat sink 140, and prevent the heat sink 140 from falling off. Optionally, the first buckle 138 is a protrusion disposed on the fourth plate segment 134, the second buckle 112 is a hole or a slot disposed on the base 110, and during the process of mounting the heat dissipation plate 130 to the base 110, the protrusion on the heat dissipation plate 130 may be precisely snapped into the slot or the hole on the base 110.

According to one embodiment of the utility model, as shown in FIG. 1, the heat sink 140 may be a heat sink fin or a heat pipe. The heat dissipation fins and the heat pipe have good heat dissipation performance, wherein the heat dissipation fins have large contact area with air, can rapidly absorb heat generated by the chip 121, and transfer the heat from the surface of the chip 121 to the surrounding environment by utilizing natural convection or forced convection. The heat pipe uses the phase change principle inside the heat pipe to efficiently transfer heat from the chip 121 to the surrounding environment, so as to realize rapid heat transfer.

The embodiment of the utility model also provides electronic equipment, which can be a camera, a sound box, an intelligent screen and the like. The electronic device includes a heat dissipating structure 100 as described above to ensure good performance and stability under various conditions of use. Optionally, the housing (or a portion of the housing) of the electronic device is used as a base of the heat dissipating structure.

Compared with the prior art, the embodiment of the utility model provides a heat dissipation structure 100 and an electronic device, wherein the heat dissipation area (heat dissipation performance) of the heat dissipation plate 130 can be increased by extending the heat dissipation plate 130 to the top of the heat sink 140 and disposing the heat insulation pad 150 between the top of the heat sink 140 and the heat dissipation plate 130, so as to effectively dissipate the heat generated by the motherboard 120. Meanwhile, thermal isolation between the heat dissipation plate 130 and the heat sink 140 can be realized, so that heat transfer between the heat dissipation plate 130 and the heat sink 140 is reduced, heat dissipation efficiency is ensured, and meanwhile, temperature balance of each component is maintained. In addition, the heat dissipation plate 130 can also fix the heat sink 140 without using screws to fix the heat sink 140, which is beneficial to simplifying the structure and reducing the cost.

It should be noted that the above-mentioned embodiments are merely preferred embodiments of the present utility model, and the present utility model is not limited thereto, but may be modified or substituted for some of the technical features thereof by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. A heat dissipation structure, comprising:

a base;

the main board is arranged on the base body and is provided with a first side and a second side, and the first side is provided with a chip;

The heat dissipation plate is arranged on the first side of the main board, is connected with the main board and/or the base body, is provided with a plurality of bends, and forms an installation space between the heat dissipation plate and the chip;

the radiator is arranged in the installation space and connected with the chip, and a preset interval is arranged between the radiator and the radiating plate;

and the heat insulation pad is arranged between the top of the radiator and the heat dissipation plate.

2. The heat dissipating structure of claim 1, wherein the heat dissipating plate comprises a first plate segment, a second plate segment, a third plate segment, and a fourth plate segment connected in sequence by bending, wherein the second plate segment, the third plate segment, the fourth plate segment, and the chip form the mounting space therebetween.

3. The heat dissipating structure of claim 2, wherein the heat insulating pad is connected between the heat sink and the third plate segment.

4. The heat dissipating structure of claim 2, wherein the fourth plate segment is provided with a first clip, the base is provided with a second clip, and the first clip is snap-fit with the second clip.

5. The heat radiation structure according to claim 2, characterized in that the heat radiation plate further comprises a fifth plate segment and/or a sixth plate segment, wherein the fifth plate segment is connected to the first plate segment by bending, and the sixth plate segment is connected to the first plate segment by bending.

6. The heat dissipating structure of claim 2, wherein said first plate segment has one or more connecting plate segments attached thereto, said connecting plate segments being screwed to said base.

7. The heat dissipating structure of any of claims 1-6, wherein said thermal insulation pad comprises a silicone pad, a ceramic pad, an aerogel pad, or a polyurethane pad.

8. The heat dissipating structure of any one of claims 1-6, wherein the heat sink is a heat sink fin or a heat pipe.

9. The heat dissipating structure of any of claims 1-6, wherein said base has a receiving cavity, and said motherboard is disposed in said receiving cavity.

10. An electronic device comprising the heat dissipation structure as recited in any one of claims 1-9.