CN223066472U - Multi-beam power splitter network and feed network for multi-beam phased array antenna - Google Patents

Abstract

The utility model discloses a multi-beam power division network and a feed network applied to a multi-beam phased array antenna, and relates to the technical field of communication. The power dividing network comprises at least two single-beam power dividing network layers, wherein the single-beam power dividing network layers are sequentially stacked, so that the single-beam power dividing network layers share the same antenna array surface, the situation that different antenna array surfaces are used by the single-beam power dividing network layers caused by simultaneous reception of a plurality of traditional single-beam phased array antennas in a coplanar laying mode is avoided, and the occupied space of the multi-beam feed network corresponding to a main board is saved. In addition, based on the equal phase of the power division network line length of each single-beam power division network layer, the phase consistency among the single-beam power division network layers is realized. The equal amplitude of the power division network line length of each single-beam power division network layer realizes the amplitude consistency among the single-beam power division network layers.

Description

Multi-beam power dividing network and feed network applied to multi-beam phased array antenna

Technical Field

The utility model relates to the technical field of communication, in particular to a multi-beam power division network and a feed network applied to a multi-beam phased array antenna.

Background

Single beam phased array antennas play an important role in satellite communications. The phase of each radiation unit in the antenna array is controlled by the beam controller, so that the direction of the antenna beam is changed, and the rapid scanning and pointing of the beam are realized.

The beam space angle of the single-beam phased array antenna is narrow, and particularly when signals are received, only signals of a certain point can be received, and the possibility of signal leakage exists. In order to ensure signal integrity, a plurality of single-beam phased array antennas are adopted for simultaneous reception, and taking a three-beam phased array antenna as an example, the corresponding main board area occupation is 3 times of that of the original single-beam phased array antenna under the condition of coplanar placement. Meanwhile, the three single-beam phased array antennas are all installed and spliced on the original single-beam phased array antennas, so that the amplitude-phase consistency among the three-beam phased array antennas is poor.

Therefore, there is a need in the art for improving the amplitude-phase uniformity between multi-beam phased array antennas and reducing the motherboard area occupied by the phased array antennas.

Disclosure of utility model

The utility model aims to provide a multi-beam power division network and a feed network applied to a multi-beam phased array antenna, which are used for solving the problems of larger main board area occupied by coplanar placement of a plurality of single-beam phased array antennas and poor amplitude-phase consistency.

In order to solve the technical problems, the utility model provides a multi-beam power division network applied to a multi-beam phased array antenna, wherein the power division network comprises at least two single-beam power division network layers;

Each single-beam power division network layer is sequentially stacked;

The power division network lines corresponding to the single-beam power division network layers are grown to meet the conditions of equal phase and equal amplitude, so that the equal phase and the equal amplitude are realized through signals received and/or transmitted by the multi-beam phased array antenna.

In one aspect, the length of the power division network line corresponding to each single-beam power division network layer is configured by the strip line of the power division network layer.

On the other hand, the length of the power division network line corresponding to each single-beam power division network layer is determined by a winding mode of the strip line of the power division network layer.

In another aspect, the device further comprises a bending structure;

And adjusting the target strip line of the power division network layer by adopting the bending structure to realize equal phase and equal amplitude of the power division network line length corresponding to each single-beam power division network layer.

On the other hand, the number of the sub-ports to which the power division network lines corresponding to the single-beam power division network layers belong is the same;

Each stage of power division of each single-beam power division network layer is uniformly distributed and placed in the corresponding single-beam power division network layer, and each stage of power division of each single-beam power division network layer is in a mirror symmetry structure or a non-mirror symmetry structure.

On the other hand, the direction of the medium substrate where each single-beam power division network layer is positioned is taken as the horizontal direction, and the sub-ports of each single-beam power division network layer are connected with the feed ports of the chip layer in the vertical direction through a vertical transition structure so as to realize the connection of the chip layer and the power division network layer;

in the horizontal direction, the ports of the single-beam power division network layers are connected with the total ports through the power division network lines.

On the other hand, the power divider further comprises a first shielding structure and a second shielding structure, wherein the first shielding structure is positioned around the power dividing network line;

The first shielding structure comprises a first metal frame and first metal ground through holes, wherein the first metal frame forms a first shielding groove, the power division network wire is positioned in the first shielding groove, and the first metal ground through holes are positioned on two sides of the first shielding groove;

The second shielding structure comprises a second metal frame and a second metal ground via hole, the first metal frame is connected with the second metal frame, the second metal frame forms a second shielding groove, the split port is located in the second shielding groove, and the second metal ground via hole is located at the peripheral side of the second shielding groove.

On the other hand, each single-beam power division network layer is sequentially stacked from top to bottom, wherein the upper layer ground of the first single-beam power division network layer is connected with the first single-beam power division network layer, the first single-beam power division network layer is connected with the lower layer ground of the first single-beam power division network layer, the lower layer ground of the upper single-beam power division network layer and the upper layer ground of the lower single-beam power division network layer of the adjacent layer are in the same layer, and the last single-beam power division network layer is connected with the lower layer ground of the last single-beam power division network layer.

In order to solve the technical problems, the utility model also provides a multi-beam feed network applied to the multi-beam phased array antenna, which comprises a vertical transition structure, a feed layer and the multi-beam power division network applied to the multi-beam phased array antenna;

And the feed layer is connected with the power division network layer of the multi-beam power division network through the vertical transition structure.

In order to solve the technical problems, the utility model also provides a multi-beam phased array antenna, which comprises a chip layer, a plurality of antenna units and the multi-beam feed network applied to the multi-beam phased array antenna;

The chip layer is connected with the plurality of antenna units;

the multi-beam feed network is connected with the chip layer.

The multi-beam power division network applied to the multi-beam phased array antenna comprises at least two single-beam power division network layers, wherein the single-beam power division network layers are sequentially stacked, and the power division network lines corresponding to the single-beam power division network layers meet the conditions of equal phase and equal amplitude so as to achieve equal phase and equal amplitude through signals received and/or transmitted by the multi-beam phased array antenna. According to the utility model, each single-beam power division network layer is placed in a stacked manner, so that each single-beam power division network layer shares the same antenna array surface, the situation that each single-beam power division network layer uses different antenna array surfaces due to simultaneous reception of a plurality of traditional single-beam phased array antennas and occupies a large space in a coplanar placement manner is avoided, and therefore, the occupied area of a main board corresponding to a multi-beam feed network is saved. In addition, based on the equal phase of the power division network line length of each single-beam power division network layer, the phase consistency among the single-beam power division network layers is realized. The equal amplitude of the power division network line length of each single-beam power division network layer realizes the amplitude consistency among the single-beam power division network layers. In summary, it is achieved that the amplitude and phase of the antenna signal and/or the transmit signal received by the multiple beams have good consistency.

In addition, the utility model also provides a multi-beam feed network applied to the multi-beam phased array antenna and the multi-beam phased array antenna, which have the same beneficial effects as the multi-beam power division network applied to the multi-beam phased array antenna.

Drawings

For a clearer description of embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described, it being apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

Fig. 1 is a block diagram of a front view of a multi-beam power division network applied to a multi-beam phased array antenna according to an embodiment of the present utility model;

fig. 2 is a schematic diagram of an exploded view of a single beam a power division network layer according to an embodiment of the present utility model;

fig. 3 is a schematic diagram of an exploded view of a single beam B power division network layer according to an embodiment of the present utility model;

fig. 4 is a block diagram of a power division network according to an embodiment of the present utility model;

fig. 5 is a schematic diagram of a single beam a power division network layer on a dielectric substrate according to an embodiment of the present utility model;

Fig. 6 is a schematic diagram of a single beam B power division network layer on a dielectric substrate according to an embodiment of the present utility model;

fig. 7 is a schematic diagram of microstrip lines corresponding to each split port of a power split network layer according to an embodiment of the present utility model;

Fig. 8 is a schematic diagram of the amplitude of a power division network of a single beam a according to an embodiment of the present utility model;

fig. 9 is a schematic phase diagram of a power division network of a single beam a according to an embodiment of the present utility model;

Fig. 10 is a schematic diagram of the amplitude of a power division network of a single beam B according to an embodiment of the present utility model;

Fig. 11 is a schematic phase diagram of a power division network of a single beam B according to an embodiment of the present utility model.

The power division network comprises a single-beam power division network layer 1, a power division network 2, a total port 3, a division port 4, a strip line 5, metal ground via holes with the power division network layer and a chip layer mutually communicated in the vertical direction 6, a bending structure 7, a first metal frame 8, a first metal ground via hole 9, a second metal frame 10 and a second metal ground via hole 11.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by a person of ordinary skill in the art without making any inventive effort are within the scope of the present utility model.

The core of the utility model is to provide a multi-beam power division network and a feed network applied to a multi-beam phased array antenna so as to solve the problems of larger main board area occupied by coplanar placement of a plurality of single-beam phased array antennas and poor amplitude-phase consistency.

In order to better understand the aspects of the present utility model, the present utility model will be described in further detail with reference to the accompanying drawings and detailed description.

In the field of satellite communications, it is desirable to receive and amplify weaker satellite communications signals in order to better communicate between the complete terminal and the satellite. The signal received by the conventional satellite communication is designed as a single-beam antenna signal, so that the space angle of a beam is narrow. So that only part of the signal can be received in the process of receiving the antenna signal. In order to receive the complete antenna signal, multiple single beam phased array antennas are used to receive simultaneously, resulting in a large main board area. For example, the size of a motherboard occupied by a single-beam phased array antenna is 56.45mm by 56.45mm, and if a plurality of single-beam phased array antennas are adopted, a tiling mode is required to be performed by using a plurality of motherboard sizes of 56.45mm by 56.45mm, so that the occupied motherboard area is larger. A plurality of single-beam phased array antennas are installed on the basis of the original single-beam phased array antennas, and are combined and spliced on the basis of the amplitude phase consistency of each single-beam phased array antenna, so that the amplitude phase consistency of the plurality of single-beam phased array antennas of the whole single-beam phased array antenna can be poor. The feed network based on multiple beams provided by the utility model solves the technical problems.

Fig. 1 is a block diagram of a front view of a multi-beam power division network applied to a multi-beam phased array antenna according to an embodiment of the present utility model, where, as shown in fig. 1, a power division network 2 includes at least two single-beam power division network layers 1;

Each single-beam power division network layer 1 is sequentially stacked;

The power division network lines corresponding to the single-beam power division network layers 1 meet the conditions of equal phase and equal amplitude, so that the equal phase and the equal amplitude are realized through signals received and/or transmitted by the multi-beam phased array antenna.

The main function of the power division network layer corresponding to the dielectric substrate where the multi-beam power division network is located is to uniformly distribute input signals to a plurality of ports 4, and the power division network layer is used for power distribution in a radio frequency system, and can be a divide by two, a divide by four, an eight and the like, and the power division network 2 can be passive or active. Passive power distribution networks achieve power distribution by passive elements only (e.g., resistors, capacitors, inductors), and active power distribution networks may include active elements (e.g., amplifiers) to enhance signals. The present utility model is not particularly limited, and may be set according to actual conditions.

The single-beam power division network layer 1 is used for transmitting single-beam signals, and the single-beam power division network layer 1 comprises a power division network line length. Plays a critical role in multi-beam antenna systems, and is responsible for efficiently distributing signal energy to individual radiating elements of an antenna array to form a desired beam pattern. The beam work dividing network layer distributes the power of the input signal to a plurality of sub-ports 4, each corresponding to one or more radiating elements in the antenna array. Single beam power division network layer 1 is a key component in achieving beam forming, and each beam can point to one direction or cover one area. The multiple beams are directed in multiple different directions or cover multiple different areas by multiple single beam power division network layers 1. In modern multi-beam antenna systems, the single-beam power division network layer 1 can realize dynamic adjustment and reconstruction of beams so as to adapt to the change of communication requirements. The design of the single beam power splitting network layer 1 requires consideration of insertion loss to ensure the efficiency of the signal during the allocation process.

In this embodiment, at least two single-beam power division network layers 1 are included, and each single-beam power division network layer 1 is placed in a stacked manner. In addition, the stacked placement is to place the structures of two or more components on top of each other in a physical layout or design to constitute the stacked placement. Specifically, each beam power division network layer is sequentially stacked from top to bottom according to the size of a medium substrate where the multi-beam power division network is located.

In this embodiment, all stacked placement from top to bottom is realized, and in combination with the above embodiment, the size of the dielectric substrate occupied by the single-beam phased array antenna is 56.45mm by 56.45mm, and in combination with the stacked placement of this embodiment, the size of the dielectric substrate occupied by the multi-beam phased array antenna is 56.45mm by 56.45mm, so that the area occupied by the dielectric substrate is unchanged, and occupied resources of the motherboard are further saved. It should be noted that, the dielectric substrate where the multi-beam power division network is located in this embodiment includes a dielectric layer and metal layers distributed on the upper and lower surfaces of the dielectric layer, where the metal layers are etched to form a required structure based on practical situations. The power division network may be formed by etching a metal layer.

It should be noted that what is achieved in this embodiment is a spatial lamination, a physical lamination, to save space or to achieve specific radiation characteristics of the antenna. The corresponding functional stacks are not limited in this embodiment, and if the functional stacks are performed, different functions or components thereof may be stacked in design to optimize performance or simplify structure, and may be set according to actual situations.

The power division network lines corresponding to the single-beam power division network layers 1 meet the conditions of equal phase and equal amplitude, so that the equal phase and the equal amplitude are realized through signals received and/or transmitted by the multi-beam phased array antenna. The equiphase is determined based on the equiphase length of the corresponding power division network line length of each single-beam power division network layer 1, and the equiphase is realized by the equiphase of the same number of stages of the power division realized in each single-beam power division network layer 1 and the power distribution ratio of the power divider.

The power division number is a cascade of stages that divide an input signal into several equally divided signals, and is typically determined by cascading a plurality of bisector power dividers, each bisector dividing the signal into two equal portions. Fig. 2 is a schematic diagram of an exploded view of a single beam a power division network layer provided by an embodiment of the present utility model, and fig. 3 is a schematic diagram of an exploded view of a single beam B power division network layer provided by an embodiment of the present utility model, as shown in fig. 2 and 3, 4 2-level power division networks input beam signals of a chip layer through a total port 3 as an example in a signal transmitting process, determine a corresponding single beam power division network layer 1 through the beam signals, perform power processing through the single beam power division network layer 1, process the beam signals to obtain a plurality of sub-signals, transmit the sub-signals to a corresponding sub-port 4, and perform signal processing through the chip layer so that the sub-signals after signal processing are transmitted through an antenna unit. The phase relationship between the individual sub-ports 4 is taken into account to ensure that the signals, when combined, achieve the desired beam forming or radiation pattern of the antenna.

The equal power division in the embodiment is based on the same number of stages of the power division of each beam power division network layer corresponding to the plurality of beams and the power distribution ratio of the power divider, and the amplitude phase consistency is realized on the basis of realizing the equal phase. Specifically, the power division network layer based on each beam is provided with strip lines 5 with equal length, and the same power division network level is designed among the beams. It should be noted that, the amplitude-phase consistency requires not only that the amplitude of the signals received by each radiation unit be the same, but also that the signals have the same phase, and that when the signals are superimposed on each other in space, the antenna is caused to form a beam having a specific directivity.

The multi-beam power division network applied to the multi-beam phased array antenna comprises at least two single-beam power division network layers 1, wherein the single-beam power division network layers 1 are sequentially stacked, and the power division network lines corresponding to the single-beam power division network layers 1 meet the conditions of equal phase and equal amplitude so as to achieve equal phase and equal amplitude through signals received and/or transmitted by the multi-beam phased array antenna. According to the utility model, each single-beam power division network layer 1 is placed in a laminated manner, so that each single-beam power division network layer 1 shares the same antenna array surface, the situation that each single-beam power division network layer 1 uses different antenna array surfaces and occupies a large space in a coplanar placement manner due to simultaneous reception of a plurality of traditional single-beam phased array antennas is avoided, and therefore, the occupied area of a main board corresponding to a multi-beam feed network is saved. In addition, based on the equal phase of the power division network line length of each single-beam power division network layer 1, the phase consistency among the single-beam power division network layers 1 is realized. The equal amplitude of the power division network line length of each single-beam power division network layer 1 realizes the amplitude consistency among the single-beam power division network layers 1. In summary, it is achieved that the amplitude and phase of the antenna signal and/or the transmit signal received by the multiple beams have good consistency.

In some embodiments, the power division network line length corresponding to each beam power division network layer is configured by the strip line 5 of the power division network layer.

Specifically, the strip line 5 is a transmission line between the split ports 4 in the power split network layer, between the split ports 4 and the total port 3. Fig. 4 is a block diagram of a power division network according to an embodiment of the present utility model, and as shown in fig. 4, a strip line 5 in the power division network is a transmission line corresponding to each of the ports 4. The equal phase matching of the paths from the split port 4 to the total port 3 is achieved by the configuration of the strip line 5 of the power split network layer. In some embodiments, a specific configuration process of the stripline 5 of the power division network layer includes:

Acquiring the size of a medium substrate where each single-beam power division network layer 1 corresponds to, the relative position between a sub-port 4 and a main port 3, and a metal ground via hole 6 where the power division network layer and a chip layer are mutually communicated in the vertical direction;

The strip line 5 of the power division network layer is configured according to the size of a medium substrate where each single-beam power division network layer 1 corresponds to, the relative position between the sub-port 4 and the total port 3 and the metal ground via holes 6 where the power division network layer and the chip layer are mutually communicated in the vertical direction, and the paths between the sub-port 4 and the total port 3 matched with equal phases and equal amplitude are determined;

The strip line 5 corresponding to the path between the equal-phase and equal-amplitude matched sub-port 4 and the total port 3 is used as the power division network line corresponding to each single-beam power division network layer 1.

The strip line 5 needs to be configured by considering the size of a dielectric substrate (space of a main board) where the corresponding multi-beam power division network layer between different beams corresponds to and the relative position between the division port 4 and the total port 3, and the metal ground via hole position 6 where the power division network layer and the chip layer are mutually communicated in the vertical direction, so that the path between each division port 4 and the total port 3 can be realized.

Fig. 5 is a schematic diagram of a single beam a power division network layer provided by the embodiment of the present utility model on a dielectric substrate, fig. 6 is a schematic diagram of a single beam B power division network layer provided by the embodiment of the present utility model on a dielectric substrate, as shown in fig. 5 and 6, a total port 3 is a left mark, a metal ground via hole 6 where the power division network layer and a chip layer are mutually communicated in a vertical direction is based on a position corresponding to a middle circle in each quincuncial hole in the split port 4, and a metal ground via hole 6 where the power division network layer and the chip layer are mutually communicated in a vertical direction is shown as a mark 6 in fig. 4. The strip line 5 in fig. 5 and 6 is a power division network line of the current single beam power division network layer 1.

The stripline 5 configuration processing of the power division network layer provided in this embodiment determines the power division network line length corresponding to each beam power division network layer, so as to achieve good amplitude phase consistency output and good power output consistency of each sub-port 4.

In some embodiments, the equal length property of the power division network line length corresponds to the adjustment process of the strip line 5, specifically, the power division network line length corresponding to each single beam power division network layer 1 is determined by the winding mode of the strip line 5 of the power division network layer.

Specifically, the winding of the strip line 5 is a process performed on the conductive strip during the manufacturing process of the strip line 5, and may need to be wound into a specific shape, such as a spiral, a round, or other shape, to adapt to a specific circuit design or to implement impedance transformation. The density of its windings affects the characteristic impedance and electromagnetic properties of the transmission line. The winding technique requires precise control to ensure consistency and performance of the transmission line. The wire and the insulating medium are prevented from being damaged in the winding process. The shape of the corresponding winding is not limited in this embodiment, and may be set according to practical situations.

In some embodiments, further comprising a bending structure 7;

And the target strip line 5 of the power division network layer is adjusted by adopting a bending structure 7 so as to realize equal phase and equal amplitude of the power division network line length corresponding to each single-beam power division network layer 1.

Specifically, the target strip line 5 of the power division network layer is adjusted by adopting a bending structure 7, so that the equal phase of the length of the power division network line is realized. As shown in fig. 5 and 6, the corresponding bending structures such as the marks 7, the bending structures 7 of different beams may consider the unoccupied via hole positions disposed on the dielectric substrate where the power division network layer is located, and the shapes corresponding to the bending structures 7 of each power division, which are not limited herein. The position of the target strip line 5 at which the strip line 5 is required to be bent may be set according to the actual situation.

The winding manner and the connection relation of the bending structure 7 provided in this embodiment reduce transmission loss of signals and external interference, and ensure equal phase and equal amplitude of the power division network line length corresponding to each single beam power division network layer 1.

In some embodiments, the number of ports 4 to which the power division network lines corresponding to each single beam power division network layer 1 belong is the same;

Each stage of power division of each single-beam power division network layer 1 is uniformly distributed and placed in the corresponding single-beam power division network layer 1, and each stage of power division of each single-beam power division network layer 1 is in a mirror symmetry structure or a non-mirror symmetry structure.

Specifically, as shown in fig. 2 and 3, the number of the ports 4 corresponding to different beams in the corresponding beam power division network layers is the same, that is, the power division number is the same. Taking fig. 2 and 3 as examples, the two power divisions are 42 stages. The power divisions of all levels are uniformly distributed and placed in the corresponding beam power division network layers, and all levels of the power divisions of the single beam power division network layer 1 of each layer are in mirror symmetry structures or non-symmetry structures, preferably mirror symmetry structures or non-mirror symmetry structures.

The mirror symmetry structure is used for realizing better impedance matching, reducing signal reflection and improving transmission efficiency. Regarding the center line or center point symmetry, in the power division network, the mirror symmetry is used for realizing symmetrical power distribution and phase characteristics, is convenient for symmetrical distribution design, and saves the research and development cost of research and development personnel.

Taking fig. 2 as an example, the horizontal plane direction of the single beam power division network layer 1 is taken as a reference plane, and a1, a2, a3 and a4 are sequentially arranged from left to right and from top to bottom, wherein a1, a2, a3 and a4 respectively show the central line symmetry of the two, and a1, a3, a2 and a4 respectively show the central line symmetry of the two. Similarly, in fig. 3, the horizontal plane direction of the single beam power division network layer 1 is taken as a reference plane, and b1, b2, b3 and b4 are sequentially from left to right and from top to bottom, wherein b1 and b2, b3 and b4 respectively show central line symmetry of the two, and b1 and b3, b2 and b4 respectively show central line symmetry of the two.

In addition, for the non-mirror-symmetrical structure, the lowest 1-level 2 power component, as seen in connection with fig. 2, is not symmetrical with any of the above-mentioned 2-level power components (a 1, a2, a3 and a 4) in the center line or center point, and thus is a non-mirror-symmetrical structure.

It can be understood that, in this embodiment, for a single beam power division network layer 1, equal amplitude and equal phase are satisfied between power division network lines corresponding to each level of power division.

The mirror symmetry structure and the non-mirror symmetry corresponding to the power division of each stage provided by the embodiment enable the arrangement to be tidy and attractive, and meanwhile, the work division structure and the non-mirror symmetry are convenient for workers in subsequent processes to check.

In some embodiments, the direction of the dielectric substrate where each single-beam power division network layer 1 is located is taken as the horizontal direction, and the sub-port 4 of each single-beam power division network layer 1 is connected with the feed port of the chip layer in the vertical direction through a vertical transition structure so as to realize the connection of the chip layer and the power division network layer;

In the horizontal direction, the ports 4 of the single-beam power division network layers 1 and the total ports 3 are connected through power division network lines, and the ports 4 of the single-beam power division network layers 1 are connected through power division network lines. Specifically, the direction of the dielectric substrate where the single-beam power division network layer 1 is located is taken as the horizontal direction, and the sub-port 4 of the single-beam power division network is connected with the feed port of the chip layer in the vertical direction through a vertical structure, so that the connection between the power division network layer and the chip layer is realized, and signals corresponding to the sub-port 4 passing through the single-beam power division network can be fed to the chip layer. Meanwhile, in the horizontal direction, the ports 4 of the single-beam power division network layers 1 are connected with the total ports 3 through power division network wires, and the ports 4 are connected with each other through the power division network wires. The connection relationship between the split port 4 and the element of the feed port of the chip layer provided in this embodiment is connected to the split port 4 of each feed port by a good match of unconventional coax. The amplitude and phase consistency is realized through the connection of the sub-port 4 of each single-beam power division network layer 1 and the total port 3, and the connection of the sub-port 4 and the sub-port 4 through the power division network line.

In some embodiments, the power distribution system further comprises a first shielding structure and a second shielding structure, wherein the first shielding structure is positioned around the power distribution network line;

The first shielding structure comprises a first metal frame 8 and first metal ground through holes 9, wherein the first metal frame 8 forms a first shielding groove, a power division network wire is positioned in the first shielding groove, and the first metal ground through holes 9 are positioned at two sides of the shielding groove;

The second shielding structure comprises a second metal frame 10 and a second metal ground via hole 11, the first metal frame 8 is connected with the second metal frame 10, the second metal frame 10 forms a second shielding groove, the split port 4 is located in the second shielding groove, and the second metal ground via hole 11 is located on the outer periphery side of the second shielding groove.

As shown in fig. 4, the first shielding structure and the second shielding structure are correspondingly located around the power division network line and the split port 4, the first metal frame 8 of the first shielding structure forms a first shielding groove, the power division network line is located in the first shielding groove, and the first metal ground vias 9 are located at two sides of the first shielding groove and grounded, so that a shielding effect is achieved. Similarly, the second metal frame 10 of the second shielding structure forms a second shielding groove, the sub-port 4 is positioned in the first shielding groove, the second metal ground via 11 is positioned at the peripheral side of the second shielding groove and grounded, so as to realize the shielding effect. It can be understood that the first metal frame 8 and the second metal frame 10 may be hollow areas, and the first corresponding power division network lines are distributed in the hollow areas. The distribution conditions of the first metal vias 9 and the second metal vias 11 are not limited, and the first metal vias 9 may be uniformly distributed on both sides of all the first shielding trenches, and the second metal vias 11 may be uniformly distributed on the peripheral side of the second shielding trenches. Each metal-to-metal via may be equidistant from corresponding adjacent metal-to-metal vias.

The second metal ground via 11 provided in this embodiment is used for shielding an interference signal corresponding to a signal penetrating into the split port 4, so that the signal penetrating into the split port 4 is transmitted to the chip layer as much as possible. The first metal ground via 9 is used for shielding signals corresponding to the power division network line. In some embodiments, the single-beam power division network layers 1 are sequentially stacked from top to bottom, wherein the upper layer ground of the first single-beam power division network layer 1 is connected with the first single-beam power division network layer 1, the first single-beam power division network layer 1 is connected with the lower layer ground of the first single-beam power division network layer 1, the lower layer ground of the upper single-beam power division network layer 1 and the upper layer ground of the lower single-beam power division network layer 1 of the adjacent layers are in the same layer, and the last single-beam power division network layer 1 is connected with the lower layer ground of the last single-beam power division network layer 1. Specifically, taking single beam a and single beam B as examples, the present embodiment only considers the problem solved by the present utility model, which corresponds to 5 layers, the first layer is the upper layer ground (metal ground) of the single beam a power division network, the second layer is the single beam a power division network, the third layer is the lower layer ground of the single beam a power division network and the upper layer ground of the single beam B power division network, the fourth layer is the single beam B power division network, and the fifth layer is the lower layer ground of the single beam B power division network.

The power division networks corresponding to the single beam A and the single beam B are mainly connected with feed ports through unconventional matching coaxiality, and the two main ports 3 are provided with strip lines 5 with equal lengths along the way, so that each sub-port 4 outputs equal phases, and the equal phases and equal power output radio frequency signals of the beam sub-ports 4 are realized. In addition, the embodiment is based on the overall arrangement layout, one-layer ground is reduced, the lower-layer ground of the upper beam power division network layer of the adjacent layer and the upper-layer ground of the lower beam power division network layer are positioned at the same layer, blind holes are reduced, and design complexity is reduced to a certain extent.

In addition, compared with the traditional single-beam design, the multi-beam power division network also increases the beam space angle, so that the received signal range is wider. Furthermore, in the multi-beam power division network, the application scene can be increased, and the flexible switching of single beams is realized.

The utility model further provides a multi-beam feed network applied to the multi-beam phased array antenna, which comprises a vertical transition structure, a feed layer and the multi-beam power division network applied to the multi-beam phased array antenna;

the feed layer is connected with the power division network layer of the multi-beam power division network through a vertical transition structure.

It is understood that the feed layer and the power division network layer of the multi-beam power division network are connected by a vertical transition structure. The vertical transition structure is an important design element in electronic and microwave engineering for achieving a smooth transition between different dielectric or different electrical layers of a printed circuit board (Printed Circuit Board, PCB). A vertical connection of the medium is achieved between a transmission line, such as a microstrip line or strip line 5, and a waveguide, coaxial cable or other type of transmission line. Ensuring proper impedance matching between different transmission lines or components, reducing signal reflection and transmission loss, when power transfer in a vertical direction is required, such as vertical feeding from a microstrip line to an antenna array, and in PCB board designs or packages, vertical stacking of components or circuit layers may be required due to space constraints. Electromagnetic interference between different parts can be reduced by transmitting signals through the vertical transition structure. Various factors are considered in designing the vertical transition structure, including electrical characteristics (e.g., impedance matching, transmission loss), physical dimensions, thermal performance, cost, and manufacturing process. The correct design can ensure the effective transmission of signals and improve the overall performance and reliability of the system.

In the embodiment, the feed layer comprises a microstrip line, the microstrip line is located at the periphery of the feed port of the chip layer to form a closed structure, and the microstrip line is connected with the sub-port 4 of the power division network layer through a vertical transition structure and is used for feeding signals of the power division network layer to the feed port of the chip layer through the sub-port 4 of the power division network layer to form a feed network.

Fig. 7 is a schematic diagram of microstrip lines corresponding to ports of a power division network layer according to an embodiment of the present utility model, as shown in fig. 7, taking a dual-beam power division network as an example, a single-beam power division network layer 1 of each layer includes 16 ports 4. In order to ensure that signals between the chip layer and the power division network layer are transmitted in a larger range, the existing via holes of the chip layer and the power division network layer have deviation, a sub-port 4 of the power division network layer is connected with a microstrip line of a feed layer of the chip layer through a vertical transition structure, so that signals around the sub-port 4 can be transmitted to the chip layer. The feeding layer in this embodiment includes microstrip lines for implementing signal transmission of the chip layer and the power division network layer. Microstrip lines exhibit a closed structure, and are formed of a conductive strip and ground plane, typically on the surface of a dielectric substrate. The microstrip line is connected with the sub-port 4 of the power division network layer through the vertical transition structure, and the signal of the power division network layer is fed to the feed port of the chip layer through the sub-port 4 in the maximum range to form a feed network.

The feed port of the chip layer, which is located at the edge or surface of the chip, is a small area or contact point on the chip, and is used for introducing the signal of the power division network layer into the chip or transmitting the signal inside the chip. The feed ports are typically connected to a feed network within the chip, responsible for distributing signals to different parts of the chip.

The description of the multi-beam feeding network applied to the multi-beam phased array antenna provided by the utility model refers to the embodiment of the method, and the utility model is not repeated herein, and has the same beneficial effects as the multi-beam power dividing network applied to the multi-beam phased array antenna.

The utility model further provides a multi-beam phased array antenna, which comprises a chip layer, a plurality of antenna units and the multi-beam feed network applied to the multi-beam phased array antenna;

the chip layer is connected with the plurality of antenna units;

The multi-beam feed network is connected with the chip layer.

Specifically, under the condition of transmitting signals, the radio frequency signals are transmitted to the multi-beam feed network to determine the corresponding single-beam power division network layer 1, the radio frequency signals enter at a total port in the single-beam power division network layer 1 and are processed to the ports of the single-beam power division network layer 1, the radio frequency signals are transmitted to an input port of a chip layer based on the connection relation between the ports and a vertical transition structure, the signals processed by the chip layer are subjected to dispersion processing by the chip layer, the single-beam signals of the single-beam power division network layers are formed through a plurality of antenna units, and the single-beam signals (multi-beam signals) are radiated outwards. Under the condition of receiving signals, signals of a plurality of antenna units are synthesized through a chip layer to obtain multi-beam signals, the multi-beam signals are transmitted to the corresponding single-beam power division network layer 1 through the connection relation between the output ports of the chip layer and the ports of the corresponding single-beam power division network layer 1 in the multi-beam feed network through a vertical transition structure, and the multi-beam signals are processed to the corresponding total ports through the power division of the single-beam power division network layer 1 so as to output the processed radio frequency signals.

In the multi-beam phased array antenna of the present utility model, if the same type of radio frequency signal processing is implemented in the phased array antenna for the scene of the received signal and/or the transmitted signal, only the function of the transmitted signal or the received signal can be implemented because the frequencies of the radio frequency signals corresponding to the transmitted signal and the received signal are different. If the processing of different radio frequency signals is realized, the function of sharing the transmitting signal and the receiving signal can be realized, but at the same time, only the transmission of one signal can be realized, namely the transmitting signal and the receiving signal can be shared in a time sharing way.

For the description of the multi-beam phased array antenna provided by the present utility model, refer to the above method embodiment, and the present utility model is not repeated herein, which has the same beneficial effects as the multi-beam power division network applied to the multi-beam phased array antenna.

Fig. 8 is a schematic diagram of the amplitude of a power division network of a single beam a according to an embodiment of the present utility model, as shown in fig. 8, where the amplitude values corresponding to the amplitude values respectively differ less in the case of frequencies 17.7GHz and 21.20GHz, and fig. 9 is a schematic diagram of the phase of a power division network of a single beam a according to an embodiment of the present utility model, as shown in fig. 9, where the phase differences corresponding to the amplitude values respectively differ less in the case of frequencies 17.7GHz and 21.20 GHz. Fig. 10 is a schematic diagram of the amplitude of a power division network of a single beam B according to an embodiment of the present utility model, as shown in fig. 10, where the amplitude values corresponding to the amplitude values respectively differ less in the case of frequencies 17.7GHz and 21.20GHz, and fig. 11 is a schematic diagram of the phase of a power division network of a single beam B according to an embodiment of the present utility model, as shown in fig. 11, where the phase differences corresponding to the amplitude values respectively differ less in the case of frequencies 17.7GHz and 21.20 GHz. Therefore, the same frequency point has the amplitude phase difference smaller than 0.2dB and the phase difference smaller than 2 degrees, and has good amplitude-phase consistency.

The multi-beam power division network and the feed network applied to the multi-beam phased array antenna provided by the utility model are described in detail. In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section. It should be noted that it will be apparent to those skilled in the art that the present utility model may be modified and practiced without departing from the spirit of the present utility model.

It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.

Claims (10)

1. A multi-beam power division network for a multi-beam phased array antenna, characterized in that the power division network (2) comprises at least two single-beam power division network layers (1);

each single-beam power division network layer (1) is sequentially stacked;

the corresponding power division network lines of each single-beam power division network layer (1) meet the conditions of equal phase and equal amplitude, so that the equal phase and the equal amplitude are realized through signals received and/or transmitted by the multi-beam phased array antenna.

2. Multi-beam power division network for a multi-beam phased array antenna according to claim 1, characterized in that the power division network line length corresponding to each single-beam power division network layer (1) is configured by a strip line (5) of the power division network layer.

3. Multi-beam power division network for a multi-beam phased array antenna according to claim 2, characterized in that the power division network line length corresponding to each single-beam power division network layer (1) is determined by the winding mode of the strip line (5) of the power division network layer.

4. A multi-beam power splitting network for use in a multi-beam phased array antenna according to claim 3, further comprising a meander structure (7);

and adjusting the target strip line (5) of the power division network layer by adopting the bending structure (7) to realize equal phases and equal amplitudes of the power division network line length corresponding to each single-beam power division network layer (1).

5. The multi-beam power division network applied to the multi-beam phased array antenna according to claim 1, wherein the number of ports (4) to which the power division network lines corresponding to the single-beam power division network layers (1) belong is the same;

The power division of each single-beam power division network layer (1) is uniformly distributed and placed in the corresponding single-beam power division network layer (1), and all the power divisions of each single-beam power division network layer (1) are in a mirror symmetry structure or a non-mirror symmetry structure.

6. The multi-beam power division network applied to the multi-beam phased array antenna according to claim 1, wherein the direction of the dielectric substrate where each single-beam power division network layer (1) is located is taken as a horizontal direction, and the sub-ports (4) of each single-beam power division network layer (1) are connected with the feed ports of the chip layer in a vertical direction through a vertical transition structure so as to realize the connection of the chip layer and the power division network layer;

in the horizontal direction, the ports (4) of the single-beam power division network layers (1) are connected with the total ports (3) and the ports (4) of the single-beam power division network layers (1) through the power division network lines.

7. The multi-beam power splitting network applied to the multi-beam phased array antenna of claim 6, further comprising a first shielding structure and a second shielding structure, wherein the first shielding structure is positioned around the power splitting network line;

The first shielding structure comprises a first metal frame (8) and first metal ground through holes (9), wherein the first metal frame (8) forms a first shielding groove, the power division network line is positioned in the first shielding groove, and the first metal ground through holes (9) are positioned at two sides of the first shielding groove;

The second shielding structure comprises a second metal frame (10) and a second metal ground via hole (11), wherein the first metal frame (8) is connected with the second metal frame (10), the second metal frame (10) forms a second shielding groove, the split port (4) is located in the second shielding groove, and the second metal ground via hole (11) is located at the peripheral side of the second shielding groove.

8. The multi-beam power division network applied to the multi-beam phased array antenna according to claim 1 is characterized in that each single-beam power division network layer (1) is sequentially stacked from top to bottom, wherein the upper layer of a first single-beam power division network layer (1) is connected with the first single-beam power division network layer (1), the first single-beam power division network layer (1) is connected with the lower layer of the first single-beam power division network layer (1), the lower layer of the upper single-beam power division network layer (1) of the adjacent layer and the upper layer of the lower single-beam power division network layer (1) are located at the same layer, and the last single-beam power division network layer (1) is connected with the lower layer of the last single-beam power division network layer (1).

9. A multi-beam feed network for a multi-beam phased array antenna, comprising a vertical transition structure, a feed layer and a multi-beam power splitting network for a multi-beam phased array antenna according to any of claims 1 to 8;

And the feed layer is connected with the power division network layer of the multi-beam power division network through the vertical transition structure.

10. A multi-beam phased array antenna comprising a chip layer, a plurality of antenna elements and the multi-beam feed network of claim 9 for use in a multi-beam phased array antenna;

The chip layer is connected with the plurality of antenna units;

the multi-beam feed network is connected with the chip layer.