CN223013972U - A fixture for flattening products that are warped due to mold sealing - Google Patents

Abstract

The utility model provides a jig for leveling products that are warped due to mold sealing, comprising: a base, comprising a groove sunken from the top surface of the base; a container, arranged in the groove, and comprising a container space with an opening facing upward for placing the product; a spring structure, arranged in the groove and connected to the bottom surface of the container, for applying a force to the container in the direction of the opening; and an upper cover, for being arranged above the base and applying a force downward to the container. The purpose of the utility model is to provide a jig for leveling products that are warped due to mold sealing, so as to at least achieve effective leveling of the product.

Description

Jig for leveling product warped by mold sealing

Technical Field

The utility model relates to a jig for leveling a product warped by a mold seal.

Background

Fig. 1 to 4 show a prior art molding process. Fig. 1 shows a prior art substrate 1. Fig. 2 shows the molding of a substrate 1 using prior art molding dies 2, wherein two molding dies 2 sandwich the substrate 1. Fig. 3 shows the substrate 1 after the selective molding is completed, and a mold layer 3 is formed on the substrate 1. Fig. 4 shows a singulated product 4, wherein the product 4 has a smile shape on the side with the mold layer 3, the product 4 is more susceptible to shrinkage of the molding compound (compound) than a typical product because of the thin thickness of the substrate 1 and the non-uniformity of the overall structure after molding, the warpage (warpage) is found to be out of specification after singulation, and the test result deviation (out of specification, OOS)/reject ratio/yield loss averages about 3.33%.

The shape and materials of the product 4 are fixed, and the adjustment of the process parameters of the product is tried, but the situation that the warpage exceeds the specification cannot be overcome. In order to improve the yield, the process end attempts to return the product 4 to a flat state, which is called leveling.

Disclosure of utility model

In view of the problems in the related art, it is an object of the present utility model to provide a jig for flattening a product warped by molding, so as to at least achieve effective flattening of the product.

The utility model provides a jig for leveling products warped due to mold sealing, which comprises a base, a containing piece, a spring structure and an upper cover, wherein the base comprises a groove recessed from the top surface of the base, the containing piece is arranged in the groove and comprises a containing space with an upward opening for containing the products, the spring structure is arranged in the groove and connected with the bottom surface of the containing piece and is used for giving acting force to the containing piece in the direction of the opening, and the upper cover is used for being arranged above the base and giving acting force to the containing piece downwards.

In some embodiments, the jig further comprises a magnet buried in the bottom of the accommodating member.

In some embodiments, the magnet imparts a downward magnetic force to the product when the product is placed in the receptacle.

In some embodiments, the upper cover is made of a material that can be acted upon by the magnetic force of the magnet.

In some embodiments, the magnet is disposed on a central axis of the receptacle.

In some embodiments, the spring structure is disposed on a central axis of the receptacle.

In some embodiments, the spring structure overlaps with the projection of the magnet in the vertical direction.

In some embodiments, the receptacle protrudes from the top surface of the base when the upper cover is not over the base.

In some embodiments, the spring structure protrudes from the top surface of the base when the upper cover is not over the base.

In some embodiments, when the upper cover is not covered on the base, the bottom surface of the accommodating space is higher than the top surface of the base in the vertical direction.

In some embodiments, when the product is placed in the receptacle and the upper cover is capped on the base, the top surface of the product contacts the upper cover.

In some embodiments, when the product is placed in the receptacle and the upper cover is placed over the base, the top surface of the product is flush with the top surface of the base.

In some embodiments, the upper cover includes a positioning hole, the base includes a positioning post, and the positioning hole and the positioning post are engageable with each other.

In some embodiments, the locating holes and locating posts are disposed at corners of the upper cover and base, respectively.

In some embodiments, the lateral dimension of the receiving space is greater than the product.

In some embodiments, the base includes a plurality of grooves, a receiving member corresponding to the grooves one by one, and a spring structure.

The embodiment of the application also provides a jig for leveling a product warped by mold sealing, which comprises a base, a containing piece, a spring structure, a magnet and an upper cover, wherein the base comprises a groove recessed from the top surface of the base, the containing piece is arranged in the groove and comprises a containing space with an upward opening for containing the product, the spring structure is arranged in the groove and connected with the bottom surface of the containing piece and is used for giving acting force to the containing piece in the direction of the opening, the magnet is arranged at the bottom of the containing piece and is used for adsorbing the product, and the upper cover is arranged above the base and is used for giving downward acting force to the containing piece.

In some embodiments, the magnets are buried inside the receptacle and are not in direct contact with the product.

In some embodiments, the spring structure is secured at both ends to the recess and the receptacle, respectively.

In some embodiments, the base includes a plurality of recesses and receptacles, magnets and spring structures in one-to-one correspondence with the recesses, and the plurality of recesses are arranged in an array.

The beneficial technical effects of the utility model are as follows:

the jig provided by the embodiment of the application is matched with each other through the upward elastic force provided by the spring structure and the downward pressure provided by the upper cover under the gravity, so that the product is leveled, and the warping of the product is reduced.

Drawings

Fig. 1 shows a prior art substrate.

Fig. 2 illustrates the molding of a substrate using a prior art molding die.

Fig. 3 shows the substrate after the prior art selective molding is completed.

Figure 4 shows a prior art singulated product after singulation.

Fig. 5 illustrates a jig for flattening a product warped by a mold according to an embodiment of the present application.

Fig. 6 shows a perspective view of one of the recesses of fig. 5 and the receiving member, spring structure, magnet therein.

Fig. 7 shows a cross-sectional view of one of the recesses of fig. 5 and the receiving member, spring structure, magnet therein.

Detailed Description

For a better understanding of the spirit of embodiments of the present application, a further description of some preferred embodiments of the application is provided below.

Embodiments of the present application will be described in detail below. Throughout the present specification, the same or similar components and components having the same or similar functions are denoted by similar reference numerals. The embodiments described herein with respect to the drawings are of illustrative nature, of diagrammatic nature and are provided for the basic understanding of the present application. The embodiments of the present application should not be construed as limiting the application.

As used herein, the terms "substantially," "substantially," and "about" are used to describe and illustrate minor variations. When used in connection with an event or circumstance, the terms can refer to instances where the event or circumstance occurs precisely and instances where it occurs to the close approximation.

In this specification, unless specified or limited otherwise, relative terms such as "central," "longitudinal," "lateral," "front," "rear," "right," "left," "interior," "exterior," "lower," "upper," "horizontal," "vertical," "above," "below," "top," "bottom," and derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.) should be construed to refer to the directions as described in the discussion or as illustrated in the drawings. These relative terms are for convenience of description only and do not require that the application be constructed or operated in a particular orientation.

For ease of description, "first," "second," "third," etc. may be used herein to distinguish between different components of a figure or series of figures. The terms "first," "second," "third," and the like are not intended to describe corresponding components.

For the warped product 200, there are usually clamps, molds used during the process, and jigs used after the process to perform the flattening action, which is focused on a mechanism for returning the product 200 to a flat state by a force (mechanical force, magnetic force, gravity force, adhesive force, etc.).

Fig. 5 illustrates a jig 100 for flattening a product 200 warped by mold sealing according to an embodiment of the present application, wherein a lower left corner portion depicts grooves 12 and receiving members 20 therein, a spring structure 30, and a magnet 50, it should be understood that four grooves 12 of the jig 100 shown in fig. 5 and the structures therein are identical, and it should also be understood that the grooves 12 are not limited to two rows and two columns shown in fig. 5, the jig 100 may include more grooves 12, for example, 8 rows and 8 columns, etc., only one product 200 is disposed on one of the receiving members 20 in fig. 5, and it should be understood that whether each receiving member 20 needs to be used or not may be determined according to the number of products 200 to be flattened. Fig. 6 shows a perspective view of one of the grooves 12 of fig. 5 and the receiving member 20, spring structure 30, and magnet 50 therein, wherein one side of the groove 12 is open to more clearly show the internal structure, with the understanding that in practice the four sides of the groove 12 are closed. Fig. 7 shows a cross-sectional view of one of the recesses 12 and the receiving member 20, spring structure 30, and magnet 50 of fig. 5.

The jig 100 of the application comprises a base 10, a containing piece 20 arranged in the groove 12, a containing space 22 arranged in the groove 12 and used for containing a product 200, a spring structure 30 arranged in the groove 12 and connected with the bottom surface of the containing piece 20, wherein the groove 12 is recessed from the top surface of the base 10, the containing piece 20 comprises an opening upwards containing space, the spring structure 30 is used for giving a force to the containing piece 20 towards the opening direction, and an upper cover 40 is used for being arranged above the base 10 and giving a downward force to the containing piece 20. The jig 100 of the embodiment of the present application planarizes the product 200 by cooperating with the upward elastic force provided by the spring structure 30 and the downward pressure provided by the upper cover 40 itself being subjected to gravity, thereby reducing warpage of the product 200.

In some embodiments, the jig 100 further includes a magnet 50 buried in the bottom of the accommodating member 20.

In some embodiments, the magnet 50 imparts a downward magnetic force to the product 200 when the product 200 is placed in the pod 20. The magnets 50 assist in positioning the product 200.

In some embodiments, the upper cover 40 is made of a material that can be acted upon by the magnetic force of the magnet 50. Therefore, the magnet 50 makes the accommodating member 20 be adsorbed on the upper cover 40, further provides upward pressure for the product 200, and improves the leveling effect of the jig 100.

In some embodiments, the magnet 50 is disposed on a central axis of the pod 20.

In some embodiments, the spring structure 30 is disposed on a central axis of the pod 20.

In some embodiments, the spring structure 30 overlaps with the projection of the magnet 50 in the vertical direction. The spring structure 30 and the magnet 50 are both disposed on the central axis of the accommodating member 20, so that the stress of the product 200 can be more uniform.

In some embodiments, the receptacle 20 protrudes from the top surface of the base 10 when the upper cover 40 is not covering the base 10.

In some embodiments, the spring structure 30 protrudes from the top surface of the base 10 when the upper cover 40 is not over the base 10.

In some embodiments, when the upper cover 40 is not covered on the base 10, the bottom surface of the accommodating space 22 is higher than the top surface of the base 10 in the vertical direction.

In some embodiments, when the product 200 is placed in the pod 20 and the upper cover 40 is placed over the base 10, the top surface of the product 200 contacts the upper cover 40. When the upper cover 40 is pressed down, the upper cover can be directly contacted with the product 200, the spring structure 30 enables the whole accommodating piece 20 to be pressed down and rebound, and the whole product 200 can be uniformly stressed through the expansion and contraction of the spring, so that the tolerance of the product 200 and the jig 100 can not be influenced.

In some embodiments, when the product 200 is placed in the pod 20 and the upper cover 40 is placed over the base 10, the top surface of the product 200 is flush with the top surface of the base 10.

In some embodiments, the upper cover 40 includes a positioning hole 60, the base 10 includes a positioning post 62, and the positioning hole 60 and the positioning post 62 are engaged with each other. In other embodiments, as shown in fig. 5, the upper cover 40 includes a positioning post 62, the base 10 includes a positioning hole 60, and the positioning hole 60 and the positioning post 62 may be engaged with each other.

In some embodiments, the locating holes 60 and the locating posts 62 are provided at the corners of the upper cover 40 and the base 10, respectively.

In some embodiments, the lateral dimension of the receiving space 22 is greater than the product 200.

In some embodiments, the base 10 includes a plurality of grooves 12, and the accommodating elements 20 and the spring structures 30 corresponding to the grooves 12 one by one.

The embodiment of the application also provides a jig 100 for leveling a product 200 warped by molding, comprising a base 10 including a groove 12 recessed from a top surface of the base 10, a container 20 disposed in the groove 12, the container 20 including a container space 22 with an opening facing upwards for placing the product 200, a spring structure 30 disposed in the groove 12 and connected to a bottom surface of the container 20 for applying a force to the container 20 in a direction of opening, a magnet 50 disposed at a bottom of the container 20 for adsorbing the product 200, and an upper cover 40 disposed above the base 10 for applying a force to the container 20 downward. The jig 100 of the embodiment of the present application planarizes the product 200 by cooperating with the upward elastic force provided by the spring structure 30 and the downward pressure provided by the upper cover 40 itself being subjected to gravity, thereby reducing warpage of the product 200.

In some embodiments, the magnet 50 is buried inside the receptacle 20 and is not in direct contact with the product 200. That is, the magnet 50 and the product 200 are separated by a portion of the receptacle 200.

In some embodiments, the spring structure 30 is secured at both ends to the recess 12 and the receptacle 20, respectively.

In some embodiments, the base 10 includes a plurality of recesses 12 and receptacles 20, magnets 50, and spring structures 30 in a one-to-one correspondence with the recesses 12, and the plurality of recesses 12 are arranged in an array.

The embodiment of the application levels the product 200 with the warpage exceeding the specification, so that the warpage returns to the range conforming to the specification, the warpage of the product 200 is reduced, the process reject ratio of the product 200 is reduced, and the process yield is improved. In the embodiment of the application, the magnet 50 is embedded in the accommodating part 20, and magnetic leveling is matched to improve the warping condition of the product 200, so that the yield is improved.

The present application relates to the design of a leveling tool and the product 200 of the present application may be a system in package (SYSTEM IN A PACKAGE, SIP), an antenna in package (AiP, antenna in Package), a 5G/6G millimeter wave device, a sensor, etc.

In some embodiments, the leveling of the jig 100 may be used with a reflow (reflow) process, the product 200 is easier to level by heating, the effect of warpage leveling can be achieved only by about 1/10 of the heating process time without heating, and the upper cover 40 performs the flatness and surface treatment on the product 200, so that the appearance and the overall functionality of the product 200 are not affected after the leveling.

Embodiments of the present application perform leveling of the product 200 without affecting the appearance and function of the product 200, reducing the overall warpage of the product 200 by about 50%. Embodiments of the present application reduce the out-of-specification yield of the warp of product 200, improving the overall yield by about 3%. Embodiments of the present application may also be developed for application to the flattening of irregularly shaped products 200.

In some embodiments, the accommodating space 22 of the accommodating element 20 is designed according to the size of the product 200, for example, the lateral size of the accommodating space 20 is larger than the lateral size of the product 200, the depth of the accommodating space 20 depends on the thickness of the product 200 and the warping allowance standard, and the accommodating space 20 is actually a shallow groove, so the magnet 50 is required to position the product 200.

When the jig 100 of the present application is used, the product 200 is first placed in the receiving space 22 with its back face facing upward, and the placement position of the product 200 is carefully confirmed, the positioning posts 62 are placed around the base 10, and then the upper cover 40 is covered, wherein the positioning holes 60 and the positioning posts 62 are fitted to each other. The telescopic sinking resilience force of the spring structure 30 can uniformly stress each product 200, and the upper cover 40 is attracted by the magnetic force of the magnet 50, so that the stress on the contact surface of the upper cover 40 and each accommodating piece 20 is more uniform, and all the products 200 can achieve the leveling effect.

In some embodiments, for larger-sized products, such as substrates prior to singulation, laser processing may be used for warp leveling, but at a higher cost. The jig 100 of the application can be used for leveling the singulated products 200 with lower cost. The embodiment of the application achieves the device with positioning, leveling and balanced force application by utilizing the characteristics of each element.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. A jig for flattening a product warped by a mold, comprising:

a base including a recess recessed from a top surface of the base;

the accommodating part is arranged in the groove and comprises an accommodating space with an upward opening for accommodating the product;

The spring structure is arranged in the groove and connected with the bottom surface of the accommodating part, and is used for giving acting force to the accommodating part towards the direction of the opening;

And the upper cover is arranged above the base and gives downward acting force to the accommodating part.

2. The jig of claim 1, further comprising:

And the magnet is buried at the bottom of the accommodating part and gives downward magnetic force to the product when the product is placed in the accommodating part.

3. The jig of claim 2, wherein the upper cover is made of a material that can be acted upon by the magnetic force of the magnet.

4. The jig of claim 2, wherein the magnet is disposed on a central axis of the receptacle.

5. The jig of claim 4, wherein the spring structure is disposed on a central axis of the receptacle.

6. The jig of claim 4, wherein the spring structure overlaps with a projection of the magnet in a vertical direction.

7. The jig of claim 1, wherein the receiving member protrudes from a top surface of the base when the upper cover is not covered on the base.

8. The jig of claim 7, wherein the spring structure protrudes from a top surface of the base when the upper cover is not covered on the base.

9. The jig according to claim 7, wherein when the upper cover is not covered on the base, a bottom surface of the accommodation space is higher than the top surface of the base in a vertical direction.

10. The jig of claim 1, wherein the upper cover comprises a positioning hole, the base comprises a positioning post, and the positioning hole and the positioning post are mutually jogged.