CN222996903U - Liquid cooling cabinet and data center liquid cooling system - Google Patents
Liquid cooling cabinet and data center liquid cooling system Download PDFInfo
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- CN222996903U CN222996903U CN202421577800.5U CN202421577800U CN222996903U CN 222996903 U CN222996903 U CN 222996903U CN 202421577800 U CN202421577800 U CN 202421577800U CN 222996903 U CN222996903 U CN 222996903U
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Abstract
本申请公开了一种液冷机柜及数据中心液冷系统，所述液冷机柜至少包括柜体、分层板和至少一个导流管，其中，所述柜体设有容置腔；所述分层板与所述柜体连接，所述分层板将所述容置腔划分为分液腔和放置腔，所述分层板上开设有用于将所述分液腔和所述放置腔连通的若干通孔；所述导流管位于所述放置腔内，所述导流管的一端与其中一所述通孔连通，所述导流管的另一端高于所述分层板，并且所述导流管的另一端用于开口朝向主要发热部件，以使得从其中一所述通孔流出的冷却液经所述导流管导向流动至所述主要发热部件周边。本申请提供的技术方案，可以提高对服务器的散热效果。
The present application discloses a liquid cooling cabinet and a data center liquid cooling system, wherein the liquid cooling cabinet at least comprises a cabinet body, a layered plate and at least one guide pipe, wherein the cabinet body is provided with a containing cavity; the layered plate is connected to the cabinet body, the layered plate divides the containing cavity into a liquid separation cavity and a placement cavity, and the layered plate is provided with a plurality of through holes for connecting the liquid separation cavity and the placement cavity; the guide pipe is located in the placement cavity, one end of the guide pipe is connected with one of the through holes, the other end of the guide pipe is higher than the layered plate, and the other end of the guide pipe is used to open toward the main heat generating component, so that the cooling liquid flowing out of one of the through holes is guided to flow to the periphery of the main heat generating component through the guide pipe. The technical solution provided by the present application can improve the heat dissipation effect of the server.
Description
Technical Field
The application relates to the field of data centers, in particular to a liquid cooling cabinet and a liquid cooling system of a data center.
Background
The existing data center liquid cooling refrigeration mode is to submerge a server in cooling liquid, and take heat on the server away from the cooling liquid in a cooling liquid circulating mode so as to achieve a refrigeration effect.
However, due to the low-density and floating nature of the cooling liquid after heat exchange, the temperature of the cooling liquid at the lower part of the liquid cooling cabinet is lower than that of the cooling liquid at the upper part, and the main heating components (such as a processor, a display card and the like) of the server are usually close to the upper part of the server, which also causes deviation of heat dissipation effect on the main heating components of the server.
Disclosure of Invention
The application aims to provide a liquid cooling cabinet and a data center liquid cooling system, which can improve the heat dissipation effect on a server.
In order to achieve the above purpose, the application provides a liquid cooling cabinet, which at least comprises a cabinet body, a layered plate and at least one flow guide pipe, wherein the cabinet body is provided with a containing cavity, the layered plate is connected with the cabinet body and divides the containing cavity into a liquid separating cavity and a placing cavity, a plurality of through holes for communicating the liquid separating cavity with the placing cavity are formed in the layered plate, the flow guide pipe is positioned in the placing cavity, one end of the flow guide pipe is communicated with one of the through holes, the other end of the flow guide pipe is higher than the layered plate, and the other end of the flow guide pipe is used for opening towards a main heating component, so that cooling liquid flowing out of one of the through holes is guided to flow to the periphery of the main heating component through the flow guide pipe.
In order to achieve the above purpose, the application further provides a data center liquid cooling system, which at least comprises a server and the liquid cooling cabinet, wherein the server is arranged in the placing cavity, and the other end of the flow guide pipe is opened towards a CPU or a display card of the server.
Therefore, according to the technical scheme provided by the application, the liquid cooling cabinet further comprises at least one flow guide pipe, the flow guide pipe is positioned in the placing cavity, one end of the flow guide pipe is communicated with one through hole, the other end of the flow guide pipe is higher than the layering plate, and the other end of the flow guide pipe is used for opening towards the main heating component, so that the cooling liquid flowing out of one through hole 2 is guided to flow to the periphery of the main heating component through the flow guide pipe. That is, the application directly guides part of the cooling liquid to the main heating component of the equipment to be radiated through the guide pipe, thereby avoiding the problem that the heat radiation effect on the main heat radiation component is reduced due to the gradual temperature rise in the upward diffusion process of the cooling liquid, and improving the heat radiation effect.
Simultaneously, the layering board is connected with the cabinet body, and the layering board divides the holding chamber into the liquid separating chamber and places the chamber, has offered a plurality of through-holes that are used for separating the liquid chamber and place the chamber intercommunication on the layering board. When the cooling liquid enters the cabinet body from the outside, the cooling liquid firstly enters the liquid separating cavity and then enters the placing cavity through the through holes. So, compare in comparing the direct mode that places the chamber that gets into of coolant liquid, the coolant liquid can be in advance to the diffusion all around in dividing the liquid intracavity to equipartition as far as is placing the bottom in chamber, and rethread a plurality of through-holes flow to place the intracavity, and then treat the refrigerated coolant liquid of cooling equipment and distribute more evenly in the cooling rack, avoid the overheated problem of part, improve the radiating effect of server.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of a liquid cooled cabinet according to one embodiment of the present application;
FIG. 2 is a schematic diagram of a liquid-cooled cabinet in a semi-section according to one embodiment of the application;
FIG. 3 is a schematic view of a flow guiding tube according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a liquid cooling system of a data center according to an embodiment of the present application;
Reference numerals illustrate:
100. The cabinet body, 110, the accommodating cavity, 111, the liquid separating cavity, 112, the placing cavity, 1121, the first storage cavity, 1122, the liquid returning cavity, 1123, the second storage cavity, 120, the liquid inlet, 121, the first inlet, 122, the second inlet, 130, the liquid returning port, 131, the first return port, 132, the second return port, 200, the layering plate, 210, the through hole, 300, the flow guide pipe, 310, the connecting seat, 320, the flexible hose, 400, the partition plate, 500, the first liquid-liquid heat exchanger, 600 and the second liquid-liquid heat exchanger.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings. Terms such as "upper," "lower," "first end," "second end," "one end," "the other end," and the like used herein to refer to a spatially relative position are used for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Furthermore, the terms "mounted," "disposed," "provided," "connected," "slidingly connected," "secured," and "sleeved" are to be construed broadly. For example, the term "coupled" may be a fixed connection, a removable connection, or a unitary construction, may be a mechanical connection, or an electrical connection, may be a direct connection, or may be an indirect connection via an intermediary, or may be an internal communication between two devices, elements, or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
The existing data center liquid cooling refrigeration mode is to submerge a server in cooling liquid, and take heat on the server away from the cooling liquid in a cooling liquid circulating mode so as to achieve a refrigeration effect.
However, due to the low-density and floating nature of the cooling liquid after heat exchange, the temperature of the cooling liquid at the lower part of the liquid cooling cabinet is lower than that of the cooling liquid at the upper part, and the main heating components (such as a processor, a display card and the like) of the server are usually close to the upper part of the server, which also causes deviation of heat dissipation effect on the main heating components of the server.
In addition, the circulating cold water entering the liquid cooling cabinet from the water inlet directly flows to the water outlet of the liquid cooling cabinet, so that the circulating cold water cannot be effectively diffused in the liquid cooling cabinet, uneven cooling of servers in the liquid cooling cabinet is caused, and the problem of local overheating exists.
In addition, the inventor finds that only one path of water circulation is used for refrigerating the liquid cooling cabinet during research and development, and when the path of water circulation fails, the liquid cooling cabinet can only be stopped for maintenance, so that the normal use of the server is seriously affected.
Therefore, how to improve the structure of the liquid cooling cabinet and the liquid cooling system of the data center, and further improve the heat dissipation effect on the server, is a problem to be solved in the art.
The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. It should be apparent that the described embodiments of the application are only some, but not all, embodiments of the application. All other embodiments, based on the embodiments of the application, which a person skilled in the art would obtain without making any inventive effort, are within the scope of the application.
The application provides a liquid cooling cabinet, which is internally provided with a part to be cooled, wherein cooling liquid is circularly introduced into the liquid cooling cabinet, the cooling liquid is contacted with the part to be cooled, and the cooling liquid takes away heat on the part to be cooled, so that the cooling effect is realized.
Referring to fig. 1 to fig. 2 together, in one embodiment, the liquid cooling cabinet at least includes a cabinet body 100 and a laminated board 200, wherein the cabinet body 100 is used as a basic carrier of the whole liquid cooling cabinet, the cabinet body 100 is used for accommodating and supporting the laminated board 200, and the cabinet body 100 is provided with an accommodating cavity 110. The laminated board 200 is connected with the cabinet body 100, the laminated board 200 divides the accommodating cavity 110 into a liquid separating cavity 111 and a placing cavity 112, and a plurality of through holes 210 for communicating the liquid separating cavity 111 with the placing cavity 112 are formed in the laminated board 200. When the cooling liquid enters the cabinet 100 from the outside, the cooling liquid firstly enters the liquid separating cavity 111, and then enters the placing cavity 112 through the plurality of through holes 210. So, compare in comparing the direct mode that places the chamber that gets into of coolant liquid, the coolant liquid can be in advance to the diffusion all around in dividing liquid intracavity 111 to equipartition as far as possible is in placing the bottom of chamber 112, and rethread a plurality of through-holes 210 flow to place in the chamber 112, and then guarantee to treat the refrigerated coolant liquid distribution of radiator unit more evenly in the cabinet body 100, avoid the overheated problem of part, improve the radiating effect of server.
Referring to fig. 1 to 3 together, in one embodiment, the liquid cooling cabinet further includes at least one flow guiding tube 300, the flow guiding tube 300 is located in the placement cavity 112, one end of the flow guiding tube 300 is communicated with one of the through holes 210, the other end of the flow guiding tube 300 is higher than the layered board 200, and the other end of the flow guiding tube 300 is used for opening towards the main heating component, so that the cooling liquid flowing out from one of the through holes 210 is guided to flow to the periphery of the main heating component through the flow guiding tube 300. That is, the present application directly guides part of the cooling liquid to the main heat generating part of the device to be heat-dissipated through the flow guide pipe 300, thereby avoiding the problem that the heat dissipation effect on the main heat dissipating part is reduced due to the gradual temperature rise in the process of upward diffusion of the cooling liquid.
It should be noted that the device to be cooled may refer to a server, a power supply, etc., and the server is taken as an example, and the main heat generating component may be a processor, a display card, etc.
In the present embodiment, the number of the flow guiding pipes 300 should correspond to the number of the devices to be cooled in the placement chamber 112, the number of the flow guiding pipes 300 may be identical to the number of the devices to be cooled in the placement chamber 112, or the number of the flow guiding pipes 300 may be an integer multiple of the number of the devices to be cooled in the placement chamber 112, so that each device to be cooled is disposed corresponding to a plurality of flow guiding pipes 300.
For example, when two main heat generating components exist in the device to be cooled, two flow guiding pipes 300 corresponding to the device to be cooled may be selected, and the two flow guiding pipes 300 are respectively used for guiding the cooling liquid to the two main heat generating components.
With respect to the specific structure of the draft tube 300, as shown in fig. 3, in one possible embodiment, the draft tube 300 includes a junction housing 310 and a flexible hose 320. One end of the flexible hose 320 is communicated with one of the through holes 210 through the connection base 310, and the flexible hose 320 is used to adjust the orientation of the flexible hose 320 by bending so that the other end of the flexible hose 320 is oriented to the main heat generating part.
In practical applications, the connection base 310 should be made of a hard material, and the flexible tube 320 is made of a flexible material. The connection between the connection base 310 and one of the through holes 210 may be implemented in a plugging manner, and the connection base 310 and one of the through holes 210 may also be implemented in a threaded connection manner, which is not limited in particular.
In this embodiment, as shown in fig. 4, the cabinet 100 further generally has a liquid inlet 120 and a liquid return 130. The liquid inlet 120 is communicated with the liquid separating cavity 111, the liquid return port 130 is communicated with the placing cavity 112, so that cooling liquid enters the liquid separating cavity 111 from the liquid inlet 120, and heat-carrying cooling liquid after heat exchange in the placing cavity 112 flows out from the liquid return port 130.
Further, two partition plates 400 are connected to the cabinet 100. The two partition plates 400 divide the placement chamber 112 into a first storage chamber 1121, a liquid return chamber 1122, and a second storage chamber 1123, the liquid return chamber 1122 is located between the first storage chamber 1121 and the second storage chamber 1123, and the liquid return port 130 communicates with the liquid return chamber 1122. The top of the two partition plates 400 is lower than the top of the first storage chamber 1121 and the second storage chamber 1123, the through holes 210 are located at the bottom of the first storage chamber 1121 and the bottom of the second storage chamber 1123, and the draft tube 300 is located at the first storage chamber 1121 and/or the second storage chamber 1123. In this way, the cooling liquid in the liquid separating cavity 111 first enters the first storage cavity 1121 and the second storage cavity 1123 through the plurality of through holes 210, then the cooling liquid exchanges heat in the first storage cavity 1121 and the second storage cavity 1123, and the heat-carrying cooling liquid after heat exchange floats upwards and overflows into the liquid return cavity 1122, and then flows out through the liquid return port 130.
It should be noted that, in this embodiment, the principle that the density of the cooling liquid floats upwards after heat exchange in the first storage cavity 1121 and the second storage cavity 1123 is just utilized, so that the cooling liquid carrying heat after heat exchange flows out from the upper part, and the cooling liquid which does not participate in heat exchange is still remained at the bottom, thereby fully utilizing the refrigeration effect of the cooling liquid. Meanwhile, the liquid return cavity 1122 is positioned between the first storage cavity 1121 and the second storage cavity 1123, and the liquid return cavity 1122 can provide liquid return functions for two storage cavities at the same time.
In practical application, the plurality of through holes 210 at the bottom of the first storage cavity 1121 are arranged in a plurality of rows of hole sets. The plurality of hole sets are arranged in a linear array along the length direction of the first storage cavity 1121, and each hole set includes at least two through holes 210 arranged in a linear array along the width direction of the first storage cavity 1121. The first storage chamber 1121 and the second storage chamber 1123 are symmetrically disposed with respect to the liquid return chamber 1122. The inner wall of the liquid return chamber 1122 is coated or stuck with a heat insulating layer.
Based on the same inventive concept, the application also provides a data center liquid cooling system which at least comprises a server and the liquid cooling cabinet. The server is installed in the placement cavity 112, and the other end of the flow guide pipe 300 is opened toward the CPU or the graphics card of the server.
In this embodiment, the liquid inlet 120 has two inlets, namely, a first inlet 121 and a second inlet 122, the first inlet 121 and the second inlet 122 are located at two ends of the liquid cooling cabinet, and the liquid return port 130 has two inlets, namely, a first return port 131 and a second return port 132, the first return port 131 and the second return port are located at two ends of the liquid cooling cabinet. The refrigeration system further comprises a first liquid-liquid heat exchanger 500 and a second liquid-liquid heat exchanger 600, wherein the first inlet 121 and the first return port 131 are connected in series with the inner flow path of the first liquid-liquid heat exchanger 500 to form a first inner circulation loop, the second inlet 122 and the second return port 132 are connected in series with the inner flow path of the second liquid-liquid heat exchanger 600 to form a second inner circulation loop, and the first inner circulation loop and the second inner circulation loop are respectively connected in series with a circulation pump.
Therefore, according to the technical scheme provided by the application, the liquid cooling cabinet further comprises at least one flow guide pipe, the flow guide pipe is positioned in the placing cavity, one end of the flow guide pipe is communicated with one through hole, the other end of the flow guide pipe is higher than the layering plate, and the other end of the flow guide pipe is used for opening towards the main heating component, so that the cooling liquid flowing out of one through hole 2 is guided to flow to the periphery of the main heating component through the flow guide pipe. That is, the application directly guides part of the cooling liquid to the main heating component of the equipment to be radiated through the guide pipe, thereby avoiding the problem that the heat radiation effect on the main heat radiation component is reduced due to the gradual temperature rise in the upward diffusion process of the cooling liquid, and improving the heat radiation effect.
Simultaneously, the layering board is connected with the cabinet body, and the layering board divides the holding chamber into the liquid separating chamber and places the chamber, has offered a plurality of through-holes that are used for separating the liquid chamber and place the chamber intercommunication on the layering board. When the cooling liquid enters the cabinet body from the outside, the cooling liquid firstly enters the liquid separating cavity and then enters the placing cavity through the through holes. So, compare in comparing the direct mode that places the chamber that gets into of coolant liquid, the coolant liquid can be in advance to the diffusion all around in dividing the liquid intracavity to equipartition as far as is placing the bottom in chamber, and rethread a plurality of through-holes flow to place the intracavity, and then treat the refrigerated coolant liquid of cooling equipment and distribute more evenly in the cooling rack, avoid the overheated problem of part, improve the radiating effect of server.
Further, by utilizing the principle that the density of the cooling liquid floats upwards after heat exchange in the first storage cavity and the second storage cavity, the cooling liquid carrying heat after heat exchange flows out from the upper part, and the cooling liquid which does not participate in heat exchange still remains at the bottom, so that the refrigerating effect of the cooling liquid is fully utilized. Meanwhile, the liquid return cavity is positioned between the first storage cavity and the second storage cavity, and can provide liquid return functions for the two storage cavities at the same time.
The foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the application are intended to be included within the scope of the application.
Claims (10)
1. The liquid cooling cabinet is characterized by at least comprising a cabinet body, a laminated plate and at least one flow guide pipe, wherein the cabinet body is provided with an accommodating cavity;
the layered plate is connected with the cabinet body, the accommodating cavity is divided into a liquid separating cavity and a placing cavity by the layered plate, and a plurality of through holes for communicating the liquid separating cavity with the placing cavity are formed in the layered plate;
The honeycomb duct is located place the intracavity, the one end of honeycomb duct with one of them through-hole intercommunication, the other end of honeycomb duct is higher than the layering board, and the other end of honeycomb duct is used for opening towards main heating element to make the coolant liquid that flows from one of them through-hole is directed through the honeycomb duct and is flowed to main heating element periphery.
2. The liquid cooled cabinet of claim 1, wherein the draft tube comprises a connection base and a flexible hose;
One end of the flexible hose is communicated with one through hole through the connecting seat, and the flexible hose is used for adjusting the orientation of the flexible hose through bending.
3. The liquid cooled cabinet of claim 2 wherein the connection block is threadably coupled to one of the through holes.
4. The liquid cooled cabinet of claim 1 or 2, wherein the cabinet body further has a liquid inlet and a liquid return;
The liquid inlet is communicated with the liquid separating cavity, and the liquid return port is communicated with the placing cavity.
5. The liquid cooled cabinet of claim 4 wherein two divider plates are connected within the cabinet;
The two separation plates divide the placing cavity into a first storage cavity, a liquid return cavity and a second storage cavity, the liquid return cavity is positioned between the first storage cavity and the second storage cavity, and the liquid return port is communicated with the liquid return;
The tops of the two partition plates are lower than the tops of the first storage cavity and the second storage cavity, the through holes are located at the bottom of the first storage cavity and the bottom of the second storage cavity, and the flow guide pipe is located in the first storage cavity and/or the second storage cavity.
6. The liquid cooled enclosure of claim 5 wherein the plurality of through holes at the bottom of the first storage cavity are arranged in a plurality of rows of groups of holes;
The plurality of the hole groups are arranged in a linear array along the length direction of the first storage cavity, and each row of the hole groups at least comprises two through holes arranged in a linear array along the width direction of the first storage cavity.
7. The liquid cooled cabinet of claim 6 wherein the first storage cavity and the second storage cavity are symmetrically disposed about the liquid return cavity.
8. The liquid cooled cabinet of claim 5, wherein an inner wall of the liquid return chamber is coated or adhered with a thermal insulation layer.
9. A data center liquid cooling system, comprising at least a server and the liquid cooling cabinet of any one of claims 4-8;
The server is arranged in the placing cavity, and the other end of the flow guide pipe is opened towards the CPU or the display card of the server.
10. The data center liquid cooling system of claim 9, wherein the liquid inlet has two inlets, a first inlet and a second inlet, respectively, the first inlet and the second inlet being located at two ends of the liquid cooling cabinet;
the liquid return ports are two, namely a first return port and a second return port, and the first return port and the second return port are positioned at two ends of the liquid cooling cabinet;
The data center liquid cooling system further comprises a first liquid-liquid heat exchanger and a second liquid-liquid heat exchanger, wherein the first inlet and the first return port are connected with the inner flow path of the first liquid-liquid heat exchanger in series to form a first inner circulation loop, the second inlet and the second return port are connected with the inner flow path of the second liquid-liquid heat exchanger in series to form a second inner circulation loop, and the first inner circulation loop and the second inner circulation loop are respectively connected with a circulating pump in series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421577800.5U CN222996903U (en) | 2024-07-04 | 2024-07-04 | Liquid cooling cabinet and data center liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421577800.5U CN222996903U (en) | 2024-07-04 | 2024-07-04 | Liquid cooling cabinet and data center liquid cooling system |
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| Publication Number | Publication Date |
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| CN222996903U true CN222996903U (en) | 2025-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202421577800.5U Active CN222996903U (en) | 2024-07-04 | 2024-07-04 | Liquid cooling cabinet and data center liquid cooling system |
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