CN222814807U

CN222814807U - Display panel and display device

Info

Publication number: CN222814807U
Application number: CN202421237846.2U
Authority: CN
Inventors: 傅晓亮; 王康; 王楚翔; 沈家铭; 张斌
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2024-05-31
Filing date: 2024-05-31
Publication date: 2025-04-29
Anticipated expiration: 2034-05-31
Also published as: WO2025247156A1

Abstract

The application provides a display panel and a display device, which are applied to the display device, wherein the display device comprises a display panel and a back plate, the display panel comprises a light emitting side and a backlight side opposite to the light emitting side, and the back plate is contacted with the backlight side through at least one elastic sheet structure at a preset position; the display panel also comprises at least one stress structure which is arranged on the backlight side and at least partially corresponds to the at least one shrapnel structure, and the projection on the backboard at least partially covers the at least one shrapnel structure.

Description

Display panel and display device

Technical Field

The application relates to the technical field of display, in particular to a display panel and a display device.

Background

When the structure design of the whole system is carried out on the mobile phone product, the back plate where the system end is positioned and the display panel where the display module is positioned are required to be subjected to conductive design so as to effectively conduct and connect the mobile phone product.

In the related art, a metal material is generally used for conducting connection in a contact manner, but the metal contact manner can cause a certain pressure to press the display panel, and the pressure can cause local stamping defects to be seen on the front surface of the display panel.

Disclosure of utility model

In view of the above, the present application provides a display panel and a display device to solve or partially solve the above-mentioned problems.

The application provides a display panel applied to a display device, the display device comprises a display panel and a back plate, the display panel comprises a light emitting side and a backlight side opposite to the light emitting side, the back plate is contacted with the backlight side through at least one spring plate structure at a preset position, and the display panel further comprises:

At least one stress structure is arranged on the backlight side and at least partially corresponds to the at least one elastic sheet structure.

In some exemplary embodiments, the spring structures include a boss, and the stress structures are configured to be disposed in correspondence with the boss, with a projection onto the back plate at least partially covering the at least one spring structure.

In some exemplary embodiments, the stress structure comprises a stainless steel sheet;

the hardness of the stainless steel sheet is less than or equal to 400Hv, and the yield strength is greater than or equal to 1000MPa.

In some exemplary embodiments, the backlight side includes a heat dissipation film layer including an adhesive layer, a conductive layer, and a copper surface layer that are stacked, the at least one stress structure being disposed on a side of the copper surface layer that is remote from the light exit side.

In some exemplary embodiments, the conductive layer has a compressive force deflection value greater than or equal to 0.3.

In some exemplary embodiments, the copper surface layer is specifically a calendered copper layer.

In some exemplary embodiments, the backlight side further includes a PET layer disposed on a side of the copper surface layer remote from the light exit side, and a groove structure corresponding to the at least one stress structure is disposed at a position corresponding to the at least one stress structure.

In some exemplary embodiments, the display device comprises a display area and a non-display area, and the at least one stress structure is arranged in one-to-one correspondence with the elastic sheet structure of the backboard arranged in the display area.

In some exemplary embodiments, the at least one stress structure comprises a conductive foam structure.

Based on the same conception, the application also provides a display device which comprises a back plate and the display panel.

The display panel and the display device provided by the application are applied to the display device, the display device comprises a display panel and a backboard, the display panel comprises a light emitting side and a backlight side opposite to the light emitting side, the backboard is contacted with the backlight side through at least one shrapnel structure at a preset position, and the display panel further comprises at least one stress structure which is arranged on the backlight side and at least partially corresponds to the at least one shrapnel structure, and the projection on the backboard at least partially covers the at least one shrapnel structure. According to the application, the stress structure is arranged at the position corresponding to the elastic sheet structure of the backboard on the backlight side of the display panel, so that the stress applied to the backlight side of the display panel by the elastic sheet structure can be dispersed and buffered through the stress structure, thereby reducing or preventing local stamping defects of the display panel caused by the pressure of the elastic sheet structure and improving the overall yield.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a related art product stamping mechanism analysis according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a partial structure of a display panel according to an embodiment of the application.

Fig. 3 is a schematic design structure diagram of a backlight side of a display panel according to an embodiment of the application.

Fig. 4 is a schematic diagram of another design structure of the backlight side of the display panel according to the embodiment of the application.

Detailed Description

The present utility model will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present utility model more apparent.

It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present specification should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present disclosure pertains. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements, objects, and the like, preceding the word, are included in the elements, objects, and equivalents thereof recited after the word, without excluding other elements, objects. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.

As described in the background section, in order to realize the conductive design between the back plate and the display panel, the conductive material is generally selected to be conductive adhesive, conductive foam or metal material for conductive connection in the related art.

The conductive adhesive is an adhesive with certain conductivity after being solidified or dried. It can connect various conductive materials together to form an electrical path between the materials to be connected. The conductive adhesive can be classified into silver-based conductive adhesive, gold-based conductive adhesive, copper-based conductive adhesive, carbon-based conductive adhesive, etc. according to the types of conductive particles in the conductive adhesive, the most widely used conductive adhesive is silver-based conductive adhesive. In the process production, the conductive adhesive has the problems of low conductivity, long curing time, relatively low adhesive strength and higher cost in application, and the application scene is gradually reduced.

The conductive foam is formed by wrapping conductive cloth on a flame-retardant sponge, and after a series of treatments, the conductive foam has good surface conductivity and can be easily fixed on a device to be shielded by using an adhesive tape. The conductive foam has excellent buffering performance, so that the conductive foam has a damping and buffering effect and the mechanical performance of the product is improved, and a large number of application forms taking the conductive foam as a conductive carrier exist in a complete machine system at present.

The direct conduction mode of the metal material is also adopted by some whole machine customer designs, and in the related art, the whole machine design adopts the conduction mode of the metal spring sheet in a local area. In the whole machine, the shrapnel structure design of the metal shrapnel can be manufactured above the metal shielding cover above the loudspeaker or other electronic device areas, and the metal shrapnel can contact the copper surface layer (cooper) surface of the back SCF of the display panel after the OLED display module is assembled so as to realize the conduction of different departments, enhance the whole grounding area of a mobile phone system and realize more excellent antistatic (ESD, electro-STATIC DISCHARGE) and shielding performance. Specifically, in some display device products, which may generally include the display panel 100 and the backplate 200, a plurality of spring structures 210 are disposed on the backplate 200, and when the display panel 100 is fastened to the backplate 200 during assembly, the spring structures 210 on the backplate 200 can contact with the backlight side of the display panel 100 to achieve conduction.

However, in this solution of the spring structure, since the spring structure 210 has a certain pressure when contacting the backlight side of the display panel 100, a certain compression is caused to the spring structure, and the compression may cause a local poor stamping to be seen on the front side (i.e. the light emitting side or the display side) of the display panel 100, as shown in fig. 1, the specific principle is that the compression from the back may cause deformation of the cover plate (CG) on the light emitting side of the display panel 100, and the deformation may cause a change in the reflection angle of the light, so that the poor stamping is formed on the light emitting side of the display panel 100. Wherein CG represents Cover Glass, TOCA represents top optical glue layer (Top Optically CLEAR ADHESIVE), PST represents polarizing layer sensor touch structure (Polarizer Sensor Touch), BOCA represents bottom optical glue layer (Bottom Optically CLEAR ADHESIVE), panel represents display panel.

In view of the above, the embodiment of the application provides a display panel applied to a display device, the display device comprises a display panel and a back plate, the display panel comprises a light emitting side and a backlight side opposite to the light emitting side, the back plate is contacted with the backlight side through at least one shrapnel structure at a preset position, the display panel further comprises at least one stress structure which is arranged on the backlight side and at least partially corresponds to the at least one shrapnel structure, and the projection on the back plate at least partially covers the at least one shrapnel structure. According to the application, the stress structure is arranged at the position corresponding to the elastic sheet structure of the backboard on the backlight side of the display panel, so that the stress applied to the backlight side of the display panel by the elastic sheet structure can be dispersed and buffered through the stress structure, thereby reducing or preventing local stamping defects of the display panel caused by the pressure of the elastic sheet structure and improving the overall yield. It can be seen that improving the problem is basically a problem of optimizing the stamping, which occurs because the back of the display panel 100 is stressed and then pressure is transmitted to the OCA (Optical CLEAR ADHESIVE, optically clear adhesive) material of the cover plate (CG), and the OCA material is deformed, thereby causing a phenomenon that a user can observe the stamping from the front.

Next, fig. 2 shows a schematic partial structure of a display panel according to an embodiment of the present application.

As shown in fig. 2, the display panel 100 of the present embodiment is applied to a display device, where the display device includes the display panel 100 and a back panel 200, the display panel 100 includes a light-emitting side 110 and a backlight side 120 opposite to the light-emitting side 110, the back panel 200 contacts the backlight side 120 through at least one dome structure 210 at a preset position, and the display panel 100 further includes at least one stress structure 130 disposed on the backlight side 120 and at least partially corresponding to the at least one dome structure 210, and a projection on the back panel 200 at least partially covers the at least one dome structure 210.

The display panel 100 is mainly used for performing a screen display operation and the like. Therefore, the structure generally needs a light-emitting side 110 for emitting light, and the light-emitting structures such as pixels in the display panel 100 can transmit corresponding light through the light-emitting side 110, so that a user can see the picture displayed on the display panel 100. The backlight side 120 is the opposite side of the light-emitting side 110, and some control chips, signal lines, driving circuits, etc. are generally disposed on the opposite side. Then, the backplate 200 is generally used to carry a battery, a complete machine control system, etc., and besides being connected to each other through centralized control data lines, the backplate 200 and the display panel 100 are also electrically conductive designed at some specific positions, for example, conducting through the spring structures 210, where the set positions are generally determined when the overall design of the corresponding display device is performed, and at the same time, the backplate 200 may be electrically conductive designed at more than one place, and in this embodiment, more than one spring structures 210 may be disposed at preset positions.

Fig. 3 is a schematic diagram of a design structure of a backlight side of a display panel according to an embodiment of the application, wherein 210 is a projection position of a dome structure 210 on a backplate 200 on a backlight side 120 of the display panel 100. It can be seen that in the present embodiment, the dome structure 210 is designed at a plurality of positions and distributed in the display area 300 and the non-display area 400 of the entire display device.

Thereafter, as shown in fig. 2, in the present embodiment, on the backlight side 120 of the display panel 100, at positions corresponding to the dome structures 210, stress structures 130 corresponding to the dome structures 210 may be provided. The stress structures 130 may be in one-to-one correspondence with the spring structures 210, i.e., each spring structure 210 has a corresponding stress structure 130 disposed on the backlight side 120 of the corresponding display panel 100. Depending on the specific application scenario, only a portion of the dome structures 210 may be selected, and the corresponding stress structures 130 may be disposed on the backlight side 120 of the corresponding display panel 100, for example, only the dome structures 210 located in the display area 300 may be disposed with respect to the corresponding stress structures 130. I.e. at least one stress structure 130 is at least partially arranged in correspondence with the at least one spring structure 210. In a specific embodiment, the stress structure 130 may be made of a high-modulus conductive material, that is, the high-modulus conductive material is used to conduct electricity and disperse stress at the contact position between the dome structure 210 and the backlight side 120. Among them, the high modulus conductive material may be selected from stainless steel sheet (SUS steel sheet), or stainless steel sheet with gold plating on the surface. The point stress of contact of the dome structure 210 can be changed into a surface stress by contacting the stainless steel sheet, and the corresponding structure (e.g., SCF material) of the backlight side 120 of the display panel 100 can well mitigate the effect of front stamping under the effect of the surface stress.

In some embodiments, since the non-display area 400 is not generally used for display operation, and is generally a pad-bonding area or FPC area in which the materials such as bending sapcer, IC COVER TAPE, FPC, etc. are disposed, even if the design of the spring sheet is selected but the material stack in these areas is thick, the stress applied to the module by the spring sheet is converted to a deformation amount of OCA material that is very slight, and is not recognized by a person on the front of the module, and since the non-display area 400 is not used for display operation, even slight deformation is not perceived, and further, the spring sheet structure 210 in the non-display area 400 may not be provided with the stress structure 130 at the opposite position of the backlight side 120 of the display panel 100. As shown in fig. 4, similar to fig. 3, the projection position of the dome structure 210 on the backplate 200 on the backlight side 120 of the display panel 100 is shown as 210, in this embodiment, only the stress structure 130 is disposed in the display area 300, and no stress structure 130 is disposed in the non-display area 400. That is, in some embodiments, the display device includes a display area 300 and a non-display area 400, and the at least one stress structure 130 is disposed in one-to-one correspondence with the spring structures 210 of the backplate 200 disposed in the display area 300.

In other embodiments, the stress structure 130 may cover the whole of the dome structure 210, i.e. the projection of the stress structure 130 on the backplate 200 completely covers the whole dome structure 210, or may cover only a part of the dome structure 210, for example, only the protrusion 211 of the dome structure 210, as shown in fig. 2 or fig. 4, and thus the area of the stress structure 130 may be reduced because the backplate 200 itself only needs the protrusion 211 to contact the backlight side 120 of the display panel 100. I.e. the projection of at least one stress structure 130 onto the backplate 200 at least partially covers the at least one dome structure 210. That is, in some embodiments, the spring structure 210 includes a protrusion 211, and the stress structure 130 is configured to be disposed corresponding to the protrusion 211.

Then, in order to further consider that the risk of assembling stamping is reduced in the assembly of the display panel 100 at the complete machine shrapnel position, as shown in fig. 2 and 4, it can be seen that the main cause of the stamping defect problem may be caused by too concentrated stress caused by too small contact area when the protruding portion 211 of the shrapnel structure 210 contacts the backlight side 120 of the display panel 100. Further, when designing the stress structure 130, a scheme of dispersing stress may be considered. Further, in some embodiments, the stress structure 130 may be designed as a sheet structure, while it may be considered to be designed as a stainless steel sheet structure in order to compromise the properties of hardness, conductivity, and the like. The stainless steel (Steel Use Stainless, SUS) sheet may be sized according to specific design requirements and stress dispersion degree, and may be designed into a sheet structure of 2.5mm by 2.5mm, for example.

Further, as shown in table 1, a partial parameter comparison diagram of different stainless steel materials is shown. In order to solve the technical problems of the application, the parameters such as hardness, yield strength and the like of the stainless steel material are mainly required to be paid attention to. The higher the yield strength, the greater the degree of deformation it can withstand or the stress it can buffer, and in some embodiments the yield strength of the stainless steel material selected needs to be greater than or equal to 1000MPa. Thereafter, in order to improve the dimensional accuracy of the stainless steel sheet, the structure corresponding to the backlight side of the display panel may be generally processed when die-cut and cut, so that the structure may be integrally formed to a very high degree of dimensional accuracy, for example, the stainless steel sheet may be directly bonded when the processing and cutting of the heat dissipation film SCF (SCF) layer on the backlight side are performed, so that the bonding alignment standard may be made uniform. The lower the hardness of the stainless steel sheet, the less the risk of stamping at the edge of the SUS sheet during SCF Roller lamination. Thus, in some embodiments, there may be a requirement for the hardness of the stainless steel sheet, for example, a requirement that the hardness of the stainless steel sheet be less than or equal to 400Hv. And by combining table 1, it can be seen that the selected SUS 316L type stainless steel material has hardness and yield strength reaching corresponding requirements relative to SUS 301 and SUS 304, and can be better suitable for different application scenes, and the stamping risk presented at the edge of the stainless steel sheet in the SCF Roller laminating process is small.

TABLE 1 comparison of partial parameters for different stainless steel materials

Still further, the above embodiment provides the stress structure 130 on the heat dissipation film SCF layer (the heat dissipation film 140 is shown in fig. 2) of the backlight side 120. As shown in fig. 2, if only the stress structures 130 are provided, local islands of protrusions are formed on the backlight side 120 during the entire processing, and thus the entire processing may be affected to some extent. Further, as shown in fig. 2, a PET layer 150 may be further added on the backlight side, and the PET layer 150 may be disposed on a side of the heat dissipation film layer 140 away from the light emitting side 110, like the stress structure 130. The specific structure of the heat dissipation film layer 140 may be divided into an adhesive layer 141, a conductive layer 142 and a copper surface layer 143 which are stacked. The adhesive layer 141 may be a embo adhesive layer, and is mainly used for adhering the heat dissipation film layer 140 to the backlight side 120 of the display panel 100. The conductive layer 142 may be a conductive foam layer for conducting and buffering. The copper surface layer 143 is the copper or copper-plated film or copper alloy film on one side of the outermost layer for shaping, protection, and electrical conduction. Then, the conductive layer 142 and the copper surface layer 143 are sequentially stacked outward. That is, the stress structure 130 is disposed on a side of the copper surface layer 143 away from the light emitting side 110. That is, in some embodiments, the backlight side 120 includes a heat dissipation film layer 140, the heat dissipation film layer 140 includes an adhesive layer 141, a conductive layer 142, and a copper surface layer 143 that are stacked, and the at least one stress structure 130 is disposed on a side of the copper surface layer 143 away from the light-emitting side 110.

Thereafter, the PET layer 150 is disposed on the copper surface layer 143 on a side away from the light-emitting side 110 due to the stress structure 130. Then a hole or slot structure corresponding to the stress structure 130 may be dug into the PET layer 150 at a location corresponding to the stress structure 130 to carry the stress structure 130. As shown in fig. 2, a corresponding groove structure is dug on the PET layer 150 at a position corresponding to the stress structure 130. In particular applications, the PET layer 150 may cover the stress structure 130, thereby forming a "concave" channel structure, and if flush with the stress structure 130, a "hole-type" channel structure. Of course, the description is made here in terms of the structure after molding, and during the processing, since the PET layer 150 may be post-processed, and further, after the bonding of the stress structure 130 and the heat dissipation film layer 140 is completed, the filling design of PET may be performed, so as to solve the problem of stamping of the stainless steel sheet of the stress structure 130 due to the height difference during the vacuum bonding (the D-lami process) in a specific application scenario. It should be noted that the stamping problem is two different problems from the stamping problem to be solved by the core of the present application, the stamping problem of the present application is pressed by the spring plate structure 210, and the stamping problem may be formed at the edge of the stress structure 130 (stainless steel sheet) due to the addition of the stress structure 130 (stainless steel sheet). Therefore, the PET filling design can ensure that the whole paste is approximately attached to the whole surface (namely, the flatness is ensured) when the whole paste is completed. The stamping is reduced to a minimum level during the die set D-lami process. That is, in some embodiments, the backlight side 120 further includes a PET layer 150 disposed on a side of the copper surface layer 143 remote from the light-emitting side 110, and a groove structure corresponding to the at least one stress structure 130 is disposed at a position corresponding to the at least one stress structure 130.

According to the foregoing embodiment, the heat dissipation film layer 140 is provided on the backlight side 120 of the display panel 100, and the corresponding structure thereof is specifically described. Further, the material of the heat dissipation film layer 140 can be improved to further reduce the stamping phenomenon. In some embodiments, the conductive layer 142 may be further limited, for example, selecting a foam with a higher compressive deformation (Compression Force Deformation, CFD) value may reduce contact stamping, and in particular, a material with a compressive deformation value greater than or equal to 0.3 (e.g., a satisfactory conductive foam, etc.) may be selected to form the conductive layer 142. In other embodiments, the copper surface layer 143 may be further limited, such as by selecting a high modulus, high yield strength copper layer material to reduce contact stamping. In a specific scenario, since electrolytic copper is generally used to make the copper surface layer 143 in the related art, in order to improve modulus and yield strength, the manufacturing process may be adjusted to be rolled copper, so that the produced rolled copper is used as the copper surface layer 143, thereby meeting the corresponding requirements and reducing contact stamping. That is, in some embodiments, the copper surface layer 143 is specifically a calendered copper layer.

Finally, in some embodiments, as shown in FIG. 4, the stress structure 130 may be a conductive foam structure 160 in addition to being a stainless steel sheet. As shown in fig. 4, a portion of the stress structure 130 is a stainless steel sheet, and a portion of the stress structure 130 is an example of a conductive foam structure 160. Specifically, for the conductive foam structure 160, a buffer foam material with a conductive function is added at a position corresponding to the elastic sheet structure 210, and the stress influence (such as stress on the SCF layer) of the elastic sheet structure 210 on the backlight side 120 of the display panel 100 can be reduced by compressing the buffer material of the conductive foam structure 160, so as to reduce the contact stamping. Since the conductive foam structure 160 itself has a conductive effect, it can also have a buffer effect, and in some embodiments, the corresponding spring structure 130 may be omitted, that is, at this position, the contact connection between the display panel 100 and the backplate 200 may be performed only through the conductive foam structure 160. That is, the conductive foam structure 160 is used in the partial area of the module in the whole design to conduct between the module (display panel 100) and the system (back plate 200) of the product. With this arrangement, the structure of the region is difficult to cause poor stamping in the whole machine assembly process. Of course, due to the material limitation of the conductive foam structure 160, the conductivity of the conductive foam structure is lower than that of the metal contact scheme (i.e. the scheme that the stainless steel sheet is contacted with the spring sheet structure), and the specific application can be selected according to the requirements of the specific scene.

As can be seen from the above embodiments, the display panel provided by the embodiments of the present application is applied to a display device, where the display device includes a display panel and a back plate, the display panel includes a light-emitting side and a backlight side opposite to the light-emitting side, and the back plate contacts the backlight side through at least one spring structure at a preset position; the display panel also comprises at least one stress structure which is arranged on the backlight side and at least partially corresponds to the at least one shrapnel structure, and the projection on the backboard at least partially covers the at least one shrapnel structure. According to the application, the stress structure is arranged at the position corresponding to the elastic sheet structure of the backboard on the backlight side of the display panel, so that the stress applied to the backlight side of the display panel by the elastic sheet structure can be dispersed and buffered through the stress structure, thereby reducing or preventing local stamping defects of the display panel caused by the pressure of the elastic sheet structure and improving the overall yield.

Based on the same conception, the application also provides a display device which comprises a back plate and the display panel according to any of the previous embodiments.

The display device of the foregoing embodiment is used for applying the corresponding display panel of the foregoing embodiment, and has the beneficial effects of the corresponding display panel embodiment, which are not described herein.

It will be appreciated that the display device is a product with an image display function, and is generally driven by multiple driving circuits, for example, a display, a television, a billboard, a digital photo frame, a laser printer with a display function, a telephone, a mobile phone, a Personal digital assistant (Personal DIGITAL ASSISTANT, PDA), a digital camera, a portable camcorder, a viewfinder, a navigator, a vehicle, a large-area wall, a home appliance, an information query device (such as a service query device of an e-government, a bank, a hospital, an electric power department, etc.), a monitor, etc.

It will be appreciated by persons skilled in the art that the foregoing discussion of any embodiment is merely exemplary and is not intended to imply that the scope of the application (including the claims) is limited to these examples, that combinations of technical features in the foregoing embodiments or in different embodiments may be implemented in any order and that many other variations of the different aspects of the embodiments described above exist within the spirit of the application, which are not provided in detail for clarity.

Additionally, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown within the provided figures, in order to simplify the illustration and discussion, and so as not to obscure the embodiments of the present application. Furthermore, the devices may be shown in block diagram form in order to avoid obscuring the embodiments of the present application, and also in view of the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the embodiments of the present application are to be implemented (i.e., such specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the application, it should be apparent to one skilled in the art that embodiments of the application can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative in nature and not as restrictive.

While the application has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of those embodiments will be apparent to those skilled in the art in light of the foregoing description. The present embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, and the like, which are within the spirit and principles of the embodiments of the application, are intended to be included within the scope of the application.

Claims

1. The display panel is characterized by comprising a display panel and a back plate, wherein the display panel comprises a light emitting side and a backlight side opposite to the light emitting side, the back plate is contacted with the backlight side through at least one elastic sheet structure at a preset position, and the display panel further comprises:

The at least one stress structure is arranged on the backlight side and at least partially corresponds to the at least one shrapnel structure, and the projection on the backboard at least partially covers the at least one shrapnel structure.

2. The display panel of claim 1, wherein the spring structure comprises a protrusion, and wherein the stress structure is configured to be disposed corresponding to the protrusion.

3. The display panel of claim 2, wherein the stress structure comprises a stainless steel sheet;

4. The display panel of claim 1, wherein the backlight side comprises a heat dissipation film layer comprising an adhesive layer, a conductive layer, and a copper surface layer that are stacked, and the at least one stress structure is disposed on a side of the copper surface layer that is away from the light-emitting side.

5. The display panel according to claim 4, wherein a compressive force deformation value of the conductive layer is greater than or equal to 0.3.

6. The display panel according to claim 4, characterized in that the copper surface layer is in particular a rolled copper layer.

7. The display panel of claim 4, wherein the backlight side further comprises a PET layer disposed on a side of the copper surface layer remote from the light exit side, and wherein a groove structure corresponding to the at least one stress structure is disposed at a position corresponding to the at least one stress structure.

8. The display panel of claim 1, wherein the display device comprises a display area and a non-display area, and the at least one stress structure is arranged in one-to-one correspondence with the spring structures of the back plate arranged in the display area.

9. The display panel of claim 1, wherein the at least one stress structure comprises a conductive foam structure.

10. A display device comprising a back plate and a display panel according to any one of claims 1 to 9.