CN222089814U - Circuit board with heat dissipation structure, vehicle charger and vehicle - Google Patents
Circuit board with heat dissipation structure, vehicle charger and vehicle Download PDFInfo
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- CN222089814U CN222089814U CN202323562458.XU CN202323562458U CN222089814U CN 222089814 U CN222089814 U CN 222089814U CN 202323562458 U CN202323562458 U CN 202323562458U CN 222089814 U CN222089814 U CN 222089814U
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- heat
- circuit board
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- board body
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Abstract
The utility model provides a circuit board with a heat radiation structure, a vehicle-mounted charger and a vehicle, and relates to the technical field of vehicles, wherein the circuit board with the heat radiation structure comprises a circuit board body, electronic components, a heat radiation module and a heat conduction block, the circuit board body is provided with a mounting hole which is penetrated up and down, the electronic component is arranged above the mounting hole, the heat dissipation module is arranged below the mounting hole, the heat conduction block is arranged in the mounting hole, the upper end of the heat conduction block is connected with the electronic component, and the lower end of the heat conduction block is connected with the heat dissipation module. The electronic components in this circuit board with heat radiation structure directly installs and to the circuit board body on can realize the heat dissipation equally, and need not to install the aluminium base board to the loaded down with trivial details steps such as locking when having reduced aluminium base board installation attach and welding, and then improve the paster efficiency of electronic components on the circuit board body.
Description
Technical Field
The utility model relates to the technical field of vehicles, in particular to a circuit board with a heat dissipation structure, a vehicle-mounted charger and a vehicle.
Background
The electronic component takes an MOS tube (metal oxide semiconductor metal-oxide-semiconductor field effect transistor) as an example, is widely applied to a vehicle-mounted charger, but generates large heat easily during working, so that the vehicle-mounted charger needs to be timely cooled.
At present, an aluminum substrate is usually locked and welded on a circuit board body, then an electronic component patch is welded on the aluminum substrate, heat of the electronic component is conducted to a water channel through the aluminum substrate to realize heat dissipation, but the aluminum substrate needs to be locked and welded when assembled on the circuit board body, the assembly process is complex, and the electronic component patch efficiency is affected.
Disclosure of utility model
The utility model solves the problem of how to improve the pasting efficiency of the electronic components on the circuit board body.
In order to solve the problems, the utility model provides a circuit board with a heat dissipation structure, which comprises a circuit board body, electronic components, a heat dissipation module and a heat conduction block, wherein the circuit board body is provided with a mounting hole which is penetrated up and down, the electronic components are arranged above the mounting hole, the heat dissipation module is arranged below the mounting hole, the heat conduction block is arranged in the mounting hole, the upper end of the heat conduction block is connected with the electronic components, and the lower end of the heat conduction block is connected with the heat dissipation module.
Optionally, the heat conducting block is embedded on the mounting hole.
Optionally, the electronic component is a MOS tube, and/or,
The thermally conductive block comprises a copper block, and/or,
The material of the circuit board body is FR4 material.
Optionally, the heat dissipation module comprises a water channel, an upper side wall of the water channel is arched upwards to form a heat dissipation convex part, and the lower end of the heat conduction block is connected with the heat dissipation convex part.
Optionally, the projection of the electronic component on the circuit board body is located in the projection of the heat dissipation convex part on the circuit board body.
Optionally, the heat dissipation device further comprises a heat dissipation fin arranged between the circuit board body and the heat dissipation module, and the lower end of the heat conduction block is connected with the heat dissipation module through the heat dissipation fin.
Optionally, the fin includes the ceramic body, locates the first heat conduction portion of ceramic body up end and locate the second heat conduction portion of ceramic body lower terminal surface, first heat conduction portion connects the lower extreme of heat conduction piece, the second heat conduction portion is connected the heat dissipation module.
Optionally, on a plane vertical to the up-down direction, the first heat conduction part and the second heat conduction part are made of copper materials, and/or,
The heat dissipation module comprises a water channel, the upper side wall of the water channel is upwards arched to form a heat dissipation convex part, the second heat conduction part is connected with the heat dissipation convex part, and the projection of the second heat conduction part on the circuit board body is positioned in the projection of the heat dissipation convex part on the circuit board body.
The utility model also provides a vehicle-mounted charger which comprises the circuit board with the heat dissipation structure.
The utility model also provides a vehicle, which comprises the vehicle-mounted charger.
Compared with the prior art, the circuit board with the heat dissipation structure has the following technical effects:
In the circuit board with the heat radiation structure, the mounting hole penetrating up and down is formed in the circuit board body so as to enable the heat conduction block to penetrate, meanwhile, the electronic component is arranged above the mounting hole, the heat radiation module is arranged below the mounting hole, the heat conduction block is arranged in the mounting hole, the upper end of the heat conduction block is connected with the electronic component, and the lower end of the heat conduction block is connected with the heat radiation module, so that the heat conduction block can transfer heat generated by the electronic component above the circuit board body to the heat radiation module below the circuit board body, and heat radiation of the electronic component is realized. Therefore, the electronic components in the circuit board with the heat radiation structure can be directly mounted on the circuit board body to realize heat radiation, and an aluminum substrate is not required to be mounted, so that complicated steps such as locking and welding during mounting of the aluminum substrate are reduced, and the chip mounting efficiency of the electronic components on the circuit board body is improved.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the utility model;
fig. 2 is an enlarged schematic diagram of a circuit board part a with a heat dissipation structure in fig. 1.
Reference numerals illustrate:
1-circuit board body, 11-mounting hole, 2-electronic components, 21-body, 22-pin, 3-heat dissipation module, 31-water course, 311-heat dissipation convex part, 4-heat conduction piece, 5-fin, 51-ceramic body, 52-first heat conduction portion, 53-second heat conduction portion.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the description of the present utility model, it should be understood that, if there are terms "upper", "lower", "front", "rear", "left", "right", the indicated orientation or positional relationship is based on that shown in the drawings, only for convenience of description and simplification of the description, and does not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Further, in the description of the present utility model, the Z-axis in the drawings represents the vertical direction, that is, the up-down position, and the forward direction of the Z-axis represents the up direction, and correspondingly, the reverse direction of the Z-axis represents the down direction. It should be noted that the foregoing Z-axis is provided merely for convenience of description and to simplify the description and is not to be construed as indicating or implying that the apparatus or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present utility model.
Referring to fig. 1, an embodiment of the present utility model provides a circuit board with a heat dissipation structure, which includes a circuit board body 1, an electronic component 2, a heat dissipation module 3 and a heat conduction block 4, wherein a mounting hole 11 penetrating up and down is provided on the circuit board body 1, the electronic component 2 is provided above the mounting hole 11, the heat dissipation module 3 is provided below the mounting hole 11, the heat conduction block 4 is provided in the mounting hole 11, the upper end of the heat conduction block 4 is connected with the electronic component 2, and the lower end is connected with the heat dissipation module 3.
The electronic component 2 may be soldered to the circuit board body 1, for example, a MOS tube, which may include a tube body 21 and a plurality of pins 22 connected to the tube body 21, and the pins 22 may be soldered to an upper end surface of the circuit board body 1 so as to fix the MOS tube above the mounting hole 11, and the heat dissipation module 3 may be fixed to other parts of the vehicle-mounted battery charger, such as a casing, so that the heat dissipation module 3 is fixed below the mounting hole 11. The way in which the upper end of the heat conduction block 4 is connected to the electronic component 2 is not limited, and the upper end of the heat conduction block 4 may be bonded to the electronic component 2 by, for example, a heat conduction adhesive.
In this embodiment, the mounting hole 11 penetrating up and down is formed in the circuit board body 1 to allow the heat conducting block 4 to penetrate, meanwhile, the electronic component 2 is arranged above the mounting hole 11, the heat radiating module 3 is arranged below the mounting hole 11, the heat conducting block 4 is arranged in the mounting hole 11, the upper end of the heat conducting block 4 is connected with the electronic component 2, and the lower end of the heat conducting block 4 is connected with the heat radiating module 3, so that the heat conducting block 4 can transfer heat generated by the electronic component 2 above the circuit board body 1 to the heat radiating module 3 below the circuit board body 1 to radiate the electronic component 2. Like this, electronic components 2 direct mount can realize the heat dissipation equally on circuit board body 1 in this circuit board with heat radiation structure, and need not to install the aluminium base board to the loaded down with trivial details steps such as locking when having reduced aluminium base board installation attach and welding, and then improve the paster efficiency of electronic components 2 on circuit board body 1.
Optionally, referring to fig. 1, the heat conducting block 4 is embedded in the mounting hole 11.
Specifically, the heat conducting block 4 and the circuit board body 1 may be integrally disposed when the circuit board body 1 is manufactured, so that the copper-embedded circuit board body 1 is formed, and the heat conducting block 4 is embedded in the mounting hole 11 of the circuit board body 1.
In this embodiment, through embedding the heat conduction block 4 in the mounting hole 11 of the circuit board body 1, the heat conduction block 4 is installed more firmly on the mounting hole 11, and the heat conduction effect of the heat conduction block 4 on the electronic component 2 is improved.
Optionally, referring to fig. 1, the electronic component 2 is a MOS transistor, and/or the heat conducting block 4 includes a copper block, and/or the material of the circuit board body 1 is FR4 material.
In some other embodiments, the heat conducting block 4 may be made of a metal material having good heat conductivity, such as aluminum or an aluminum alloy.
In this embodiment, the heat conducting block 4 is copper, that is, the material of the heat conducting block 4 is copper, so that the heat conducting performance of copper is good, and the heat dissipation of the electronic component 2 is facilitated. The material of the circuit board body 1 is FR4 material, the FR4 material is a circuit board body 1 raw material and a base material, FR represents Flame-RETARDANT (Flame retardant), 4 represents resin is epoxy resin, the reinforcing material is glass fiber cloth, the Flame retardant grade is UL 94V-0 board, and the FR4 material has good high temperature resistance, thereby being beneficial to improving the stability of the circuit board body 1.
Alternatively, referring to fig. 1, the heat dissipation module 3 includes a water channel 31, an upper sidewall of the water channel 31 is arched upwards to form a heat dissipation protrusion 311, and a lower end of the heat conduction block 4 is connected to the heat dissipation protrusion 311.
Specifically, the lower end of the heat conductive block 4 may be indirectly connected to the heat radiation protrusion 311 through the heat radiation fin 5.
In this embodiment, a heat dissipation convex portion 311 is formed on the water channel 31 and is connected with the heat conducting block 4, so that heat dissipation to the heat conducting block 4 through the heat dissipation convex portion 311 is avoided, the whole water channel 31 is connected with the lower end of the heat conducting block 4 to dissipate heat, and interference with other components in the vehicle-mounted battery charger is reduced.
Optionally, referring to fig. 1, the projection of the electronic component 2 on the circuit board body 1 is located in the projection of the heat dissipation protrusion 311 on the circuit board body 1.
In this embodiment, the projection of the electronic component 2 is located in the projection of the heat dissipation convex portion 311, that is, the electronic component 2 is just opposite to the heat dissipation convex portion 311 from top to bottom, so that the heat transfer path is relatively short, which is beneficial to improving the heat dissipation efficiency.
Optionally, referring to fig. 1, the circuit board with the heat dissipation structure further includes a heat dissipation fin 5 disposed between the circuit board body 1 and the heat dissipation module 3, and the lower end of the heat conduction block 4 is connected to the heat dissipation module 3 through the heat dissipation fin 5.
Specifically, the heat sink 5 may be bonded to the heat conductive block 4 and the heat dissipation module 3 by means of, for example, a heat conductive adhesive.
In this embodiment, by adding the heat sink 5 between the heat conducting block 4 and the heat dissipating module 3, the surface area of the heat sink 5 is relatively large, which is beneficial to heat dissipation, and the heat dissipation effect on the electronic component 2 can be improved.
Alternatively, referring to fig. 1 and 2, the heat sink 5 includes a ceramic body 51, a first heat conducting portion 52 disposed on an upper end surface of the ceramic body 51, and a second heat conducting portion 53 disposed on a lower end surface of the ceramic body 51, wherein the first heat conducting portion 52 is connected to a lower end of the heat conducting block 4, and the second heat conducting portion 53 is connected to the heat dissipating module 3.
In this embodiment, the ceramic body 51 is made of ceramic, which is not easy to store heat and has a certain microporous structure, so that the heat dissipation is facilitated, and the heat dissipation effect on the electronic component 2 is greatly enhanced.
Optionally, referring to fig. 1 and 2, the first heat conducting portion 52 and the second heat conducting portion 53 are made of copper, and/or the heat dissipating module 3 includes a water channel 31, an upper side wall of the water channel 31 is arched upwards to form a heat dissipating convex portion 311, the second heat conducting portion 53 is connected to the heat dissipating convex portion 311, and a projection of the second heat conducting portion 53 on the circuit board body 1 is located in a projection of the heat dissipating convex portion 311 on the circuit board body 1.
The first heat conducting portion 52 and the second heat conducting portion 53 may be coated on the upper and lower end surfaces of the ceramic body 51 by sintering.
In this embodiment, the first heat conducting portion 52 and the second heat conducting portion 53 are made of copper, which is more beneficial to heat conduction. By making the projection of the second heat conducting portion 53 on the circuit board body 1 be located in the projection of the heat dissipating convex portion 311 on the circuit board body 1, the heat conducting effect between the second heat conducting portion 53 and the heat dissipating convex portion 311 can be ensured, the size of the second heat conducting portion 53 can be relatively reduced, and the cost of the heat dissipating fin 5 can be reduced.
The embodiment of the utility model also provides a vehicle-mounted charger which comprises the circuit board with the heat dissipation structure.
Specifically, the vehicle-mounted charger comprises a shell, a charging circuit module is arranged in the shell, a circuit board with a heat dissipation structure is arranged on the charging circuit module, and a heat dissipation module 3 is fixedly connected with the shell.
In this embodiment, since the vehicle-mounted charger adopts all the technical schemes of all the embodiments of the circuit board with the heat dissipation structure, the vehicle-mounted charger has at least all the beneficial effects brought by the technical schemes of the embodiments, and the description thereof is omitted.
The embodiment of the utility model also provides a vehicle, which comprises the vehicle-mounted charger.
In this embodiment, since the vehicle adopts all the technical solutions of all the embodiments of the vehicle-mounted charger, at least the technical solutions of the embodiments have all the beneficial effects, and are not described in detail herein.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, or may be directly connected or indirectly connected via an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the description of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. As such, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.
In the description of the present utility model, the meaning of the term "and/or" includes three parallel schemes, taking "a and/or B" as an example, including a scheme, or B scheme, or a scheme that is satisfied by a and B simultaneously.
Furthermore, in the description of the present utility model, the term "embodiment" or "an embodiment" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or implementation is included in at least one embodiment or implementation of the present utility model. In the present utility model, the schematic representation of the above terms does not necessarily refer to the same examples or implementations. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or implementations.
Although the utility model is disclosed above, the scope of the utility model is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the scope of the utility model.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323562458.XU CN222089814U (en) | 2023-12-26 | 2023-12-26 | Circuit board with heat dissipation structure, vehicle charger and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323562458.XU CN222089814U (en) | 2023-12-26 | 2023-12-26 | Circuit board with heat dissipation structure, vehicle charger and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222089814U true CN222089814U (en) | 2024-11-29 |
Family
ID=93604672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323562458.XU Active CN222089814U (en) | 2023-12-26 | 2023-12-26 | Circuit board with heat dissipation structure, vehicle charger and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222089814U (en) |
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2023
- 2023-12-26 CN CN202323562458.XU patent/CN222089814U/en active Active
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