CN221587234U - Vibration automatic arrangement feeding device and semiconductor device test braid system - Google Patents
Vibration automatic arrangement feeding device and semiconductor device test braid system Download PDFInfo
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- CN221587234U CN221587234U CN202322901743.3U CN202322901743U CN221587234U CN 221587234 U CN221587234 U CN 221587234U CN 202322901743 U CN202322901743 U CN 202322901743U CN 221587234 U CN221587234 U CN 221587234U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000012360 testing method Methods 0.000 title claims abstract description 30
- 238000001514 detection method Methods 0.000 claims abstract description 33
- 230000005540 biological transmission Effects 0.000 claims abstract description 28
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 238000007664 blowing Methods 0.000 claims description 49
- 230000005284 excitation Effects 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 4
- 238000009954 braiding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000012956 testing procedure Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The application discloses a vibration automatic arrangement feeding device and a semiconductor device test braid system, wherein the vibration automatic arrangement feeding device is applied to the semiconductor device test braid system and comprises the following components: the vibration disc is used for carrying out directional vibration, adjusting the conveyed semiconductor devices and transmitting the semiconductor devices to the discharging track in an orderly arrangement; the detection device is arranged relative to the transmission track of the vibration disc and is used for detecting whether the semiconductor devices conveyed on the transmission track of the vibration disc are ink dot products or not; and the removing mechanism is arranged on the vibration disk, responds to the detection of the detecting device to determine that the semiconductor device is the ink dot product, and the ink dot product is separated from the transmission track of the vibration disk by utilizing the removing mechanism. The vibration automatic arrangement feeding device can improve the data accuracy of semiconductor device testing.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a vibration automatic arrangement feeding device and a semiconductor device test braid system.
Background
The application discloses a semiconductor device test equipment braiding system, which adopts vibration disc feeding, polarity direction test, printing, marking and braiding modes.
Disclosure of utility model
The application provides a vibration automatic arrangement feeding device and a semiconductor device test braid system, which can improve the data accuracy of semiconductor device test.
An embodiment of the present application provides a vibration automatic arrangement feeding device, which is applied to a semiconductor device test braid system, and includes: the vibration disc is used for carrying out directional vibration, adjusting the conveyed semiconductor devices and transmitting the semiconductor devices to the discharging track in an orderly arrangement; the detection device is arranged relative to the transmission track of the vibration disc and is used for detecting whether the semiconductor device conveyed on the transmission track of the vibration disc is a ink dot product or not; and the removing mechanism is arranged on the vibration disc, responds to the detection of the detecting device to determine that the semiconductor device is an ink dot product, and enables the ink dot product to be separated from the transmission track of the vibration disc by utilizing the removing mechanism.
Further, vibrations automatic arrangement pan feeding device still includes: and the collecting device is used for collecting the ink dot products separated from the conveying track of the vibration disc.
Further, the removing mechanism comprises a blowing device, wherein a blowing port of the blowing device faces the transmission track of the vibration disk, the blowing device is excited to spray out release gas in response to the detection of the semiconductor device as the ink dot product by the detection device, so that the ink dot product is released from the transmission track of the vibration disk.
Further, vibrations automatic arrangement pan feeding device still includes: and the control device is respectively connected with the air blowing device and the detection device, wherein when the detection device detects that the semiconductor device is a ink dot product, the detection device generates a corresponding detection signal to the control device, and the control device generates an excitation signal to the air blowing device based on the detection signal.
Further, the collecting device comprises a receiving connecting pipe, the receiving connecting pipe penetrates through the vibration disc, a receiving opening of the receiving connecting pipe is arranged corresponding to an air blowing opening of the air blowing device, the air blowing device is excited, and when the ink dot product is separated from a transmission track of the vibration disc by spraying separation gas, the ink dot product enters the receiving opening by means of the separation gas.
Further, the receiving opening of the receiving connecting pipe comprises at least one receiving opening, and the receiving opening is configured to be opposite to the air blowing opening of the air blowing device.
Further, the receiving opening of the receiving connecting pipe comprises a plurality of receiving openings, and each receiving opening is matched with the specification of one semiconductor device; the receiving connecting pipe is configured to be rotatable so as to face the matched receiving opening to the air blowing port of the air blowing device through rotation.
Further, the collecting device further comprises a collecting box connected with the receiving connecting pipe so as to collect the ink dot products transmitted from the receiving connecting pipe.
Further, the automatic vibration arrangement feeding device further comprises: and the fixed bracket is arranged between the fixed brackets, and the detection device is opposite to the transmission track of the vibration disc.
A second aspect of the embodiment of the present application provides a semiconductor device testing braid system, including the vibration automatic arrangement feeding device described in any one of the above.
The beneficial effects of the application are as follows: the vibration automatic arrangement feeding device 100 comprises a vibration disc, a detection device and a removing mechanism, and responds to the detection of the detection device to determine that a semiconductor device is a dot product, wherein the dot product is waste in the semiconductor device, the removing mechanism is utilized to separate the dot product from a transmission track of the vibration disc, the dot product in the vibration disc can be removed through the detection device and the removing mechanism, namely, the dot product can not enter a next test station, so that the distortion of test data of the semiconductor device caused by the dot product is avoided, the data accuracy of the test of the semiconductor device can be improved, the normal feeding and testing procedures of the vibration disc are not changed, and the practicability of the device is provided.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural view of an embodiment of a vibration automatic arrangement feeding apparatus according to the present application;
FIG. 2 is a schematic diagram of an embodiment of the vibration plate of FIG. 1;
fig. 3 is a schematic structural diagram of an embodiment of a semiconductor device test braid system of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1 and 2, in one embodiment, a vibration automatic arrangement feeding apparatus 100 applied to a semiconductor device test taping system includes a vibration plate 110, a detection device 120, and a removal mechanism 130.
The vibration plate 110 is used for directional vibration, adjusts the transported semiconductor devices, and sequentially transfers the semiconductor devices into the discharging track. Specifically, the semiconductor devices can be orderly arranged and the semiconductor devices can be distinguished and filtered in the wrong direction by the directional vibration of the vibration motor, and the semiconductor devices are adjusted to the correct direction in the vibration plate 110, so that the feeding is more convenient and effective. The vibration plate 110 is generally bowl-shaped for accommodating the semiconductor device, and the inner wall of the vibration plate 110 is provided with a spiral-rising transmission track.
The detecting device 120 is disposed with respect to the transfer rail of the vibration plate 110, and detects whether the semiconductor device transferred on the transfer rail of the vibration plate 110 is a dot product. Specifically, the ink dot product is a defect in the semiconductor device, for example, the defect has a small origin on the semiconductor device, and if the defect enters a subsequent test station, the defect may cause distortion of test data. The detecting device 120 may be an optical sensor or a visual sensor, and the detecting device 120 is disposed opposite to the transmission track of the vibration plate 110, and can detect whether the semiconductor device is a dot product.
The removing mechanism 130 is disposed on the vibration plate 110, and in response to the detection device 120 detecting that the semiconductor device is the ink dot product, the ink dot product is separated from the conveying track of the vibration plate 110 by the removing mechanism 130. Specifically, the removing mechanism 130 may be, for example, an air blowing device, where the removing mechanism 130 is disposed through the vibration plate 110 or is fixed on the vibration plate 110 by bonding, and the removing mechanism 130 breaks away the ink dot product from the transmission track of the vibration plate 110, that is, makes the ink dot product not enter the next testing station, so as to improve the data accuracy of the semiconductor device testing.
As can be seen from the above description, the vibration automatic arrangement feeding device 100 of the present application includes the vibration tray 110, the detecting device 120 and the removing mechanism 130, and in response to the detecting device 120 detecting that the semiconductor device is a dot product, the dot product is a waste product in the semiconductor device, the removing mechanism 130 is utilized to separate the dot product from the transmission track of the vibration tray 110, and the dot product in the vibration tray 110 can be removed through the detecting device 120 and the removing mechanism 130, that is, the dot product can not enter the next testing station, so as to avoid the distortion of the test data of the semiconductor device caused by the dot product, thereby improving the accuracy of the test data of the semiconductor device, and not changing the normal feeding and testing procedures of the vibration tray 110, and providing the practicality of the device 100.
In an embodiment, the vibration automatic alignment feeding apparatus 100 further includes a collecting device 140, where the collecting device 140 is used to collect the dot products detached from the conveying track of the vibration plate 110, and the collecting device 140 may be, for example, a collecting box. The collection device 140 may extend through the transfer track of the shock tray 110, and when the removal mechanism 130 disengages the dot product from the transfer track of the shock tray 110, the dot product falls into the collection device 140.
In other embodiments, the dot product detached from the transfer rail of the vibration plate 110 may also be collected by a robot.
In one embodiment, the removing mechanism 130 includes a blowing device, wherein a blowing port of the blowing device faces the transfer rail of the vibration plate 110, and in response to the detection device 120 detecting that the semiconductor device is the ink dot product, the blowing device is activated to eject the release gas so as to release the ink dot product from the transfer rail of the vibration plate 110.
Specifically, the blowing device penetrates the transport rail of the vibration plate 110, and when the blowing device is activated, the release gas may be ejected to release the dot product from the transport rail of the vibration plate 110. In an application scenario, the blowing direction of the blowing device is perpendicular to the conveying track, so that the ink dot products can be blown off more easily. The blowing device comprises a compressed gas generator, a gas pipe, a nozzle and the like, and the gas is pressurized from the compressed gas generator, is transmitted to the nozzle through the gas pipe and is blown out from the nozzle.
In other embodiments, the removing mechanism 130 may be, for example, a thimble mechanism, where the thimble penetrates through the transmission track of the vibration plate 110, and in response to the detection device 120 detecting that the semiconductor device is the ink dot product, the thimble pushes the ink dot product to separate the ink dot product from the transmission track of the vibration plate 110.
In an embodiment, the vibration automatic arrangement feeding device 100 further includes a control device 150, where the control device 150 is connected to the air blowing device and the detecting device 120, respectively, and when the detecting device 120 detects that the semiconductor device is a dot product, the detecting device 120 generates a corresponding detecting signal to the control device 150, and the control device 150 generates an excitation signal to the air blowing device based on the detecting signal.
Specifically, the control device 150 may be, for example, a CPU (Central Processing Unit ), a PLC (Programmable Logic Controller, programmable logic controller), and the control device 150 receives the detection signal of the detection device 120 and generates an excitation signal to control whether the blowing device blows air.
In an embodiment, the collecting device 140 includes a receiving connecting pipe 141, the receiving connecting pipe 141 penetrates through the vibration plate 110, and a receiving opening of the receiving connecting pipe 141 is corresponding to an air blowing opening of the air blowing device, the air blowing device is activated, and when the release gas is ejected to release the ink dot product from the transmission track of the vibration plate 110, the ink dot product enters the receiving opening through the release gas.
Specifically, the material receiving connection pipe 141 penetrates through the transmission track of the vibration plate 110, and when the blowing device blows out the release gas to release the ink dot product from the transmission track of the vibration plate 110, the ink dot product is blown into the material receiving opening. In other embodiments, the receiving connection pipe 141 may not be provided.
In an embodiment, the receiving opening of the receiving connecting pipe 141 includes at least one receiving opening 142, and the receiving opening 142 is configured to face the air blowing opening of the air blowing device.
Specifically, the material receiving opening 142 has a larger cross-sectional area than the material receiving opening 142 of the semiconductor device, and the material receiving opening 142 is arranged to face the air blowing port of the air blowing device so that the semiconductor device falls into the material receiving port.
In one embodiment, the receiving opening of the receiving connecting pipe 141 includes a plurality of receiving openings 142, and each receiving opening 142 is matched with the specification of a semiconductor device.
Specifically, the receiving connection pipe 141 is configured to be rotatable to the receiving connection pipe 141 such that the matched receiving opening 142 is faced to the blowing port of the blowing device by rotation, and the receiving connection pipe 141 may be fixed to the collecting device 140 by screw connection or the like. By arranging the material receiving openings 142 with different sizes to adapt to semiconductor devices with different sizes, the practicability of the vibration automatic arrangement feeding device 100 is improved.
In an embodiment, the collecting device 140 further includes a collecting box connected to the receiving connection pipe 141 to collect the dot product transferred from the receiving connection pipe 141, and the material of the collecting box may be, for example, plastic, resin, etc., which is not limited in the present application. In other embodiments, a collection box may not be provided.
In one embodiment, the vibration automatic alignment feeding device 100 further includes a fixing bracket 160, and the detecting device 120 is mounted on the fixing bracket 160 and faces the transmission track of the vibration plate 110. The fixing bracket 160 fixes the detecting device 120. In other embodiments, the position of the detection device 120 is controlled by a robot.
Referring to fig. 3, in one embodiment, a semiconductor device test taping system 200 includes a vibration automatic alignment loading apparatus 100 according to any of the above embodiments. Since the semiconductor device test taping system 200 includes the vibration automatic arrangement feeding device 100, the semiconductor device test taping system 200 can also improve the data accuracy of the semiconductor device test.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.
Claims (10)
1. The utility model provides a vibrations automatic arrangement pan feeding device, is applied to semiconductor device test braid system, its characterized in that includes:
The vibration disc is used for carrying out directional vibration, adjusting the conveyed semiconductor devices and transmitting the semiconductor devices to the discharging track in an orderly arrangement;
The detection device is arranged relative to the transmission track of the vibration disc and is used for detecting whether the semiconductor device conveyed on the transmission track of the vibration disc is a ink dot product or not;
And the removing mechanism is arranged on the vibration disc, responds to the detection of the detecting device to determine that the semiconductor device is an ink dot product, and enables the ink dot product to be separated from the transmission track of the vibration disc by utilizing the removing mechanism.
2. The vibration automatic arrangement feeding device according to claim 1, further comprising:
and the collecting device is used for collecting the ink dot products separated from the conveying track of the vibration disc.
3. The vibration automatic arrangement feeding device according to claim 2, wherein,
The removing mechanism comprises a blowing device, wherein a blowing port of the blowing device faces the transmission track of the vibration disk, the blowing device is excited to spray release gas in response to the detection of the detection device to determine that the semiconductor device is an ink dot product, and the ink dot product is released from the transmission track of the vibration disk.
4. The vibration automatic arrangement feeding device according to claim 3, further comprising:
And the control device is respectively connected with the air blowing device and the detection device, wherein when the detection device detects that the semiconductor device is a ink dot product, the detection device generates a corresponding detection signal to the control device, and the control device generates an excitation signal to the air blowing device based on the detection signal.
5. The vibration automatic arrangement feeding device according to claim 3, wherein,
The collecting device comprises a receiving connecting pipe, the receiving connecting pipe penetrates through the vibration disc, a receiving opening of the receiving connecting pipe corresponds to an air blowing opening of the air blowing device, the air blowing device is excited, and when the ink dot product is separated from a transmission track of the vibration disc by spraying separation gas, the ink dot product enters the receiving opening by the separation gas.
6. The vibration automatic arrangement feeding device according to claim 5, wherein,
The receiving opening of the receiving connecting pipe comprises at least one receiving opening, and the receiving opening is configured to be opposite to the air blowing opening of the air blowing device.
7. The vibration automatic arrangement feeding device according to claim 6, wherein,
The receiving opening of the receiving connecting pipe comprises a plurality of receiving openings, and each receiving opening is matched with the specification of one semiconductor device;
the receiving connecting pipe is configured to be rotatable so as to face the matched receiving opening to the air blowing port of the air blowing device through rotation.
8. The vibration automatic arrangement feeding device according to claim 7, wherein,
The collecting device further comprises a collecting box connected with the receiving connecting pipe so as to collect the ink dot products transmitted from the receiving connecting pipe.
9. The vibration automatic alignment feeding device according to claim 1, further comprising:
And the detection device is arranged on the fixed bracket and is opposite to the transmission track of the vibration disc.
10. A semiconductor device test braid system comprising a vibration automatic alignment feed device as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322901743.3U CN221587234U (en) | 2023-10-26 | 2023-10-26 | Vibration automatic arrangement feeding device and semiconductor device test braid system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322901743.3U CN221587234U (en) | 2023-10-26 | 2023-10-26 | Vibration automatic arrangement feeding device and semiconductor device test braid system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221587234U true CN221587234U (en) | 2024-08-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322901743.3U Active CN221587234U (en) | 2023-10-26 | 2023-10-26 | Vibration automatic arrangement feeding device and semiconductor device test braid system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221587234U (en) |
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2023
- 2023-10-26 CN CN202322901743.3U patent/CN221587234U/en active Active
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