CN221466003U - Server device and main board module thereof - Google Patents

Abstract

A server device and a main board module thereof are provided. The server device comprises a chassis, a bracket, a fan assembly and an air guide frame. The chassis comprises a supporting frame and a transverse partition plate. The support frame divides the interior space of the chassis into front and rear regions. The transverse partition separates the front region into upper and lower regions. The bracket is located in the rear region. The fan assembly comprises a fan frame and a fan array, wherein the fan frame is positioned on the bracket, and a diversion space is arranged between the fan frame and the support frame. The fan array has a plurality of fan units within the fan frame. The air guide frame is connected with the fan frame and the supporting frame, divides the flow dividing space into an upper flow channel and a lower flow channel, and divides the fan array into an upper part and a lower part. The upper portion defines a range of the upper flow passage and the lower portion defines a range of the lower flow passage, the number of fan units covered by the upper portion being different from the number of fan units covered by the lower portion. The scheme can enable different areas with obvious different heat dissipation requirements to provide heat dissipation air flows with matching degrees, and the overall heat dissipation efficiency is improved through the high energy consumption elements.

Description

Server device and mainboard module thereof

Technical Field

The utility model relates to a server device, in particular to a server device with an air guide frame.

Background technique

With the continuous improvement and advancement of current cloud technology, servers are moving towards high-frequency and high-speed data processing modes, so the heat dissipation performance of servers is crucial. Generally speaking, servers use the heat dissipation airflow generated by fans to dissipate the high-energy-consuming components inside the server, such as the CPU, memory, and expansion cards.

However, in order to reasonably utilize the internal space, the high-energy-consuming components in the server are inevitably located above and below the internal space, which makes it difficult to centrally distribute the heat dissipation airflow generated by the fan to the high-energy-consuming components, and fails to effectively improve the overall heat dissipation performance.

It can be seen that the above technology still has inconveniences and defects, which is a problem that needs to be solved urgently in this industry.

Utility Model Content

An object of the present invention is to provide a server device and a mainboard module thereof to solve the difficulties mentioned in the above prior art.

One embodiment of the utility model provides a server device. The server device includes a chassis, a bracket, a power supply motherboard, a fan assembly and an air guide. The chassis includes a cover, a box, a support frame and a transverse partition. The cover covers the box and defines an internal space together with the box. The support frame connects the box and the cover, and separates the internal space into a front area and a rear area. The transverse partition connects the box and the support frame, and separates the front area into an upper area and a lower area. The bracket is located in the rear area, and the power supply motherboard is located on the bottom surface of the bracket. The fan assembly includes a fan frame and a fan array. The fan frame is fixed on the bracket, and defines a diversion space connecting the upper area and the lower area together with the box, the cover and the support frame. The fan array includes a plurality of fan units. These fan units are stacked in the fan frame in sequence along the normal direction of the bottom surface of the bracket, and are electrically connected to the power supply motherboard. The air guide includes a partition. The partition plate connects the fan assembly and the support frame, and divides the flow distribution space into an upper flow channel and a lower flow channel, and divides the fan array into an upper part and a lower part. The upper part defines the range of the upper flow channel, the lower part defines the range of the lower flow channel, and the number of the fan units covered by the upper part is different from the number of the fan units covered by the lower part.

According to one or more embodiments of the utility model, the server device further comprises a first electronic module, at least one second electronic module and a backplane module. The first electronic module is removably located in the upper layer area. The second electronic module is removably located in the lower layer area. The backplane module is fixed on the support frame and electrically connected to the first electronic module, the second electronic module and the power supply mainboard.

According to one or more embodiments of the utility model, in the above-mentioned server device, the first electronic module includes a first carrier plate, at least one first electronic device and two wind blocking members. The first carrier plate is removably located in the upper area and defines a first accommodation space connected to the upper flow channel. The first electronic device is fixed in the first accommodation space. These wind blocking members are respectively fixed to two opposite inner walls of the first carrier plate to limit the first accommodation space.

According to one or more embodiments of the utility model, in the above-mentioned server device, the lower area includes a plurality of accommodating slots. The second electronic module includes a plurality of second electronic modules. These second electronic modules are arranged side by side in these accommodating slots, and each second electronic module includes a second carrier plate and at least one second electronic device. The second carrier plate can be removably located in one of the accommodating slots and defines a second accommodating space connected to the lower flow channel. The second electronic device is fixed in the second accommodating space.

According to one or more embodiments of the utility model, in the above-mentioned server device, the air guide frame further includes a partition column. The partition column connects the partition plate and the bracket, and connects the fan frame and the support frame, so that the lower flow channel is divided into two flow channel areas. These flow channel areas are independently connected to these accommodating grooves, and point to these fan units covered by the lower part.

According to one or more embodiments of the utility model, in the above-mentioned server device, the air guide frame includes a first handle, the first handle is located in the upper flow channel and fixed to the partition plate. The motherboard module also includes two lugs and a second handle, these lugs protrude in the direction away from the power motherboard. The second handle is connected to these lugs and is arranged relative to the first handle.

According to one or more embodiments of the utility model, in the above-mentioned server device, the fan array includes a plurality of vertical fan modules, which are arranged in sequence in the fan frame along the long axis direction of the support frame, and each vertical fan module includes a columnar frame. Parts of these fan units are stacked in sequence in the columnar frame along the normal direction.

One embodiment of the utility model provides a motherboard module. The motherboard module includes a bracket, a power supply motherboard, a fan assembly and an air guide. The power supply motherboard is located on the bottom surface of the bracket. The fan assembly includes a fan frame, a fan array and an abutting gasket. The fan frame is located on the power supply motherboard. The fan array includes a plurality of fan units. These fan units are stacked in sequence in the fan frame along the normal direction of the bottom surface of the bracket and are electrically connected to the power supply motherboard. The abutting gasket is fixed to the outer side of the fan frame and divides these fan units of the fan array into an upper part and a lower part. The number of these fan units covered by the upper part is different from the number of these fan units covered by the lower part, and the long axis direction of the abutting gasket is orthogonal to the normal direction. The air guide is connected to the abutting gasket and extends outwardly from the abutting gasket to divert the airflow of these fan units covered by the upper part and the airflow of these fan units covered by the lower part.

According to one or more embodiments of the utility model, in the above-mentioned motherboard module, the air guide frame includes a partition plate, a first handle and at least one bracket. One side of the partition plate is connected to the abutment gasket. The bracket is respectively connected to the partition plate and the bracket, and the first handle is fixed to the side of the partition plate facing away from the power motherboard. The bracket also includes two lugs and a second handle. These lugs protrude together in the direction facing away from the power motherboard, and the second handle is fixedly connected to these lugs and is arranged relative to the first handle.

According to one or more embodiments of the utility model, in the above-mentioned mainboard module, the air guide frame further includes a partition column. The partition column is respectively connected to the partition plate, the bracket and the fan assembly, so that the space between the partition plate and the bracket is divided into two flow channel areas, one of which points to one of the fan units.

Thus, through the above architecture, the server device and its motherboard module of the present case can enable the fan assembly to provide matching cooling airflow for different areas with significantly different cooling requirements, so that it can fully pass through higher energy-consuming components, thereby effectively improving the overall cooling performance.

The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following implementation mode and related drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to make the above and other purposes, features, advantages and embodiments of the present invention more clearly understood, the attached drawings are described as follows:

FIG1 is a perspective view of a server device according to an embodiment of the present invention;

FIG2 is an exploded view of the server device of FIG1 ;

FIG3 is a cross-sectional view taken along line segment AA in FIG1;

FIG4 is a cross-sectional view taken along line segment BB in FIG1 ;

FIG5 is a cross-sectional view taken along line segment CC in FIG1;

FIG6 is a partial enlarged view of the area M in FIG5 ;

FIG7 is an enlarged view of the first electronic module of this embodiment;

FIG. 8 is an enlarged view of the second electronic module of this embodiment.

【Symbol Description】

10: Server device

100: Chassis

110, 111: Cover

120: Cabinet

121: Bottom plate

122: Side panel

123:Interior Space

130: Support frame

131: Front Area

132: Rear area

133: against flange

140: Horizontal partition

150:Interval

151: Upper Area

152: Lower Level

153: Receiving groove

160: Back cover

200: First electronic module

210: first carrier plate

211: First plate

212: First side panel

213: Opening

214: Second side panel

215: Inner wall

220: first accommodation space

230: Wind blocking parts

231: Channel

240: First electronic device

300: Second electronic module

310: Second carrier plate

320: Second accommodation space

330: Second electronic device

400: Backplane module

500: Mainboard module

510: Bracket

511: Bottom

512: Lug

513: Second handle

520: Power supply motherboard

600: Fan assembly

610: Fan frame

611: abutting gasket

620: Vertical fan module

621: Column frame

624: Fan unit

630: Fan array

631: Upper part

632: Lower part

700: Wind guide frame

710:Separator

720: Bracket

730: Horizontal part

731: Narrow groove

732: convex wing

733: Circulation Gap

740: Longitudinal part

750:Separator

760: Flow channel area

761: Sub-flow channel

770: First Handle

AA,BB,CC: Line segment

M: Area

F:Front port

R: Rear port

S: Diversion space

S1: Upstream

S2: Downstream

X,Y,Z: axis

Detailed ways

The following will disclose multiple embodiments of the utility model with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the utility model. In other words, in one embodiment of the utility model, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and elements will be depicted in a simple schematic manner in the drawings.

FIG. 1 is a three-dimensional view of a server device 10 according to an embodiment of the present invention. FIG. 2 is an exploded view of the server device 10 of FIG. 1 . FIG. 3 is a cross-sectional view taken along line segment AA in FIG. 1 . As shown in FIGS. 1 to 3 , in this embodiment, the server device 10 comprises a chassis 100, a first electronic module 200, two second electronic modules 300, a backplane module 400 and a mainboard module 500. The chassis 100 comprises two covers 110, 111, a box 120, a support frame 130 and a transverse partition 140. These covers 110, 111 cover the box 120 respectively, so that these covers 110, 111 and the box 120 together define an internal space 123. In this embodiment, for example, the box 120 includes a bottom plate 121, two side plates 122 and a rear cover 160. The side plates 122 are respectively located at two opposite long sides of the bottom plate 121 and extend in a common direction (such as the Z axis), so that the box 120 has a front port F and a rear port R opposite to each other, and the rear cover 160 covers the rear port R. The covers 110 and 111 are opposite to the bottom plate 121 and cover the side plates 122, so that the covers 110 and 111, the bottom plate 121 and the side plates 122 jointly define the internal space 123. The support frame 130 is located in the internal space 123, and is connected to the covers 110 and 111 and the bottom plate 121 of the box 120 and the side plates 122, and separates the internal space 123 into a front area 131 and a rear area 132. The transverse partition 140 is located in the inner space 123, connecting the support frame 130 and the side panels 122 of the box body 120, and dividing the front area 131 into an upper layer area 151 and a lower layer area 152. The long axis direction (such as the X axis) of the box body 120 and the long axis direction (such as the X axis) of the transverse partition 140 are parallel to each other, and the long axis direction (such as the Y axis) of the support frame 130 is orthogonal to each other.

FIG4 is a cross-sectional view taken along line segment BB in FIG1. As shown in FIGS. 2 to 4, the motherboard module 500 includes a bracket 510, a power motherboard 520, a fan assembly 600, and an air guide frame 700. The bracket 510 is located in the rear area 132, and the power motherboard 520 is located on the bottom surface 511 of the bracket 510. In this embodiment, the bracket 510 is fixed to the bottom plate 121 of the housing 120, and the power motherboard 520 is placed flat on the bottom surface 511 (such as the X-Y plane) of the bracket 510, and the support frame 130 passes through the power motherboard 520 and is locked on the bracket 510. The fan assembly 600 is located on the power motherboard 520, and the air guide frame 700 connects the support frame 130 and the fan assembly 600. The fan assembly 600 , the support frame 130 , the covers 110 , 111 and the side panels 122 of the box body 120 together define a flow distribution space S ( FIG. 3 ), and the flow distribution space S connects the upper layer area 151 and the lower layer area 152 .

The first electronic module 200 is removably located in the upper area 151, that is, the first electronic module 200 can enter and exit the upper area 151 from the front port F. These second electronic modules 300 are removably located in the lower area 152. More specifically, the lower area 152 is divided into a plurality of (e.g., 2) receiving grooves 153 (FIG. 2) by a partition 150, and each second electronic module 300 is removably installed in one of the receiving grooves 153, that is, each second electronic module 300 can enter and exit the receiving groove 153 of the lower area 152 from the front port F. The backplane module 400 is fixed to the support frame 130 and electrically connects the first electronic module 200, the second electronic module 300 and the power supply motherboard 520.

As shown in FIG. 2 and FIG. 3 , the fan assembly 600 includes a fan frame 610 and a plurality of vertical fan modules 620. The fan frame 610 is located on the bracket 510, and the long axis direction (such as the Y axis) of the fan frame 610 is parallel to the long axis direction (such as the Y axis) of the support frame 130. In the present embodiment, the fan frame 610 is fixed to the power supply mainboard 520, the bracket 510 and the side panels 122 of the housing 120 by screws, and the fan frame 610, the support frame 130, the cover 111 and the side panels 122 of the housing 120 jointly define the diversion space S ( FIG. 3 ).

FIG. 5 is a cross-sectional view taken along line segment CC in FIG. 1 . As shown in FIG. 2 and FIG. 5 , these vertical fan modules 620 are sequentially arranged side by side in the fan frame 610 along the long axis direction (such as the Y axis) of the support frame 130. Each vertical fan module 620 is pluggable in the fan frame 610 and is electrically connected to the power supply motherboard 520. The vertical fan module 620 includes a columnar frame 621 and a plurality of fan units 624. These fan units 624 are sequentially stacked in the columnar frame 621 along the normal direction (such as the Z axis) of the bottom surface 511 of the bracket 510 and are electrically connected to the power supply motherboard 520.

It should be understood that since all fan units 624 of all upright fan modules 620 in the fan frame 610 can be considered to be arranged in an array (such as 4X8) in the fan frame 610, all fan units 624 in the fan frame 610 are also called a fan array 630 (Figure 5).

As shown in FIG. 2 and FIG. 5 , the outer surface of the fan frame 610 is covered with a support gasket 611. The support gasket 611 extends toward the long axis direction (such as the Y axis) of the support frame 130. In other words, the long axis direction (such as the Y axis) of the support gasket 611 is parallel to the long axis direction (such as the Y axis) of the fan frame 610, and the length of the support gasket 611 is similar to the length of the fan frame 610. The position of the support gasket 611 in the fan frame 610 can divide the fan units 624 of the fan array 630 into an upper part 631 and a lower part 632 ( FIG. 5 ). The upper part 631 defines the range of the upper flow channel S1, and the lower part 632 defines the range of the lower flow channel S2, and the number of the fan units 624 covered by the upper part 631 is different from the number of the fan units 624 covered by the lower part 632.

In this embodiment, the number of the fan units 624 covered by the upper portion 631 of the fan assembly 600 is greater than the number of the fan units 624 covered by the lower portion 632 thereof, that is, the amount of air that can be drawn from the upper area 151 by the fan units 624 covered by the upper portion 631 of the fan assembly 600 is greater than the amount of air that can be drawn to the lower area 152 by the fan units 624 covered by the lower portion 632 thereof, thereby providing different areas with significantly different heat dissipation requirements with matching degrees of heat dissipation airflow, allowing them to fully pass through higher energy-consuming components, thereby effectively improving the overall heat dissipation efficiency.

As shown in FIGS. 3 to 5 , the air guide frame 700 includes a partition plate 710 and at least one bracket 720. The partition plate 710 is connected obliquely to the fan frame 610 and the support frame 130, and divides the flow distribution space S into an upper flow channel S1 and a lower flow channel S2. The upper flow channel S1 is connected to the upper layer area 151 and the fan frame 610, and the lower flow channel S2 is connected to the lower layer area 152 and the fan frame 610. The bracket 720 is located in the lower flow channel S2, and is connected to the partition plate 710 and the bracket 510, respectively, and supports the partition plate 710, so as to support the partition plate 710.

More specifically, as shown in FIG3 and FIG5 , the outer surface of the support frame 130 facing the fan assembly 600 protrudes outwardly with a contact flange 133 ( FIG4 ). Two opposite long sides of the partition plate 710 contact the contact pad 611 and the contact flange 133 respectively to separate the airflow of the fan unit 624 covered by the upper portion 631 and the airflow of the fan unit 624 covered by the lower portion 632.

More specifically, as shown in FIG. 3 and FIG. 4 , the air guide frame 700 further includes a partition column 750, and the bracket 720 is a plurality (e.g., 2). The two opposite ends of the partition column 750 are respectively fixedly connected to the partition plate 710 and the bracket 510, and the two opposite sides of the partition column 750 are respectively fixedly connected to the fan frame 610 and the support frame 130, so that the lower flow channel S2 is divided into two flow channel areas 760 by the partition column 750, and these flow channel areas 760 are respectively and independently connected to these accommodating grooves 153. Each bracket 720 connects the bottom surface 511 of the partition and the bottom surface 511 of the bracket 510 in one of the flow channel areas 760, and these brackets 720 and partition columns 750 further subdivide these flow channel areas 760 into multiple sub-flow channels 761, one of which is aligned with or directed to two of the fan units 624, so that the airflow passing through the sub-flow channel 761 can be more smoothly delivered to the corresponding fan unit 624.

Furthermore, as shown in FIG. 3 and FIG. 5 , each bracket 720 is U-shaped and includes a transverse portion 730 and two longitudinal portions 740. One side of the transverse portion 730 is locked to the bottom surface 511 of the partition plate 710, and the longitudinal portions 740 extend from two opposite ends of the transverse portion 730 toward the bracket 510. The transverse portion 730 is locked to the bottom surface 511 of the partition plate 710, and one end of each longitudinal portion 740 away from the transverse portion 730 is locked to the bracket 510.

In addition, FIG. 6 is a partial enlarged view of the area M in FIG. 5 . As shown in FIG. 6 , the side of the transverse portion 730 facing the partition plate 710 has a narrow groove 731 and a plurality of convex wings 732. The partition plate 710 covers the transverse portion 730 and the narrow groove 731. These convex wings 732 are convexly arranged at intervals at the bottom of the narrow groove 731, and separate a plurality of flow gaps 733 in the narrow groove 731. In this way, the transverse portion 730 is provided with the narrow groove 731 and the convex wings 732, which can not only bring a specific structural strength at a specific thickness, but also enhance the passage of airflow, thereby providing heat dissipation efficiency.

The air guide frame 700 further includes a first handle 770. The first handle 770 is fixed on the partition plate 710 and is located in the upper flow channel S1. The mainboard module 500 further includes two lugs 512 and a second handle 513. The lugs 512 extend from two opposite sides of the bracket 510 toward the direction of the cover 111 (such as the Z axis). The second handle 513 connects these lugs 512 and is arranged relative to the first handle 770. In this way, referring to FIG. 3, when the user wants to remove the mainboard module 500 from the chassis 100, the user can grab the first handle 770 and the second handle 513 and move the mainboard module 500 out of the chassis 100.

FIG7 is an enlarged view of the first electronic module 200 of the present embodiment. In the present embodiment, more specifically, as shown in FIG3 and FIG7, the upper area 151 can be provided for a first electronic module 200 to be removably installed therein. The first electronic module 200 includes a first carrier plate 210, a plurality of wind blocking members 230 and one or more first electronic devices 240. The first carrier plate 210 is removably located in the upper area 151, and the first carrier plate 210 contains a first accommodating space 220 connected to the upper flow channel S1. These first electronic devices 240 are located on the first carrier plate 210 and fixed in the first accommodating space 220. These wind blocking members 230 are respectively fixed to two opposite inner walls of the first carrier plate 210, and protrude toward each other, thereby limiting the first accommodating space 220.

Therefore, when the airflow in the first accommodating space 220 is blocked by the wind blocking members 230 and is concentratedly guided into the upper flow channel S1 , the airflow can quickly deliver the heat energy of the first electronic device 240 to the fan assembly 600 without circling or stagnating in the first carrier plate 210 .

In the present embodiment, for example, the first carrier plate 210 includes a first plate body 211, two first side plates 212 and two second side plates 214. The first side plates 212 are opposite to each other, the second side plates 214 are opposite to each other, and the first side plates 212 and the second side plates 214 jointly surround and are adjacent to the first plate body 211, and jointly define the above-mentioned first accommodating space 220. The first electronic device 240 is, for example, an expansion card component (GPU or PCI-e), and is arranged side by side on the first plate body 211. The wind blocking members 230 are respectively located on the inner wall surface 215 of the second side plates 214. In addition, the first electronic module 200 further includes an opening 213. The opening 213 is formed on one of the first side plates 212 closer to the support frame 130, and is aligned with the channel 231 between the wind blocking members 230, and the opening 213 has the same amplitude as the channel 231.

FIG8 is an enlarged view of the second electronic module 300 of this embodiment. More specifically, as shown in FIG3 and FIG8, the second electronic module 300 includes a second carrier plate 310 and one or more second electronic devices 330. The second carrier plate 310 is removably located in one of the accommodating grooves 153, and the second carrier plate 310 has a second accommodating space 320 connected to the lower flow channel S2. The second electronic device 330 is fixed in the second accommodating space 320. The second electronic device 330 is, for example, a transmission unit or a storage unit.

In some embodiments, the chassis 100 is a rack-type server chassis (Rack) for accommodating the above-mentioned related electronic devices and/or expansion components. The height of the chassis 100 is measured in U units (1U equals 1.75 inches or 44.45 mm). The chassis 100 is, for example but not limited to, used to accommodate standard server chassis such as 7U.

Thus, through the above architecture, the server device and its motherboard module of the present case can enable the fan assembly to provide matching cooling airflow for different areas with significantly different cooling requirements, so that it can fully pass through higher energy-consuming components, thereby effectively improving the overall cooling performance.

Finally, the above disclosed embodiments are not intended to limit the present invention. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all of them can be protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.

Claims (10)

1. A server device, comprising: A case, comprising a cover, a box, a support frame and a transverse partition, wherein the cover covers the box and defines an internal space together with the box, the support frame connects the box and the cover and separates the internal space into a front area and a rear area, and the transverse partition connects the box and the support frame and separates the front area into an upper area and a lower area; a bracket located within the rear region; A power supply mainboard is located on a bottom surface of the bracket; a fan assembly, comprising a fan frame and a fan array, wherein the fan frame is located on the bracket and defines a flow distribution space connecting the upper area and the lower area together with the cover, the box and the support frame, and the fan array comprises a plurality of fan units, which are sequentially stacked in the fan frame along the normal direction of the bottom surface of the bracket and are electrically connected to the power supply mainboard; and A wind guide frame includes a partition plate, the partition plate connects the fan assembly and the support frame, and divides the flow distribution space into an upper flow channel and a lower flow channel, and divides the plurality of fan units of the fan array into an upper part and a lower part, The upper portion defines a range of the upper flow channel, the lower portion defines a range of the lower flow channel, and the number of the plurality of fan units covered by the upper portion is different from the number of the plurality of fan units covered by the lower portion. 2. The server device according to claim 1, further comprising: a first electronic module removably located in the upper region; at least one second electronic module removably located within the lower region; and A backplane module is fixed on the support frame and electrically connected to the first electronic module, the second electronic module and the power mainboard. 3. The server device as claimed in claim 2, wherein the first electronic module comprises: a first carrier plate, removably located in the upper region and defining a first accommodating space connected to the upper flow channel; and At least one first electronic device is fixed in the first accommodating space; and The two wind blocking members are respectively fixed to two opposite inner walls of the first carrying plate to limit the first accommodating space. 4. The server device as described in claim 2 is characterized in that the lower area includes a plurality of accommodating grooves, the second electronic module includes a plurality of second electronic modules, the plurality of second electronic modules are arranged side by side in the plurality of accommodating grooves, and each of the plurality of second electronic modules includes a second carrier plate and at least one second electronic device, the second carrier plate can be removably located in one of the plurality of accommodating grooves and defines a second accommodating space connected to the lower flow channel, and the second electronic device is fixed in the second accommodating space. 5. The server device according to claim 4, wherein the air guide frame further comprises: A partition column connects the partition plate and the bracket, and connects the fan frame and the support frame, so that the lower flow channel is divided into two flow channel areas, and the two flow channel areas are independently connected to the multiple accommodating grooves and point to the multiple fan units covered by the lower part. 6. The server device according to claim 1, wherein the air guide frame comprises a first handle, the first handle is located in the upper flow channel and fixed to the partition plate; and The bracket further comprises two lugs and a second handle. The two lugs protrude together in a direction away from the power supply mainboard. The second handle is connected to the two lugs and is arranged opposite to the first handle. 7. The server device as claimed in claim 1, wherein the fan array comprises a plurality of vertical fan modules, the plurality of vertical fan modules are sequentially arranged side by side in the fan frame along the long axis direction of the support frame, and each of the plurality of vertical fan modules comprises a columnar frame, Parts of the plurality of fan units are sequentially stacked in the columnar frame along the normal direction. 8. A motherboard module, comprising: a bracket; A power supply mainboard is located on a bottom surface of the bracket; A fan assembly, comprising: A fan frame is located on the power supply mainboard; a fan array, comprising a plurality of fan units, wherein the plurality of fan units are sequentially stacked in the fan frame along a normal direction of the bottom surface of the bracket and are electrically connected to the power supply mainboard; and an abutting gasket fixed to the outer side of the fan frame and dividing the plurality of fan units of the fan array into an upper portion and a lower portion, wherein the number of the plurality of fan units covered by the upper portion is different from the number of the plurality of fan units covered by the lower portion, wherein the long axis direction of the abutting gasket is orthogonal to the normal direction; and An air guide frame is connected to the abutting gasket and extends outwardly obliquely from the abutting gasket to divide the airflow of the multiple fan units covered by the upper part and the airflow of the multiple fan units covered by the lower part. 9. The motherboard module as claimed in claim 8, wherein the air guide frame comprises a partition plate, a first handle and at least one bracket, one side of the partition plate is connected to the abutting gasket, the bracket is respectively connected to the partition plate and the bracket, and the first handle is fixed to a side of the partition plate facing away from the power motherboard; and The bracket further comprises two lugs and a second handle, wherein the two lugs protrude together in a direction away from the power supply mainboard, and the second handle is fixedly connected to the two lugs and arranged opposite to the first handle. 10. The motherboard module as described in claim 9 is characterized in that the air guide frame further includes a partition column, which connects the partition plate, the bracket and the fan frame, so that the space between the partition plate and the bracket is divided into two flow channel areas, one of which points to a part of the multiple fan units.