CN220774706U - Microwave composite substrate for circulator - Google Patents
Microwave composite substrate for circulator Download PDFInfo
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- CN220774706U CN220774706U CN202321470585.4U CN202321470585U CN220774706U CN 220774706 U CN220774706 U CN 220774706U CN 202321470585 U CN202321470585 U CN 202321470585U CN 220774706 U CN220774706 U CN 220774706U
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- substrate
- microwave
- dielectric constant
- circulator
- ferrite
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- 239000000758 substrate Substances 0.000 title claims abstract description 84
- 239000002131 composite material Substances 0.000 title claims abstract description 24
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 33
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 239000012790 adhesive layer Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 239000003595 mist Substances 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011268 mixed slurry Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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- Non-Reversible Transmitting Devices (AREA)
Abstract
A microwave composite substrate for a circulator belongs to the field of electronic components. The microwave composite substrate comprises a high dielectric constant microwave substrate, a substrate through hole, ferrite posts and an adhesive layer; the substrate through holes are uniformly formed in the high dielectric constant microwave substrate; the ferrite is a cylinder and is nested in the through hole of the microwave substrate with high dielectric constant through the adhesive layer. The punching aperture range of the ceramic substrate is 1.5 mm-5 mm, the taper of the front and back faces of the aperture is +/-1 DEG, the size of the high dielectric constant microwave substrate is 50.8mm multiplied by (0.6-1) mm, the diameter range of the ferrite column is 1.49 mm-5.01 mm, and the taper of the front and back faces is as follows: + -1 deg.. The problems that the existing substrate material is low in dielectric constant, large in magnetic loss, poor in control precision and poor in performance, and cannot meet the requirements of microstrip annular miniaturization technology are solved. The method is widely applied to the broadband and miniaturized circulator.
Description
Technical Field
The utility model belongs to the field of electronic components, and further relates to the field of microwave composite substrates, in particular to a microwave composite substrate for a circulator.
Background
In recent years, as the requirements of electronic information technology and equipment are continuously improved, the phased array radar system is increasingly important to be miniaturized, integrated, light-weighted, anti-interference and high-reliability. The circulator is used as a key component of the phased array radar, and plays roles of unidirectional transmission and signal isolation of radio frequency signals in a radio frequency receiving and transmitting system.
The substrate materials for the microstrip ring at present mainly comprise pure ferrite substrate materials, MEMS process silicon substrate nested ferrite materials, low-temperature co-fired dielectric ferrite materials, high-dielectric ceramic-ferrite heterogeneous integrated composite materials and the like. But the silicon substrate nested ferrite material adopting the pure ferrite and MEMS technology has the technical problems of low dielectric constant, large magnetic loss, secondary harmonic interference and the like, and the device has larger size and poorer performance and can not meet the requirements of the technical development of novel equipment. Secondly, the microstrip circulator has extremely high requirement on the dimensional accuracy of a circuit, and is directly related to the performance of the device. The traditional low-temperature cofiring technology cannot meet the requirements of a microstrip circulator on high-precision thin film technology due to poor material shrinkage control precision, and is easy to generate technical problems of device failure caused by layering, and the like, so that the requirements of the performance and reliability of the novel device cannot be met.
In view of this, the present utility model has been made.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: the problems that the existing substrate material is low in dielectric constant, large in magnetic loss, poor in control precision and poor in performance, and cannot meet the requirements of high-precision thin film technology of a microstrip circulator and the device is miniaturized are solved.
The utility model is characterized in that: according to the electromagnetic wave transmission theory, the higher the dielectric constant of the substrate material is, the smaller the electromagnetic wave size is, the smaller the device volume is, and the lower the substrate material loss is, the smaller the electromagnetic loss is, and the better the device performance is. The microwave dielectric ceramic has the advantages of high dielectric constant, small loss and the like, and the problems of poor electric performance and the like of a pure ferrite substrate material for devices can be perfectly solved through the structural design form of the dielectric loaded ferrite, so that the miniaturization and ultra-wideband design of the devices are realized. Therefore, the micro-strip annular device can be miniaturized and has high-performance technical design requirements by adopting the high-dielectric and low-loss microwave dielectric ceramic and ferrite for composite embedding.
To this end, the present utility model provides a microwave composite substrate for a circulator, as shown in fig. 1 to 3. Comprises a high dielectric constant microwave substrate 1, a substrate through hole 4, ferrite posts 3 and an adhesive layer 2.
The high dielectric constant microwave substrate is a microwave ceramic substrate with a dielectric constant more than or equal to 20.
The microwave substrate is a planar substrate.
The high-dielectric-constant microwave substrate is provided with a plurality of through holes which are uniformly formed on the high-dielectric-constant microwave substrate.
The ferrite posts are cylinders.
The adhesive layer is high-temperature resistant, acid and alkali resistant and salt mist resistant and is positioned between the high-dielectric-constant microwave substrate through hole and the ferrite column gap.
The ferrite posts are nested in the high-dielectric-constant microwave substrate through holes through an adhesive.
Compared with the prior art, the utility model has the following beneficial effects:
the microwave ceramic substrate with high dielectric constant and low dielectric loss is adopted to be compounded with ferrites with different dielectric constants and magnetic fluxes, ferrite columns are embedded in the ceramic substrate, and then the microwave ceramic substrate and the ferrite columns are firmly bonded through an adhesive layer which can resist high temperature, acid and alkali and salt mist, so that the technical design requirements of miniaturization and high performance of the microstrip annular device can be met.
Drawings
Fig. 1 is a schematic diagram of a circuit substrate structure.
Fig. 2 is a schematic cross-sectional view of a conforming substrate for a circulator.
Fig. 3 is a schematic diagram of a composite substrate microwave substrate-adhesive-ferrite interface structure for a circulator.
Fig. 4 is a schematic view of a composite substrate microwave substrate for a circulator.
In the figure: 1 is a high dielectric constant microwave substrate, 2 is an adhesive layer, 3 is a ferrite post, and 4 is a substrate through hole.
Detailed Description
As shown in fig. 1-3, a specific embodiment of the microwave composite substrate for a circulator is as follows:
(1) Punching and preparing a substrate: a precision machining center was used to punch a microwave ceramic substrate (substrate size: 50.8 mm. Times.50.8 mm. Times.0.6 to 1 mm) having a high dielectric constant (dielectric constant range:. Gtoreq.20), pore size range: 1.5 mm-5 mm, tolerance: 5 μm, pore diameter front and back face hole taper: + -1 deg..
(2) Preparing ferrite columns: ferrite substrates (substrate dimensions: 50.8 mm. Times.50.8 mm. Times.0.6 to 1 mm) were subjected to precision machining center, type: ni-based, li-based spinel structure, garnet structure, dielectric constant: 10 to 30, the magnetic flux is: 1000GS to 5000 GS) is processed, and in order to control the gap between the ferrite and the ceramic substrate to be + -10 μm, the diameter range of the ferrite post is 1.49mm to 5.01mm, the tolerance is + -5 μm, and the taper of the front and back face holes is: + -1 deg..
(3) And (3) preparation of an adhesive:
mixing high dielectric constant microwave ceramic powder with DB5012 glue, weighing in proportion, and placing in a high-speed stirrer for rapid stirring to form mixed slurry, wherein the stirring speed is 1000-2000 r/min, and the stirring time is 30-60 s; and rolling the mixed slurry which is well stirred rapidly repeatedly for a plurality of times (5-10 times) by adopting a triaxial slurry binding machine, so as to obtain the adhesive with good fluidity.
(4) Preparation of a composite substrate:
placing the processed substrate on a vacuum adsorption table, starting vacuum adsorption to prevent the substrate from shaking randomly in the embedding process, plugging ferrite columns into holes of a high-dielectric-constant microwave substrate one by one, uniformly spreading adhesive on the substrate by adopting a scraper, continuing vacuum adsorption (5-10) for a minute, scraping excessive adhesive on the surface of the substrate clean after finishing, placing the embedded composite substrate into a vacuum drying oven for curing, wherein the curing temperature is 200 ℃, and preserving heat for 2 hours; and (3) grinding and polishing the substrate by adopting a high-precision grinding and polishing machine after curing is finished, wherein the grinding time is 20-60 min, and the polishing time is 60-90 min.
By testing the polished composite substrate, the thickness of the plate was: 0.2 mm-0.5 mm, thickness tolerance: 2 μm, the warp of the substrate is less than or equal to 0.1%, and the surface roughness is less than or equal to 0.02 μm; the gap between the ferrite post and the substrate is: the gaps are uniformly filled with adhesive agent between 10 μm.
Finally, it should be noted that: the above examples are only illustrative and the utility model includes, but is not limited to, the above examples, which need not and cannot be exhaustive of all embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. All embodiments meeting the requirements of the utility model are within the protection scope of the utility model.
Claims (7)
1. The utility model provides a microwave composite substrate for circulator which characterized in that: the microwave composite substrate comprises a high dielectric constant microwave substrate, a substrate through hole, ferrite posts and an adhesive layer;
the high dielectric constant microwave substrate is a microwave ceramic substrate with a dielectric constant more than or equal to 20;
the high dielectric constant microwave substrate is a planar substrate;
the substrate through holes are uniformly formed in the high dielectric constant microwave substrate;
the ferrite column is a cylinder;
the adhesive layer is positioned between the high dielectric constant microwave substrate through hole and the ferrite column gap;
the ferrite posts are nested in the high-dielectric-constant microwave substrate through holes through an adhesive.
2. The microwave composite substrate for a circulator of claim 1, wherein an aperture range of the microwave substrate through hole is: 1.5 mm-5 mm, tolerance + -5 um, aperture positive and negative face hole taper: + -1 deg..
3. The microwave composite substrate for a circulator of claim 1, wherein said ferrite posts have a diameter in the range of: 1.49 mm-4.99 mm, tolerance + -10 μm, positive and negative face hole taper: + -1 deg..
4. The microwave composite substrate for a circulator of claim 1, wherein a gap between the ferrite post and the substrate is: the gaps are uniformly filled with adhesive agent between 10 μm.
5. A microwave composite substrate for a circulator according to claim 1, wherein the size of the high dielectric constant microwave substrate is 50.8mm x (0.6 to 1) mm.
6. The microwave composite substrate for a circulator of claim 1, wherein the microwave composite substrate has a thickness of 0.2mm to 0.5mm, a thickness tolerance of + -5 μm, a substrate warpage of 0.1% or less, and a surface roughness of 0.02 μm or less.
7. The microwave composite substrate for a circulator of claim 1, wherein said adhesive layer is an adhesive layer resistant to high temperature, acid and alkali and salt mist.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2022231449498 | 2022-11-25 | ||
| CN202223144949 | 2022-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220774706U true CN220774706U (en) | 2024-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321470585.4U Active CN220774706U (en) | 2022-11-25 | 2023-06-09 | Microwave composite substrate for circulator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115832662A (en) * | 2022-11-25 | 2023-03-21 | 中国振华集团云科电子有限公司 | Microwave composite substrate for circulator and preparation method thereof |
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2023
- 2023-06-09 CN CN202321470585.4U patent/CN220774706U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115832662A (en) * | 2022-11-25 | 2023-03-21 | 中国振华集团云科电子有限公司 | Microwave composite substrate for circulator and preparation method thereof |
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