CN212303658U - Small-outline package integrated circuit lead frame - Google Patents
Small-outline package integrated circuit lead frame Download PDFInfo
- Publication number
- CN212303658U CN212303658U CN202020912524.9U CN202020912524U CN212303658U CN 212303658 U CN212303658 U CN 212303658U CN 202020912524 U CN202020912524 U CN 202020912524U CN 212303658 U CN212303658 U CN 212303658U
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- CN
- China
- Prior art keywords
- lead frame
- frame
- base island
- integrated circuit
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a little appearance encapsulation integrated circuit lead frame, including frame and a plurality of lead frame unit, a plurality of lead frame units are all fixed in the frame, and the lead frame unit includes interior pin and base island, and the peripheral evenly distributed of base island has 24 interior pins, and the fixed solder joint that is provided with on the interior pin, interior pin all is fixed with the outer pin of one-to-one, and outer pin is fixed mutually with the frame through the brace rod, and the base island is fixed mutually with the frame through the splice rod, has still seted up the encapsulation hole on the interior pin, has seted up a plurality of groove points that all have the distribution on the base island. The advantage still has seted up the encapsulation hole on the inner pin, and the encapsulation plastic passes the encapsulation hole when encapsulating the lead frame unit to further increase the encapsulation back, the steadiness of plastic-sealed body and lead frame unit. The base island is fixed with the chip through the conductive adhesive, and the contact area among the chip, the conductive adhesive and the base island can be effectively increased by the groove points arranged on the upper end face of the base island, so that the fixing reliability of the chip and the base island is increased.
Description
Technical Field
The utility model particularly relates to a little appearance encapsulation integrated circuit lead frame.
Background
The electronic components are components of electronic components and small-sized machines and instruments, and are generally composed of a plurality of parts, so that the electronic components can be commonly used in similar products, and along with the updating and development of the technology, the electronic components are various in types and smaller in appearance. Most of the existing electronic components are semiconductor electronic components, and although the appearance of the semiconductor electronic components is simple, the manufacturing technology is quite complex and the technical content is high. The existing low-profile lead frame is generally composed of a plurality of frame units, and each frame unit comprises a base island for carrying and fixing a chip. The chip of the existing small-outline lead frame is packaged through the subsequent packaging steps, the reliable packaging of the chip has a crucial influence on the use of a finished product, if the chip is not firmly fixed with a base island, the connection line between the chip and a pin is poor in contact due to vibration or shaking in the using process of the chip, and even the connection line is broken due to vibration, so that the chip or the lead frame cannot work normally. Meanwhile, the existing lead frame is cut apart of the frame unit through the cutter, the cutting end of the lead frame and the two sides of the lead frame are right-angled through the mode, so that the lead frame cannot smoothly enter a rail of a customer packaging production line, and the lead frame and the cutter are deformed or even scrapped due to interference in severe cases.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: a lead frame for a small-outline powder integrated circuit is provided, in which a chip can be reliably fixed to a frame unit of the lead frame in a subsequent packaging process.
The utility model provides a technical scheme that above-mentioned technical problem adopted does: the utility model provides a little appearance encapsulation integrated circuit lead frame, includes frame and a plurality of lead frame unit, a plurality of lead frame unit all fix in the frame, 4 lead frame unit constitute lead frame group for a set of, evenly be provided with multiunit lead frame group along the length direction of frame, the lead frame unit include inner pin and base island, the peripheral evenly distributed of base island have 24 inner pins, inner pin on the fixed solder joint that is provided with, inner pin all be fixed with the outer pin of one-to-one, outer pin pass through brace rod and frame and fix mutually, the base island pass through the splice rod and fix mutually with the frame, inner pin on still seted up the encapsulation hole, the base island on seted up a plurality of groove points that all have the distribution, the both ends of frame all be provided with the encapsulation angle.
Furthermore, 8 groups of lead frame groups are arranged in the side frame along the length direction of the side frame, and first cutting holes are formed among the lead frame groups.
Furthermore, a second cutting hole is formed between every two adjacent lead frame units in the lead frame group.
Furthermore, both sides of the frame are provided with positioning holes corresponding to the middle part of the lead frame group.
Furthermore, the groove points are conical grooves.
Furthermore, the depth of the groove point is 0.01 mm-0.038 mm.
Furthermore, the diameter of the packaging hole is 0.3 mm-0.5 mm.
Compared with the prior art, the utility model has the advantages that 4 lead frame units are a set of lead frame group that constitutes, evenly are provided with multiunit lead frame group along the length direction of frame, are the production and processing of the enterprise of being convenient for of the lead frame group that the strip was arranged to and the cutting separation of follow-up lead frame unit. Meanwhile, 24 inner pins are uniformly distributed on the periphery of the base island, and welding spots are fixedly arranged on the inner pins, so that the 24-pin chip is convenient to mount and connect with the outside; the inner pins are all fixed with the outer pins in one-to-one correspondence, the outer pins are fixed with the frame through the supporting ribs, the base island is fixed with the frame through the connecting ribs, the stability of the outer pins, the base island and the frame can be effectively improved through the supporting ribs and the connecting ribs, and the packaging of the lead frame unit is facilitated. The inner pin is also provided with a packaging hole, and packaging plastic cement passes through the packaging hole when the lead frame unit is packaged, so that the stability of the plastic package body and the lead frame unit is further improved after packaging. The base island is fixed with the chip through the conductive adhesive, and the contact area among the chip, the conductive adhesive and the base island can be effectively increased by the groove points arranged on the upper end face of the base island, so that the fixing reliability of the chip and the base island is increased. Meanwhile, the arrangement of the first cutting hole and the second cutting hole can effectively increase the convenience of cutting and separating the lead frame unit.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural diagram of a lead frame assembly according to the present invention;
fig. 3 is a schematic structural diagram of the lead frame unit of the present invention;
FIG. 4 is a schematic diagram of the position of a slot on a base island according to the present invention;
fig. 5 is an enlarged schematic view of a portion a in fig. 2.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments.
The utility model provides a small-size appearance encapsulation integrated circuit lead frame, includes frame 1 and 32 lead frame units 3, 32 lead frame units 3 all fix in frame 1, promptly 34 lead frame units constitute lead frame group 2 for a set of, all be provided with second cutting hole 14 between two adjacent lead frame units 3 in the lead frame group 2. Meanwhile, 8 groups of lead frame groups 2 are uniformly arranged along the length direction of the frame 1, and a first cutting hole 13 is formed between every two adjacent lead frame groups 2.
The lead frame unit 3 comprises inner pins 4 and a base island 5, wherein 24 inner pins 4 are uniformly distributed on the periphery of the base island 5, welding spots 9 are fixedly arranged on the inner pins 4, and the chip pins and the inner pins 4 can be electrically connected through the welding spots 9. The inner pins 4 are all fixed with outer pins 6 which correspond one to one, the outer pins 6 are fixed with the frame 1 through support ribs 7, the base island 5 is fixed with the frame 1 through connecting ribs 8, the inner pins 4 are all provided with packaging holes 10, and the diameters of the packaging holes 10 are 0.3 mm-0.5 mm; the base island 5 is provided with 25 groove points 11 which are distributed uniformly, and the groove points 11 are conical grooves. The length of the frame 1 is 213.36mm, and the width is 58.42 mm. Wherein 25 groove points 11 are uniformly distributed in a square shape, the distance between two adjacent groove points 11 is 0.508mm, and the depth of each groove point 11 is 0.01-0.038 mm. The upper end surface of the groove point 11 is square.
Both ends of the frame 1 are provided with packaging corners 12, the packaging corners 12 are chamfers of the frame 1, and the chamfers are 30 degrees; the frame 1 can be effectively made to slide into the packaging machine or the cutting machine through the arranged chamfer, so that the deformation and scrapping of the lead frame caused by the interference of the frame 1 and the packaging machine or the cutting machine are avoided, and the enterprise cost is saved.
Meanwhile, positioning holes 15 are formed in the two sides of the frame 1, and the positioning holes 15 correspond to the middle of the lead frame group 2; the accurate positioning of the frame 1 can be realized through the arrangement of the positioning holes 15, so that the cutting of the lead frame is facilitated.
In the chip mounting process, the connection between the chip and the inner pin 4 is realized through the matching of the welding spot 9 or the connecting line on the inner pin 4, and meanwhile, the arrangement of the packaging hole 10 increases the fixity between the lead frame unit 3 and the plastic package body when the chip is packaged. The base island 5 is fixed with the chip through the conductive adhesive, and the groove points 11 arranged on the upper end face of the base island 5 can effectively increase the contact area among the chip, the conductive adhesive and the base island 5, and increase the reliability of fixing the chip and the base island 5.
The above-described embodiments are only preferred embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several changes and modifications can be made, which are within the scope of the present invention.
Claims (7)
1. The utility model provides a little appearance encapsulation integrated circuit lead frame, includes frame and a plurality of lead frame unit, and a plurality of lead frame unit are all fixed in the frame, its characterized in that, 4 lead frame unit constitute lead frame group for a set of, evenly be provided with multiunit lead frame group along the length direction of frame, the lead frame unit include inner pin and base island, the peripheral evenly distributed of base island have 24 inner pins, inner pin on the fixed solder joint that is provided with, inner pin all be fixed with the outer pin of one-to-one, outer pin pass through brace rod and frame and fix mutually, the base island pass through the splice rod and frame and fix mutually, inner pin on still seted up the encapsulation hole, the base island on seted up a plurality of groove points that all have the distribution, the both ends of frame all be provided with the encapsulation angle.
2. The small outline package integrated circuit lead frame according to claim 1, wherein the frame has 8 lead frame groups along the length thereof, and the lead frame groups have first cut holes formed therebetween.
3. The small outline package integrated circuit lead frame according to claim 1, wherein a second cut hole is formed between each two adjacent lead frame units in the lead frame group.
4. The small outline package integrated circuit lead frame according to claim 2, wherein the frame has positioning holes on both sides thereof, the positioning holes corresponding to the middle of the lead frame assembly.
5. The small outline package integrated circuit lead frame of claim 1, wherein the notch is a tapered notch.
6. The small outline package integrated circuit lead frame as defined in claim 5, wherein the depth of the notch is 0.01mm to 0.038 mm.
7. The small outline package integrated circuit lead frame as defined in claim 1, wherein the package hole has a diameter of 0.3mm to 0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020912524.9U CN212303658U (en) | 2020-05-26 | 2020-05-26 | Small-outline package integrated circuit lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020912524.9U CN212303658U (en) | 2020-05-26 | 2020-05-26 | Small-outline package integrated circuit lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212303658U true CN212303658U (en) | 2021-01-05 |
Family
ID=73970760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020912524.9U Expired - Fee Related CN212303658U (en) | 2020-05-26 | 2020-05-26 | Small-outline package integrated circuit lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212303658U (en) |
-
2020
- 2020-05-26 CN CN202020912524.9U patent/CN212303658U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210105 |