CN212303646U - Fingerprint identification module and terminal equipment - Google Patents
Fingerprint identification module and terminal equipment Download PDFInfo
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- CN212303646U CN212303646U CN202021869297.2U CN202021869297U CN212303646U CN 212303646 U CN212303646 U CN 212303646U CN 202021869297 U CN202021869297 U CN 202021869297U CN 212303646 U CN212303646 U CN 212303646U
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Abstract
本实用新型提供一种指纹识别模组和终端设备，所述指纹识别模组包括电路板、指纹芯片和封装结构，所述电路板与所述指纹芯片电性连接，所述封装结构用于对所述指纹芯片进行封装；所述封装结构具有背向所述指纹芯片的弧形面。由于封装结构具有背向指纹芯片的弧形面，从而使指纹识别模组具有弧形的外观面，有利于改善操作手感；此外，当指纹识别模组应用于终端设备时，在设备主体上直接开设收容腔，即可放置指纹识别模组，加工工艺简单，易于实现。
The utility model provides a fingerprint identification module and a terminal device. The fingerprint identification module includes a circuit board, a fingerprint chip and an encapsulation structure. The circuit board is electrically connected to the fingerprint chip, and the encapsulation structure is used for The fingerprint chip is packaged; the package structure has an arc surface facing away from the fingerprint chip. Since the package structure has an arc surface facing away from the fingerprint chip, the fingerprint identification module has an arc-shaped appearance surface, which is beneficial to improve the operating feel; in addition, when the fingerprint identification module is applied to a terminal device, it is The fingerprint identification module can be placed by opening the receiving cavity, and the processing technology is simple and easy to realize.
Description
Technical Field
The utility model relates to an electronic equipment field especially relates to a fingerprint identification module and terminal equipment.
Background
Fingerprint identification technology has been widely applied to terminal equipment such as mobile phones and tablet computers, and specific schemes include a capacitance fingerprint scheme, a side fingerprint scheme, an optical fingerprint scheme and the like. Use the side fingerprint scheme of cell-phone as an example, the fingerprint identification module sets up in the side of cell-phone usually, and the user when holding the cell-phone, but the surface of finger direct contact fingerprint identification module carries out the fingerprint operation, for example fingerprint unblock, fingerprint payment etc..
SUMMERY OF THE UTILITY MODEL
For solving at least one among the above-mentioned technical problem, the utility model provides a fingerprint identification module and terminal equipment.
Specifically, the utility model provides a fingerprint identification module, the fingerprint identification module includes circuit board, fingerprint chip and packaging structure, the circuit board with the fingerprint chip electric connection, packaging structure is used for encapsulating the fingerprint chip; the packaging structure is provided with an arc-shaped surface back to the fingerprint chip.
Further, the packaging structure comprises a side face connected with the arc-shaped face, the arc-shaped face comprises a first arc-shaped face and a second arc-shaped face, the curvature radii of the first arc-shaped face and the second arc-shaped face are different, and the second arc-shaped face is connected with the side face and the first arc-shaped face.
Furthermore, the curvature radius of the first arc-shaped surface is larger than that of the second arc-shaped surface, and the central angle corresponding to the first arc-shaped surface is smaller than that corresponding to the second arc-shaped surface.
Further, the fingerprint identification module still includes: the fingerprint chip packaging structure comprises an electric connecting element and a reinforcing structure, wherein the electric connecting element is electrically connected with the fingerprint chip through the circuit board, and the reinforcing structure supports the circuit board, the fingerprint chip, the packaging structure and the electric connecting element.
On the other hand, the utility model provides a terminal equipment still, terminal equipment includes the equipment main part and as before fingerprint identification module, the equipment main part has and is curved outer profile face and runs through the chamber of acceping of outer profile face, fingerprint identification module at least part is located accept the intracavity, the arcwall face dorsad the equipment main part.
Further, the fingerprint identification module has and is on a parallel with the circuit board and is located the first tangent plane in the equipment main part outside, first tangent plane with the minimum distance of outer profile face is 0.15 ~ 0.3 mm.
Further, the equipment main part includes first button, first button set up in accept the intracavity and with fingerprint identification module butt.
Furthermore, the device main body further comprises a second key, at least part of the second key protrudes out of the device main body, the second key is provided with a second tangent plane which is parallel to the circuit board and located on the outer side of the device main body, the first tangent plane is located between the second tangent plane and the outer contour plane, and the minimum distance between the second tangent plane and the outer contour plane is 0.4-0.6 mm.
The packaging structure is provided with the arc-shaped surface back to the fingerprint chip, so that the fingerprint identification module has an arc-shaped appearance surface, and the operation hand feeling is favorably improved; in addition, when fingerprint identification module was applied to terminal equipment, directly set up on the equipment principal and accept the chamber, can place the fingerprint identification module, processing technology is simple, easily realizes.
Drawings
Fig. 1 is a perspective view of a terminal device.
Fig. 2 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a fingerprint identification module according to another embodiment of the present invention.
Fig. 4 is a schematic perspective view of a terminal device according to an embodiment of the present invention.
Fig. 5 is an assembly diagram of the fingerprint identification module and the device body of the terminal device shown in fig. 4.
Fig. 6 is a partial schematic view of the terminal device shown in fig. 4.
Fig. 7 is a schematic structural diagram of a substrate and a plurality of fingerprint chips disposed in a mold cavity according to an embodiment of the present invention.
Fig. 8 is a schematic structural view of a substrate and a package structure molded by the mold shown in fig. 7.
Fig. 9 is a schematic structural diagram of a circuit board and a fingerprint chip disposed in a mold cavity according to another embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus consistent with certain aspects of the invention, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which the invention belongs. The use of "first," "second," and similar terms in the description and in the claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "a number" means two or more. Unless otherwise indicated, "front", "rear", "lower" and/or "upper" and the like are for convenience of description and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
Based on the background art record, utility model people discover through the research, and in the current side fingerprint scheme, the user is when carrying out the fingerprint operation, and the finger is scratched easily, and the operation is felt poorly. Specifically, referring to fig. 1, the fingerprint detection surface 30A of the fingerprint identification module 10A is a plane, and the surface of the middle frame 61A of the terminal device is an arc surface, and the arc surface of the middle frame area corresponding to the fingerprint identification module needs to be processed into the plane 610A, and an accommodating cavity is formed on the plane, so that the fingerprint identification module can be placed. Because the fingerprint detection face is the plane, and the center surface is the cambered surface, therefore produce easily during the operation and scrape the feel, and then influence user's operation feel. On the other hand, the processing technology of the accommodating cavity for accommodating the fingerprint identification module is also complex.
Referring to fig. 2, the present embodiment provides a fingerprint identification module 10, where the fingerprint identification module 10 includes a circuit board 1, a fingerprint chip 2, a package structure 3, an electrical connection element 4, and a reinforcement element 5, the circuit board 1, the fingerprint chip 2, the package structure 3, and the reinforcement element 5 are sequentially arranged in a longitudinal Y direction, and a portion of the electrical connection element 4 is located between the package structure 3 and the reinforcement element 5. The circuit board 1 comprises a first pin and a second pin (the first pin and the second pin are not shown) which are respectively connected with the fingerprint chip 2 and the electric connecting element 4, the circuit board 1 is electrically connected with the fingerprint chip 2 and the electric connecting element 4 through the first pin and the second pin respectively so as to realize the electrical connection of the first pin and the second pin, and the electric connecting element 4 is used for electrically connecting the fingerprint chip to a mainboard of the terminal equipment so as to realize data transmission; the packaging structure 3 packages the fingerprint chip 2 to prevent water and oxygen from invading the fingerprint chip; the stiffening element 5 is used to provide sufficient strength to support the circuit board 1, the fingerprint chip 2, the package structure 3 and the electrical connection element 4. In other embodiments, the fingerprint identification module may only include the circuit board 1, the fingerprint chip 2 and the package structure 3.
The circuit board 1 is loaded with a fingerprint identification circuit, and the fingerprint chip 2 can be directly welded on the fingerprint identification circuit to realize mechanical connection and electrical connection. The electrical connection element 4 may be a flexible circuit board (FPC) or a flexible cable (FFC), and the reinforcement element 5 is, for example, a steel sheet or an iron sheet.
The packaging structure 3 packages the fingerprint chip 2, and has an arc-shaped surface 30 facing away from the fingerprint chip and a side surface 33 connected to the arc-shaped surface 30. Because the packaging structure 3 is provided with the arc-shaped surface 30 which faces away from the fingerprint chip, the fingerprint identification module 10 is provided with an arc-shaped appearance surface (even if an appearance coating exists, the shape of the appearance coating is consistent with that of the arc-shaped surface 30 supporting the appearance coating), and the operation hand feeling of a user is favorably improved; in addition, directly set up in the center of equipment main part and accept the chamber and be used for placing the fingerprint identification module, processing technology is simple, easily realizes.
Optionally, the arc surface 30 includes a first arc surface 31 and a second arc surface 32 with different curvature radiuses, the second arc surface 32 is used as a chamfer surface, and the second arc surface 32 is smoothly connected with the side surface 33 and the first arc surface 31, so as to further improve the operation hand feeling of the user.
In this embodiment, the curvature radius of the first arc-shaped surface 31 is greater than the curvature radius of the second arc-shaped surface 32, and the central angle corresponding to the first arc-shaped surface 31 is smaller than the central angle corresponding to the second arc-shaped surface 32. For example, the curvature radius of the first arc-shaped surface 31 is 5-6mm, and the corresponding central angle is 30-40 degrees; the curvature radius of the second arc-shaped surface 32 is 0.1-0.2 mm, and the corresponding central angle is 45-60 degrees.
Optionally, the fingerprint identification module further includes an appearance film layer (not shown) covering the arc-shaped surface 30, and the appearance film layer is used for providing an appearance color consistent with the middle frame of the terminal device. Usually, the shape, the size of the surface of outward appearance rete with the arcwall face is unanimous, the thickness of outward appearance rete is 25 ~ 35um, and packaging structure 3's maximum thickness (being the distance of packaging structure's peak to fingerprint chip 2 in fig. 2) is 150 ~ 250 um.
Referring to fig. 3, in another embodiment, the arc surface 30 includes only the first arc surface 31 and does not include the second arc surface 32, i.e. the radius of curvature of the arc surface 30 is a constant value. The arcuate face 30 is directly connected to the side face 33. The processing process of the arc-shaped surface 30 of the embodiment is simpler and is easy to realize. The other structures in this embodiment are the same as or similar to those in the embodiment shown in fig. 2.
On the other hand, the utility model also provides a terminal equipment. Referring to fig. 4 to 6, the terminal device includes a device body 6 and a fingerprint identification module 10 according to any of the embodiments. The device main body 6 includes a middle frame 61, a display screen 62 assembled on the middle frame 61, and a first key 63, and of course, the device main body 6 further includes a main board, a processor, a memory, a communication component, a power supply component, and other components, which are not described in detail. The first key 63 is, for example, one of a power key and a volume key.
The middle frame 61 has an arc-shaped outer contour surface (i.e., a side surface or a top surface of the terminal device) 611 and an accommodating cavity 612 penetrating through the outer contour surface 611, the fingerprint identification module 10 is at least partially located in the accommodating cavity 612, the arc-shaped surface 30 faces away from the device body 6, i.e., the arc-shaped surface 30 faces the outer side of the device body 6, and an exposed surface of the fingerprint identification module 10 is an outer surface of the arc-shaped surface 30 or an outer film layer (hereinafter, referred to as an outer surface of the fingerprint identification module 10) having a shape identical to that of the arc-shaped surface 30. The first key 63 is disposed in the accommodating cavity 612 and abutted to the fingerprint identification module 10, so that a user can press the fingerprint identification module 10 to operate the first key 63.
Optionally, the device main body 6 further includes a second key 64, and the second key 64 is the other of the power key and the volume key. In this embodiment, the first key 63 is a power key, and the second key 64 is a volume key. The second key 64 is partially accommodated in another space (not shown) penetrating the outer contour surface 611 and partially protrudes from the middle frame 61, so that the user can directly operate the second key. The outer contour surface 611 and the outer surface shape of the fingerprint identification module 10 are consistent, so that the overall appearance of the terminal equipment is high in consistency, and the attractiveness is improved.
The device main body 6 further comprises a limiting bracket 65 positioned in the accommodating cavity 612, the reinforcing element 5 of the fingerprint identification module 10 is provided with a limiting clamping groove 50 matched with the limiting bracket 65, and the limiting bracket 65 is clamped in the limiting clamping groove 50, so that the fingerprint identification module 10 and the middle frame 61 (or the device main body 6) are assembled.
In this embodiment, the fingerprint identification module 10 has a first tangential plane a1 parallel to the circuit board 1 and located outside the main body 6, and the first tangential plane a1 is a tangential plane of the outer surface of the fingerprint identification module 10. The minimum distance between the first tangent plane A1 and the outer contour surface 611 is 0.15-0.3 mm, that is, the maximum size of the fingerprint identification module 10 protruding from the device body is 0.15-0.3 mm. Fingerprint identification module 10 is outstanding in equipment main part 6, is favorable to the user to realize fingerprint identification very easily and to the pressing of first button 63.
The second key 64 has a second cut surface a2 parallel to the circuit board 1 and located outside the device body 6. Optionally, the first tangent plane a1 is located between the second tangent plane a2 and the outer contour plane 611, for example, the minimum distance between the second tangent plane a2 and the outer contour plane 611 is 0.4-0.6 mm. That is to say, the first tangent plane a1 is located between the second tangent plane a2 and the outer contour surface 611, in other words, the second key 64 protrudes outward relative to the fingerprint identification module 10, and when the terminal device accidentally drops or collides with another object, the second key 64 (compared with the fingerprint identification module 10) is firstly impacted, so that the protection of the fingerprint identification module 10 with a higher price and a higher possibility of damage is facilitated, and the service life of the fingerprint identification module 10 is prolonged.
In addition, the minimum distance between the second tangent plane a2 and the outer contour surface 611 and the minimum distance between the first tangent plane a1 and the outer contour surface 611 are selected from the above ranges, so that good operation comfort is also ensured. In order to ensure good operation comfort and not affect the appearance of the terminal equipment, it is preferable that the minimum distance between the first tangent plane a1 and the outer contour plane 611 is 0.2-0.25 mm, and the minimum distance between the second tangent plane a2 and the outer contour plane 611 is 0.45-0.5 mm.
In another aspect, the present invention further provides a method for manufacturing a fingerprint identification module, for manufacturing the fingerprint identification module of any of the aforementioned embodiments. Referring to fig. 7 and 8, in the present embodiment, the manufacturing method includes:
step S11: a fingerprint chip 2 and a circuit board 1 are provided.
Step S12: assembling the fingerprint chip 2 to the circuit board 1, wherein the fingerprint chip 2 is electrically connected with the circuit board 1;
step S13: placing the fingerprint chip 2 and the circuit board 1 in a mold cavity 700, wherein the mold cavity 700 is provided with an arc surface 71 facing away from the fingerprint chip 2;
step S14: injecting a liquid encapsulating material into the mold cavity 700;
step S15: cooling treatment is carried out to enable liquid packaging materials to form a packaging structure 3, the packaging structure 3 is used for packaging the fingerprint chip 2, the packaging structure 3 is provided with an arc-shaped surface 30 consistent with the arc-shaped surface 71, and the arc-shaped surface 30 faces away from the fingerprint chip 2.
The mold cavity 700 is enclosed by a first mold 7 and a second mold 8, the plurality of arc surfaces 71 are formed on the first mold 7, the second mold 8 has a supporting surface 81 facing the arc surfaces 71, and the supporting surface 81 supports the circuit board 1 and the fingerprint chip 2. The arc surface 71 is consistent with the arc surface 30 in shape and size. The first mold 7 further has a filling opening 72 communicating with the mold cavity 700, and the liquid encapsulating material enters the mold cavity 700 from the filling opening 72.
The packaging material is epoxy resin material, for example, the heating temperature in the die cavity 700 is 175-200 ℃, and the pressure in the die cavity 700 is 3000-4000N.
Optionally, referring to fig. 7, in step S11, a plurality of fingerprint chips and a plurality of circuit boards are provided; in step S15, the process is cooled so that the liquid encapsulating material forms a plurality of connected encapsulating structures 3. Correspondingly, the manufacturing method of the fingerprint identification module further comprises the step S16: the connected plurality of packages 3 are diced to separate the plurality of packages 3. It should be noted that a plurality of circuit boards 1 may be connected or disconnected from each other. When the circuit boards 1 are connected, the circuit boards 1 connected are cut while the package structures 3 are cut, so that the circuit boards 1 are separated.
Alternatively, in step S16, the connected multiple package structures (and the connected multiple circuit boards) are cut by a numerical control machine, and the cutting blade 9 of the numerical control machine is as shown in fig. 8. Preferably, the cutting blade 9 comprises a main cutting edge 91 and a fillet cutting edge 92, and the fillet cutting edge 92 and the main cutting edge 91 are arranged along the cutting direction Y. The fillet cutting edge 92 is spaced from the central axis L of the cutting burr by a distance greater than the distance from the main cutting edge 91 to the central axis L of the cutting burr. The radius of curvature of the fillet cutting edge 92 is 0.1-0.2 mm (the radius of curvature of the second arc-shaped surface cut out correspondingly is also 0.1-0.2 mm), the circuit board 1 and the package structure 3 obtained after cutting are as shown in fig. 2, and the bridge structure connecting the two package structures 3 is cut off in the cutting process. When the dicing blade 9 does not include the fillet cutting edge 92, the circuit board 1 and the package structure 3 obtained after dicing are as shown in fig. 3. In other embodiments, the substrate and the package structure may also be cut by using a laser, and the circuit board 1 and the package structure 3 obtained by cutting are shown in fig. 3.
When the fingerprint identification module only comprises the circuit board 1, the fingerprint chip 2 and the packaging structure 3, the manufacturing is finished after the step S15; when the fingerprint identification module further includes an electrical connection element 4 and a reinforcement element 5, the manufacturing method further includes soldering the electrical connection element 4 (e.g., a flexible circuit board) to the circuit board 1 by a SMT (surface mount technology) surface mounting process, and assembling the reinforcement element, for example, by a snap-fit method. When the fingerprint recognition module further includes an appearance film layer, a material with a color consistent with the appearance color of the terminal device may be sprayed on the package structure 3, and this step may be performed after step S15 and before step S16, or may be performed after step S16.
Referring to fig. 9, in another embodiment, in step S11, a single fingerprint chip 2 and a single circuit board 1 are provided, that is, the fingerprint chip 2 is separately assembled and packaged, so that step S16 is not required, which is beneficial to omitting the cutting step and simplifying the manufacturing process.
The packaging structure is provided with the arc-shaped surface back to the fingerprint chip, so that the fingerprint identification module has an arc-shaped appearance surface, and the operation hand feeling is favorably improved; in addition, when fingerprint identification module was applied to terminal equipment, directly set up on the equipment principal and accept the chamber, can place the fingerprint identification module, processing technology is simple, easily realizes.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and although the present invention has been disclosed in the above description in terms of preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can make modifications or changes to equivalent embodiments by using the above disclosed technical contents without departing from the scope of the present invention.
Claims (8)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021869297.2U CN212303646U (en) | 2020-08-31 | 2020-08-31 | Fingerprint identification module and terminal equipment |
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| CN202021869297.2U CN212303646U (en) | 2020-08-31 | 2020-08-31 | Fingerprint identification module and terminal equipment |
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| CN212303646U true CN212303646U (en) | 2021-01-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114121689A (en) * | 2020-08-31 | 2022-03-01 | 北京小米移动软件有限公司 | Fingerprint identification module, terminal equipment and manufacturing method of fingerprint identification module |
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- 2020-08-31 CN CN202021869297.2U patent/CN212303646U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114121689A (en) * | 2020-08-31 | 2022-03-01 | 北京小米移动软件有限公司 | Fingerprint identification module, terminal equipment and manufacturing method of fingerprint identification module |
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