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CN212009537U - Touch screen, touch display screen and intelligent terminal - Google Patents

Touch screen, touch display screen and intelligent terminal Download PDF

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Publication number
CN212009537U
CN212009537U CN202020630688.2U CN202020630688U CN212009537U CN 212009537 U CN212009537 U CN 212009537U CN 202020630688 U CN202020630688 U CN 202020630688U CN 212009537 U CN212009537 U CN 212009537U
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CN
China
Prior art keywords
touch
conductive
insulating film
notch
substrate
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Expired - Fee Related
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CN202020630688.2U
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Chinese (zh)
Inventor
李艳强
许建勇
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Nanchang OFilm Display Technology Co Ltd
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Nanchang OFilm Display Technology Co Ltd
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Priority to CN202020630688.2U priority Critical patent/CN212009537U/en
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Abstract

The utility model relates to a touch screen, a touch display screen and an intelligent terminal, wherein the touch screen comprises a substrate, a touch area and a non-touch area positioned at the periphery of the touch area; the conducting layer comprises a touch pattern and a lead pattern electrically connected with the touch pattern, the touch pattern is arranged in the touch area, the lead pattern is arranged in the non-touch area, the lead pattern forms a binding part at the edge of the substrate, and the binding part comprises a plurality of wiring contacts arranged at intervals; the insulating layer is arranged on the substrate, and a notch exposing the binding part is formed at the edge of the insulating layer; the flexible circuit board is provided with golden fingers, the golden fingers comprise conductive contacts which are equal in number and correspond to the wiring contacts one by one, and the golden fingers are connected with the insulating layer and cover the binding part; and the conductive adhesive is arranged between the binding part and the golden finger so as to electrically connect the wiring contact and the conductive contact, and the conductive adhesive extends to a position between the golden finger and the insulating layer from the notch. The utility model discloses avoided binding the portion by the risk of oxidation and golden finger by the fracturing, and can realize narrow frame.

Description

Touch screen, touch display screen and intelligent terminal
Technical Field
The utility model relates to a touch-control field especially relates to a touch screen, touch-control display screen and intelligent terminal.
Background
The touch screen of intelligent terminals such as cell-phones, panel computer establishes the base plate and the insulating layer of laminating including folding, the insulating layer forms the window district at the edge of base plate, the base plate has touch-control district and the non-touch-control district that is located touch-control district periphery, the touch-control district is provided with the touch-control pattern, the non-touch-control district is provided with the lead wire pattern, the lead wire pattern forms electric connection with the touch-control pattern, the lead wire pattern has the portion of binding that is located the base plate edge and exposes the window district, bind the portion can and flexible circuit board electric connection, in order to receive and transmit the touch-control signal that comes from the touch-. However, when the gold finger of the flexible circuit board is bonded to the bonding portion by hot pressing, the ACF (anisotropic conductive adhesive) is disposed in the window area, and at this time, the gold finger of the flexible circuit board has a defect of fracturing the gold finger due to contact with the insulating layer, or the bonding portion is not completely covered by the flexible circuit board, so that the PAD oxidation problem occurs.
SUMMERY OF THE UTILITY MODEL
Based on this, it is necessary to provide a touch screen, a touch display screen including the touch screen, and an intelligent terminal including the touch display screen, for a problem that a gold finger of a flexible circuit board has a defect of contacting with an insulating layer to crack the gold finger, or a binding portion is not completely covered by the flexible circuit board to cause PAD oxidation.
A touch screen, comprising:
the substrate is provided with a touch area and a non-touch area positioned on the periphery of the touch area;
the conducting layer comprises a touch pattern and a lead pattern electrically connected with the touch pattern, the touch pattern is arranged in the touch area, the lead pattern is arranged in the non-touch area, the lead pattern forms a binding part at the edge of the substrate, and the binding part comprises a plurality of wiring contacts arranged at intervals;
the insulating layer is arranged on the substrate and covers the conducting layer, and a notch exposing the binding part is formed at the edge of the insulating layer;
the flexible circuit board is provided with golden fingers, the golden fingers comprise conductive contacts which are equal in number and correspond to the wiring contacts one by one, the golden fingers cover the binding parts, and the golden fingers extend towards the direction of the touch area to be opposite to the insulating layer; and
the conducting resin is arranged between the binding part and the golden finger to electrically connect the wiring contact with the conducting contact, and the conducting resin extends to the golden finger from the notch and the insulating layer.
Above-mentioned touch-control screen, golden finger cover binding portion, and the conducting resin is filled in the golden finger and is bound the clearance between the portion, has avoided binding portion's partial structure to expose by the breach and the problem of oxidation appears, has improved touch-control screen's life. In addition, locate between binding portion and golden finger at the conducting resin to under the prerequisite of electric connection wiring contact and conductive contact, the golden finger of flexible circuit board still is connected with the insulating layer, and the conducting resin extends to between golden finger and the insulating layer by the breach, so set up, the conducting resin between golden finger and the insulating layer can cushion the golden finger with bind the hot pressing impact of portion when binding, thereby avoid the golden finger by the risk of fracturing. In addition, under the condition, the contact area between the golden finger of the flexible circuit board and the conductive adhesive is increased, so that the binding strength of the flexible circuit board is enhanced, the size of the notch can be smaller on the premise of ensuring the binding strength, and the occupied space of the non-touch area of the substrate is reduced, so that the frame of the touch screen can be narrower.
In one embodiment, the lead patterns include a driving route and a sensing route, the touch pattern includes a driving electrode pattern and a sensing electrode pattern, the driving electrode pattern is electrically connected with the driving route and forms a first conductive layer, and the sensing electrode pattern is electrically connected with the sensing route and forms a second conductive layer; the binding portion includes a first portion formed at the driving route and a second portion formed at the sensing route, both the first portion and the second portion including a plurality of wiring contacts; the golden fingers comprise first golden fingers and second golden fingers, the conductive adhesive comprises first conductive adhesive and second conductive adhesive, the first conductive adhesive is arranged between the first part and the first golden fingers, and the first conductive adhesive extends from the gaps to the positions between the first golden fingers and the insulating layer; the second conductive adhesive is arranged between the second part and the second golden finger, and the second conductive adhesive extends from the notch to a position between the second golden finger and the insulating layer. Therefore, the driving electrode patterns and the sensing electrode patterns can form capacitive coupling, and when a user finger presses the touch screen, a touch effect can be achieved.
In one embodiment, the first conductive layer and the second conductive layer are sequentially stacked on the same side of the substrate, the insulating layer includes a first insulating film, the notch includes a first notch formed at an edge of the first insulating film, and the binding portion is exposed to the first notch.
In one embodiment, the first insulating film has a thickness value of 6nm to 10nm, and the first conductive paste and the second conductive paste have a thickness value of 14nm to 18 nm. So, the thickness of this range value can guarantee to cushion the hot pressing impact of golden finger when binding with binding portion, avoids the risk that the golden finger is fractured.
In one embodiment, the first gold finger and the second gold finger are located on the same side of the flexible circuit board and at the edge of the flexible circuit board and are arranged at intervals. So, can reduce the quantity of conducting resin, and can avoid when the pressfitting first conducting resin and second conducting resin to spread each other and link together, and then lead to the first part of binding department and the second part of binding department to appear the short circuit phenomenon.
In one embodiment, the first insulating film has a first side surface, a second side surface and a third side surface, and the first side surface, the second side surface and the third side surface are sequentially connected to form the first notch; the wiring contact is exposed out of the first notch from the side where the second side face is located, and the conductive contact extends to the side, back to the substrate, of the first insulating film from the side where the second side face is located and is connected with the first insulating film through the conductive adhesive. Therefore, compared with the situation that the wiring contact is exposed out of the first notch from the first side face or the second side face, the size of the first notch can be reduced, and then the narrow frame of the touch screen is achieved.
In one embodiment, the base plate has a first side edge, the binding portion is located at the first side edge, the second side edge is parallel to the first side edge, and the extending direction of the wiring contacts and the extending direction of the conductive contacts are perpendicular to the first side edge. So, reduce the breach size, realize narrow frame.
In one embodiment, the first conductive layer and the second conductive layer are disposed on opposite sides of the substrate, the insulating layer includes a first insulating film and a second insulating film, the first insulating film is disposed on a side where the first conductive layer is disposed, and the second insulating film is disposed on a side where the second conductive layer is disposed; the notch includes a first notch formed at an edge of the first insulating film to expose the first portion and a second notch formed at an edge of the second insulating film to expose the second portion; the first conductive adhesive extends from the first gap to a position between the first golden finger and the first insulating film, and the second conductive adhesive extends from the second gap to a position between the second golden finger and the second insulating film. In this way, the double-sided binding can avoid interference between the first part and the second part.
A touch display screen, comprising:
the touch screen; and
and the display screen is connected with the touch screen.
So, the golden finger covers binding portion, and the conducting resin is filled in the golden finger and is bound the clearance between the portion, has avoided binding portion's partial structure to expose by the breach and the problem of oxidation appears, has improved touch screen's life. In addition, locate between binding portion and golden finger at the conducting resin to under the prerequisite of electric connection wiring contact and conductive contact, the golden finger of flexible circuit board still is connected with the insulating layer, and the conducting resin extends to between golden finger and the insulating layer by the breach, so set up, the conducting resin between golden finger and the insulating layer can cushion the golden finger with bind the hot pressing impact of portion when binding, thereby avoid the golden finger by the risk of fracturing. In addition, under the condition, the contact area between the golden finger of the flexible circuit board and the conductive adhesive is increased, so that the binding strength of the flexible circuit board is enhanced, the size of the notch can be smaller on the premise of ensuring the binding strength, and the occupied space of the non-touch area of the substrate is reduced, so that the frame of the touch screen can be narrower.
An intelligent terminal, comprising:
a main board; and
in the touch display screen, the flexible circuit board is provided with a conductive part electrically connected with the golden finger, and the conductive part is electrically connected with the main board.
So, the golden finger covers binding portion, and the conducting resin is filled in the golden finger and is bound the clearance between the portion, has avoided binding portion's partial structure to expose by the breach and the problem of oxidation appears, has improved touch screen's life. In addition, locate between binding portion and golden finger at the conducting resin to under the prerequisite of electric connection wiring contact and conductive contact, the golden finger of flexible circuit board still is connected with the insulating layer, and the conducting resin extends to between golden finger and the insulating layer by the breach, so set up, the conducting resin between golden finger and the insulating layer can cushion the golden finger with bind the hot pressing impact of portion when binding, thereby avoid the golden finger by the risk of fracturing. In addition, under the condition, the contact area between the golden finger of the flexible circuit board and the conductive adhesive is increased, so that the binding strength of the flexible circuit board is enhanced, the size of the notch can be smaller on the premise of ensuring the binding strength, and the occupied space of the non-touch area of the substrate is reduced, so that the frame of the touch screen can be narrower.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an intelligent terminal according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the touch display screen shown in FIG. 1;
FIG. 3 is a schematic structural diagram of the touch screen of FIG. 2 including a substrate and a conductive layer;
FIG. 4 is a schematic structural diagram of the touch screen shown in FIG. 3 including an insulating layer;
FIG. 5 is a schematic structural diagram of the flexible circuit board in FIG. 2;
fig. 6 is a schematic structural diagram of the flexible circuit board in fig. 5 being bound with the binding portion in fig. 4;
FIG. 7 is a partial sectional view taken along section line II-II in FIG. 6.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be embodied in many different forms other than those specifically described herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention, and it is therefore not to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the present application will describe a smart terminal 10 by taking a smart phone as an example. Those skilled in the art will readily understand that the smart terminal 10 of the present application may be any device having communication and storage functions, such as an electronic device, such as a smart phone, a tablet computer, a notebook computer, a mobile phone, a video phone, a digital still camera, an electronic book reader, a Portable Multimedia Player (PMP), a mobile medical device, etc., and the representation of the smart terminal 10 is not limited herein. Of course, wearable devices such as smartwatches are also applicable to the smart terminal 10 according to the embodiments of the present application.
The intelligent terminal 10 includes a terminal body 11 and a touch display screen 12 disposed on the terminal body 11. In an embodiment, the terminal body 11 includes a middle frame 13 and a rear cover 14, the middle frame 13 and the rear cover 14 may be integrally formed or detachably connected, the rear cover 14 and the touch display screen 12 are respectively connected to two opposite sides of the middle frame 13 and enclose an accommodation space, and devices such as a main board, a memory, and a power supply of the intelligent terminal 10 are disposed in the accommodation space. The side of the touch display screen 12 facing away from the rear cover 14 has a displayable region 121 for displaying image information.
In one embodiment, referring to fig. 2 and 3, the touch display screen 12 includes a touch screen 100 and a display screen 200. The display screen 200 is connected to the touch screen 100 and is used for displaying image information, a conductive layer 120 is disposed in the touch screen 100, and the conductive layer 120 is used for electrically connecting to a main board in the intelligent terminal 10 through the flexible circuit board 140, so that when a user touches the touch screen 100, the conductive layer 120 can be triggered to generate a touch signal, and further, the content indicated by the touch signal is displayed through the display screen 200.
It should be noted that the Display 200 may adopt an LCD (Liquid Crystal Display) screen for displaying information, and the LCD screen may be a TFT (Thin Film Transistor) screen, an IPS (In-Plane Switching) screen, or an SLCD (split Liquid Crystal Display) screen. The display panel 200 may also adopt an OLED (Organic Light-Emitting Diode) panel for displaying information, and the OLED panel may be an AMOLED (Active Matrix Organic Light-Emitting Diode) panel or a Super AMOLED (Super Active Matrix Organic Light-Emitting Diode) panel or a Super AMOLED Plus (Super Active Matrix Organic Light-Emitting Diode Plus) panel, which will not be described herein again.
In one embodiment, referring to fig. 3 and 4, the touch screen 100 includes a substrate 110, a conductive layer 120, an insulating layer 130, and a flexible circuit board 140. The substrate 110 is a carrier of the conductive layer 120, and the substrate 110 has a touch region 111 and a non-touch region 112 located at the periphery of the touch region 111. In one embodiment, the non-touch area 112 is disposed around the touch area 111. Of course, the non-touch areas 112 can also be located on two opposite sides of the touch area 111. The substrate 110 may be a polyethylene terephthalate (PET) film, a Polycarbonate (PC) film, a Cyclic Olefin Polymer (COP) film, a polyvinyl chloride (PVC) film, a Cyclic Olefin Copolymer (COC) film, or the like, but is not limited thereto. In one embodiment, the substrate 110 is a Polyimide (PI) film, particularly a Colorless Polyimide (CPI) film, which has good bending resistance and insulation properties.
The conductive layer 120 is used for generating a touch signal in the touch area 111 and outputting the touch signal to the outside through the non-touch area 112, for example, the conductive layer 120 is electrically connected to a main board in the smart terminal 10 through the flexible circuit board 140. The conductive layer 120 includes a touch pattern 121 formed in the touch area 111 and a lead pattern 122 formed in the non-touch area 112, and the lead pattern 122 is electrically connected to the touch pattern 121. In an embodiment, the lead pattern 122 forms the binding portion 123 at the edge of the substrate 110, and the binding portion 123 includes a plurality of wiring contacts 1231 arranged at intervals, for example, the plurality of wiring contacts 1231 may be arranged at intervals along the direction of the edge of the substrate 110, and the direction of the edge of the substrate 110 may be, for example, a straight line or a curved line, which is not limited herein.
In one embodiment, the lead pattern 122 includes a driving trace 122a and a sensing trace 122b, the touch pattern 121 includes a driving electrode pattern 121a and a sensing electrode pattern 121b, the driving electrode pattern 121a is electrically connected to the driving trace 122a and forms a first conductive layer, and the sensing electrode pattern 121b is electrically connected to the sensing trace 122b and forms a second conductive layer. At this time, the binding portion 123 includes a first portion 123a formed on the driving route 122a and a second portion 123b formed on the sensing route 122b, and each of the first portion 123a and the second portion 123b includes a plurality of wire contacts 1231. In the drawings, the first conductive layer and the second conductive layer are sequentially stacked on the same side of the substrate 110. It is understood that in other embodiments (not shown), the first conductive layer and the second conductive layer can be disposed on opposite sides of the substrate 110.
The material of the touch pattern 121 includes any one of the following materials: indium tin oxide, zinc tin oxide, indium zinc oxide, metal mesh, conductive metal nanowire, carbon nanotube, graphene, or organic transparent conductive material. The shape of the touch pattern 121 may be selected as a square, a rectangle, a diamond, a circle, an ellipse, a polygon, or the like, as needed. In an embodiment, the Conductive layer 120 includes a transferable Transparent Conductive Film (TCTF), and the touch pattern 121 is a pattern obtained by patterning the transferable Transparent Conductive Film. The transferable transparent conductive film has adhesiveness, so that the transferable transparent conductive film can be directly attached to the substrate 110 without an additional adhesive layer, and the transferable transparent conductive film further comprises a photosensitive material, and the touch pattern 121 (such as a nano silver wire or a nano silver screen) can be formed by exposure and development, so that an additional photoresist material is not needed. The lead pattern 122 may be a silver nanowire obtained by printing, sensitization or laser.
The insulating layer 130 is disposed on the substrate 110 to effectively prevent the conductive layer 120 from being scratched by a foreign object, the insulating layer 130 covers the conductive layer 120, and a notch 131 exposing the binding portion 123 is formed at an edge of the insulating layer 130, so that the binding portion 123 can be bound and connected with the flexible circuit board 140. In an embodiment, the first conductive layer and the second conductive layer are sequentially stacked on the same side of the substrate 110, where the insulating layer 130 includes a first insulating film 130a, the notch 131 includes a first notch 131a formed on an edge of the first insulating film 130a, and the binding portion 123 is exposed out of the first notch 131 a. It is understood that, in other embodiments, when the first conductive layer and the second conductive layer are disposed on opposite sides of the substrate 110, the insulating layer 130 includes a first insulating film 130a and a second insulating film (not shown), the first insulating film 130a is disposed on the first conductive layer side, and the second insulating film is disposed on the second conductive layer side. At this time, the notch 131 includes a first notch 131a formed at an edge of the first insulating film 130a to expose the first portion 123a and a second notch (not shown) formed at an edge of the second insulating film to expose the second portion 123 b.
Referring to fig. 5, the flexible circuit board 140 has a gold finger 141 and a conductive portion 142, the gold finger 141 includes conductive contacts 1411 corresponding to the connection contacts 1231 in number and one to one, the gold finger 141 covers the bonding portion 123, and the gold finger 141 extends toward the touch region 111 to be opposite to the insulating layer 130. The conductive part 142 is electrically connected to the gold finger 141, and the conductive part 142 is further used for electrically connecting to a motherboard inside the intelligent terminal 10. In an embodiment, referring to fig. 6 and 7, the touch screen 100 further includes a conductive adhesive 150, the conductive adhesive 150 may be an anisotropic conductive adhesive, the conductive adhesive 150 is disposed between the binding portion 123 and the gold finger 141 to electrically connect the wire contact 1231 and the conductive contact 1411, and the conductive adhesive 150 extends from the gap 131 to between the gold finger 141 and the insulating layer 130. In one embodiment, the gold finger 141 includes a first gold finger 141a and a second gold finger 141b, the conductive paste 150 includes a first conductive paste 151 and a second conductive paste (not shown), the first conductive paste 151 is disposed between the first portion 123a and the first gold finger 141a, and the first conductive paste 151 extends from the gap 131 to between the first gold finger 141a and the insulating layer 130. The second conductive paste is disposed between the second portion 123b and the second gold finger 141b, and extends from the gap 131 to a position between the second gold finger 141b and the insulating layer 130.
When the first conductive layer and the second conductive layer are sequentially stacked on the same side of the substrate 110, the first conductive paste 151 extends from the first gap 131a to between the first gold finger 141a and the first insulating film 130a, and the second conductive paste extends from the first gap 131a to between the second gold finger 141b and the first insulating film 130 a. When the first conductive layer and the second conductive layer are disposed on opposite sides of the substrate 110, the first conductive paste 151 extends from the first gap 131a to between the first gold finger 141a and the first insulating film 130a, and the second conductive paste extends from the second gap to between the second gold finger 141b and the second insulating film, at this time, the first gold finger 141a and the second gold finger 141b are disposed on opposite sides of the substrate 110 and are disposed opposite to each other.
In the application, the gold finger 141 covers the binding portion 123, and the conductive adhesive 150 is filled in the gap between the gold finger 141 and the binding portion 123, so that the problem that part of the structure of the binding portion 123 is exposed from the notch 131 and oxidized is solved, and the service life of the touch screen 100 is prolonged. In addition, on the premise that the conductive adhesive 150 is disposed between the binding portion 123 and the gold finger 141 to electrically connect the wiring contact 1231 and the conductive contact 1411, the gold finger 141 of the flexible circuit board 140 is further connected to the insulating layer 130, and the conductive adhesive 150 extends from the notch 131 to between the gold finger 141 and the insulating layer 130, so that the conductive adhesive 150 between the gold finger 141 and the insulating layer 130 can buffer the thermal compression impact of the gold finger 141 when bound with the binding portion 123, thereby avoiding the risk of fracturing the gold finger 141. Referring to fig. 7, when a specific hot pressing process is performed, the cutting head 20 is used to hot press the region where the gold finger 141 of the flexible circuit board 140 is located, the cutting head 20 may form an avoiding groove 21 (i.e., a step is formed) in the region where the alignment gold finger 141 is connected to the insulating layer 130, the avoiding groove 21 ensures that the cutting head 20 is not in direct contact with the region (i.e., the region where the gold finger 141 is opposite to the insulating layer 130), the risk of fracturing caused by excessive pressure in the region where the gold finger 141 is opposite to the insulating layer 130 is avoided, and the conductive adhesive 150 may be smoothly heated and cured. Moreover, since the contact area between the gold finger 141 of the flexible circuit board 140 and the conductive adhesive 150 is increased, so that the binding strength of the flexible circuit board 140 is enhanced, the size of the notch 131 can be made smaller on the premise of ensuring the binding strength, which is equivalent to the space occupied by the non-touch area 112 of the substrate 110 being reduced, so that the frame of the touch screen 100 can be made narrower.
In one embodiment, the thickness of the first insulating film 130a and the second insulating film has a value of 6nm to 10nm, for example, the thickness of the first insulating film 130a and the second insulating film has a value of 8 nm. The thickness of the first conductive paste 151 and the second conductive paste is 14nm to 18nm, for example, the thickness of the first conductive paste 151 and the second conductive paste is 16 nm. Thus, the thickness of the range value can ensure that the hot pressing impact of the gold finger 141 when being bound with the binding part 123 is buffered, and the risk of being fractured is avoided.
In an embodiment, referring to fig. 4, taking the example that the first conductive layer and the second conductive layer are formed on the same side of the substrate 110 as an example, the first insulating film 130a has a first side surface 1301, a second side surface 1302 and a third side surface 1303, and the first side surface 1301, the second side surface 1302 and the third side surface 1303 are sequentially connected to form the first notch 131 a. The wire contact 1231 is exposed out of the first notch 131a from the side of the second side 1302, and the conductive contact 1411 of the gold finger 141 extends from the side of the second side 1302 to the side of the first insulating film 130a opposite to the substrate 110 and is connected to the first insulating film 130a through the conductive adhesive 150. Thus, compared with the wire contact 1231 exposed from the first side 1301 or the third side 1303 to the first notch 131a, the size of the first notch 131a can be reduced, and thus a narrow frame of the touch screen 100 is realized. Of course, when the first conductive layer and the second conductive layer are formed on opposite sides of the substrate 110, the second notch and the conductive contact 1411 exposed out of the second notch may have the same structure as the first notch 131a, and will not be described herein again.
In one embodiment, with reference to fig. 3 and 4, the substrate 110 has a first side 1101, the binding portion 123 is located on the first side 1101, the second side 1302 is parallel to the first side 1101, and the extension direction of the wire contact 1231 and the extension direction of the conductive contact 1411 are perpendicular to the first side 1101. Fig. 3 illustrates that the substrate 110 has a second side 1102 disposed opposite the first side 1101, the substrate 110 being generally rectangular in shape. The positional relationship between the first side 1101 and the second side 1102 and the shape of the substrate 110 are not limited.
In an embodiment, referring to fig. 5, the first gold finger 141a and the second gold finger 141b are located on the same side of the flexible circuit board 140 and at the edge of the flexible circuit board 140 and are spaced apart from each other. In this way, when the gold finger 141 is bound to the binding part 123, the amount of the conductive adhesive 150 can be reduced, and a phenomenon that the first conductive adhesive 151 and the second conductive adhesive are spread and connected to each other when the gold finger is pressed, and thus the first part 123a of the binding part 123 and the second part 123b of the binding part 123 are short-circuited can be prevented.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A touch screen, comprising:
the substrate is provided with a touch area and a non-touch area positioned on the periphery of the touch area;
the conducting layer comprises a touch pattern and a lead pattern electrically connected with the touch pattern, the touch pattern is arranged in the touch area, the lead pattern is arranged in the non-touch area, the lead pattern forms a binding part at the edge of the substrate, and the binding part comprises a plurality of wiring contacts arranged at intervals;
the insulating layer is arranged on the substrate and covers the conducting layer, and a notch exposing the binding part is formed at the edge of the insulating layer;
the flexible circuit board is provided with golden fingers, the golden fingers comprise conductive contacts which are equal in number and correspond to the wiring contacts one by one, the golden fingers cover the binding parts, and the golden fingers extend towards the direction of the touch area to be opposite to the insulating layer; and
the conducting resin is arranged between the binding part and the golden finger to electrically connect the wiring contact with the conducting contact, and the conducting resin extends to the golden finger from the notch and the insulating layer.
2. The touch screen of claim 1, wherein the lead patterns comprise driving traces and sensing traces, the touch patterns comprise driving electrode patterns and sensing electrode patterns, the driving electrode patterns are electrically connected with the driving traces and form a first conductive layer, and the sensing electrode patterns are electrically connected with the sensing traces and form a second conductive layer; the binding portion includes a first portion formed at the driving route and a second portion formed at the sensing route, both the first portion and the second portion including a plurality of wiring contacts; the golden fingers comprise first golden fingers and second golden fingers, the conductive adhesive comprises first conductive adhesive and second conductive adhesive, the first conductive adhesive is arranged between the first part and the first golden fingers, and the first conductive adhesive extends from the gaps to the positions between the first golden fingers and the insulating layer; the second conductive adhesive is arranged between the second part and the second golden finger, and the second conductive adhesive extends from the notch to a position between the second golden finger and the insulating layer.
3. The touch screen of claim 2, wherein the first conductive layer and the second conductive layer are sequentially stacked on the same side of the substrate, the insulating layer comprises a first insulating film, the notch comprises a first notch formed at an edge of the first insulating film, and the binding portion is exposed to the first notch.
4. The touch panel according to claim 3, wherein the thickness of the first insulating film is 6nm to 10nm, and the thickness of the first conductive paste and the thickness of the second conductive paste are 14nm to 18 nm.
5. The touch screen of claim 3, wherein the first gold finger and the second gold finger are located on a same side of the flexible circuit board and at an edge of the flexible circuit board and spaced apart from each other.
6. The touch screen of claim 3, wherein the first insulating film has a first side surface, a second side surface, and a third side surface, and the first side surface, the second side surface, and the third side surface are sequentially connected to form the first notch; the wiring contact is exposed out of the first notch from the side where the second side face is located, and the conductive contact extends to the side, back to the substrate, of the first insulating film from the side where the second side face is located and is connected with the first insulating film through the conductive adhesive.
7. The touch screen of claim 6, wherein the substrate has a first side edge, the binding portion is located at the first side edge, the second side edge is parallel to the first side edge, and the extending direction of the wiring contacts and the extending direction of the conductive contacts are perpendicular to the first side edge.
8. The touch screen of claim 2, wherein the first conductive layer and the second conductive layer are disposed on opposite sides of the substrate, the insulating layer comprises a first insulating film and a second insulating film, the first insulating film is disposed on a side of the first conductive layer, and the second insulating film is disposed on a side of the second conductive layer; the notch includes a first notch formed at an edge of the first insulating film to expose the first portion and a second notch formed at an edge of the second insulating film to expose the second portion; the first conductive adhesive extends from the first gap to a position between the first golden finger and the first insulating film, and the second conductive adhesive extends from the second gap to a position between the second golden finger and the second insulating film.
9. A touch display screen, comprising:
the touch screen of any one of claims 1-8; and
and the display screen is connected with the touch screen.
10. An intelligent terminal, comprising:
the terminal comprises a terminal body, wherein a main board is arranged in the terminal body; and
the touch display screen of claim 9, the flexible circuit board having a conductive portion electrically connected to the gold finger, the conductive portion being electrically connected to the motherboard.
CN202020630688.2U 2020-04-23 2020-04-23 Touch screen, touch display screen and intelligent terminal Expired - Fee Related CN212009537U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112558822A (en) * 2020-12-14 2021-03-26 上海中航光电子有限公司 Touch device, electronic equipment and manufacturing method of touch device
CN113010054A (en) * 2021-04-20 2021-06-22 广州视源电子科技股份有限公司 Binding method of capacitive screen
CN113870732A (en) * 2021-09-30 2021-12-31 惠科股份有限公司 Display device
CN114360371A (en) * 2021-11-30 2022-04-15 昆山国显光电有限公司 Display screen assembly and display device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112558822A (en) * 2020-12-14 2021-03-26 上海中航光电子有限公司 Touch device, electronic equipment and manufacturing method of touch device
CN113010054A (en) * 2021-04-20 2021-06-22 广州视源电子科技股份有限公司 Binding method of capacitive screen
CN113870732A (en) * 2021-09-30 2021-12-31 惠科股份有限公司 Display device
CN113870732B (en) * 2021-09-30 2024-02-02 惠科股份有限公司 Display device
CN114360371A (en) * 2021-11-30 2022-04-15 昆山国显光电有限公司 Display screen assembly and display device
CN114360371B (en) * 2021-11-30 2023-11-07 昆山国显光电有限公司 Display screen assembly and display device

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