CN211930817U - Bone voiceprint sensors and electronics - Google Patents
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- CN211930817U CN211930817U CN202020940634.6U CN202020940634U CN211930817U CN 211930817 U CN211930817 U CN 211930817U CN 202020940634 U CN202020940634 U CN 202020940634U CN 211930817 U CN211930817 U CN 211930817U
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Abstract
本实用新型公开一种骨声纹传感器和电子设备。所述骨声纹传感器包括:拾振单元,所述拾振单元包括拾振壳体和设于所述拾振壳体内的弹性膜;以及传感器单元,所述传感器单元包括封装壳体、及设于所述封装壳体内的传感器芯片,所述封装壳体上设有声孔和泄气孔,所述拾振壳体安装于所述封装壳体,所述声孔连通所述拾振壳体与所述封装壳体;所述泄气孔用于在装配所述拾振单元与所述传感器单元时泄压。如此,可不必在拾振壳体上开孔,从而不会减少拾振壳体的拾振面积,从而有利于提高骨声纹传感器的性能。
The utility model discloses a bone voiceprint sensor and electronic equipment. The bone voiceprint sensor includes: a vibration pickup unit, the vibration pickup unit includes a vibration pickup housing and an elastic membrane provided in the vibration pickup housing; and a sensor unit, the sensor unit includes a package housing, and a device. The sensor chip in the package shell, the package shell is provided with a sound hole and a vent hole, the vibration pickup shell is mounted on the package shell, and the sound hole communicates with the vibration pickup shell and the the package housing; the air vent hole is used to release pressure when the vibration pickup unit and the sensor unit are assembled. In this way, it is not necessary to open a hole on the vibration pickup shell, so that the vibration pickup area of the vibration pickup shell will not be reduced, which is beneficial to improve the performance of the bone voiceprint sensor.
Description
技术领域technical field
本实用新型涉及传感器技术领域,特别涉及一种骨声纹传感器和电子设备。The utility model relates to the technical field of sensors, in particular to a bone voiceprint sensor and electronic equipment.
背景技术Background technique
骨声纹传感器是利用人讲话时引起的头颈部骨骼的轻微振动,来把声音信号收集起来转为电信号的。由于它不同于传统麦克风的通过空气传导采集声音,所以可以在很嘈杂的环境里也可以把声音高清晰的传出来。在许多场合如火灾现场,带着防毒而具的消防人员不能用嘴直接对着麦克风讲话,因此此时可以利用骨声纹传感器。随着电子产品的发展,骨声纹传感器的应用越来越广泛。The bone voiceprint sensor uses the slight vibration of the head and neck bones caused by people's speech to collect sound signals and convert them into electrical signals. Because it is different from traditional microphones that collect sound through air conduction, it can transmit sound with high definition in a very noisy environment. In many occasions, such as fire scenes, firefighters with anti-virus equipment cannot speak directly into the microphone with their mouths, so bone voiceprint sensors can be used at this time. With the development of electronic products, the application of bone voiceprint sensors is becoming more and more extensive.
相关技术中,骨声纹传感器通常包括拾振单元和传感器单元,拾振单元用于拾取外界的骨振动信号,并传递给传感器单元;传感器单元用于将振动信号转化为电信号。In the related art, a bone voiceprint sensor usually includes a vibration pickup unit and a sensor unit. The vibration pickup unit is used to pick up the external bone vibration signal and transmit it to the sensor unit; the sensor unit is used to convert the vibration signal into an electrical signal.
拾振单元通常包括拾振壳体及设于拾振壳体内的弹性膜,为了在装配拾振单元与传感器单元时泄压,通常会在拾振壳体上设置泄气孔。但是,泄气孔设置在拾振壳体上,泄气孔会影响拾振壳体的拾振面积,也会使得泄气孔的大小受限。The vibration pickup unit usually includes a vibration pickup housing and an elastic membrane disposed in the vibration pickup housing. In order to relieve pressure when the vibration pickup unit and the sensor unit are assembled, a vent hole is usually provided on the vibration pickup housing. However, the vent hole is provided on the vibration pickup housing, and the vent hole will affect the vibration pickup area of the vibration pickup housing, and also limit the size of the vent hole.
实用新型内容Utility model content
本实用新型的主要目的是提出一种骨声纹传感器,旨在解决相关技术中,将泄气孔设置在拾振单元的拾振壳体上,从而影响拾振壳体的拾振面积的技术问题。The main purpose of the present utility model is to propose a bone voiceprint sensor, which aims to solve the technical problem in the related art that the vent hole is arranged on the vibration pickup shell of the vibration pickup unit, thereby affecting the vibration pickup area of the vibration pickup shell. .
为实现上述目的,本实用新型提出一种骨声纹传感器,包括:In order to achieve the above purpose, the present utility model proposes a bone voiceprint sensor, comprising:
拾振单元,所述拾振单元包括拾振壳体和设于所述拾振壳体内的弹性膜;以及a vibration pickup unit, the vibration pickup unit includes a vibration pickup housing and an elastic membrane disposed in the vibration pickup housing; and
传感器单元,所述传感器单元包括封装壳体、及设于所述封装壳体内的传感器芯片,所述封装壳体上设有声孔和泄气孔,所述拾振壳体安装于所述封装壳体,所述声孔连通所述拾振壳体与所述封装壳体;所述泄气孔用于在装配所述拾振单元与所述传感器单元时泄压。A sensor unit, the sensor unit includes a package housing and a sensor chip arranged in the package housing, the package housing is provided with a sound hole and a vent hole, and the vibration pickup housing is mounted on the package housing , the sound hole communicates with the vibration pickup housing and the packaging housing; the air vent hole is used to release pressure when the vibration pickup unit and the sensor unit are assembled.
可选地,所述封装壳体包括连接板,所述连接板用于安装于电子设备的主控板,所述泄气孔设于所述连接板。Optionally, the encapsulation housing includes a connection board, and the connection board is used for being mounted on a main control board of an electronic device, and the air vent is provided on the connection board.
可选地,所述封装壳体还包括基板,所述基板与所述连接板相对设置,所述声孔和所述传感器芯片设置于所述基板;所述拾振壳体安装于所述基板。Optionally, the package housing further includes a substrate, the substrate is arranged opposite to the connection plate, the acoustic hole and the sensor chip are arranged on the substrate; the vibration pickup housing is mounted on the substrate .
可选地,所述泄气孔远离所述传感器芯片设置。Optionally, the vent hole is disposed away from the sensor chip.
可选地,所述泄气孔的截面面积大于或等于10平方微米。Optionally, the cross-sectional area of the vent hole is greater than or equal to 10 square micrometers.
可选地,所述泄气孔间隔分布有多个。Optionally, a plurality of the vent holes are distributed at intervals.
可选地,所述拾振单元还包括设置在所述弹性膜上的振动调节件,所述振动调节件包括与所述弹性膜连接的调节基部、及设于所述调节基部的表面的调节凸出部,所述调节凸出部伸入所述声孔内。Optionally, the vibration pickup unit further includes a vibration adjustment member disposed on the elastic film, the vibration adjustment member includes an adjustment base connected with the elastic film, and an adjustment member disposed on the surface of the adjustment base A protruding part, the adjusting protruding part protrudes into the sound hole.
可选地,所述传感器芯片对应所述声孔设置,所述调节凸出部伸入所述传感器芯片的前腔内。Optionally, the sensor chip is disposed corresponding to the sound hole, and the adjustment protrusion extends into the front cavity of the sensor chip.
可选地,所述拾振单元还包括设置在所述弹性膜上的振动调节件,所述振动调节件包括与所述弹性膜连接的调节主体、及设于所述调节主体的侧面的侧向凸出部,所述侧向凸出部与所述弹性膜之间形成有避位间隔;或者,Optionally, the vibration pickup unit further includes a vibration adjustment member disposed on the elastic film, the vibration adjustment member includes an adjustment body connected with the elastic film, and a side provided on the side of the adjustment body. the lateral protruding portion, an avoidance interval is formed between the lateral protruding portion and the elastic film; or,
所述拾振单元还包括设置在所述弹性膜上的振动调节件,所述振动调节件包括与所述弹性膜连接的调节基部、及设于所述调节基部的表面的调节凸出部,所述调节基部包括与所述弹性膜连接的调节主体、及设于所述调节主体的侧面的侧向凸出部,所述侧向凸出部与所述弹性膜之间形成有避位间隔;所述调节凸出部伸入所述声孔内。The vibration pickup unit further includes a vibration adjustment member disposed on the elastic film, the vibration adjustment member includes an adjustment base connected with the elastic film, and an adjustment protrusion disposed on the surface of the adjustment base, The adjustment base includes an adjustment body connected with the elastic film, and a lateral protruding portion provided on the side surface of the adjustment main body, and an avoidance interval is formed between the lateral protruding portion and the elastic film ; The adjusting protrusion extends into the sound hole.
本实用新型还提出一种电子设备,包括如上所述的骨声纹传感器。The utility model also provides an electronic device, comprising the above-mentioned bone voiceprint sensor.
相较于将泄气孔设置在拾振壳体上,本实用新型骨声纹传感器将泄气孔设置在封装壳体上,可不必在拾振壳体上开孔,从而不会减少拾振壳体的拾振面积,从而有利于提高骨声纹传感器的性能。Compared with arranging the vent hole on the vibration pickup shell, the bone voiceprint sensor of the present invention sets the vent hole on the package shell, so it is not necessary to open a hole on the vibration pickup shell, so that the vibration pickup shell is not reduced. Therefore, it is beneficial to improve the performance of the bone voiceprint sensor.
附图说明Description of drawings
为了更清楚地说明本实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained based on the structures shown in these drawings without any creative effort.
图1为本实用新型骨声纹传感器一实施例的结构示意图;1 is a schematic structural diagram of an embodiment of the bone voiceprint sensor of the present invention;
图2为本实用新型骨声纹传感器又一实施例的结构示意图;2 is a schematic structural diagram of another embodiment of the bone voiceprint sensor of the present invention;
图3为本实用新型骨声纹传感器另一实施例的结构示意图;3 is a schematic structural diagram of another embodiment of the bone voiceprint sensor of the present invention;
图4为本实用新型骨声纹传感器再一实施例的结构示意图。FIG. 4 is a schematic structural diagram of still another embodiment of the bone voiceprint sensor of the present invention.
附图标号说明:Description of reference numbers:
本实用新型目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The realization, functional characteristics and advantages of the purpose of the present utility model will be further described with reference to the accompanying drawings in conjunction with the embodiments.
具体实施方式Detailed ways
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型的一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, not all of them. Example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.
需要说明,若本实用新型实施例中有涉及“第一”、“第二”等的描述,则该“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。It should be noted that if there are descriptions related to "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for the purpose of description, and should not be construed as instructions Either imply their relative importance or imply the number of technical features indicated. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature.
另外,全文中出现的“和/或”的含义为,包括三个并列的方案,以“A和/或B”为例,包括A方案,或B方案,或A和B同时满足的方案。In addition, the meaning of "and/or" in the whole text is to include three parallel schemes. Taking "A and/or B" as an example, it includes scheme A, scheme B, or scheme that A and B satisfy at the same time.
本实用新型提出一种骨声纹传感器和电子设备。其中,骨声纹传感器用于电子设备,该电子设备可以是但不限于头戴设备、耳机、智能手表、智能手环、车载降噪设备及振动感测装置等本领域技术人员所熟知的电子设备。The utility model provides a bone voiceprint sensor and an electronic device. Among them, the bone voiceprint sensor is used in electronic equipment, which can be, but is not limited to, electronic equipment known to those skilled in the art, such as headsets, earphones, smart watches, smart bracelets, vehicle noise reduction equipment, and vibration sensing devices. equipment.
在本实用新型一实施例中,如图1所示,所述骨声纹传感器100包括拾振单元10和传感器单元20,所述拾振单元10与传感器单元20连接,即所述拾振单元10与传感器单元20结合在一起,所述拾振单元10用于拾取外界(如佩戴者,或其他振动源,下文以佩戴者为例进行说明)的骨振动信号而产生响应振动信号、并将响应振动信号传递给传感器单元20,所述传感器单元20用于将接收到的振动信号转换为电信号。可以理解,不失一般性,所述拾振单元10与传感器单元20之间形成有密闭传振气道,以使所述响应振动信号通过该密闭传振气道传递给传感器单元20。In an embodiment of the present invention, as shown in FIG. 1 , the
进一步地,如图1所示,所述拾振单元10包括拾振壳体11和设于拾振壳体11内的弹性膜12。Further, as shown in FIG. 1 , the
具体的,弹性膜12安装在拾振壳体11内,拾振壳体11可对弹性膜12进行保护。拾振壳体11可将佩戴者说话者时的骨头振动传递给弹性膜12,弹性膜12用于拾取佩戴者说话者时的骨头振动而振动,以形成响应振动信号;其中,弹性膜12在振动时带动密闭传振气道内的气体振动,以将响应振动信号通过该密闭传振气道传递给传感器单元20。Specifically, the
其中,弹性膜12可以采用具有弹性形变能力的膜片,包括但不限于塑料膜片、纸质膜片、金属膜片、生物膜片等。而且,弹性膜12可以采用单层结构,也可以采用多层复合的膜片。弹性膜12可以采用单一材质,也可以采用不同材质复合而成。在此不再具体说明。The
进一步地,如图1所示,所述拾振单元10还包括设置在弹性膜12上的振动调节件13。Further, as shown in FIG. 1 , the
如此,所述振动调节件13用于对弹性膜12的振动进行调节,使弹性膜12的振动与佩戴者的骨振动信号匹配性更好,从而可提高骨声纹传感器100的灵敏度。而且,振动调节件13随弹性膜12一同振动,可增加弹性膜12振动时的质量,从而可以有效避免外界因素(如声波)的干扰。In this way, the
不失一般性,如图1所示,所述振动调节件13在弹性膜12上的投影应当小于弹性膜12。Without loss of generality, as shown in FIG. 1 , the projection of the
可选地,所述振动调节件13可以通过胶体粘接在弹性膜12上。Optionally, the
进一步地,如图1所示,所述传感器单元20包括封装壳体21、及设于封装壳体21内的传感器芯片22,所述拾振壳体11安装于封装壳体21,所述封装壳体21上设有声孔211,所述声孔211连通传感器单元20与拾振单元10。具体的,所述声孔211连通封装壳体21与拾振壳体11;可以理解,所述声孔211用于形成密闭传振气道。Further, as shown in FIG. 1 , the
具体的,响应振动信号通过声孔211传递到封装壳体21内,并传递给传感器芯片22,所述传感器芯片22用于将该响应振动信号转换为电信号。Specifically, the response vibration signal is transmitted into the
具体的,如图1所示,所述弹性膜12将拾振壳体11内的空间分隔成第一腔体和第二腔体,所述第一腔体与第二腔体分别位于弹性膜12的两侧(在图1所示的状态下,所述第一腔体位于弹性膜12的上侧,第二腔体位于弹性膜12的下侧);其中,第二腔体与声孔211连通。Specifically, as shown in FIG. 1 , the
具体的,所述拾振壳体11为一端敞口设置的壳体,拾振壳体11的敞口端安装于封装壳体21,封装壳体21封堵拾振壳体11的敞口,封装壳体21与拾振壳体11通过声孔211连通。如此,可简化结构。Specifically, the
可选地,所述拾振壳体11的敞口端可通过胶体粘接于封装壳体21。Optionally, the open end of the
可选地,所述振动调节件13可以设于弹性膜12的任意一面;即是说,所述振动调节件13既可以设于第一腔体内,也可以设于第二腔体内。Optionally, the
在具体实施例中,所述封装壳体21和/或拾振壳体11上设有泄气孔212,所述泄气孔212用于在装配拾振单元10与传感器单元20时泄压。具体的,所述泄气孔212与外部环境连通。如此,通过设置泄气孔212,在装配拾振单元10与传感器单元20时,可避免由于封装壳体21或拾振壳体11内外空间的气压差而导致拾振单元10或传感器芯片22失效,从而可降低骨声纹传感器100的装配难度。In a specific embodiment, the
但是,在骨声纹传感器100应用时,即将其应用到电子设备上时,泄气孔212需要被封堵,以免其影响骨声纹传感器100的性能。可选地,可以通过密封胶、或粘接密封胶带、或添加密封塞等形式将泄气孔212封堵。However, when the
需要指出的是,若泄气孔212设于拾振壳体11,可选地,所述泄气孔212与第一腔体连通,如所述泄气孔212设于拾振壳体11的顶部;可选地,所述泄气孔212为环形孔。It should be pointed out that, if the
在本实用新型给出的实施例中,如图1-4所示,所述泄气孔212设置在封装壳体21上。In the embodiment given by the present invention, as shown in FIGS. 1-4 , the
需要指出的是,相较于将泄气孔212设置在拾振壳体11上,将泄气孔212设置在封装壳体21上,可不必在拾振壳体11上开孔,从而不会减少拾振壳体11的拾振面积,从而有利于提高骨声纹传感器100的性能。It should be noted that, compared with disposing the
进一步地,如图1所示,所述封装壳体21包括连接板214,所述连接板214用于安装于电子设备的主控板,所述泄气孔212设于连接板214。Further, as shown in FIG. 1 , the
具体的,所述电子设备包括电控板,当骨声纹传感器100应用于电子设备时,骨声纹传感器100可安装在电控板上。具体来说,所述封装壳体21的连接板214安装于主控板,可选地,所述连接板214贴装于主控板表面。Specifically, the electronic device includes an electronic control board. When the
如此,通过将泄气孔212设于连接板214,在将骨声纹传感器100安装(如贴装)到主控板上时,可通过填充胶的原有工序将泄气孔212封堵,从而可简化现场应用工序,从而可降低生产成本。In this way, by arranging the
进一步地,所述泄气孔212的截面面积大于或等于10平方微米。Further, the cross-sectional area of the
可以理解,由于泄气孔212设置在封装壳体21上,从而不会影响拾振壳体11的拾振面积;同时为了提高泄压效果,可增大泄气孔212的尺寸,而且,泄气孔212越大,越有利于加工。It can be understood that since the
可选地,所述泄气孔212的截面面积大于或等于40平方微米;甚至可使所述泄气孔212的截面面积大于或等于100平方微米;甚至更大,如150、200、300平方微米等等。Optionally, the cross-sectional area of the
进一步地,所述泄气孔212间隔分布有多个(即大于或等于两个)。可以理解,由于泄气孔212设置在封装壳体21上,从而不会影响拾振壳体11的拾振面积;所以,为了提高泄压效果,可使泄气孔212设置有多个。当然,也可使泄气孔212仅设置为一个。Further, there are multiple (that is, more than or equal to two) vent holes 212 distributed at intervals. It can be understood that since the air vent holes 212 are provided on the
进一步地,如图1所示,所述泄气孔212远离传感器芯片22设置。如此,可避免泄气孔212对传感器芯片22造成影响。Further, as shown in FIG. 1 , the
进一步地,如图1所示,所述封装壳体21还包括基板213,所述基板213与连接板214相对设置,所述声孔211和传感器芯片22设置于基板213;所述拾振壳体11安装于基板213。如此,当骨声纹传感器100安装到主控板上时,可便于拾振单元10拾取骨振动信号。当然,于其他实施例中,也可以使基板213与连接板214相临设置。Further, as shown in FIG. 1 , the
具体的,所述封装壳体21还包括设于基板213周缘的围板215,所述围板215在远离基板213的一端形成敞口,所述连接板214连接于该敞口处。Specifically, the
进一步地,如图1所示,所述传感器芯片22对应声孔211设置。详细地,所述传感器芯片22的前腔221对应声孔211设置,并与声孔211连通。Further, as shown in FIG. 1 , the
不失一般性,如图1所示,所述传感器单元20还包括设于封装壳体21内的ASIC(Application Specific Integrated Circuit)芯片70,所述ASIC芯片70与传感器芯片22电连接,以对传感器芯片22产生的电信号进行处理。Without loss of generality, as shown in FIG. 1 , the
具体的,所述ASIC芯片70可设于基板213的表面,或者所述ASIC芯片70埋设于是基板213内。需要指出的是,将ASIC芯片70埋设于是基板213内,可便于组装骨声纹传感器100。Specifically, the
具体的,所述基板213为电路板,如PCB板,所述ASIC芯片70与传感器芯片22与基板213电连接。Specifically, the
可选地,如图1所示,所述连接板214上设有用于与外部电路(即电子设备的电路)电连接的电连接部2141,所述电连接部2141与基板213电连接,以实现与ASIC芯片70和传感器芯片22电连接。Optionally, as shown in FIG. 1 , the
如此,当连接板214安装到电控板上时,可将电连接部2141与电控板电连接,以使传感器芯片22与外部电路(即电子设备的电路)电连接。In this way, when the
其中,所述传感器单元20还包括电连接件23,所述电连接件23电连接基板213与电连接部2141。可选地,所述电连接件23埋设于围板215内。The
可选地,如图1所示,所述弹性膜12与所述振动调节件13上设有第一通气孔121。Optionally, as shown in FIG. 1 , the
可选地,如图1所示,所述传感器芯片22的感应膜222上设有第二通气孔223。Optionally, as shown in FIG. 1 , the
可选地,所述传感器芯片22可以为麦克风芯片或压力传感器芯片22。也即传感器单元20可以采用MEMS麦克风或MEMS压力传感器,如此,可以降低骨声纹传感器100的设计难度。Optionally, the
在本实用新型另一实施例中,如图3所示,所述振动调节件13包括与弹性膜12连接的调节基部131、及设于所述调节基部131的表面的调节凸出部132,所述调节凸出部132伸入声孔211内。具体的,所述调节凸出部132还伸入封装壳体21内。如此,可提高空间利用率,以增大振动调节件13的质量,从而有利于提高骨声纹传感器100模组的灵敏度。In another embodiment of the present invention, as shown in FIG. 3 , the
在该实施例中,可以理解,所述振动调节件13设于弹性膜12的朝向声孔211的一侧。In this embodiment, it can be understood that the
在该实施例中,如图3所示,所述传感器芯片22对应声孔211设置,所述调节凸出部132通过声孔211伸入传感器芯片22的前腔221内。如此,可提高传感器芯片22的准确性。In this embodiment, as shown in FIG. 3 , the
而且,可以理解,为了进一步地增大振动调节件13的质量,可增大调节凸出部132的尺寸,如此,就需要将声孔211扩大。即是说,通过将声孔211扩大,可以容纳更大尺寸的调节凸出部132,以便于进一步地增大振动调节件13的质量;同时,由于将声孔211扩大,可降低传感器芯片22的前腔221对高频的影响,使得高频更平,从而可提高骨声纹传感器100的可靠性。换而言之,本实用新型可将声孔211扩大,以降低传感器芯片22的前腔221对高频的影响,使得高频更平,从而可提高骨声纹传感器100的可靠性。Moreover, it can be understood that in order to further increase the mass of the
在该实施例中,如图3所示,可使所述声孔211的周缘与传感器芯片22的前腔221的周缘齐平;或者,所述声孔211的周缘设于传感器芯片22的前腔221的周缘的外侧。如此,可避免声孔211对调节凸出部132造成干扰,以便于进一步地增大调节凸出部132的尺寸,以增大振动调节件13的质量,从而可降低传感器芯片22的前腔221对高频的影响,使得高频更平,以提高骨声纹传感器100的可靠性。In this embodiment, as shown in FIG. 3 , the periphery of the
在该实施例中,如图3所示,所述调节凸出部132在弹性膜12上的投影具有第一面积,所述传感器芯片22的前腔221的周壁在弹性膜12上的投影具有第二面积,所述第一面积与第二面积的比值大于或等于0.1,且小于或等于0.99。In this embodiment, as shown in FIG. 3 , the projection of the
可选地,所述第一面积与第二面积的比值大于或等于0.5,且小于或等于0.9。Optionally, the ratio of the first area to the second area is greater than or equal to 0.5 and less than or equal to 0.9.
可选地,所述第一面积与第二面积的比值大于或等于0.6,且小于或等于0.8。Optionally, the ratio of the first area to the second area is greater than or equal to 0.6 and less than or equal to 0.8.
可选地,所述第一面积与第二面积的比值大于或等于0.65,且小于或等于0.75。Optionally, the ratio of the first area to the second area is greater than or equal to 0.65 and less than or equal to 0.75.
可以理解,所述传感器芯片22的规格通常是一定的,那么所述第一面积与第二面积的比值越大,则越有利于增大振动调节件13的质量;但若该比值过大,则可能会使调节凸出部132在振动的过程中与传感器芯片22的前腔221的周壁发生干涉,从而影响骨声纹传感器100的性能。当然,该比值的大小还会传感器芯片22的前腔221的气体量,从而影响传感器芯片22的性能;所以,在实际应用中,可根据实际情况对第一面积与第二面积的比值进行设计。It can be understood that the specifications of the
在该实施例中,如图3所示,所述调节凸出部132与传感器芯片22的感应膜222之间的间距大于或等于10微米。In this embodiment, as shown in FIG. 3 , the distance between the
可选地,所述调节凸出部132与传感器芯片22的感应膜222之间的间距可选为12微米、15微米、17微米、20微米、23微米、或25微米等,甚至更大。Optionally, the distance between the
可以理解,所述传感器芯片22的规格通常是一定的,那么所述调节凸出部132与传感器芯片22的感应膜222之间的间距越小,则越有利于增大振动调节件13的质量;但若该间距过小,则可能会使调节凸出部132在振动的过程中与传感器芯片22的感应膜222发生干涉,从而影响骨声纹传感器100的性能。当然,该间距的大小还会传感器芯片22的前腔221的气体量,从而影响传感器芯片22的性能;所以,在实际应用中,可根据实际情况对调节凸出部132与感应膜222之间的间距进行设计。It can be understood that the specifications of the
需要说明的是,在实际应用中,可根据实际情况来对第一面积与第二面积的比值、及调节凸出部132与传感器芯片22的感应膜222之间的间距进行设计,以既能够较大程度地增大振动调节件13的质量,又可以保证/提高传感器芯片22的性能,还可以避免调节凸出部132在前腔221内的振动受到干涉。It should be noted that, in practical applications, the ratio of the first area to the second area and the distance between the
在该实施例中,所述调节凸出部132设于调节基部131的中部。如此,可使得弹性膜12在振动的过程中受力较均匀,以降低破裂的风险;同时,还可提高弹性膜12振动的稳定性,以提高骨声纹传感器100的性能。In this embodiment, the
在本实用新型又一实施例中,如图2所示,所述振动调节件13包括与弹性膜12连接的调节主体133、及设于调节主体133的侧面的侧向凸出部134,所述侧向凸出部134与弹性膜12之间形成有避位间隔。具体的,所述侧向凸出部134朝向弹性膜12的侧面,与弹性膜12的表面之间形成避位间隔。当弹性膜振动时,该避位间隔的大小会随着弹性膜的振动而发生变化。In yet another embodiment of the present invention, as shown in FIG. 2 , the
如此,可在不增大振动调节件13与弹性膜12的连接面积的情况下,有效地利用拾振壳体11内的空间,以增大振动调节件13的质量,从而可提高骨声纹传感器100的灵敏度,从而可提高骨声纹传感器100的性能;并有利于实现骨声纹传感器100的小型化设计。In this way, without increasing the connection area between the
即是说,该实施例中的骨声纹传感器100,提升了空间利用率,有利于降低产品尺寸,提升了产品性能。That is to say, the
或者,可在不减小振动调节件13的质量的情况下,可减小振动调节件13与弹性膜12的连接面积,以提高骨声纹传感器100的性能。Alternatively, without reducing the mass of the
在该实施例中,进一步地,如图2所示,所述侧向凸出部134为环形结构。如此,一方面可降低振动调节件13的制作难度,另一方面还可以较大程度地增大振动调节件13的质量。当然,于该实施例的并列实施例中,也可使:所述侧向凸出部134设有多个,多个所述侧向凸出部134在调节主体133的周向方向上间隔分布。In this embodiment, further, as shown in FIG. 2 , the
在该实施例中,进一步地,如图2所示,所述调节主体133包括与弹性膜12连接的第一调节部1331、及连接于第一调节部1331的远离弹性膜12的一侧的第二调节部,所述侧向凸出部134设于第二调节部的侧面。如此,可使得侧向凸出部134与弹性膜12之间形成避位间隔。In this embodiment, further, as shown in FIG. 2 , the adjusting
在该实施例中,既可以使侧向凸出部134、第一调节部1331及第二调节部三者一体设置;也可以使侧向凸出部134与第二调节部一体设置,并与第一调节部1331分体配合连接。In this embodiment, the
在该实施例中,进一步地,如图2所示,所述侧向凸出部134的厚度与第二调节部的厚度相等。如此,使得振动调节件13为台阶式结构,从而可较大程度地增大振动调节件13的质量。In this embodiment, further, as shown in FIG. 2 , the thickness of the
在该实施例中,进一步地,所述侧向凸出部134的外轮廓形状与第一调节部1331的外轮廓形状相同。In this embodiment, further, the outer contour shape of the
在该实施例中,进一步地,所述第二调节部的厚度与第一调节部1331的厚度的比值大于或等于0.1,且小于或等于100。可以理解,若该比值过大,则容易使侧向凸出部134在振动的过程中与弹性膜12干涉;若该比值过小,则不利于增大振动调节件13的质量。可选地,所述第二调节部的厚度与第一调节部1331的厚度的比值大于或等于0.2,且小于或等于10;或者,所述第二调节部的厚度与第一调节部1331的厚度的比值大于或等于0.3,且小于或等于6。In this embodiment, further, the ratio of the thickness of the second adjusting portion to the thickness of the
在该实施例中,进一步地,所述侧向凸出部134与第二调节部在所述弹性膜12上的投影具有第一面积,所述第一调节部1331在弹性膜12上的投影具有第二面积,所述第二面积与第一面积的比值大于1,且小于或等于100。可以理解,若该比值过小,则不利于增大振动调节件13的质量;若该比值过大,则容易造成“头重脚轻”。可选地,所述第二面积与第一面积的比值大于或等于1.1,且小于或等于10;或者,所述第二面积与第一面积的比值大于或等于1.2,且小于或等于6。In this embodiment, further, the projection of the
在该实施例中,所述振动调节件13可设于弹性膜12的任意一面。In this embodiment, the
当然,在该实施例中,通过对侧向凸出部134进行设计,可使得振动调节件13为三阶、或四阶、或更多阶的台阶式结构。Of course, in this embodiment, by designing the
当然,在该实施例中,通过对侧向凸出部134进行设计,也可以使所述振动调节件13的纵截面(即过振动调节件13的中心线的截面)为梯形、或腰形。Of course, in this embodiment, by designing the
另外,需要指出的是,以上各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本实用新型要求的保护范围之内。如在本实用新型再一实施例中,如图4所示,可使振动调节件13包括与弹性膜12连接的调节基部131、及设于所述调节基部131的表面的调节凸出部132,所述调节基部131包括与弹性膜12连接的调节主体133、及设于调节主体133的侧面的侧向凸出部134,所述侧向凸出部134与弹性膜12之间形成有避位间隔;所述调节凸出部132伸入声孔211内。具体的,所述侧向凸出部134朝向弹性膜12的侧面,与弹性膜12的表面之间形成避位间隔。当弹性膜振动时,该避位间隔的大小会随着弹性膜的振动而发生变化。In addition, it should be pointed out that the technical solutions between the above embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions contradicts or cannot be realized, it should be considered that such The combination of technical solutions does not exist and is not within the protection scope required by the present invention. In yet another embodiment of the present invention, as shown in FIG. 4 , the
如此,可较大程度地提高空间利用率,以增大振动调节件13的质量,从而可提高骨声纹传感器100模组的灵敏度,以提高骨声纹传感器100模组的性能;并有利于实现骨声纹传感器100模组的小型化设计。In this way, the space utilization rate can be greatly improved to increase the quality of the
当骨声纹传感器应用到电子设备上时,在一实施例中,所述电子设备包括如上所述的骨声纹传感器。When the bone voiceprint sensor is applied to an electronic device, in one embodiment, the electronic device includes the bone voiceprint sensor as described above.
具体的,所述电子设备还包括电控板,所述骨声纹传感器的连接板贴装在电控板上,并通过胶体封堵连接板上的泄气孔。Specifically, the electronic device further includes an electric control board, the connection board of the bone voiceprint sensor is mounted on the electric control board, and the air leakage hole on the connection board is blocked by colloid.
以上所述仅为本实用新型的可选实施例,并非因此限制本实用新型的专利范围,凡是在本实用新型的发明构思下,利用本实用新型说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本实用新型的专利保护范围内。The above descriptions are only optional embodiments of the present utility model, and are not intended to limit the scope of the present utility model patent. Under the inventive concept of the present utility model, the equivalent structure transformations made by using the contents of the present utility model description and accompanying drawings, Or directly/indirectly applied in other related technical fields are included in the scope of patent protection of the present invention.
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Cited By (8)
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|---|---|---|---|---|
| CN112565993A (en) * | 2020-11-16 | 2021-03-26 | 歌尔微电子有限公司 | Bone voiceprint sensor and electronic device |
| CN113259818A (en) * | 2021-04-26 | 2021-08-13 | 歌尔微电子股份有限公司 | Bone voiceprint sensor, manufacturing method thereof and electronic device |
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| CN113709643A (en) * | 2021-08-27 | 2021-11-26 | 歌尔微电子股份有限公司 | Vibration pickup unit, bone voiceprint sensor and electronic equipment |
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| WO2022227672A1 (en) * | 2021-04-26 | 2022-11-03 | 歌尔微电子股份有限公司 | Bone voiceprint sensor and manufacturing method therefor, and electronic device |
| WO2023000999A1 (en) * | 2021-07-20 | 2023-01-26 | 歌尔微电子股份有限公司 | Vibration sensor and electronic device |
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2020
- 2020-05-27 CN CN202020940634.6U patent/CN211930817U/en active Active
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| US20210364346A1 (en) * | 2020-03-25 | 2021-11-25 | Merry Electronics Co., Ltd. | Vibration sensor |
| US11619544B2 (en) * | 2020-03-25 | 2023-04-04 | Merry Electronics Co., Ltd. | Vibration sensor having vent for pressure enhancing member |
| CN112565993A (en) * | 2020-11-16 | 2021-03-26 | 歌尔微电子有限公司 | Bone voiceprint sensor and electronic device |
| US12356140B2 (en) | 2020-12-28 | 2025-07-08 | Shenzhen Shokz Co., Ltd. | Vibration sensors |
| CN113259818A (en) * | 2021-04-26 | 2021-08-13 | 歌尔微电子股份有限公司 | Bone voiceprint sensor, manufacturing method thereof and electronic device |
| WO2022227672A1 (en) * | 2021-04-26 | 2022-11-03 | 歌尔微电子股份有限公司 | Bone voiceprint sensor and manufacturing method therefor, and electronic device |
| WO2023000999A1 (en) * | 2021-07-20 | 2023-01-26 | 歌尔微电子股份有限公司 | Vibration sensor and electronic device |
| CN113709643A (en) * | 2021-08-27 | 2021-11-26 | 歌尔微电子股份有限公司 | Vibration pickup unit, bone voiceprint sensor and electronic equipment |
| CN113709643B (en) * | 2021-08-27 | 2024-04-26 | 歌尔微电子股份有限公司 | Vibration pickup unit, bone voiceprint sensor and electronic equipment |
| CN114136426A (en) * | 2021-11-25 | 2022-03-04 | 歌尔微电子股份有限公司 | Sensor and wearable equipment |
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