CN211907401U - Wafer carrier loading and unloading device - Google Patents

Abstract

The wafer loading and unloading device comprises a loading disc, a main correcting mechanism, a wafer correcting mechanism and a material placing mechanism which are built in the moving range of a first mechanical arm and a second mechanical arm, wherein the first mechanical arm is provided with an image capture component and a wafer positioning piece loading and unloading mechanism, the second mechanical arm is provided with a wafer taking and placing mechanism, the main correcting mechanism respectively corrects the image capture component, the wafer positioning piece loading and unloading mechanism and the wafer taking and placing mechanism, the image capture component corresponds to a wafer on the loading disc, the wafer positioning piece loading and unloading mechanism takes down a wafer positioning piece on the wafer disc, the wafer taking and placing mechanism takes out a wafer from the material placing mechanism, a wafer notch is correctly adjusted by the wafer correcting mechanism and then moves to the wafer disc, and the wafer positioning piece loading and unloading mechanism combines the wafer positioning piece on the wafer disc and presses the periphery of; after the wafer is processed, the image capture component corresponds to the wafer disc again, the wafer positioning piece is taken down by the wafer positioning piece loading and unloading mechanism, the wafer is moved to the wafer correction mechanism by the wafer taking and placing mechanism to read the wafer code, and then the wafer is placed in the material placing mechanism.

Description

Wafer carrier loading and unloading device

technical field

The utility model relates to a device for placing and unloading a wafer carrier, in particular to a device that can quickly, simply and efficiently pick up and place wafers on the carrier.

Background technique

The general integrated circuit (IC) manufacturing process can be mainly divided into three parts: silicon wafer manufacturing, integrated circuit manufacturing and integrated circuit packaging; when the silicon ingot is cut into wafers, it needs to pass through yellow light , crystal growth, etching, mechanical grinding and other complicated procedures to complete the production of integrated circuits, and in the above manufacturing process, the wafer is tested, cleaned, evaporated, dried or soaked in organic solvents and other processes In order to effectively fix the wafers to facilitate processing, each wafer needs to be fixed on a wafer tray first, and each wafer tray carries each wafer to perform the processing operations in the above-mentioned processes.

The basic structure of the wafer disk in the prior art is a disk body with an area slightly larger than the outer diameter of the wafer, a separable annular frame body is arranged above the disk body, a position for accommodating the wafer is defined, and the The periphery of the disk body is provided with at least two buckling mechanisms, and the annular frame body can be clamped by the buckling mechanisms so as to be pressed on the periphery of the wafer to form a positioning.

In practical applications, in order to process a larger number of wafers at the same time, at least two wafer trays are usually arranged on a large-area carrier tray, which can accommodate multiple wafer trays and move them to each Different processing procedures to effectively increase the efficiency of wafer processing.

With the gradual popularization of automated processing, it is inevitable to use a robotic arm to perform the pick-and-place action between each wafer and each wafer tray in the tray, which not only saves a lot of manpower, but also reduces production costs and improves processing efficiency. Since the general wafer itself is extremely fragile and has extremely high requirements for processing precision, how can the material characteristics and accuracy of the wafer itself be overcome under the operational requirements of using a robotic arm to pick and place each wafer? Requirements and restrictions are issues that all relevant businesses need to work on urgently.

In view of the above-mentioned disadvantages of the prior art for unloading the wafers from the carrier tray, the inventors have researched and improved methods for these disadvantages, and finally the present invention is produced.

Utility model content

The main purpose of the present invention is to provide a wafer loading and unloading device, which mainly includes an image grabbing component and a wafer positioning member loading and unloading mechanism on a first robotic arm, and a second robotic arm with a mounting and unloading mechanism. There is a wafer pick-and-place mechanism, and a carrier plate, a main calibration mechanism, a wafer calibration mechanism and a material loading mechanism are respectively built within the movable range of the first and second robotic arms, and the first robotic arm is used to drive the The image grabbing assembly is attached to the main calibration mechanism to correct the accuracy of its imaging range, and then the wafer positioning member loading and unloading mechanism is driven to the main calibration mechanism to correct its operating position, and the wafer positioning member loading and unloading mechanism and memory are stored. The relative position coordinates between the image capture ranges of the image-grabbing component, and then move the image-grabbing component to the top of the carrier tray to obtain an image of one of the wafer trays on the carrier tray, and adjust it to the correct corresponding position, and then the Referring to the relative position coordinates, the first robotic arm drives the wafer positioning member loading and unloading mechanism to align the wafer tray, removes the wafer positioning member pre-fixed on the periphery of the wafer tray, and drives the wafer positioning member by the second robotic arm. The circular pick-and-place mechanism is placed on the main calibration mechanism to correct the working position of the wafer pick-and-place mechanism, and then the wafer to be processed is taken out from the loading mechanism and placed on the wafer calibration mechanism to obtain the wafer. and adjust the notch of the wafer to the correct angle, the wafer to be processed is placed on the wafer tray by the wafer pick-and-place mechanism, and the image grabbing assembly is driven by the first robotic arm On the carrier tray, confirm whether the wafers on the wafer tray are complete, and then drive the wafer positioning member loading and unloading mechanism to combine the wafer positioning member on the wafer tray, so that the wafer positioning member can be pressed together Positioning is formed on the periphery of the wafer; after the wafer is processed, the first robotic arm drives the image grabbing component to the top of the carrier, obtains an image of one of the wafer trays on the carrier, and adjusts to the correct corresponding Then, the wafer positioning member loading and unloading mechanism is aligned with the wafer tray, and the wafer positioning member that is fixed on the wafer tray to complete the processing of the wafer is removed, and then the second robotic arm drives the wafer to pick and place. The mechanism moves the wafer on the wafer tray to the wafer calibration mechanism. After the wafer calibration mechanism obtains the code of the wafer, the processed wafer is moved to the loading mechanism for use. An automated processing operation for correctly and quickly picking and placing each wafer from the carrier is completed.

In order to achieve the above objects and effects, the technical means implemented by the present invention include: a first mechanical arm, connected and driven by a control module, at least one image grabbing component is arranged on the movable end of the first mechanical arm; a first mechanical arm Two manipulators are connected and driven by the control module, a wafer pick-and-place mechanism is arranged on the movable end of the second manipulator; and driven by the control module, the carrier plate is provided with at least one wafer plate for holding wafers; a wafer calibration mechanism is arranged in the movable range of the second robot arm, and is connected and driven by the control module , for reading the code of the inserted wafer and adjusting the gap of the wafer; a main calibration mechanism is arranged within the movable range of the first and second robotic arms, and is connected and driven by the control module for The positions of the image grabbing component and the wafer pick-and-place mechanism are respectively corrected; and a material loading mechanism is arranged within the movable range of the second mechanical arm.

According to the above structure, each wafer is respectively fixed on the wafer tray by a lockable wafer positioning member, and the movable end of the first robot arm is further provided with a wafer capable of attaching and detaching the wafer positioning member Positioning part loading and unloading mechanism.

According to the above structure, wherein the image-grabbing component has an upper image-capturing component that can generate illumination light, the main correction mechanism has a lower image-capturing component, a transparent sheet is arranged above the lower image-taking component, and a The standard scale of the positioning reference; the wafer positioning member loading and unloading mechanism has a positioning surface, and a positioning scale is arranged on the positioning surface; the wafer pick-and-place mechanism has a wafer suction cup that can suck wafers, There is an indicator scale.

According to the above structure, the wafer positioning member loading and unloading mechanism is provided with at least two laser light sources outside the positioning surface.

According to the above structure, the main calibration mechanism is provided with a distance-measuring laser light source beside the lower image pickup assembly.

According to the above structure, wherein the feeding mechanism is a feeding box with a receiving space inside, the feeding box is arranged on a lifting mechanism, and the lifting mechanism is connected and driven by the control module to adjust the height of the feeding box .

According to the above structure, wherein the carrier plate is arranged on a sliding mechanism, the sliding mechanism has a sliding seat, the sliding seat can move along at least two parallel extending sliding guide rails, and a sliding seat is provided on the sliding seat A pivot seat for holding the carrier plate.

According to the above structure, a cover is provided above the carrier, and a recess is formed on the cover, so that part of the wafer on the carrier can be exposed to the outside.

According to the above structure, the wafer calibration mechanism has a support seat for placing the wafer, and an imaging unit is arranged above the support seat.

In order to obtain a more specific understanding of the above-mentioned objects, functions and features of the present invention, the following descriptions are given with reference to the following drawings.

Description of drawings

Figure 1 is a complete three-dimensional structural diagram of the utility model partially disassembling the carrier plate.

Fig. 2 is a partial enlarged schematic view of the main calibration mechanism of the present invention.

FIG. 3 is a schematic diagram of the state of the image grabbing assembly of the present invention calibrating the position above the main calibrating mechanism.

FIG. 4 is a schematic diagram of the state where the wafer positioning member loading and unloading mechanism of the present invention calibrates the position above the main calibration mechanism.

FIG. 5 is a schematic diagram of the state where the image grabbing assembly of the present invention is correctly corresponding to the wafer tray above the carrier tray.

FIG. 6 is a schematic diagram of the state in which the wafer positioning member loading and unloading mechanism of the present invention moves to the wafer tray to grab the wafer positioning member.

FIG. 7 is a schematic diagram of the state of removing the wafer positioning member by the wafer positioning member loading and unloading mechanism of the present invention.

FIG. 8 is a partially enlarged schematic view of the portion A in FIG. 7 .

FIG. 9 is a schematic diagram of the state of the wafer pick-and-place mechanism of the present invention calibrating the position above the main calibration mechanism.

FIG. 10 is a schematic diagram of the state of the wafer pick-and-place mechanism of the present invention taking out the wafers from the feeding mechanism.

FIG. 11 is a schematic diagram of the state in which the wafer pick-and-place mechanism of the present invention places the wafer on the wafer calibration mechanism.

FIG. 12 is a schematic diagram of the state of the wafer calibration mechanism of the present invention calibrating the wafer.

FIG. 13 is a schematic diagram of the state in which the wafer pick-and-place mechanism of the present invention transfers the wafer onto the wafer tray.

FIG. 14 is a schematic diagram of the state of the image grabbing assembly of the present invention for confirming the position of the wafer on the carrier plate.

FIG. 15 is a schematic diagram of the state in which the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray to install the wafer positioning member.

FIG. 16 is a schematic diagram of the state in which the wafer positioning member loading and unloading mechanism of the present invention is moved back to the initial position and the wafer positioning member is fixed on the wafer tray.

FIG. 17 is a schematic diagram of the state where the image grabbing assembly of the present invention is correctly corresponding to the wafer tray above the carrier tray.

FIG. 18 is a schematic diagram of the state in which the wafer positioning member loading and unloading mechanism of the present invention moves to the wafer tray to grab the wafer positioning member.

FIG. 19 is a schematic diagram of the state of removing the wafer positioning member by the wafer positioning member loading and unloading mechanism of the present invention.

FIG. 20 is a schematic diagram of the state in which the wafer pick-and-place mechanism of the present invention removes the wafer from the wafer tray.

FIG. 21 is a schematic diagram of the state of the wafer calibration mechanism of the present invention reading the wafer code.

FIG. 22 is a schematic diagram showing the state of the wafer pick-and-place mechanism of the present invention placing the wafer into the material-placement mechanism.

Description of reference numbers.

1 The first robotic arm

11 Image capture component

111 Upper image acquisition unit

12 Wafer positioner loading and unloading mechanism

121 Positioning surface

122 Positioning scale

123 Clamps

124 Laser light source

2 Second robotic arm

21 Wafer pick and place mechanism

211 Indication scale

3 trays

31 Wafer tray

311 Wafer Positioner

32 cover

321 Notch

33 Sliding mechanism

331 Sliding seat

332 Sliding rails

333 Pivot seat

4 Main Correction Mechanism

41 Ranging laser light source

411 Laser beam

42 lower acquisition unit

43 Transparencies

431 standard scale

5 Wafer Correction Mechanism

51 Holder

52 Acquisition unit

53 tips

54 Transpose mechanism

6 feeding mechanism

60 wafers

61 Lifting mechanism

Detailed ways

Please refer to Figures 1 and 2, it can be seen that the main structure of the present invention includes: a first robot arm 1, a second robot arm 2, a carrier plate 3, a main calibration mechanism 4 and a wafer calibration mechanism 5 and other parts; The first robot arm 1 is connected and driven by a control module (which can be a computer with computing function, not shown), and an image grabbing component 11 and a wafer positioning member are mounted on the movable end of the first robot arm 1 Agency 12.

In a feasible embodiment, the image capture assembly 11 has an upper image capture assembly 111 (which can be a CCD camera) that can generate illumination light; The surface 121 (center) is provided with a positioning scale 122 (which can be a hole), at least two opposite clamping members 123 are provided on the outer peripheral side of the positioning surface 121, and at least two uniform clamping members 123 are provided on the peripheral side of the wafer positioning member loading and unloading mechanism 12 For the distributed laser light sources 124 , the at least two laser light sources 124 are respectively disposed at at least three points outside the positioning surface 121 .

The second robot arm 2 is connected and driven by the control module, and a wafer pick-and-place mechanism 21 (which can be a wafer chuck) is provided on the movable end of the second robot arm 2 for sucking the wafer 60; In this embodiment, the wafer pick-and-place mechanism 21 is provided with an indicator scale 211 .

The carrier plate 3 is disposed within the movable range of the first and second robotic arms 1 and 2, and is connected to and driven by the control module. At least two wafer disks 31 are arranged on the carrier plate 3 at different positions. The discs 31 are respectively provided with lockable wafer positioning members 311 (which may be a pressing ring).

In a feasible embodiment, the carrier tray 3 is arranged on a sliding mechanism 33, and the sliding mechanism 33 has a sliding seat 331, and the sliding seat 331 is arranged on at least two sliding guide rails 332 extending in parallel , on the sliding seat 331 is provided a pivot seat 333 for supporting the carrier plate 3; and a cover 32 is fixed above the carrier plate 3, and a concave notch 321 is formed on the cover 32 to allow the carrier plate The partial wafer tray 31 on 3 is exposed to the outside, and the control module is used to operate the sliding mechanism 33, so that the sliding seat 331 can drive the pivoting seat 333 to slide between the two ends of the sliding guide rail 332, and can The carrier tray 3 is driven to pivot by the pivot seat 333 .

The main calibration mechanism 4 is disposed within the movable range of the first and second robotic arms 1 and 2, and is connected to and driven by the control module for calibrating the image grabbing assembly 11, the wafer positioning member loading and unloading mechanism 12 and the wafer respectively. The round pick and place mechanism 21 keeps it in the correct position, respectively.

In a feasible embodiment, the main calibration mechanism 4 has a lower image capturing component 42 capable of generating illumination light and at least one ranging laser light source 41 with a ranging function; the lower image capturing component 42 may be a For the CCD camera, a transparent sheet 43 is arranged above the lower image pickup assembly 42 , and a standard scale 431 is arranged in the center of the transparent sheet 43 .

The wafer calibrating mechanism 5 is disposed within the movable range of the second robotic arm 2 and is connected and driven by the control module; in this embodiment, the wafer calibrating mechanism 5 has a support for placing the wafer 60 The seat 51, the center of the seat 51 is provided with a through hole, an imaging unit 52 is arranged above the seat 51, and a suction head 53 with a vacuum suction hole (which can suck the wafer 60) is arranged below the through hole, The suction head 53 can be driven by a transposing mechanism 54 to perform movements such as lifting and pivoting.

In addition, a loading mechanism 6 can be provided within the movable range of the second robotic arm 2 as required. The loading mechanism 6 can be a loading box (or an external loading device), which has a capacity for accommodating wafers inside. 60 load space and mechanism.

In the embodiments disclosed in the figures of this application, a lifting mechanism 61 can be provided under the feeding mechanism 6 (feeding box) as required, and the lifting mechanism 61 can drive the feeding mechanism 6 to raise or lower the position.

Please refer to FIGS. 3 to 22, it can be seen that when the above structure of the present invention is in operation, the sliding seat 331 of the sliding mechanism 33 is first moved out along the sliding guide rail 332 to carry at least two wafers. The carrier tray 3 of the tray 31 is placed on the pivot seat 333 of the sliding mechanism 33;

Then, the sliding seat 331 moves inward along the sliding guide 332 to below the outer cover 32 , and one of the wafer trays 31 is positioned under the recess 321 to be exposed.

Then, the first robotic arm 1 drives the image grabbing component 11 to move to the main calibration mechanism 4 (as shown in FIG. 3 ) to adjust and correct the image range obtained by the image grabbing component 11 to the correct position.

When the first robotic arm 1 drives the image-grabbing assembly 11 to approach above the main calibration mechanism 4, the lower image-capturing assembly 42 directly obtains the position of the standard scale 431 on the transparent sheet 43, and the main calibration mechanism 4 uses the measurement The laser beam 411 generated from the laser light source 41 is projected onto the image grabbing element 11 to measure the distance of the image grabbing element 11 to adjust the lens focal length of the lower image capturing element 42; and the image grabbing element 11 passes through The upper image capturing element 111 obtains the position of the standard scale 431 on the transparent sheet 43, and the control module compares the position of the standard scale 431 obtained by the lower image capturing element 42 with the position of the standard scale 431 obtained by the image capturing element 11 The position of the image grabbing unit 11 is adjusted by the first robotic arm 1 so that the position of the standard scale 431 obtained by the lower image capturing unit 42 and the image of the standard scale 431 obtained by the upper image capturing unit 111 are superimposed , and then the control module memorizes the coordinates of the correct image capturing range of the image grabbing component 11 , so as to achieve the purpose of correcting the image capturing range of the image grabbing component 11 .

The first robot arm 1 drives the positioning surface 121 of the wafer positioner loading and unloading mechanism 12 to move to the main calibration mechanism 4 (as shown in FIG. 4 ) to adjust and correct the working position of the wafer positioning member loading and unloading mechanism 12 , and the control module can compare and memorize the relative position coordinates between the working position of the wafer positioning member loading and unloading mechanism 12 and the image range obtained by the image grabbing component 11 .

When the first robotic arm 1 drives the wafer positioning member loading and unloading mechanism 12 to approach above the main calibration mechanism 4, the main calibration mechanism 4 uses the laser light generated by the ranging laser light source 41 to project onto the positioning surface 121, It is used to measure the distance of the wafer positioning member loading and unloading mechanism 12 to adjust the lens focal length of the lower image pickup assembly 42; and the lower image pickup assembly 42 can observe the standard scale 431 on the transparent sheet 43 and the positioning surface 121. The position difference between the positioning scales 122 (or holes), and the control module drives the wafer positioning member loading and unloading mechanism 12 through the first robot arm 1 to adjust the position, so that the positioning scale 122 (or The position of the hole) overlaps with the standard scale 431, so that the working position of the wafer positioning member loading and unloading mechanism 12 can be corrected to the correct position.

The first robot arm 1 drives the image grabbing unit 11 to move above the carrier tray 3 (as shown in FIG. 5 ), so as to confirm the position of the wafer tray 31 and inspect the wafer tray that does not hold the wafer 60 Condition on 31 (whether there are residual wafer 60 chips or fragments).

The control module refers to the relative position coordinates, drives the wafer positioner loading and unloading mechanism 12 to approach the wafer tray 31 through the first robotic arm 1 , and uses the control module to drive the wafer positioning member loading and unloading through the first robotic arm 1 The mechanism 12 adjusts the position, so that the laser beams of the same length generated by the at least two (at least three) laser light sources 124 can be projected on the wafer disk 31 together, so that the positioning surface 121 is aligned (parallel to) the After the wafer tray 31 (as shown in FIG. 6) is unlocked, the wafer positioning member 311 preset on the periphery of the wafer tray 31 is unlocked, and the wafer positioning member 311 is taken out by the clamping member 123 and maintained Clamping state (as shown in Figures 7 and 8).

The second robot arm 2 drives the wafer pick-and-place mechanism 21 to move to the main calibration mechanism 4 (as shown in FIG. 9 , the wafer calibration mechanism 5 is not shown in order to facilitate the inspection of the main calibration mechanism 4 ) , to correct the position of the wafer pick-and-place mechanism 21 .

When the second robotic arm 2 drives the wafer pick-and-place mechanism 21 to be close to the main calibration mechanism 4 , the main calibration mechanism 4 uses the laser light generated by the ranging laser light source 41 to project the wafer pick-and-place mechanism to the wafer pick-and-place mechanism 4 . 21 is used to measure the distance of the wafer pick-and-place mechanism 21 to adjust the lens focal length of the lower image pickup assembly 42; and the lower image pickup assembly 42 can observe the standard scale 431 on the transparent sheet 43 and the wafer The position difference between the indication scales 211 on the pick-and-place mechanism 21, and the control module drives the wafer pick-and-place mechanism 21 through the second robotic arm 2 to adjust the position, so that the indication on the wafer pick-and-place mechanism 21 The scale 211 and the standard scale 431 are overlapped, so that the working position of the wafer pick-and-place mechanism 21 can be corrected to the correct position.

The second robotic arm 2 drives the wafer pick-and-place mechanism 21 to move to the feeding mechanism 6 to take out the wafer 60 to be processed (as shown in FIG. 10 ), and place the wafer 60 in the wafer calibration on the seat 51 of the mechanism 5 (as shown in Fig. 11).

The imaging unit 52 of the wafer calibration mechanism 5 first obtains the code and the position of the notch of the wafer 60 to be processed (as shown in FIG. 12 ), and then the control module determines the position of the notch to be placed in the wafer tray 31 according to the position of the notch. Calculate the angle that the wafer 60 needs to be adjusted, and the suction head 53 is driven by the transposing mechanism 54 to suck the wafer 60 up (separate from the support seat 51 ), and rotate the wafer 60 to make the wafer 60 The notch is adjusted to the correct angle; then the transposing mechanism 54 drives the suction head 53 to suck the wafer 60 down, so as to place the wafer 60 back on the holder 51 .

The second robot arm 2 drives the wafer pick-and-place mechanism 21 to take the wafer 60 with the correct notch angle from the holder 51 of the wafer alignment mechanism 5 and place the wafer on the carrier tray 3 plate 31 (as shown in Fig. 13).

The first robot arm 1 drives the image grabbing component 11 to move onto the carrier tray 3 (as shown in FIG. 14 ), and obtains the image of the wafer 60 placed in the previous step to confirm whether the wafer 60 is complete and is placed in the correct location.

The first robot arm 1 drives the wafer positioning member loading and unloading mechanism 12 to combine the wafer positioning member 311 held by the clamping member 123 on the wafer tray 31 (as shown in FIG. 15 ), and accordingly The wafer positioning member 311 is pressed against the periphery of the wafer 60 to form positioning (as shown in FIG. 16 ).

Then, the pivot seat 333 drives the carrier tray 3 to rotate, so that the wafer tray 31 on which the wafers 60 have been placed is rotated under the cover 32, and another wafer tray 31 without the wafer 60 is moved to the The underside of the concave notch 321 of the outer cover 32 is exposed, so that the above steps can be repeated in sequence to fix the different wafers 60 to be processed on the respective wafer trays 31; After carrying the wafer 60 to be processed, the sliding seat 331 of the sliding mechanism 33 slides outward along the sliding guide rail 332 so as to move the carrier tray 3 to the next process.

After the processing of each wafer 60 to be processed is completed, the sliding seat 331 of the sliding mechanism 33 moves outward along the sliding guide rail 332, and the carrier tray 3 carrying at least two wafer trays 31 is placed on the sliding mechanism On the pivot seat 333 of the 33, and on each wafer tray 31, the processed wafers 60 are respectively fixed by the wafer positioning members 311; then, the sliding seat 331 moves inward along the sliding guide 332 to Under the cover 32 , one of the wafer trays 31 is exposed under the recess 321 .

The first robot arm 1 drives the image grabbing unit 11 to move above the carrier tray 3 (as shown in FIG. 17 ), so as to confirm the position of the wafer tray 31 and inspect the condition on the wafer tray 31 (wafers 60 is intact and not broken).

The control module refers to the relative position coordinates, drives the wafer positioner loading and unloading mechanism 12 to approach the wafer tray 31 through the first robotic arm 1 , and uses the control module to drive the wafer positioning member loading and unloading through the first robotic arm 1 The mechanism 12 adjusts the position so that the at least two (at least three) laser light sources 124 can project the same length of laser light on the wafer disk 31, so that the positioning surface 121 is aligned (parallel to) The wafer tray 31 (as shown in FIG. 18 ) is unlocked from the wafer positioning member 311 pre-set on the periphery of the wafer tray 31 , and the wafer positioning member 311 is taken out by the clamping member 123 . Maintain the clamped state (as shown in Figure 19).

The second robotic arm 2 drives the wafer pick-and-place mechanism 21 to move to the wafer tray 31 of the carrier tray 3 (exposed under the recess 321 ) to suck the wafer 60 (as shown in FIG. 20 ); and The wafer 60 is placed on the holder 51 of the wafer calibration mechanism 5, the code of the wafer 60 is read by the imaging unit 52 (as shown in FIG. 21), and recorded by the control module The encoding of the processed wafer 60 .

The second robotic arm 2 drives the wafer pick-and-place mechanism 21 to remove the wafer 60 from the holder 51 , and cooperates with the lift mechanism 61 to drive the lift mechanism 6 to lift and lower the processed wafer 60 . Put it into the material holding space of the material feeding mechanism 6 (as shown in Figure 22).

Then, the pivot base 333 drives the carrier tray 3 to rotate, so that the wafer tray 31 from which the wafer 60 has been taken out is rotated under the housing 32, and another wafer tray 31 carrying the wafer 60 is moved to the housing The underside of the concave notch 321 of 32 is exposed, so that the above steps can be repeated in sequence to move the processed wafers 60 on different wafer trays 31 to the loading mechanism 6 respectively; After all the processed wafers 60 have been taken out, the sliding seat 331 of the sliding mechanism 33 slides outward along the sliding guide rail 332, so as to take out the empty tray 3, and take out the other one with the processed wafers. The carrier tray 3 of 60 is placed on the pivot seat 333 .

To sum up the above, the device for placing and unloading the wafer tray of the present invention can indeed achieve the functions of reducing labor costs and improving the displacement efficiency of wafers on the wafer tray, which is novel and progressive. Therefore, it is proposed to apply for a new type patent according to the law; only the content of the above description is only the description of the preferred embodiment of the present invention, citing any changes, modifications, changes or equivalent replacements extended by the technical means and scope of the present invention All of them should also fall within the scope of the patent application of the present invention.

Claims (14)

1. A device for loading and unloading a wafer carrier, comprising at least: a first manipulator connected to and driven by a control module, at least one image grabbing component is disposed on the movable end of the first manipulator; a second manipulator, connected and driven by the control module, and a wafer pick-and-place mechanism is arranged on the movable end of the second manipulator; a carrier tray, disposed within the movable range of the first and second robotic arms, connected to and driven by the control module, and at least one wafer tray for holding wafers is arranged on the carrier tray; a wafer calibration mechanism, disposed within the movable range of the second robotic arm, connected to and driven by the control module, for reading the code of the inserted wafer and adjusting the gap of the wafer; a main calibration mechanism, disposed within the movable range of the first and second manipulators, and connected to and driven by the control module for calibrating the positions of the image grabbing component and the wafer pick-and-place mechanism respectively; A feeding mechanism is arranged within the movable range of the second mechanical arm. 2 . The device for loading and unloading a wafer carrier as claimed in claim 1 , wherein each wafer is respectively fixed on the wafer via a lockable wafer positioning member, and the first robot arm There is also a wafer positioning member loading and unloading mechanism on the movable end of the wafer positioning member. 3 . The device for loading and unloading a wafer carrier as claimed in claim 2 , wherein the image grabbing component has an upper imaging component capable of generating illumination light, the main calibration mechanism has a lower imaging component, and the image capturing component has a lower imaging component in the A transparent sheet is arranged above the lower image pickup assembly, and a standard scale as a positioning reference is arranged on the transparent sheet; the wafer positioning member loading and unloading mechanism has a positioning surface, and a positioning scale is arranged on the positioning surface; the wafer pick and place The mechanism has a wafer suction cup capable of sucking wafers, and an indication scale is arranged on the wafer suction cup. 4 . The device for loading and unloading a wafer carrier as claimed in claim 3 , wherein the loading and unloading mechanism for the wafer positioning member is provided with at least two laser light sources on the outer side of the positioning surface. 5 . 5 . The device for loading and unloading a wafer carrier as claimed in claim 3 , wherein the main calibration mechanism is provided with a distance measuring laser light source beside the lower image pickup assembly. 6 . 6. The device for loading and unloading a wafer carrier according to claim 1, 2, 3, 4 or 5, wherein the loading mechanism is a loading box with a receiving space inside, and the loading box is provided with On an elevating mechanism, the elevating mechanism is connected and driven by the control module to adjust the height of the magazine. 7. The device for loading and unloading a wafer carrier according to claim 1 or 2 or 3 or 4 or 5, wherein the carrier is disposed on a sliding mechanism, and the sliding mechanism has a sliding seat , the sliding seat can move along at least two parallel extending sliding guide rails, and a pivot seat for supporting the carrier plate is arranged on the sliding seat. 8 . The device for loading and unloading a wafer carrier as claimed in claim 6 , wherein the carrier is disposed on a sliding mechanism, and the sliding mechanism has a sliding seat, and the sliding seat can move along at least The two parallel extending sliding guide rails move, and the sliding seat is provided with a pivot seat for receiving the carrier plate. 9 . The device for loading and unloading a wafer carrier as claimed in claim 7 , wherein a cover is provided above the carrier, and a concave notch is formed on the cover, so that a part of the wafer on the carrier can be exposed to the outside. 10 . exposed. 10 . The device for loading and unloading a wafer carrier as claimed in claim 8 , wherein a cover is provided above the carrier, and a concave notch is formed on the cover, so that a part of the wafer on the carrier can be exposed to the outside. 11 . exposed. 11. The device for loading and unloading a wafer carrier according to claim 1 or 2 or 3 or 4 or 5, wherein the wafer calibration mechanism has a seat for placing wafers, and the wafer calibration mechanism has a seat on which the wafer can be placed. An imaging unit is arranged above the seat. 12 . The device for loading and unloading a wafer carrier as claimed in claim 6 , wherein the wafer alignment mechanism has a support seat for placing wafers, and an imaging unit is arranged above the support seat. 13 . . 13 . The device for loading and unloading a wafer carrier as claimed in claim 7 , wherein the wafer calibration mechanism has a support seat for placing wafers, and an imaging unit is arranged above the support seat. 14 . . 14 . The device for loading and unloading a wafer carrier as claimed in claim 8 , wherein the wafer alignment mechanism has a seat for placing wafers, and an imaging unit is arranged above the seat. 15 . .

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