CN211428168U - Optical sensing devices and electronic equipment - Google Patents

Abstract

The application discloses an optical sensing device and an electronic device. The optical sensing device comprises an image sensing chip and a lens module. The image sensing chip comprises a plurality of pixel units, a light source and a light source, wherein the pixel units are used for receiving light beams, converting the received light beams into corresponding electric signals, and defining one side surface of the image sensing chip, which is used for sensing the light beams, as a photosensitive surface. The lens module includes: a plurality of first lenses disposed on the image sensing chip, the plurality of first lenses being spaced apart from each other and each facing a plurality of the pixel units, the plurality of first lenses being for converging light beams to the plurality of pixel units; and a light shielding part disposed on the image sensing chip, the light shielding part being located in an interval region between the plurality of first lenses, the light shielding part being configured to shield a light beam. The electronic equipment comprises the optical sensing device.

Description

Optical sensing devices and electronic equipment

technical field

The present application relates to the field of optoelectronic technology, and in particular, to an optical sensing device having an ultra-thin size and an electronic device having the optical sensing device.

Background technique

With the advancement of technology and the improvement of people's living standards, users require more functions and stylish appearance for electronic devices such as mobile phones, tablet computers, and cameras. At present, the development trend of electronic devices such as mobile phones is to have a high screen ratio and to have functions such as fingerprint detection. In order to achieve a full-screen or near-full-screen effect and make electronic devices have a high screen-to-body ratio, under-screen fingerprint detection technology came into being. Since the internal space of electronic devices such as mobile phones is limited, and the imaging device using traditional lenses to realize optical imaging takes up a large space due to its large size and volume, it is necessary to provide a device for imaging with a small volume.

Utility model content

In view of this, the present application provides an optical sensing device and electronic device that can solve or improve the problems of the prior art.

The present application provides an optical sensing device, including:

The image sensor chip includes a plurality of pixel units, the pixel units are used to receive light beams and convert the received light beams into corresponding electrical signals, and define the surface of one side of the image sensor chip used for sensing light beams as photosensitive face; and

Lens module, including:

A plurality of first lenses are disposed on the image sensor chip, the plurality of first lenses are spaced apart from each other, and each first lens faces the plurality of the pixel units, and the plurality of first lenses are used for condensing the light beam to the plurality of pixel units; and

a light-shielding part, disposed on the image sensor chip, the light-shielding part is located in the interval area between the plurality of first lenses, the light-shielding part is used for shielding the light beam, wherein the light-shielding part faces away from the The highest point of the image sensor chip is higher than the highest point of the first lens facing away from the image sensor chip, or, the highest point of the light shielding portion facing away from the image sensor chip is opposite to the highest point of the first lens. The highest point of the image sensor chip is flush, or the highest point of the light shielding part facing away from the image sensor chip is lower than the highest point of the first lens facing away from the image sensor chip but not higher than the highest point of the first lens facing away from the image sensor chip. below 10 microns.

In some embodiments, the highest height of the light shielding portion relative to the photosensitive surface is not lower than the highest height of the first lens relative to the photosensitive surface; or, the highest height of the light shielding portion relative to the photosensitive surface It is lower than the highest height of the first lens relative to the photosensitive surface, and the height difference between the highest height of the first lens relative to the photosensitive surface and the highest height of the light shielding portion relative to the photosensitive surface is not more than 10 microns .

In some embodiments, an area of the plurality of pixel units that can receive light beams through the first lens is defined as an effective photosensitive area, and each effective photosensitive area is respectively facing one of the first lenses, transparent The light beam passing through the first lens is condensed to an effective photosensitive area opposite to the first lens.

In some embodiments, the light shielding portion is used to prevent part or all of the light beams passing through one of the first lenses from being transmitted to the effective photosensitive area facing adjacent or other first lenses.

In some embodiments, the light-shielding part includes a blocking wall and a light-shielding layer, the blocking wall is located between the image sensor chip and the light-shielding layer, and the light-shielding layer is used to shield the light beam.

In some embodiments, the blocking wall and the first lens are made of the same light-transmitting material.

In some embodiments, the light-shielding part includes a blocking wall and a light-shielding layer, the light-shielding layer is formed on the image sensor chip and has a plurality of openings exposing the photosensitive surface, the plurality of first A lens is formed above the light-shielding layer, the first lens is opposite to one of the openings and overlaps with the edge portion of the light-shielding layer, and the blocking wall is formed on the light-shielding layer and located on the first lens spaced area between, wherein the light shielding layer and the blocking wall are used for shielding the light beam.

In some embodiments, for the light shielding portion located between two adjacent first lenses and between the two adjacent first lenses: the light shielding portion is not at the highest point facing away from the image sensor chip. The highest point lower than the two adjacent first lenses facing away from the image sensor chip, or the highest point of the light shielding portion facing away from the image sensor chip is lower than the two adjacent first lenses. The highest point of a lens facing away from the image sensor chip but not less than 10 microns can prevent part or all of the light beams passing through one of the first lenses from being transmitted to the other first lens The effective photosensitive area that is facing.

In some embodiments, the highest height of the blocking wall to the photosensitive surface is higher than the highest height of the first lens to the photosensitive surface.

In some embodiments, the highest height of the light shielding portion relative to the photosensitive surface is higher than the highest height of the first lens relative to the photosensitive surface by any value from 5 micrometers to 100 micrometers.

In some embodiments, the highest height of the light shielding portion relative to the photosensitive surface is higher than the highest height of the first lens relative to the photosensitive surface by any value from 5 micrometers to 10 micrometers.

In some embodiments, the pitch between adjacent first lenses is any value between 300 microns and 500 microns.

In some embodiments, the plurality of first lenses are arranged in an array, and the plurality of pixel units are arranged in an array.

In some embodiments, the lens module further includes a first substrate, the first substrate includes opposite upper and lower surfaces, one side of the upper surface is above the first substrate, the lower surface One side of the surface is below the substrate, the image sensor chip is located below the first substrate; the plurality of first lenses and the light shielding portion are arranged on the upper surface of the first substrate, The image sensor chip and the lens module are fixed by dispensing glue.

In some embodiments, the optical sensing device further includes a plurality of second lenses located between the plurality of first lenses and the plurality of pixel units, and the plurality of second lenses are located between the plurality of first lenses and the plurality of pixel units, and the A plurality of second lenses are directly opposite to the plurality of pixel units, and the plurality of second lenses are used for condensing light beams to the plurality of pixel units.

In some embodiments, air is spaced between the second lens and the first substrate, and the refractive index of the second lens is greater than the refractive index of air.

In some embodiments, the optical sensing device further includes a filter layer disposed above the plurality of pixel units, the filter layer is used to transmit light beams in a target wavelength band and filter out light beams outside the target wavelength band , the plurality of pixel units are used for receiving the light beams of the target wavelength band, and converting the light beams of the target wavelength band into corresponding electrical signals.

In some embodiments, the optical sensing device further includes a filter layer disposed above the plurality of pixel units, the filter layer is used to transmit the light beam of the target wavelength band and filter out the second preset wavelength band The light shielding part is used to filter out the light beam of the first preset wavelength band, wherein the first preset wavelength band and the second preset wavelength band are completely different, completely or partially the same.

In some embodiments, when the first preset wavelength band is partially the same as the second preset wavelength band, the first preset wavelength band includes the second preset wavelength band.

In some embodiments, the first preset wavelength band includes a visible light band and a near-infrared light band, and the second preset wavelength band includes a near-infrared light band.

In some embodiments, the area of the orthographic projection of the area of the effective photosensitive region on the first substrate is smaller than the area of the orthographic projection of the first lens on the first substrate.

In some embodiments, the plurality of second lenses are arranged in an array, the plurality of first lenses are of the same size, the plurality of second lenses are of the same size, and some of the plurality of first lenses or All face each of the plurality of second lenses.

In some embodiments, the optical sensing device further includes a support structure supported between the image sensing chip and the first substrate.

In some embodiments, the optical sensing device further includes a reinforcing plate and a flexible circuit board, the flexible circuit board is provided with an opening, and the image sensor chip is provided on the flexible circuit board The image sensor chip is electrically connected to the flexible circuit board, and is fixed with the reinforcing plate.

In some embodiments, the image sensor chip converts the received light beam into a corresponding electrical signal to obtain the biometric information of the external object, or the optical sensing device is used for sensing the biometric information of the external object .

In some embodiments, the plurality of first lenses are spherical lenses or aspherical lenses.

In some embodiments, the plurality of second lenses are spherical lenses or aspherical lenses.

In some embodiments, the filter layer is formed on the upper surface and the lower surface of the first substrate, respectively.

The present application also provides an electronic device, which includes a display screen and the optical sensing device described in any one of the above, the display screen is used to display a picture, and the optical sensing device is arranged on the display screen The lower part is used to receive the light beam returned by the external object through the display screen to perform biometric information sensing.

The beneficial effect of the present application is that the lens module of the optical sensing device includes a plurality of first lenses for condensing light beams to the photosensitive module, and the plurality of first lenses have smaller sizes than the large lenses in the prior art The thickness of the optical sensing device is reduced, and the focal length is reduced, so that the optical sensing device has a compact and small volume and size, and can be used in electronic equipment with limited internal space.

Further, the lens module further includes a light shielding portion disposed in the spaced area between the plurality of first lenses, and the highest point of the light shielding portion facing away from the image sensor chip is higher than the first lens The highest point facing away from the image sensor chip, or the highest point of the light shielding portion facing away from the image sensor chip is flush with the highest point of the first lens facing away from the image sensor chip, or , the highest point of the light shielding part facing away from the image sensor chip is lower than the highest point of the first lens facing away from the image sensor chip but not lower than 10 microns, so as to avoid or reduce the crosstalk of the light beam, Improve sensing accuracy.

The optical sensing device can be used as an ultra-thin camera, and in addition, it can also be applied under a display screen to realize optical information detection under the screen.

Description of drawings

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device of the present application.

FIG. 2 is a partial exploded schematic diagram of the optical sensing device according to the first embodiment of the present application.

Fig. 3 is an enlarged schematic partial cross-sectional view of the optical detection device shown in Fig. 2 along the line II-II'.

FIG. 4 shows the respective imaging diagrams of the large lens of the prior art and the first lens of the present application.

5 is a schematic plan view and a partial cross-sectional schematic view of the optical sensing device according to the first embodiment of the present application.

6 is a partial cross-sectional schematic diagram of an optical sensing device according to a second embodiment of the present application.

FIG. 7 is a partial cross-sectional schematic diagram of an optical sensing device according to a third embodiment of the present application.

FIG. 8 is a partial cross-sectional schematic diagram of an optical sensing device according to a fourth embodiment of the present application.

FIG. 9 is a partial cross-sectional schematic diagram of an optical sensing device according to a fifth embodiment of the present application.

FIG. 10 is a partial cross-sectional schematic diagram of an optical sensing device according to a sixth embodiment of the present application.

FIG. 11 is a partial cross-sectional schematic diagram of an optical sensing device according to a seventh embodiment of the present application.

Detailed ways

In the detailed description of embodiments of the present application, it will be understood that when a substrate, sheet, layer or pattern is referred to as being "on" or "under" another substrate, sheet, layer or pattern, it It may be "directly" or "indirectly" on another substrate, another sheet, another layer or another pattern, or one or more intervening layers may also be present. The thickness and size of each layer in the drawings of the specification may be exaggerated, omitted or schematically represented for the purpose of clarity. Furthermore, the sizes of elements in the drawings do not fully reflect actual sizes.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

Further, the described features and structures may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to enable a thorough understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical solutions of the present application may be practiced without one or more of the specific details, or with other structures, components, and the like. In other instances, well-known structures or operations have not been shown or described in detail to avoid obscuring the focus of this application.

Please refer to FIG. 1 , which is a schematic structural diagram of an embodiment of an electronic device of the present application. The electronic device 1000 includes an optical sensing device 1 and a display screen 2 . The display screen 2 is used for displaying pictures. The optical sensing device 1 is located below the display screen 2, and is used to receive the light beam returned by the external object through the display screen 2, and convert the received light beam into a corresponding electrical signal to perform corresponding information sensing. The optical sensing device 1 is, for example, used to perform biometric information sensing, and the biometric information includes, for example, but not limited to, fingerprint information, palm print information and other texture feature information, and/or blood oxygen information, heartbeat information , pulse information and other living information. However, the present application is not limited to this, and the optical sensing device 1 can also be used to perform other information sensing, for example, to perform depth information sensing, proximity sensing and the like. In this application, the optical sensing device 1 performs biometric information sensing as an example for description. The display screen 2 is, for example, but not limited to, an OLED display screen or an LCD display screen. The display screen 2 can be used as an excitation light source to provide a light beam for detection, or an excitation light source is additionally provided in the electronic device 1000 to provide a light beam for detection.

The electronic device 1000 is, for example, but not limited to, consumer electronic products, household electronic products, vehicle-mounted electronic products, financial terminal products and other suitable types of electronic products. Among them, the consumer electronic products are, for example, mobile phones, tablet computers, notebook computers, desktop monitors, all-in-one computers, and the like. Examples of household electronic products are smart door locks, TVs, refrigerators, and the like. The in-vehicle electronic products are, for example, an in-vehicle navigator, an in-vehicle DVD, and the like. The financial terminal products are, for example, ATM machines, terminals for self-service business, and the like.

It should be noted in advance that, in this application, the optical sensing device 1 has multiple different embodiments, and for the sake of clarity, the optical sensing device 1 in the different embodiments are respectively marked with different symbols 1a, 1b, 1c, 1d, 1e, 1f, 1g are marked for distinction. Further, for the convenience of description, the same reference numerals in different embodiments of the optical sensing device 1 may represent the same elements, or may represent similar elements that can be modified, replaced, expanded, or combined.

Please refer to FIG. 2 and FIG. 3 together. FIG. 2 is a partial exploded schematic diagram of the optical sensing device 1 a according to the first embodiment of the present application. Fig. 3 is an enlarged schematic partial cross-sectional view of the optical detection device 1a shown in Fig. 2 along the line II-II'. The optical sensing device 1 a includes a lens module 10 and a photosensitive module 20 located below the lens module 10 . The lens module 10 is used for condensing light beams to the photosensitive module 20 . The photosensitive module 20 is used for converting the received light beams into corresponding electrical signals.

The lens module 10 includes a plurality of first lenses 110 and a light shielding portion 111 . The plurality of first lenses 110 and the light shielding portion 111 are disposed on the photosensitive module 20 . The plurality of first lenses 110 are spaced apart from each other. The plurality of first lenses 110 are used for condensing light beams onto the photosensitive module 20 . The light shielding portion 111 is disposed in a spaced area between the plurality of first lenses 110 and is higher than the first lenses 110 in height. The light shielding portion 111 is used for shielding the light beam.

Optionally, the lens module 10 further includes a first substrate 12 . The first substrate 12 includes an upper surface 121 and a lower surface 122 opposite to each other, one side of the upper surface 121 is above the first substrate 12 , and one side of the lower surface 122 is the side of the first substrate 12 . below. The lens module 20 is disposed below the first substrate 12 and faces the lower surface 122 . The plurality of first lenses 110 and the light shielding portion 111 are disposed on the upper surface 121 of the first substrate 12 . The highest height of the light shielding portion 111 relative to the first surface 121 is higher than the highest height of the first lens 110 relative to the first surface 121 .

Optionally, the upper surface 121 or/and the lower surface 122 of the first substrate 12 are flat. Further optionally, the upper surface 121 and the lower surface 122 are planes parallel to each other.

Optionally, the first substrate 12 is a transparent substrate, such as, but not limited to, a transparent glass substrate or a transparent resin substrate.

Of course, alternatively, in some embodiments, the first substrate 12 can also be omitted.

Optionally, when the first substrate 12 is omitted, the first connection layer 41 may also be omitted. The lens 110 is formed on the photosensitive module 20 by an embossing process, so that the thickness of the optical sensing device 1a is thinner because the first substrate 12 and the first connection layer 41 are saved.

Optionally, the plurality of first lenses 110 are arranged in a regular array. Further optionally, the plurality of first lenses 110 are, for example but not limited to, arranged in a rectangular array. Of course, alternatively, in some embodiments, the plurality of first lenses 110 may also be irregularly arranged.

Optionally, the light shielding portion 111 is only located between some adjacent first lenses 110 , or the light shielding portion 111 is disposed between any adjacent first lenses 110 .

Optionally, the height of the light shielding portion 111 is higher than the first lens 110 by any value from 5 micrometers to 100 micrometers. Further optionally, the height of the light shielding portion 111 is higher than the first lens 110 by any value between 5 micrometers and 10 micrometers. However, the present application is not limited to this, as long as the light shielding portion 111 is higher than the first lens 110 in height, it should fall within the protection scope of the present application.

Optionally, the plurality of first lenses 110 are convex lenses. Further optionally, the plurality of first lenses 110 are spherical lenses or aspherical lenses.

Optionally, the plurality of first lenses 110 are made of transparent materials. The transparent material is, for example, but not limited to, transparent acrylic resin, transparent glass, UV glue material, and the like.

Optionally, the plurality of first lenses 110 are identical, for example. Of course, alternatively, in some embodiments, the plurality of first lenses 110 may not be exactly the same.

The photosensitive module 20 includes a plurality of pixel units 212 . The plurality of pixel units 212 are configured to receive light beams through the lens module 10 and convert the received light beams into corresponding electrical signals to obtain corresponding biometric information of the external object 1001 (see FIG. 1 ). The external object 1001 is, for example, but not limited to, the user's finger, palm, and the like. The pixel unit 212 includes, for example, but not limited to, a photodiode and the like.

Optionally, the plurality of pixel units 212 are arranged in a regular array. Of course, alternatively, in some embodiments, the plurality of pixel units 212 may also be irregularly arranged.

Optionally, each of the first lenses 110 faces a plurality of the pixel units 212 respectively. Of course, alternatively, in some embodiments, the plurality of first lenses 110 may also face the plurality of pixel units 212 one-to-one.

Compared with each first lens 110 facing only one pixel unit 212, each first lens 110 facing a plurality of pixel units 212 in the embodiment of the present application can increase the photosensitive area. The accuracy is higher than the sensing accuracy of the former.

An area of the plurality of pixel units 212 that can receive light beams through the first lens 110 is defined as an effective photosensitive area 211 . The effective photosensitive area 211 can convert light beams into corresponding electrical signals.

Optionally, each effective photosensitive area 211 faces one of the first lenses 110 respectively. The light beam passing through the first lens 110 is condensed to the effective photosensitive area 211 which is opposite to the first lens 110 . The effective photosensitive regions 211 facing each of the first lenses 110 are arranged at intervals. The area of the effective photosensitive region 211 is smaller than the area of the orthographic projection of the first lens 110 on the photosensitive surface 210 .

Optionally, the light beams can reach a plurality of the pixel units 212 respectively after being converged by each of the first lenses 110 . That is, the effective photosensitive area 211 includes a plurality of areas where the pixel units 212 are located.

The light shielding portion 111 is higher than the first lens 110 in height, so that part or all of the light beam 101 passing through the first lens 110 will not be transmitted to the adjacent or other first lens 110 opposite. Effective photosensitive area 211 .

Optionally, the plurality of pixel units 121 are integrated in an image sensor chip (Die) 21 . Further optionally, the thickness of the image sensor chip 21 may be about 100 microns.

A side surface of the image sensor chip 21 capable of sensing light beams is defined as a photosensitive surface 210 , and the lens module 10 is located on the photosensitive surface 210 . The highest height from the light shielding layer 111 to the photosensitive surface 210 is higher than the highest height from the first lens 110 to the photosensitive surface 210 .

Optionally, a first connection layer 41 is disposed between the photosensitive module 20 and the lens module 10, and the first connection layer 14 is, for example, but not limited to, DAF (die attach film), solid glue, liquid glue, Optical glue, or any other suitable adhesive. The first connection layer 41 fills and covers the opposite part between the lens module 10 and the photosensitive module 20 .

Optionally, the optical sensing device 1a further includes a filter layer 13 . The filter layer 13 is disposed above the plurality of pixel units 212 .

In some embodiments, the filter layer 13 is used to transmit light beams in the target wavelength band and filter out light beams outside the target wavelength band, thereby reducing the interference of stray light on the sensing accuracy. The light beam of the target wavelength band is, for example, visible light.

Alternatively, in other embodiments, the filter layer 13 is used to filter out the light beam of the second preset wavelength band, and the light shielding portion 111 is used to filter out the light beam of the first preset wavelength band, wherein the first preset wavelength band is used. A preset band is completely different, completely or partially the same as the second preset band.

When the first preset wavelength band is partially the same as the second preset wavelength band, the first preset wavelength band includes the second preset wavelength band. For example, the first preset wavelength band includes a visible light band and a near-infrared light band, and the second preset wavelength band includes a near-infrared light band. The filter layer 13 is, for example, an infrared cut filter.

In some embodiments, the filter layer 13 is disposed on the photosensitive module 20 , or/and the filter layer 13 is disposed on the lens module 10 . Specifically, for example, the filter layer 13 is disposed on the plurality of first lenses 110 and the light shielding layer 111 . Alternatively, the filter layer 13 is disposed on the upper surface 121 and/or the lower surface 122 of the first substrate 12 . Alternatively, the filter layer 13 and the plurality of pixel units 212 are integrated in the image sensor chip 21 .

In particular, when the filter layer 13 is formed on the upper surface 121 and the lower surface 122 of the first substrate 12 respectively, the tension of the filter layer 13 on the upper surface 121 and the lower surface 122 of the first substrate 12 The influences of factors such as these are approximately the same, so that the problem of warpage of the optical sensing device 1a due to being too thin can be reduced to a certain extent.

Optionally, the filter layer 13 is formed on the photosensitive surface 210 of the image sensor chip 21 by, for example, an evaporation process.

Optionally, the thickness of the filter layer 13 is 1 μm to 5 μm.

Optionally, the optical sensing device 1 a further includes a second substrate 30 located below the photosensitive module 20 . The second substrate 30 is used, for example, to provide support for the photosensitive module 20 and to electrically connect with external circuits. The second substrate 30 is, for example, a flexible circuit board or a rigid circuit board.

Optionally, the optical sensing device 1a further includes a second connection layer 42 located between the photosensitive module 20 and the second substrate 30 , and the second connection layer 42 is used to connect the photosensitive module 20 and the second substrate 30 . For the second substrate 30 , the second connection layer 42 is located between the photosensitive module 20 and the second substrate 30 and covers the opposite part between the photosensitive module 20 and the second substrate 30 .

Please refer to FIG. 3 again, FIG. 3 shows two adjacent first lenses 110, the corresponding optical centers are G1 and G2 respectively, and the distance LP between the optical centers G1 and G2 is the pitch (Pitch) . Optionally, the pitch may be any value from 300 microns to 500 microns, for example, but not limited to, the pitch may be 350 microns, 400 microns, and 450 microns.

Optionally, the maximum width LR or diameter of the first lens 110 is, for example, but not limited to, 100 microns.

The first lens 110 includes a curved surface 1101 capable of condensing the light beam 101 entering the first lens 110 . Optionally, in some embodiments, the first lens 110 may be a small lens (mini-lens), and the small lens includes the curved surface 1101 and a lens bottom surface 1102 connected to the curved surface, and the curved surface 1102 The surface 1101 is a convex surface, and the bottom surface 1102 of the lens is located on the upper surface 121 of the first substrate 12 . For example, but not limited to, the sagittal height H1 of the small lens may be 20 microns, the bottom surface 1102 of the lens may be a circle with a diameter of 100 microns to 150 microns, and the curved surface 1101 may be a spherical surface with a radius of 80 microns to 100 microns.

Optionally, the light-shielding portion 111 includes a blocking wall 1111 and a light-shielding layer 1112 . The blocking walls 1111 are located in the spaced regions between the plurality of first lenses 110 . The light shielding layer 1112 is located above the blocking wall 1111 and covers the spaced area between the first lenses 110 . The light shielding layer 1112 is used for shielding the light beam 101 . For example, the light shielding layer 1112 prevents the light beam 101 from passing through the spaced area between the first lenses 110 .

Optionally, the blocking wall 1111 and the first lens 110 may be made of the same transparent material. The transparent material is, for example, but not limited to, transparent acrylic resin, transparent glass, UV glue material, and the like. The blocking wall 1111 and the first lens 110 can be formed at one time through an embossing process. Therefore, the technological production process can be shortened, the production efficiency can be improved, and the product cost can be reduced.

FIG. 3 is only an example, in an actual product, the blocking wall 1111 and the first lens 110 may be integrated. There is no disconnection between the blocking wall 1111 and the plurality of first lenses 110, and they are integrally formed of the same material.

When the first substrate 12 and the first connection layer 41 are omitted, the image sensor chip 21 serves as a carrier substrate, and the plurality of first lenses 110 and the blocking walls 1111 in the lens module 10 are, for example, However, it is not limited to be formed on the image sensor chip 21 by an imprinting process. Due to the imprinting process, the manufacturing cost of the optical sensing device 1a is low.

Of course, alternatively, in some embodiments, the blocking wall 1111 and the plurality of first lenses 101 can also be made of different materials, and the blocking wall 1111 and the plurality of first lenses 101 A lens 101 can also be formed separately and successively. This application does not make any restrictions on this.

Optionally, the material of the light shielding layer 1112 is an opaque resin material or other opaque materials, and the light beam 101 cannot pass through the light shielding layer 1112 . Optionally, the light shielding layer 1112 can be made by coating, spraying, vapor deposition, embossing or other suitable processes, and its thickness can be 1 micrometer to 5 micrometers.

Optionally, a height H2 of the blocking wall 1111 relative to the upper surface 121 is greater than a height H1 of the first lens 110 relative to the upper surface 121 .

Taking two adjacent first lenses 110 and the light shielding portion 111 disposed between the two adjacent first lenses 110 as an example for description, the light shielding portion 111 is used to allow transmission through one of the first lenses 110 . Part or all of the light beam 101 of the first lens 110 will not reach the effective photosensitive area 211 facing the other first lens 110 .

However, alternatively, in some embodiments, the light shielding layer 1112 is omitted, and the blocking wall 1111 is made of an opaque material.

The retaining walls 1111 may have different structures, positions or numbers, all of which should fall within the protection scope of the present application.

In the present application, the light shielding portion 111 is higher than the first lens 110 in height, so that part or all of the light beams passing through the first lens 110 will not be transmitted to the adjacent or the rest of the first lens 110 . An effective photosensitive area 211 facing the lens 110 . Therefore, the mutual interference of the light beams can be reduced or avoided, and the sensing accuracy can be improved. In addition, since the light shielding portion 111 is higher than the first lens 110 in height, when pressure is applied to the lens module 10 from top to bottom, the light shielding portion 111 can bear all or most of the pressure, and the first lens 110 does not Deformation or breakage due to pressure will not affect optical imaging.

For example, but not limited to, when the filter layer 13 is formed on the lower surface 122 of the first substrate 12, when the lens module 10 and the photosensitive module 20 are connected, and when the photosensitive module 20 and the second substrate 30 are connected, the lens module may be affected. 10. Apply pressure. Since the shielding portion 111 is higher than the first lens 110, the first lens 110 will not be damaged due to the pressure.

Of course, alternatively, in some embodiments, the light shielding portion 111 may also be flush with the first lens 110 or lower than the first lens 110 in height. For example, the highest height of the light shielding portion 111 relative to the photosensitive surface 210 is equal to or lower than the highest height of the first lens 110 relative to the photosensitive surface 210 .

Optionally, when the light shielding portion 111 is all lower than the first lens 110 in height, the first lens 110 cannot be higher than the light shielding portion 111 by 10 micrometers, for example. In this way, the interference after the light beam passes through each of the first lenses 110 is small and the luminous flux is high, so that the sensing accuracy can be improved.

For example, the difference between the highest height of the first lens 110 relative to the photosensitive surface 210 and the highest height of the light shielding portion 111 relative to the photosensitive surface 210 is not greater than 10 microns.

For example, the highest point of the light shielding portion 111 facing away from the image sensor chip 21 is higher than the highest point of the first lens 110 facing away from the image sensor chip 21 , or the light shielding portion 111 facing away from the image sensor chip 21 The highest point of the image sensor chip 21 is flush with the highest point of the first lens 110 facing away from the image sensor chip 21 , or the light shielding portion 111 is facing away from the highest point of the image sensor chip 21 . It is lower than the highest point of the first lens 110 facing away from the image sensor chip 21 but not lower than 10 microns.

Please refer to FIG. 4 . FIG. 4 shows the respective imaging diagrams of the large lens 1002 of the prior art and the first lens 110 of the present application. The light incident surface of the large lens 1002 is a convex surface of a single lens. In the embodiment of the present application, the first lens 110 of the optical sensing device 1a adopts a small lens (Mini-lens). The curved surfaces 1101 of the plurality of first lenses 110 of the optical sensing device 1a also serve as light incident surfaces. It should be noted that the lenses described in this application document all refer to convex lenses. The focal length of the lens may be determined based on the viewing angle of the electronic device 1000 and the size of the lens. For example, when the viewing angle is fixed, the focal length may increase in proportion to the size of the lens.

Taking fingerprint detection as an example, in order to obtain sufficient fingerprint characteristic information, the large lens 1002 and the small lens 110 need to focus and image the light beams in the detection area VA. For example, but not limited to, the detection area VA may be a rectangular area of 4 mm*4 mm to 10 mm*10 mm, or the detection area VA may be a circle with a diameter greater than or equal to 4 mm and less than or equal to 10 mm, of course, the detection area The VA may have other configurations, which are not limited in this embodiment of the present application.

The diameter of the large lens 1002 in the prior art can generally be 1 mm or more, while the diameter of the first lens 110 in the present application can be 100 microns, which is only 1/10 of the diameter of the large lens 1002 . The focal length of 110 is less than the focal length of large lens 1002 . In addition, in the optical sensing device 1a, each different first lens 110 is used to collect a part of the detection area VA, respectively. For example, as shown in FIG. 4 , three different first lenses 110 are respectively used for converging and imaging the light beams 101 passing through the sub-detection regions V1 , V2 and V3 , and the sub-detection regions V1 , V2 and V3 are the detection regions. The partial regions of VA, the sub-detection regions V1, V2, V3 may have overlapping or non-overlapping. In contrast, the large lens 1002 of the prior art needs to focus and image the light beam 101 passing through the entire detection area VA. When the viewing angle is basically the same, the distance between the optical center of the first lens 110 and the detection area VA is smaller than the distance between the optical center of the large lens 1002 and the detection area VA, and the optical center of the first lens 110 and the photosensitive surface of the photosensitive module 20 The distance 210 is smaller than the distance between the optical center of the large lens 1002 and the photosensitive surface 210 of the image sensor chip 21 .

Therefore, the distance from the detection area VA in the prior art to the photosensitive surface 210 of the image sensor chip 21 is greater than the distance between the detection area VA and the image sensor chip 21 when the optical sensing device 1a is used for fingerprint detection in the embodiment of the present application The distance from the photosensitive surface 210. It can be seen that, compared with the prior art, the optical sensing device 1a of the present application has a more compact and small volume and size, and can be used in electronic devices 1000 with stricter requirements on internal space occupation, such as mobile phones, Tablets, smart watches, etc. The thickness of the module of the optical sensing device 1a of the present application (the thickness from the blocking wall 1111 to the second substrate 30 in FIG. 3 ) can be within 0.5 mm, for example, 0.4 mm, 0.35 mm or less. The detection device 1a can be used as an ultra-thin camera, or applied under the display screen 2 (see FIG. 1 ) to realize under-screen optical biometric detection.

Please refer to FIG. 5 . FIG. 5 is a schematic top view and a partial cross-sectional view of the optical sensing device 1 a. Reference numeral PA in FIG. 5 denotes a pixel area where a plurality of pixel units 212 (see FIG. 3 ) of the image sensor chip 21 are located, and reference numeral BA denotes a peripheral area of the image sensor chip 21 . The peripheral area BA is located around the pixel area PA. The optical sensing device 1 a further includes wires 22 , and the image sensor chip 21 is electrically connected to the second substrate 30 through the wires 22 . The second substrate 30 can be electrically connected to an external integrated circuit. The first connection layer 41 of the optical sensing device 1 a is located between the lens module 10 and the photosensitive module 20 , and basically covers the opposite surface between the lens module 10 and the image sensor chip 21 . The second connection layer 42 of the optical sensing device 1 a connects the image sensing chip 21 and the second substrate 30 .

Please refer to FIG. 6 , which is a partial cross-sectional schematic diagram of an optical sensing device 1 b according to a second embodiment of the present application. The structures of the optical sensing device 1b and the optical sensing device 1a are basically the same, and the main difference between the two is that the first connection layer 41a of the optical sensing device 1b is located on the lens module 10 and the image sensor chip 21 between and facing the edge portion of the lens module 10 and the image sensor chip 21 . There is air 1003 between the lens module 10 and the image sensor chip 21 . The first connection layer 41a is formed between the lens module 10 and the edge portion of the image sensor chip 21 by, for example, but not limited to, a glue dispensing process.

Please refer to FIG. 7 , which is a partial cross-sectional schematic diagram of an optical sensing device 1 c according to a third embodiment of the present application. The structures of the optical sensing device 1c and the optical sensing device 1a are basically the same, and the main difference between the two is that the first connection layer 41b of the optical sensing device 1c is connected to at least part of the outer edge of the lens module 10, On part of the peripheral area BA, part of the outside of the edge of the image sensor chip 21 , and the upper surface of the second substrate 30 (ie, the surface of the side of the second substrate 30 adjacent to the image sensor chip 21 ). At this time, the lens module 10 and the image sensor chip 21 are facing and in direct contact with each other. The first connection layer 41b is made by, for example, but not limited to, a glue dispensing process.

Alternatively, if a part of the edge of the lens module 10 extends beyond the edge of the image sensor chip 21, the first connection layer 41b can be connected to at least part of the outside of the edge of the lens module 10, part of the peripheral area BA, and the first connection layer 41b. The upper surfaces of the two substrates 30 .

Please refer to FIG. 8 , which is a partial cross-sectional schematic diagram of the optical sensing device 1 d according to the fourth embodiment of the present application. The structures of the optical sensing device 1d and the optical sensing device 1b are basically the same, and the main difference between the two is that the photosensitive module 20 further includes a support structure 23 disposed between the image sensor chip 21 and the lens module 10 . The support structure 23 is located above the plurality of pixel units 212 (see FIG. 3 ) of the image sensor chip 21 , and the support structure 23 is disposed opposite to the spaced area of the first lens 110 . The support structure 23 can be made of transparent or opaque material, the support structure 23 is used to maintain a certain gap (gap) between the lens module 10 and the image sensor chip 21, and the support structure 23 can to support. The support structure 23 can also be used to maintain the distance between the lens module 10 and the image sensor chip 21 , so that the lens module 10 will not have an obvious one side higher and the other side lower relative to the image sensor chip 21 . situation.

Please refer to FIG. 9 , which is a partial cross-sectional schematic diagram of an optical sensing device 1 e according to a fifth embodiment of the present application. The structures of the optical sensing device 1e and the optical sensing device 1a are basically the same, and the main difference between the two is that the flexible circuit board 50 of the optical sensing device 1e has an opening 51, and the photosensitive module 20 is disposed there. On the reinforcing plate 30 c , the lens module 10 and the photosensitive module 20 are located in the opening 51 . Since there is no flexible circuit board 50 between the photosensitive module 20 and the reinforcing plate 30c, the overall thickness (or height) of the optical sensing device 1e is relatively small.

Optionally, the thickness of the flexible circuit board 50 is 0.1 mm, and the thickness of the optical sensing device 1c can be reduced by 0.1 mm compared to the flexible circuit board 50 without the opening 51 . Optionally, the reinforcing plate 30c is a metal substrate, such as but not limited to: an aluminum substrate, a stainless steel substrate, and the like.

Please refer to FIG. 10 . FIG. 10 is a partial cross-sectional schematic diagram of the optical sensing device 1 f according to the sixth embodiment of the present application. For the convenience of description, the structures of the optical sensing device 1f and the optical sensing devices 1a to 1e are substantially the same, and the main difference is that the lens module 10a of the optical sensing device 1f is the same as the optical sensing device 1f. The structures of the lens modules 10 of the measuring devices 1a to 1e are different.

The light shielding portion 111a of the lens module 10a includes a light shielding layer 1112a and a blocking wall 1111a. The light shielding layer 1112 a is located between the blocking wall 1111 a and the upper surface 121 of the first substrate 12 . An opening K exposing the upper surface 121 is formed on the light shielding layer 1112a, and the first lens 110 is formed above the opening K and overlaps with the edge portion of the light shielding layer 1112a. The blocking wall 1111a is formed directly above the light shielding layer 1112a, and both the blocking wall 1111a and the light shielding layer 1112a are used to shield light beams. The blocking wall 1111a prevents part or all of the light beam 101 passing through one of the first lenses 110 from being transmitted to the effective photosensitive area 211 facing the adjacent or other first lenses 110 .

In this embodiment, the blocking wall 1111a itself is made of a material that cannot transmit the light beam 101 . The material of the light shielding layer 1112b is an opaque resin material or other opaque materials, and the light beam 101 cannot pass through the light shielding layer 1112b.

Optionally, the light shielding layer 1112a may be formed on the first substrate 12 by an evaporation process, and then an opening K corresponding to the arrangement position of the first lens 110 is formed by a photolithography process, and the opening K exposes the The upper surface 121 of the first substrate 12 . Then, the first lens 110 and the blocking wall 1111a are formed through multiple photolithography processes.

It should be noted that the shielding of light beams in the present application may be absorbing and/or reflecting light beams. Optionally, blocking the light beam may include the transmittance of the light beam being less than 10%, 5%, 1%, or equal.

The light shielding portion 111a is higher than the first lens 110 in height. For example, the highest height of the light shielding portion 111 a relative to the photosensitive surface 210 is higher than the highest height of the first lens 110 relative to the photosensitive surface 210 .

Of course, alternatively, in some embodiments, the light shielding portion 111a may also be flush with the first lens 110 or lower than the first lens 110 in height. For example, the highest height of the light shielding portion 111 a relative to the photosensitive surface 210 is equal to or lower than the highest height of the first lens 110 relative to the photosensitive surface 210 .

Optionally, when the light shielding portion 111a is all lower than the first lens 110 in height, the first lens 110 is, for example, not higher than the light shielding portion 111a by 10 micrometers. In this way, the interference after the light beam passes through each of the first lenses 110 is small and the luminous flux is high, so that the sensing accuracy can be improved.

For example, the difference between the highest height of the first lens 110 relative to the photosensitive surface 210 and the highest height of the light shielding portion 111a relative to the photosensitive surface 210 is not greater than 10 microns.

Please refer to FIG. 3 and FIG. 11 together. FIG. 11 is a partial cross-sectional schematic diagram of an optical sensing device 1 g according to a seventh embodiment of the present application. The optical sensing device 1g may have substantially the same structure as the optical sensing devices 1a to 1f of the above-mentioned embodiments, and the main difference is that the photosensitive module 20 of the optical sensing device 1g further includes a plurality of first Two lenses 213 . The plurality of second lenses 213 are disposed between the image sensor chip 21 and the lens module 10 . The plurality of second lenses 213 are used for condensing light beams to the image sensor chip 21 . The area of the orthographic projection of the second lens 213 on the first substrate 12 of the lens module 10 (see FIG. 3 ) is smaller than the area of the orthographic projection of the first lens 110 on the first substrate 12 . The focal length of the second lens 213 is smaller than the focal length of the first lens 110 .

Optionally, the plurality of second lenses 213 are arranged in a regular array, for example, in a rectangular array. Of course, alternatively, in some embodiments, the plurality of second lenses 213 may also be irregularly arranged. Further optionally, the plurality of second lenses 213 are the same and are all convex lenses.

Optionally, the second mirror 213 is made of, for example, a transparent material. The transparent material is, for example, but not limited to, transparent acrylic resin, transparent glass, UV glue material, and the like.

Preferably, the second lens 213 is a micro lens. The plurality of second lenses 213 are directly opposite to the plurality of pixel units 212 (see FIG. 3 ). Each of the first lenses 110 faces a plurality of the pixel units 212 and/or a plurality of the second lenses 213 .

Optionally, the area occupied by each microlens 213 is not larger than the area occupied by a single pixel unit 212 .

However, alternatively, in some embodiments, the plurality of second lenses 213 may also face the plurality of first lenses 110 one by one, and face the plurality of pixel units 212 respectively. Alternatively, the plurality of first lenses 110 and the plurality of pixel units 212 face each other one-to-one, and the plurality of second lenses 213 face the plurality of first lenses 110 one-to-one. As long as the area of the orthographic projection of the second lens 213 on the first substrate 12 is smaller than the area of the orthographic projection of the first lens 110 on the first substrate 12 the scope of protection of this application.

Optionally, the first connection layer 41 a allows air 1003 between the lens module 10 and the image sensor chip 21 . There is a space 1002 between the second mirror 213 and the lens module 10 . Since the refractive indices of the air 1001 and the second lens 213 are different, the light beam is refracted when entering the second lens 213 from the air 1003 . The second lens 213 is a convex lens, and the light beam 101 is refracted and collected by the second lens 213 , and more light beams 101 can be received by the pixel unit 212 , thereby having better optical imaging quality.

However, as shown in FIG. 5 , the first connection layer 41 can also be formed between the lens module 10 and the image sensor chip 21 in place of the first connection layer 41 a, and the first connection layer 41 directly contacts and covers There is no air between the plurality of second lenses 213 , the lens module 10 and the image sensor 21 .

Alternatively, as shown in FIG. 7 , the first connection layer 41b may be formed on the outer edges of the lens module 10 and the image sensor chip 21 in place of the first connection layer 41a.

It should be noted that some or all of the structures, functions, and methods of the embodiments of the present application may be applied to other or modified embodiments, and are not limited to the correspondingly described embodiments, and all the embodiments thus obtained belong to the protection of the present application scope. In addition, in the embodiment of the present application, the light beam may be visible light or invisible light, and the invisible light may be, for example, near-infrared light. "Overlap", "coincidence" and "overlap" that may appear in the description of this application should be understood as having the same meaning and can be replaced with each other.

It should be noted that those skilled in the art can understand that, without creative efforts, part or all of the embodiments of the present application, as well as some or all of the modifications, replacements, changes, splits, combinations, Expansion, etc., shall be considered to be covered by the inventive idea of the present application and belong to the protection scope of the present application.

Any reference in this specification to "one embodiment," "an embodiment," "an example embodiment," etc. means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. The appearances of such phrases in various places in this specification are not necessarily all referring to the same embodiment. Additionally, when a particular feature or structure is described in conjunction with any embodiment, it is claimed that it is within the skill of those skilled in the art to implement such feature or structure in conjunction with other embodiments of those embodiments.

"Length", "width", "upper", "lower", "left", "right", "front", "rear", "back", "front", "vertical" may appear in the specification of this application "," "horizontal", "top", "bottom", "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and The description is simplified rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application. Like numerals and letters refer to like items in the figures, so once an item is defined in one figure, no further definition and explanation are required in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of this application, "plurality" or "plurality" means at least two or two, unless expressly and specifically defined otherwise. In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, "arrangement", "installation" and "connection" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrally connected; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. should be covered within the scope of protection of this application. The terms used in the claims should not be construed to limit the application to the specific embodiments disclosed in this specification. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims (29)

1. An optical sensing device, characterized in that, comprising: The image sensor chip includes a plurality of pixel units, the pixel units are used to receive light beams and convert the received light beams into corresponding electrical signals, and define the surface of one side of the image sensor chip used for sensing light beams as photosensitive face; and Lens module, including: A plurality of first lenses are disposed on the image sensor chip, the plurality of first lenses are spaced apart from each other, and each first lens faces the plurality of the pixel units, and the plurality of first lenses are used for condensing the light beam to the plurality of pixel units; and a light-shielding part, disposed on the image sensor chip, the light-shielding part is located in the interval area between the plurality of first lenses, the light-shielding part is used for shielding the light beam, wherein the light-shielding part faces away from the The highest point of the image sensor chip is higher than the highest point of the first lens facing away from the image sensor chip, or, the highest point of the light shielding portion facing away from the image sensor chip is opposite to the highest point of the first lens. The highest point of the image sensor chip is flush, or the highest point of the light shielding part facing away from the image sensor chip is lower than the highest point of the first lens facing away from the image sensor chip but not higher than the highest point of the first lens facing away from the image sensor chip. below 10 microns. 2 . The optical sensing device according to claim 1 , wherein the highest height of the light shielding portion relative to the photosensitive surface is not lower than the highest height of the first lens relative to the photosensitive surface; or, 2 . The highest height of the light shielding portion relative to the photosensitive surface is lower than the highest height of the first lens relative to the photosensitive surface, and the highest height of the first lens relative to the photosensitive surface is the same as the light shielding portion relative to the photosensitive surface. The height difference of the highest height of the photosensitive surface is not more than 10 microns. 3 . The optical sensing device according to claim 1 , wherein an area of the plurality of pixel units capable of receiving light beams through the first lens is defined as an effective photosensitive area, and each effective photosensitive area is defined as an effective photosensitive area. 4 . The areas are respectively opposite to the first lens, and the light beams passing through the first lens are condensed to the effective photosensitive area opposite to the first lens. 4 . The optical sensing device according to claim 3 , wherein the light shielding portion is used to prevent part or all of the light beams passing through the first lens from being transmitted to adjacent or the rest. 5 . The effective photosensitive area that the first lens faces. 5 . The optical sensing device according to claim 1 , wherein the light-shielding portion comprises a blocking wall and a light-shielding layer, and the blocking wall is located between the image sensor chip and the light-shielding layer. 6 . The light shielding layer is used for shielding the light beam. 6 . The optical sensing device of claim 5 , wherein the blocking wall and the first lens are made of the same light-transmitting material. 7 . 7 . The optical sensing device according to claim 1 , wherein the light-shielding portion comprises a blocking wall and a light-shielding layer, and the light-shielding layer is formed on the image sensor chip and has the function of exposing the photosensitive sensor. 8 . A plurality of openings on the surface, the plurality of first lenses are formed above the light shielding layer, the first lenses are opposite to one of the openings and overlap with the edge portion of the light shielding layer, and the blocking wall is formed on The light shielding layer is located on the spaced area between the first lenses, wherein the light shielding layer and the blocking wall are used for shielding light beams. 8 . The optical sensing device according to claim 3 , wherein, for the light shielding portion located between two adjacent first lenses and between the two adjacent first lenses: the light shielding portion is located in the The highest point facing away from the image sensor chip is not lower than the highest point of the two adjacent first lenses facing away from the image sensor chip, or the light shielding portion facing away from the image sensor chip The highest point is lower than the highest point of the two adjacent first lenses facing away from the image sensor chip but not lower than 10 microns, so that part of the light beam passing through one of the first lenses or All will not be transmitted to the effective photosensitive area facing the other first lens. 9 . The optical sensing device according to claim 5 , wherein the highest height from the blocking wall to the photosensitive surface is higher than the highest height from the first lens to the photosensitive surface. 10 . 10 . The optical sensing device of claim 2 , wherein the highest height of the light shielding portion relative to the photosensitive surface is higher than the highest height of the first lens relative to the photosensitive surface by 5 microns. 11 . to any value within 100 microns. 11 . The optical sensing device of claim 10 , wherein the highest height of the light shielding portion relative to the photosensitive surface is higher than the highest height of the first lens relative to the photosensitive surface by 5. 11 . Any number from microns to 10 microns. 12 . The optical sensing device according to claim 5 or 7 , wherein the pitch between adjacent first lenses is any value between 300 μm and 500 μm. 13 . 13 . The optical sensing device of claim 1 , wherein the plurality of first lenses are arranged in an array, and the plurality of pixel units are arranged in an array. 14 . 14 . The optical sensing device of claim 3 , wherein the lens module further comprises a first substrate, the first substrate comprises opposite upper and lower surfaces, one side of the upper surface is 14 . is above the first substrate, one side of the lower surface is below the substrate, the image sensor chip is located below the first substrate; the plurality of first lenses and the light shielding portion It is arranged on the upper surface of the first substrate, and the image sensor chip and the lens module are fixed by dispensing glue. 15 . The optical sensing device of claim 14 , wherein the optical sensing device further comprises a plurality of second lenses, the second lenses are located between the first lenses and the first lenses. 16 . Between the plurality of pixel units, the plurality of second lenses face the plurality of pixel units one by one, and the plurality of second lenses are used for condensing light beams to the plurality of pixel units. 16 . The optical sensing device of claim 15 , wherein air is spaced between the second lens and the first substrate, and a refractive index of the second lens is greater than that of air. 17 . 17. The optical sensing device according to claim 1 or 14, wherein the optical sensing device further comprises a filter layer disposed above the plurality of pixel units, and the filter layer is used for The plurality of pixel units are used to receive the light beams of the target wavelength band and convert the light beams of the target wavelength band into corresponding electrical signals by passing through the light beams of the target wavelength band and filtering out the light beams of the target wavelength band. 18. The optical sensing device of claim 14, wherein the optical sensing device further comprises a filter layer disposed above the plurality of pixel units, and the filter layer is used to transmit The light beam of the target wavelength band and the light beam of the second preset wavelength band are filtered out, and the light shielding part is used to filter out the light beam of the first preset wavelength band, wherein the first preset wavelength band is completely different from the second preset wavelength band or identical or partially identical. 19 . The optical sensing device of claim 18 , wherein when the first preset wavelength band is partially the same as the second preset wavelength band, the first preset wavelength band includes the first preset wavelength band. 20 . Two preset bands. 20 . The optical sensing device of claim 19 , wherein the first preset wavelength band includes a visible light band and a near-infrared light band, and the second preset wavelength band includes a near-infrared light band. 21 . 21 . The optical sensing device according to claim 14 , wherein the area of the orthographic projection of the area of the effective photosensitive region on the first substrate is smaller than the area of the orthographic projection of the first lens on the first substrate. 22 . The area of the orthographic projection on it. 22. The optical sensing device of claim 15, wherein the plurality of second lenses are arranged in an array, the plurality of first lenses are of the same size, and the plurality of second lenses are of the same size , some or all of the plurality of first lenses face the plurality of second lenses respectively. 23. The optical sensing device of claim 14 or 15, wherein the optical sensing device further comprises a support structure supported between the image sensing chip and the first substrate. 24. The optical sensing device according to claim 1, wherein the optical sensing device further comprises a reinforcing plate and a flexible circuit board, the flexible circuit board is provided with an opening, the The image sensor chip is arranged in the opening of the flexible circuit board and is fixed with the reinforcing plate, and the image sensor chip is electrically connected to the flexible circuit board. 25. The optical sensing device of claim 1, wherein the image sensing chip converts the received light beam into a corresponding electrical signal to obtain biometric information of an external object, or the optical sensing The detection device is used to sense the biometric information of the external object. 26. The optical sensing device of claim 1, wherein the plurality of first lenses are spherical lenses or aspherical lenses. 27. The optical sensing device of claim 15, wherein the plurality of second lenses are spherical lenses or aspherical lenses. 28. The optical sensing device of claim 18, wherein the filter layer is formed on the upper surface and the lower surface of the first substrate, respectively. 29. An electronic device, characterized in that: the electronic device comprises a display screen and the optical sensing device according to any one of the preceding claims 1-28, the display screen is used to display a picture, the optical The type sensing device is arranged under the display screen, and is used for receiving the light beam returned by the external object through the display screen, so as to perform biometric information sensing.

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