CN211227301U - Evaporation devices, evaporation sources and deposition systems for evaporation source materials - Google Patents
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Abstract
本文描述的实施方式涉及一种用于蒸发源材料(150)的蒸发装置(100),所述蒸发装置包括蒸发坩埚(110)和支撑布置(120),所述支撑布置(120)具有多个材料托盘(125),所述多个材料托盘(125)用于在所述多个材料托盘(125)上布置源材料。所述支撑布置(120)可去除地放置在所述蒸发坩埚(110)的内部体积(115)中。本文描述的实施方式还涉及一种蒸发源(200)和一种具有蒸发装置(100)的沉积系统(300)。
Embodiments described herein relate to an evaporation apparatus (100) for evaporating a source material (150), the evaporation apparatus comprising an evaporation crucible (110) and a support arrangement (120) having a plurality of A material tray (125) on which source material is arranged. The support arrangement (120) is removably placed in the interior volume (115) of the evaporation crucible (110). Embodiments described herein also relate to an evaporation source (200) and a deposition system (300) having an evaporation device (100).
Description
技术领域technical field
本公开的实施方式涉及一种用于蒸发源材料的蒸发装置,一种具有蒸发装置的蒸发源,以及一种用于在基板上沉积蒸发的源材料的沉积系统。本文描述的实施方式还涉及一种用于蒸发待沉积到基板上的源材料的方法。具体地,本文描述的实施方式涉及一种用于蒸发待在沉积系统中沉积到基板上的源材料 (例如有机源材料)的蒸发装置。Embodiments of the present disclosure relate to an evaporation apparatus for evaporating a source material, an evaporation source having an evaporation apparatus, and a deposition system for depositing evaporated source material on a substrate. Embodiments described herein also relate to a method for evaporating a source material to be deposited on a substrate. In particular, embodiments described herein relate to an evaporation apparatus for evaporating source material (eg, organic source material) to be deposited on a substrate in a deposition system.
背景技术Background technique
用于在基板上沉积材料层的技术包括例如热蒸发、物理气相沉积(PVD)和化学气相沉积(CVD)。经涂覆的基板可用于各种应用和不同的技术领域。例如,经涂覆的基板可用于有机发光二极管(OLED)器件领域。OLED可用于制造电视屏幕、计算机监视器、移动电话、其他手持设备和类似物以显示信息。OLED 是一种特殊类型的发光二极管,其中发光层包括某些有机化合物的薄膜。OLED 显示器可能的颜色、亮度和视角范围大于传统LCD显示器,因为OLED像素直接发光并且不需要背光。因此,OLED显示器的能耗远低于传统LCD显示器的能耗。此外,OLED可以制造到柔性基板上的事实导致了进一步的应用。Techniques for depositing layers of materials on substrates include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates can be used in a variety of applications and in different technical fields. For example, coated substrates can be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used to make television screens, computer monitors, mobile phones, other handheld devices and the like to display information. An OLED is a special type of light-emitting diode in which the light-emitting layer includes thin films of certain organic compounds. OLED displays have a wider range of possible colors, brightness and viewing angles than conventional LCD displays because OLED pixels emit light directly and do not require a backlight. Therefore, the energy consumption of OLED displays is much lower than that of conventional LCD displays. Furthermore, the fact that OLEDs can be fabricated onto flexible substrates leads to further applications.
OLED设备,诸如OLED显示器,可以包括位于被沉积在基板上的两个电极之间的一个或多个有机材料层。例如,OLED显示器可以包括以形成具有可单独激励的像素的矩阵显示面板的方式沉积在基板上的层。OLED通常放置在两个玻璃面板之间,并且玻璃面板的边缘被密封以将OLED封装在其中。OLED devices, such as OLED displays, can include one or more layers of organic material between two electrodes deposited on a substrate. For example, an OLED display may include layers deposited on a substrate in a manner to form a matrix display panel with individually actuable pixels. The OLED is usually placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED within.
OLED器件的制造中遇到了许多挑战。OLED显示器包括几种通常在真空系统中蒸发的材料的堆叠。有机材料通常以由掩模限定的预定图案沉积。对于 OLED制造,共沉积或共蒸发两种或更多种材料(例如,主材料和掺杂剂)以导致混合/掺杂层是有益的。必须考虑用于蒸发非常敏感的有机材料的几种工艺条件。Many challenges are encountered in the fabrication of OLED devices. OLED displays include stacks of several materials that are typically evaporated in a vacuum system. The organic material is typically deposited in a predetermined pattern defined by a mask. For OLED fabrication, it is beneficial to co-deposit or co-evaporate two or more materials (eg, host material and dopant) to result in a mixed/doped layer. Several process conditions must be considered for evaporating very sensitive organic materials.
在处理期间,基板可支撑在载体上,所述载体被配置为保持基板与掩模对准。通过掩模将来自蒸发源的蒸汽朝向基板引导,以在基板上产生图案化的膜。可以经由一个或多个掩模在基板上沉积一种或多种材料,以在基板上产生小像素,例如用于提供全色显示。During processing, the substrate may be supported on a carrier configured to keep the substrate aligned with the mask. The vapor from the evaporation source is directed towards the substrate through a mask to produce a patterned film on the substrate. One or more materials may be deposited on the substrate via one or more masks to create small pixels on the substrate, eg, for providing full color display.
可以在包括蒸发坩埚的蒸发装置中蒸发源材料。可以加热蒸发坩埚的内部体积以蒸发源材料。源材料可以以固体或液体形式布置在蒸发坩埚内,例如作为粉末或作为颗粒。难以长时间确保源材料的预定蒸发速率。此外,典型的源材料对温度非常敏感,使得如果源材料长时间暴露于高温,则存在蒸发坩埚中材料分解的风险。The source material can be evaporated in an evaporation apparatus including an evaporation crucible. The interior volume of the evaporation crucible can be heated to evaporate the source material. The source material can be arranged in the evaporation crucible in solid or liquid form, eg as powder or as granules. It is difficult to ensure a predetermined evaporation rate of the source material for a long time. Furthermore, typical source materials are very temperature sensitive, so that if the source material is exposed to high temperatures for a prolonged period of time, there is a risk of decomposition of the material in the evaporation crucible.
鉴于上述,提供一种确保蒸发材料的高品质沉积的改进蒸发装置将为有利的,特别是对于OLED器件的制造。具体地,应当在确保长时间的预定蒸发速率的同时降低材料分解的风险。In view of the above, it would be advantageous to provide an improved evaporation apparatus that ensures high quality deposition of evaporation material, especially for the manufacture of OLED devices. In particular, the risk of material decomposition should be reduced while ensuring a predetermined evaporation rate for a long time.
实用新型内容Utility model content
鉴于上述,提供了一种用于蒸发源材料的蒸发装置,一种蒸发源,一种用于在基板上沉积蒸发的源材料的沉积系统,以及一种用于蒸发源材料的方法。In view of the above, there are provided an evaporation apparatus for evaporating source material, an evaporation source, a deposition system for depositing evaporated source material on a substrate, and a method for evaporating source material.
根据一个方面,提供了一种用于蒸发源材料的蒸发装置。所述蒸发装置包括蒸发坩埚和支撑布置,所述支撑布置具有多个材料托盘,所述多个材料托盘用于在所述多个材料托盘上布置源材料。所述支撑布置可去除地放置在蒸发坩埚的内部体积中。According to one aspect, an evaporation device for evaporating source material is provided. The evaporation apparatus includes an evaporation crucible and a support arrangement having a plurality of material trays for arranging source material on the plurality of material trays. The support arrangement is removably placed in the interior volume of the evaporation crucible.
在另一实施方式中,所述多个材料托盘可一个在另一个上面地布置在所述支撑布置中。In another embodiment, the plurality of material trays may be arranged one above the other in the support arrangement.
在又一实施方式中,所述支撑布置可从所述蒸发坩埚的所述内部体积取出,以便在所述多个材料托盘上再填充源材料。In yet another embodiment, the support arrangement is removable from the interior volume of the evaporation crucible for refilling the plurality of material trays with source material.
在又一实施方式中,所述多个材料托盘可包括四个或更多个材料托盘。In yet another embodiment, the plurality of material trays may include four or more material trays.
在又一实施方式中,所述多个材料托盘可包括八个、十个或更多个材料托盘。In yet another embodiment, the plurality of material trays may include eight, ten or more material trays.
在又一实施方式中,所述多个材料托盘中的一个或多个材料托盘可具有板形状和一个或多个凹槽中的至少一种。In yet another embodiment, one or more of the plurality of material trays may have at least one of a plate shape and one or more grooves.
在又一实施方式中,所述支撑布置可包括框架结构,所述框架结构支撑所述多个材料托盘,并且所述蒸发坩埚可包括导向件,所述框架结构可以沿着所述导向件插入到所述蒸发坩埚的所述内部体积中。In yet another embodiment, the support arrangement may include a frame structure supporting the plurality of material trays, and the evaporation crucible may include guides along which the frame structure may be inserted into the interior volume of the evaporation crucible.
在又一实施方式中,所述蒸发坩埚可基本上是瓶子形状的,并且具有用于所述蒸发的源材料的蒸汽开口。In yet another embodiment, the evaporation crucible may be substantially bottle-shaped and have a vapor opening for the evaporated source material.
在又一实施方式中,所述蒸发装置还可包括用于加热所述蒸发坩埚的所述内部体积的加热单元。In yet another embodiment, the evaporation device may further comprise a heating unit for heating the inner volume of the evaporation crucible.
在又一实施方式中,所述蒸发装置还可包括在所述多个材料托盘上的所述源材料。In yet another embodiment, the evaporation device may further include the source material on the plurality of material trays.
在又一实施方式中,所述源材料可包括有机材料和掺杂剂中的至少一种。In yet another embodiment, the source material may include at least one of an organic material and a dopant.
在又一实施方式中,所述蒸发坩埚可包括用于蒸发的源材料的蒸汽开口,并且屏蔽单元可布置在所述蒸汽开口与所述多个材料托盘之间。In yet another embodiment, the evaporation crucible may include a vapor opening for the evaporated source material, and a shielding unit may be arranged between the vapor opening and the plurality of material trays.
在又一实施方式中,所述屏蔽单元可被配置为减少热辐射通过所述蒸汽开口进入所述蒸发坩埚的所述内部体积。In yet another embodiment, the shielding unit may be configured to reduce thermal radiation from entering the interior volume of the evaporation crucible through the vapor opening.
在又一实施方式中,所述多个材料托盘可一个在另一个上面地布置在所述支撑布置中,并且所述屏蔽单元可布置在所述支撑布置中最上面的材料托盘的上方。In yet another embodiment, the plurality of material trays may be arranged one above the other in the support arrangement, and the shielding unit may be arranged above the uppermost material tray in the support arrangement.
在又一实施方式中,所述多个材料托盘中的两个相邻材料托盘可分别以彼此相距2cm或更远且30cm或更短的距离(D1)布置。In yet another embodiment, two adjacent material trays of the plurality of material trays may be arranged at a distance (D1) of 2 cm or more and 30 cm or less from each other, respectively.
根据一个方面,提供了一种蒸发源。所述蒸发源包括根据本文所述的任何实施方式的蒸发装置。蒸发源还包括与蒸发装置流体连通的蒸汽分配布置,所述蒸汽分配布置包括多个蒸汽出口以用于朝向基板引导蒸发的源材料。According to one aspect, an evaporation source is provided. The evaporation source includes an evaporation device according to any embodiment described herein. The evaporation source also includes a vapor distribution arrangement in fluid communication with the evaporation device, the vapor distribution arrangement including a plurality of vapor outlets for directing the evaporated source material toward the substrate.
在另一实施方式中,所述蒸汽分配布置可包括线性分配管,所述线性分配管可包括多个蒸汽出口(212)并且在基本上竖直的方向上延伸。In another embodiment, the steam distribution arrangement may include a linear distribution tube, which may include a plurality of steam outlets (212) and extend in a substantially vertical direction.
在又一实施方式中,所述蒸发源可包括两个或更多个蒸发装置,所述两个或更多个蒸发装置在公共支撑件上,用于蒸发不同的源材料。In yet another embodiment, the evaporation source may comprise two or more evaporation devices on a common support for evaporating different source materials.
根据一个方面,提供了一种用于在基板上沉积蒸发的源材料的沉积系统。所述沉积系统包括真空腔室;根据本文所述的任何实施方式的蒸发源,所述蒸发源在所述真空腔室中;以及用于沿着源轨道移动蒸发源的第一驱动器和用于改变蒸发源的多个蒸汽出口的蒸发方向的第二驱动器中的至少一个。According to one aspect, a deposition system for depositing evaporated source material on a substrate is provided. The deposition system includes a vacuum chamber; an evaporation source according to any of the embodiments described herein, the evaporation source in the vacuum chamber; and a first drive for moving the evaporation source along a source track and for At least one of the second drives for changing the evaporation direction of the plurality of steam outlets of the evaporation source.
根据一个方面,提供了一种用于蒸发源材料的方法。所述方法包括将源材料布置在支撑布置的多个材料托盘上,然后将支撑布置放置在蒸发坩埚的内部体积中,以及加热蒸发坩埚的内部体积以蒸发源材料。According to one aspect, a method for evaporating a source material is provided. The method includes arranging source material on a plurality of material trays in a support arrangement, then placing the support arrangement in an interior volume of an evaporation crucible, and heating the interior volume of the evaporation crucible to evaporate the source material.
具体地,将源材料布置在多个材料托盘上,同时将具有所述多个材料托盘的支撑布置布置在蒸发坩埚外部,并且随后将所述支撑布置与放置在所述支撑布置上的源材料一起插入到蒸发坩埚的内部体积中。Specifically, the source material is arranged on a plurality of material trays, while a support arrangement with the plurality of material trays is arranged outside the evaporation crucible, and the support arrangement is subsequently arranged with the source material placed on the support arrangement Inserted together into the inner volume of the evaporation crucible.
实施方式还涉及用于执行所公开的方法的设备,并且包括用于执行每个所描述的方法方面的设备部分。这些方法方面可以通过硬件部件、由适当软件编程的计算机、两者的任何组合或以任何其他方式来执行。此外,根据本公开的实施方式还涉及用于操作所描述的装置的方法。所述方法包括用于执行所述装置的各种功能的方法方面。Embodiments also relate to apparatus for performing the disclosed methods, and include portions of apparatus for performing each of the described method aspects. These method aspects may be performed by hardware components, a computer programmed with appropriate software, any combination of the two, or in any other manner. Furthermore, embodiments in accordance with the present disclosure also relate to methods for operating the described apparatus. The method includes method aspects for performing various functions of the apparatus.
附图说明Description of drawings
因此,为了能够详细理解本公开的上述特征,可以参考实施方式对以上简要概述的本公开进行更具体的描述。附图涉及本公开的实施方式,并且在下面描述:Therefore, in order to enable a detailed understanding of the above-described features of the present disclosure, the present disclosure, briefly summarized above, may be described in more detail with reference to the embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below:
图1示出了根据本文所述的实施方式的蒸发装置的示意图;Figure 1 shows a schematic diagram of an evaporation device according to embodiments described herein;
图2示出了图1的蒸发装置在再填充期间的示意图;Figure 2 shows a schematic diagram of the evaporation device of Figure 1 during refill;
图3示出了根据本文所述的实施方式的蒸发源的示意图;3 shows a schematic diagram of an evaporation source according to embodiments described herein;
图4A至图4C示出了根据本文所述的实施方式的沉积系统的三个后续沉积阶段;4A-4C illustrate three subsequent deposition stages of a deposition system according to embodiments described herein;
图5示出了根据本文所述的实施方式用于蒸发源材料的方法的流程图。5 shows a flowchart of a method for evaporating source material according to embodiments described herein.
具体实施方式Detailed ways
现在将详细参考本公开的各种实施方式,所述实施方式的一个或多个示例在附图中示出。在以下附图描述中,相同的附图标记表示相同的部件。仅描述了关于各个实施方式的差异。各个示例通过对本公开的解释来提供,并且不意味着对本公开的限制。此外,被示出或描述为一个实施方式的一部分的特征可以在其他实施方式上使用或与其他实施方式结合使用,以产生另一实施方式。本说明书旨在包括此类修改和变化。Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals refer to the same components. Only the differences with respect to the various embodiments are described. The various examples are provided by way of explanation of the present disclosure and are not meant to limit the present disclosure. Furthermore, features shown or described as part of one embodiment can be used on or in combination with other embodiments to yield another embodiment. This specification is intended to cover such modifications and variations.
图1是根据本文所述的实施方式的用于蒸发源材料150的蒸发装置100的示意图。蒸发装置100包括具有内部体积115的蒸发坩埚110,所述内部体积 115可以经由一个或多个加热单元130而被加热。蒸发坩埚110可用于热蒸发过程,特别是用于加热和蒸发有机材料、无机材料、有机掺杂剂和无机掺杂剂中的至少一种。蒸发装置100还包括多个材料托盘125,所述多个材料托盘125 用于在蒸发坩埚的内部体积115中将源材料150布置在所述多个材料托盘125 上。FIG. 1 is a schematic diagram of an
通过在多个材料托盘125上布置源材料150,源材料150的直接暴露于蒸发坩埚内的热量的表面增大,使得蒸发率与源材料被放置在一个单一隔室中的蒸发坩埚相比可提高。By arranging the
许多源材料,特别是有机源材料和其他待蒸发的材料组合物,是对温度非常敏感的,使得在将源材料长时间暴露于高温时,可能会发生材料分解。特别是对于有机材料,分解温度可能接近材料的蒸发温度,使得蒸发坩埚内的有机材料存在相当大的材料分解风险。例如,当高于源材料的蒸发温度的温度升高几度时,材料分解的风险可能已经显著增大。Many source materials, especially organic source materials and other material compositions to be evaporated, are very temperature sensitive, so that when the source material is exposed to high temperatures for extended periods of time, material decomposition may occur. Especially for organic materials, the decomposition temperature may be close to the evaporation temperature of the material, so that there is a considerable risk of material decomposition for the organic material in the evaporation crucible. For example, when the temperature is raised several degrees above the evaporation temperature of the source material, the risk of material decomposition may have increased significantly.
根据本文所述的实施方式,将源材料放置在蒸发坩埚的内部体积中的多个材料托盘125上,使得直接暴露于蒸发坩埚内的热量的源材料150的表面较大。换句话说,蒸发坩埚内的影响蒸发速率的材料-真空界面增大。不是将源材料整体放置在蒸发坩埚的底部上,而是将源材料放置在蒸发坩埚内的许多托盘上,所述许多托盘可以设置在不同的高度处。因此,可以将蒸发坩埚的内部体积中的温度保持在恰好为源材料的蒸发温度或略高于源材料的蒸发温度,同时仍然提供足够高的蒸发速率。材料分解的风险与源材料容纳在一个单一隔室中的坩埚相比可降低,从而在材料与真空之间提供缩小的界面。具体地,根据本文所述的实施方式,通过增大蒸发坩埚内的材料-真空界面,而不是通过进一步升高蒸发坩埚内的温度,来提高蒸发速率。According to embodiments described herein, the source material is placed on the plurality of
根据本文所述的实施方式,具有多个材料托盘125的支撑布置120可去除地放置在蒸发坩埚的内部体积115中。支撑布置120可包括支撑结构,所述支撑结构在所述支撑结构上支撑有多个材料托盘125,例如一个在另一个上面。支撑布置120是用于将源材料支撑在多个材料托盘上的布置,并且可以被配置为隔板布置,在所述隔板布置中所述多个材料托盘布置为一个在另一个上面。According to embodiments described herein, a
所述支撑布置120可从蒸发坩埚的内部体积115去除,例如通过坩埚开口去除。在从所述内部体积去除支撑布置120之后,可以在多个材料托盘125上再填充待蒸发的源材料。因此,通过将支撑布置120作为整体从蒸发坩埚的内部体积去除并且通过将源材料放置在蒸发坩埚外部的多个材料托盘上,可以快速且容易地用源材料再填充材料托盘125。Said
根据可与本文所述的其他实施方式组合的一些实施方式,所述多个材料托盘125被布置在支撑布置120中一个在另一个上面,例如以堆叠设置布置。支撑布置120可包括支撑结构或框架结构,所述支撑结构或框架结构承载堆叠设置的多个材料托盘125。将材料托盘125一个在另一个上面地放置在支撑布置 120中简化了通过蒸发坩埚去除支撑布置120,并且便于以预定的时间间隔用源材料再填充材料托盘125。According to some embodiments, which may be combined with other embodiments described herein, the plurality of
在可与本文描述的其他实施方式组合的一些实施方式中,支撑布置120可从蒸发坩埚的内部体积115取出,以便在多个材料托盘上再填充源材料。具体地,可以例如通过去除盖子或封闭件而打开蒸发坩埚,并且此后可以从蒸发坩埚的内部体积中取出包括支撑在支撑布置120上的多个材料托盘125的支撑布置120以进行再填充。可以简化和加速材料交换。In some embodiments, which may be combined with other embodiments described herein, the
源材料与蒸发坩埚内的真空之间的界面可增大,从而在支撑布置中提供大量材料托盘。例如,在一些实施方式中,多个材料托盘125可包括四个或更多个材料托盘,具体地六个或更多个材料托盘,更具体地八个或更多个材料托盘,或甚至十个或更多个材料托盘。因此,通过提供可在上面放置源材料的大托盘表面,可以在不升高温度的情况下提高蒸发速率。The interface between the source material and the vacuum within the evaporation crucible can be increased to provide a large number of material trays in the support arrangement. For example, in some embodiments, the plurality of
在一些实施方式中,多个材料托盘125中的两个相邻材料托盘可以分别布置为彼此相距2cm或更远的距离。相邻材料托盘之间的2cm或更远的距离确保提供足够的空间供蒸发材料从材料托盘朝向蒸汽开口111传播,并且可以容易地再填充材料托盘。另外或替代地,多个材料托盘125中的两个相邻材料托盘可以布置为彼此相距30cm或更短的距离。在相邻的材料托盘之间提供30cm 或更短的距离允许将大量材料托盘放置在紧凑的支撑布置中。In some embodiments, two adjacent material trays of the plurality of
在可与本文所述的其他实施方式组合的一些实施方式中,所述多个材料托盘125中的一个或多个材料托盘具有板形状,所述板形状可以是在中心区域中相对于边缘区域凹陷或内缩的。因此,可以增加可以放置在所述一个或多个材料托盘上的源材料的量,因为源材料可以容纳在材料托盘的凹陷或内缩的中心区域内。可以延长再填充支撑布置120的时间间隔,从而延长蒸发装置的正常工作时间(up-time)。在一些实施方式中,所述多个材料托盘中的一个或多个材料托盘具有一个或多个可用源材料填充的凹槽。In some embodiments, which may be combined with other embodiments described herein, one or more of the plurality of
在可与本文所述的其他实施方式组合的一些实施方式中,蒸发坩埚110可以为基本上瓶子形状的并且可具有用于蒸发的源材料151的蒸汽开口111。蒸汽分配组件可以连接到蒸发坩埚并且与蒸发坩埚流体连通。可以通过蒸汽开口111将蒸发的源材料151从蒸发坩埚110引导到蒸汽分配组件中。瓶子形状的坩埚可有利于在蒸发坩埚的内部体积中获得均匀的温度分布并且有利于在朝向蒸汽开口111的方向上均匀地引导蒸发的源材料。In some embodiments, which may be combined with other embodiments described herein, the
蒸发坩埚110可以包括可被打开或去除的盖或壁部分,使得在盖或壁部分打开之后,可从蒸发坩埚110的内部体积去除支撑布置120。The
待蒸发的源材料150可以放置在多个材料托盘125上,具体是在两个或更多个材料托盘上,或甚至在八个或更多个材料托盘上。源材料150可以是在蒸发组件中蒸发并且将沉积在基板上的材料。例如,源材料150可以是用于制造 OLED器件的有机材料和掺杂剂中的至少一种。在一些实施方式中,第二蒸发装置可以放置在蒸发装置100附近,使得有机材料和掺杂剂可以共蒸发。The
图2是在再填充多个材料托盘125期间图1的蒸发装置100的示意图。蒸发装置100的支撑布置120已从蒸发坩埚110的内部体积115中取出。如图2 中示意性描绘的,然后将新的源材料放置在支撑布置120的多个材料托盘125 上。FIG. 2 is a schematic diagram of the
在可与本文所述的其他实施方式组合的一些实施方式中,支撑布置120包括框架结构121,所述框架结构121支撑多个材料托盘125。框架结构121可包括两个或更多个支撑件,例如金属杆,多个材料托盘支撑在所述支撑件上,例如一个在另一个上面。蒸发坩埚110可包括导向件122,框架结构121可沿着所述导向件122插入蒸发坩埚的内部体积115中和/或从蒸发坩埚的内部体积 115去除。导向件122可以被配置为导槽或导轨,所述导槽或导轨被配置为允许将框架结构121引导插入到蒸发坩埚中。导向件122可以确保支撑布置120 在蒸发坩埚的内部体积中的正确定位。例如,导向件122将支撑布置120引导到蒸发坩埚的内部体积中位于两个或更多个加热单元130之间的中心的位置,使得可以确保均匀加热容纳在多个材料托盘上的源材料150。In some embodiments, which may be combined with other embodiments described herein, the
如图2中示意性描绘的,支撑多个材料托盘125的支撑布置120可从蒸发坩埚的内部体积中取出,以便在多个材料托盘上再填充源材料。例如,支撑布置120可以通过蒸发坩埚的顶部开口或底部开口从蒸发坩埚中去除。在再填充之后,支撑布置120可以例如通过顶部开口或底部开口插入在蒸发坩埚的内部体积中,并且蒸发过程可以继续。As schematically depicted in Figure 2, a
图3是根据本文所述的实施方式的蒸发源200的示意图。所述蒸发源200 包括根据本文所述的任何实施方式的蒸发装置。例如,蒸发装置可包括图1的蒸发装置100的一些或全部特征,使得可以参考上述说明,在此不再赘述。FIG. 3 is a schematic diagram of an
蒸发源200的蒸发装置100包括蒸发坩埚110和支撑布置120,所述支撑布置120具有多个材料托盘125,所述多个材料托盘125用于在所述多个材料托盘125上布置源材料。支撑布置120放置在蒸发坩埚110的内部体积中。The
蒸发源200还包括蒸汽分配布置210,例如分配管,所述蒸汽分配布置210 与所述蒸发装置100流体连通。蒸汽分配布置包括多个蒸汽出口212以用于朝向基板10引导在蒸发坩埚中蒸发的源材料。The
例如,蒸发的源材料151可以通过蒸汽开口111离开蒸发坩埚110,并且可以进入蒸汽分配布置210。此后,可以将蒸发的源材料151从蒸汽分配布置 210通过多个蒸汽出口212朝向基板10引导,从而使基板被涂覆。For example, evaporated
在可与本文所述的其他实施方式组合的一些实施方式中,蒸汽分配布置 210包括线性分配管,所述线性分配管包括在所述线性分配管的壁中的多个蒸汽出口212,其中所述线性分配管可以在基本上竖直的方向上延伸。可以提供竖直延伸的线源。基本上竖直定向的基板可以布置在蒸汽分配布置210的前侧上,使得多个蒸汽出口212指向基板。In some embodiments, which may be combined with other embodiments described herein, the
在一些实施方式中,蒸发源200可以包括两个或更多个蒸发装置,其中所述两个或更多个蒸发装置中的至少一个可以根据本文所述的实施方式中的一些实施方式来配置。两个或更多个蒸发装置可以支撑在蒸发源的公共支撑件上,并且可被配置为蒸发不同的源材料,例如有机材料和掺杂剂。在一些实施方式中,蒸发源可包括在共同支撑件上的根据本文所述的实施方式的两个或更多个蒸发装置。换句话说,具有相应的多个材料托盘的支撑布置可以布置在蒸发源的两个或更多个蒸发坩埚中。这允许共蒸发有机材料和至少一种掺杂剂或两种或更多种掺杂剂,其中一个蒸发源具有支撑在公共支撑件上的若干蒸发装置。In some embodiments, the
如图3中示意性描绘的,可以提供用于加热蒸发坩埚110的内部体积115 的加热单元130。加热单元130可以布置在蒸发坩埚110的外部。例如,加热单元130可以包括一个或多个电阻加热器,例如多个电流导体,所述多个电流导体可以布置成与蒸发坩埚的外壁热接触。As schematically depicted in FIG. 3 , a
蒸发坩埚的内部体积115可以被加热到等于或高于源材料的蒸发温度的温度,例如200℃或更高、250℃或更高,或300℃或更高。可以提供温度控制单元,所述温度控制单元被配置为在蒸发坩埚的内部体积115中保持预定温度,其中所述预定温度可以对应于或略高于源材料的蒸发温度。The
支撑布置120可以可去除地放置在蒸发坩埚110的内部体积中,并且可以从所述内部体积中取出以便在所述多个材料托盘125上再填充源材料。The
在一些实施方式中,可以在蒸发坩埚的内部体积中设置八个或更多个材料托盘。因此,可以增大源材料与蒸发坩埚内的真空之间的界面,并可以由此提高蒸发速率。In some embodiments, eight or more material trays may be provided in the interior volume of the evaporation crucible. Thus, the interface between the source material and the vacuum within the evaporation crucible can be increased, and the evaporation rate can thereby be increased.
如图3中示意性描绘的,多个材料托盘125可具有一个或多个凹槽126,以用于在所述凹槽126上容纳源材料。具体地,多个材料托盘125可具有板形状。As schematically depicted in FIG. 3 , the plurality of
在可与本文所述的其他实施方式组合的一些实施方式中,蒸发坩埚110包括用于蒸发的源材料151的蒸汽开口111,并且屏蔽单元140可布置在蒸汽开口111与多个材料托盘125之间。屏蔽单元140可以用作蒸发坩埚的内部体积 115与可以连接到蒸发坩埚110的蒸汽分配布置210的内部体积之间的隔热屏障。In some embodiments, which may be combined with other embodiments described herein, the
可以提供间隙,以供蒸发的源材料传播越过屏蔽单元140以通过蒸汽开口 111离开蒸发坩埚。例如,用于供蒸发的源材料传播越过屏蔽单元140的环形间隙可以围绕所述屏蔽单元。A gap may be provided for the evaporated source material to propagate past the
屏蔽单元140可以是片、网格或板,所述片、网格或板至少部分地阻挡蒸发坩埚的内部体积与蒸汽分配布置的内部体积之间的直接热辐射路径。例如,屏蔽单元140可以是与材料托盘中的一个材料托盘形状和大小相似的板。然而,屏蔽单元140不适于在屏蔽单元140上容纳源材料。The
具体地,屏蔽单元140可被配置为屏蔽和减少热辐射通过蒸汽开口111从蒸汽分配布置210进入蒸发坩埚的内部体积115。具体地,蒸汽分配布置210 的内部通常保持在高于蒸发坩埚的内部体积的温度,以减少或避免蒸发的源材料151冷凝在蒸汽分配布置的内壁上。从蒸汽分配布置210辐射到蒸发坩埚中并加热布置在材料托盘上的源材料的热量可能不利地影响材料托盘上的源材料并增加材料降解的风险。为了减少或避免来自蒸汽分配组件的热辐射直接作用于布置在一个或多个材料托盘上的源材料,屏蔽单元140可以布置在蒸发坩埚中,特别是在蒸汽开口与多个材料托盘中最上面的材料托盘之间。于是,源材料不会暴露于来自蒸汽分配布置的直接热量。In particular, the
在一些实施方式中,多个材料托盘125一个在另一个上面地布置在支撑布置120中,并且屏蔽单元140可以布置在支撑布置120中最上面的材料托盘的上方。换句话说,屏蔽单元140可以支撑在支撑布置120的框架结构上,使得屏蔽单元140可以与多个材料托盘125一起从蒸发坩埚的内部体积中取出。因此,可以简化从蒸发坩埚中去除多个材料托盘,因为通过从蒸发坩埚中去除框架结构121,可以将屏蔽单元140和多个材料托盘125都从蒸发坩埚中取出。可以加速源材料的再填充,并且可以延长蒸发源的正常工作时间。In some embodiments, a plurality of
如图3中示意性所示,多个材料托盘125中的两个相邻的材料托盘可以在支撑布置120中以彼此相距5cm或更远且20cm或更短的距离D1布置。提供了具有多个可容易且快速地再填充的材料托盘的紧凑支撑布置,特别是当对于每对相邻材料托盘,两个相邻材料托盘之间的距离是相同的时。As schematically shown in FIG. 3 , two adjacent material trays of the plurality of
图4A至图4C示出了根据本文所述的实施方式的沉积系统300的三个后续沉积阶段。沉积系统300被配置为在基板10上沉积蒸发的源材料151,并且包括真空腔室301。在真空腔室301中,布置了具有根据本文所述的任何实施方式的蒸发装置100的蒸发源200。4A-4C illustrate three subsequent deposition stages of
蒸发源200包括用于蒸发源材料的蒸发装置100和用于通过多个蒸汽出口朝向基板10引导蒸发的源材料151的蒸汽分配布置210。掩模11可以布置在蒸发源200与基板10之间,使得蒸发的源材料151可以以由掩模11的开口图案限定的预定材料图案沉积在基板10上。可以提供用于使基板10相对于掩模 11对准的对准组件。The
在可与本文所述的其他实施方式组合的一些实施方式中,可以提供用于沿着源轨道移动蒸发源200的第一驱动器302和用于改变蒸发源200的多个蒸汽出口的蒸发方向的第二驱动器303中的至少一个。In some embodiments, which may be combined with other embodiments described herein, a
在图4A中,在蒸发源200的蒸发装置100中蒸发源材料,并且通过蒸发源200的多个蒸汽开口朝向基板10引导蒸发的源材料151。由第一驱动器302 将蒸发源沿着源轨道移动经过基板10。将材料图案,特别是OLED像素的图案,沉积在基板10上。In FIG. 4A , the source material is evaporated in the
在图4B中,改变蒸发源的多个蒸汽出口的蒸发方向,特别是通过将蒸发源旋转90°或更多,特别是通过将蒸发源旋转约180°。In FIG. 4B, the evaporation direction of the plurality of steam outlets of the evaporation source is changed, particularly by rotating the evaporation source by 90° or more, particularly by rotating the evaporation source by about 180°.
在图4C中,由第一驱动器302将蒸发源200沿着源轨道移动经过第二基板,所述第二基板可以布置在蒸发源200的相对于基板10的相对侧上。在第二基板上沉积材料图案,特别是OLED像素图案。In FIG. 4C , the
将材料沉积在第二基板上之后,可以再次改变多个蒸汽出口的蒸发方向,例如改变180°,并且可以将材料沉积在与此期间已被放置于基板10的先前位置处的另一基板上。After depositing the material on the second substrate, the evaporation direction of the plurality of vapor outlets can be changed again, eg by 180°, and the material can be deposited on another substrate that has been placed at the previous position of the
具体地,沉积系统可以包括用于待涂覆的第一基板的第一沉积区域和用于待涂覆的第二基板的第二沉积区域,所述第一沉积区域和所述第二沉积区域在真空腔室301中的蒸发源200的相对侧上。因此,在布置在第二沉积区域中的第二基板上进行蒸发期间,布置在第一沉积区域中的经涂覆的第一基板可以与待涂覆的新基板交换,使得可以降低沉积系统的生产节拍速率(tact rate)并且可以增加给定时间段内涂覆的基板的数量。Specifically, the deposition system may include a first deposition zone for a first substrate to be coated and a second deposition zone for a second substrate to be coated, the first deposition zone and the second deposition zone On the opposite side of the
根据本文所述的实施方式中,源材料被容纳在多个材料托盘上,所述多个材料托盘支撑在蒸发坩埚的内部体积中的支撑布置上。由于蒸发坩埚内部的材料-真空界面较大,因此可以在不升高蒸发坩埚内温度的情况下提高蒸发速率。此外,可以快速且容易地进行材料再填充,因为支撑布置120可以作为整体(即包括多个材料托盘)从蒸发坩埚中取出以进行再填充。In accordance with embodiments described herein, the source material is contained on a plurality of material trays supported on a support arrangement in the interior volume of the evaporation crucible. Due to the larger material-vacuum interface inside the evaporation crucible, the evaporation rate can be increased without raising the temperature inside the evaporation crucible. In addition, material refilling can be performed quickly and easily because the
根据本文所述的另一个方面,提供了一种用于蒸发源材料的方法。图5是示出根据本文描述的实施方式的方法的流程图。According to another aspect described herein, a method for evaporating a source material is provided. FIG. 5 is a flowchart illustrating a method according to embodiments described herein.
在框510中,待蒸发的源材料布置在支撑布置120的多个材料托盘125上,特别是当支撑布置120设置在蒸发坩埚的外侧时。In
在框520中,支撑布置120放置在蒸发坩埚110的内部体积115中,特别是通过经由开口将支撑布置120插入到蒸发坩埚的内部体积中。例如,支撑多个材料托盘的支撑布置的框架结构可以沿着导向件插入到蒸发坩埚中,所述导向件设置在蒸发坩埚的内部体积中以用于将支撑布置引导到蒸发坩埚内的预定位置。In
在框530中,加热蒸发坩埚的内部体积,以蒸发放置在多个材料托盘上的源材料。可以通过一个或多个加热单元来加热内部体积,所述一个或多个加热单元可以放置在蒸发坩埚的内部体积之外。所述一个或多个加热单元可以与蒸发坩埚的壁热接触。在一些实施方式中,将蒸发坩埚的内部体积加热至可基本上与源材料的蒸发温度对应的温度。具体地,蒸发坩埚的内部体积中的温度可以比源材料的蒸发温度不高于10℃,特别是比源材料的蒸发温度不高于5℃,更特别地比源材料的蒸发温度不高于2℃。可以减少或防止源材料的降解,并且根据本文所述的实施方式可以获得高蒸发速率。In
如本文所用的术语“源材料”或“待蒸发的材料”可以理解为适合于在沉积过程中沉积在基板上的材料。材料可以作为固体材料和/或液体材料提供。例如,材料可以以粉末形式或颗粒形式提供。根据一些实施方式,源材料可以直接从固相转变为气相,例如,取决于所使用的材料,材料可以在一定温度下升华。另外地或替代地,源材料可以是从固相转变为液相然后转变为气相的材料,例如,材料可以在某一温度下液化,然后可以在更高的温度下蒸发。提供具有一个或多个凹槽的多个板形材料托盘可为有益的,因为材料的液相可以在升华之前被收集在所述材料托盘的所述一个或多个凹槽中。如本文使用的术语“蒸发的源材料”可被理解为在蒸发坩埚中蒸发后以气态形式提供的源材料。As used herein, the term "source material" or "material to be evaporated" may be understood as a material suitable for deposition on a substrate during deposition. Materials can be provided as solid materials and/or liquid materials. For example, the material may be provided in powder form or granular form. According to some embodiments, the source material can be directly transformed from the solid phase to the gas phase, eg, the material can sublime at a certain temperature depending on the material used. Additionally or alternatively, the source material may be a material that transitions from a solid phase to a liquid phase and then to a gas phase, eg, the material may liquefy at a certain temperature and then evaporate at a higher temperature. It may be beneficial to provide a plurality of plate-shaped material trays with one or more grooves, as the liquid phase of the material may be collected in the one or more grooves of the material tray prior to sublimation. The term "evaporated source material" as used herein may be understood as a source material provided in gaseous form after being evaporated in an evaporation crucible.
根据一些实施方式,蒸汽分配布置210可以是线性分配喷头,例如具有多个以均匀间隔设置在其中的蒸汽出口。蒸汽分配组件的长度可以至少对应于基板的高度。具体地,蒸汽分配布置的长度可以长于基板的高度。例如,蒸汽分配布置的长度可以是1.3m或更高,例如2.5m或更高。因此,可以提供在基板上的均匀沉积。According to some embodiments, the
本文所述的实施方式尤其涉及有机材料的沉积,例如对于在大面积基板上进行OLED显示器制造。根据一些实施方式,大面积基板或支撑一个或多个基板的载体可具有0.5m2或更大,特别是1m2或更大的大小。例如,沉积装置可以适用于处理大面积基板,诸如对应于约1.4m2基板(1.1m×1.3m)的GEN 5 基板、对应于约4.29m2基板(1.95m×2.2m)的GEN7.5、对应于约5.7m2基板 (2.2m×2.5m)的GEN 8.5,或甚至对应于约8.7m2基板(2.85m×3.05m)的GEN 10。甚至可以类似地实现更大的代(诸如GEN 11和GEN 12)以及相应的基板面积。Embodiments described herein relate particularly to the deposition of organic materials, such as for OLED display fabrication on large area substrates. According to some embodiments, the large area substrate or the carrier supporting one or more substrates may have a size of 0.5 m 2 or more, in particular 1 m 2 or more. For example, the deposition apparatus may be adapted to process large area substrates, such as GEN5 substrates corresponding to approximately 1.4m2 substrates (1.1m x 1.3m), GEN7.5 corresponding to approximately 4.29m2 substrates (1.95m x 2.2m) , GEN 8.5 corresponding to about 5.7m2 substrate (2.2m x 2.5m), or even
根据可与本文中所述的其他实施方式组合的本文实施方式,基板的厚度可以为0.1mm至1.8mm,并且用于基板的保持布置可适用于此类基板厚度。基板厚度可为约0.9mm或更低,诸如0.5mm或0.3mm。通常,基板可以由适用于材料沉积的材料制成。例如,基板可以由选自由以下项组成的组的材料制成:玻璃、金属、聚合物、陶瓷、复合材料、碳纤维材料,或可以通过沉积工艺涂覆的任何其他材料或材料组合。According to embodiments herein, which may be combined with other embodiments described herein, the thickness of the substrate may be from 0.1 mm to 1.8 mm, and the holding arrangement for the substrate may be suitable for such substrate thickness. The substrate thickness may be about 0.9 mm or less, such as 0.5 mm or 0.3 mm. Typically, the substrate can be made of materials suitable for material deposition. For example, the substrate can be made of a material selected from the group consisting of glass, metal, polymer, ceramic, composite, carbon fiber material, or any other material or combination of materials that can be coated by a deposition process.
根据本文所述的实施方式中,材料可以预定图案沉积在基板上,例如通过使用掩模,诸如具有多个开口的精细金属掩模(fine metal mask,FMM)。可以在基板上沉积多个像素。蒸发材料的其他示例包括ITO和金属中的一种或多种,诸如银、镁或铝。In accordance with embodiments described herein, the material may be deposited on the substrate in a predetermined pattern, eg by using a mask, such as a fine metal mask (FMM) having a plurality of openings. Multiple pixels can be deposited on the substrate. Other examples of evaporation materials include ITO and one or more of metals, such as silver, magnesium, or aluminum.
根据可与本文所述的任何其他实施方式组合的一些实施方式,蒸发装置可以布置在真空腔室中。在本公开中,“真空腔室”可以被理解为被配置用于真空沉积的腔室。如本文所用的术语“真空”可以被理解为具有小于例如10mbar 的真空压力的技术真空的含义。通常,如本文所述的真空腔室中的压力可以在 10-5mbar与约10-8mbar之间。According to some embodiments, which may be combined with any of the other embodiments described herein, the evaporation device may be arranged in a vacuum chamber. In the present disclosure, a "vacuum chamber" may be understood as a chamber configured for vacuum deposition. The term "vacuum" as used herein may be understood to mean a technical vacuum with a vacuum pressure of less than eg 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10" 5 mbar and about 10" 8 mbar.
虽然前述内容是针对实施方式,可以在不脱离基本范围的情况下设计出其他和进一步的实施方式,并且所述范围由随后的权利要求来确定。具体地,该书面描述使用示例来描述本公开,包括最佳模式,并且使本领域技术人员能够实践所描述的主题,包括制造和使用任何设备或系统以及执行任何并入的方法。虽然在前面已经公开了各种具体实施方式,但是上述实施方式的相互非排他性特征可以彼此组合。可专利范围由权利要求限定,并且如果权利要求具有的结构要素与权利要求的字面语言没有不同,或者如果权利要求包括具有与权利要求的字面语言具有非实质性差异的等同结构要素,则其他示例旨在落入权利要求的范围内。While the foregoing has been directed to embodiments, other and further embodiments can be devised without departing from the essential scope, as determined by the appended claims. Specifically, this written description uses examples to describe the disclosure, including the best mode, and to enable any person skilled in the art to practice the described subject matter, including making and using any devices or systems and performing any incorporated methods. While various specific embodiments have been disclosed in the foregoing, the mutually non-exclusive features of the above-described embodiments may be combined with each other. The patentable scope is defined by the claims, and other examples are provided if the claims have structural elements that do not differ from the literal language of the claims, or if the claims include equivalent structural elements with insubstantial differences from the literal language of the claims It is intended to fall within the scope of the claims.
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