CN211108876U - Can trace back fermented glutinous rice encapsulation jar - Google Patents

Abstract

The utility model provides a traceable fermented glutinous rice packaging jar, which aims to solve the technical problem that the fermentation process or the product quality of the fermented glutinous rice product can not be visually determined in the existing fermentation and storage processes. The fermented glutinous rice packaging jar comprises a jar body and a cover body which are matched with each other, wherein the cover body comprises a cover plate which is supported at an opening of the jar body, is embedded with an RFID antenna, a necking which extends into the opening of the jar body, and a temperature sensing box which is movably fixed at the necking and is attached with a passive RFID temperature measuring chip at the bottom. The utility model discloses a temperature sensing box bottom wall conduction jar internal temperature records to passive RFID temperature measurement chip department to transmit temperature measurement data through the RFID antenna. Through analyzing the temperature measurement data, the fermentation and storage processes of the packaged materials in the jar can be traced, so that the quality of the packaged products in the jar can be visually determined.

Description

A traceable mash packaging jar

technical field

The utility model relates to the technical field of food safety production, in particular to a traceable mash packaging jar.

Background technique

Mash, also known as fermented rice wine, sweet wine, sour wine, etc., is a popular traditional snack in my country. It is obtained by fermenting glutinous rice or rice by yeast, Rhizopus and other microorganisms. It is rich in a variety of small molecular sugars, amino acids, peptides, vitamins, minerals and proteins. It has a unique flavor and has certain health care functions.

The quality of mash is closely related to the microbial population in it, and the microbial population is more sensitive to the ambient temperature. During the fermentation production process of the product, if the temperature is too high, the activity of the yeast will be reduced, and the high temperature resistant bacteria will proliferate too fast, which will lead to abnormal fermentation, accelerate the decomposition of protein and form more alcohol substances, which will make the product bitter; but the temperature is too high. low, it will affect the fermentation process. In the process of product storage, it is also necessary to do a good job of temperature control.

At present, the product packaging of mashed grains is mainly packaged by two types of containers: glass bottles and ceramic jars. Among them, the ceramic jar packaged products are placed in it since the fermentation, and the process is more traditional. Due to the reduction of sub-packaging steps, the aroma in the container, the appearance and taste of the product are all due to the sub-packaging of the product in glass bottles, which is highly recognized by the market. However, during the fermentation process of ceramic altars, the individuals are independent of each other, but the number is relatively large, so it is difficult to intuitively determine the fermentation process and product quality of each altar. And because the ceramic jar is large and difficult to refrigerate, it is difficult to ensure that its storage environment meets the temperature control requirements.

SUMMARY OF THE INVENTION

In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a traceable glutinous rice glutinous rice packaging jar, which solves the technical problem that the fermentation process or product quality of mashed glutinous rice products cannot be visually determined in the existing fermentation and storage process.

To achieve the above object, the utility model provides the following technical solutions:

A traceable mash packaging jar, comprising a jar body and a cover body matched with the opening of the jar body, characterized in that the cover body comprises:

The cover plate is held above the opening of the jar body;

Narrow mouth, hollow inside, fixed at the bottom of the cover plate, and probed into the opening of the jar body;

The temperature sensing box has an internal accommodation space and is movably connected and fixed with the necking mouth;

Passive RFID temperature measurement chip, which is attached and fixed to the bottom wall of the temperature sensing box;

The RFID antenna is attached and fixed on the top surface of the cover, matching with the passive RFID temperature measurement chip;

Among them, the passive RFID temperature measurement chip has a data access function; the RFID antenna sends the data stored in the passive RFID temperature measurement chip to an external RFID identification system through a radio frequency signal.

Further, the jar body, the cover plate and the constriction are all made of ceramic materials.

Further, the cover plate and the constriction are integrally formed.

Further, the temperature sensing box is made of food-grade stainless steel.

Further, the outer wall of the constriction and the inner wall of the temperature sensing box are provided with mutually matching thread structures.

Further, a groove is provided on the upper surface of the cover, and the RFID antenna is embedded and fixed in the groove.

Further, the passive RFID temperature measuring chip is wirelessly matched with the RFID antenna.

The utility model conducts recording through the bottom wall of the temperature-sensing box inside the jar to the passive RFID temperature-measuring chip, and transmits the temperature-measuring data through the RFID antenna. By analyzing the temperature measurement data, the fermentation and storage process of the packaged materials in the jar can be traced, so as to visually determine the quality of the packaged products in the jar.

Further, a through hole is opened in the center of the cover plate, and an inner cover plate and a constriction made of transparent glass are embedded and fixed in the through hole, the side wall of the temperature sensing box and the inner wall of the constriction are movably fixed, and the RFID antenna is fixed on the inner cover. on the surface of the board.

Further, the diameter of the through hole is larger than the diameter of the neck.

Further, the upper surface of the inner cover is provided with a groove for embedding and fixing the RFID antenna.

The utility model can directly check the appearance of the product in the jar and the state of the passive RFID temperature measuring chip by embedding the inner cover plate made of transparent glass material and the constriction structure at the cover plate, and the appearance is beautiful.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of the utility model application.

2 is a schematic cross-sectional structural diagram of a cover body in an embodiment of the present invention.

3 is a schematic three-dimensional structural diagram of a cover body in another embodiment of the present invention.

Reference signs: 10. Jar body, 20. Cover body, 1. Cover plate, 2. Narrow mouth, 3. Temperature sensing box, 4. Passive RFID temperature measuring chip, 5. RFID antenna, 6. Groove, 7 .Inner cover.

Detailed ways

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the disclosed embodiments. Accordingly, the drawings and description are to be regarded as illustrative in nature and not restrictive.

In the description of the application embodiments of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings , it is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as implementing the application of the present utility model. example limitations.

In the application examples of the present utility model, unless otherwise expressly specified and limited, terms such as "installation", "connection", "connection", "fixation" should be understood in a broad sense, for example, it may be a fixed connection or a It is a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or two components. interaction relationship. For those of ordinary skill in the art, the specific meanings of the above terms in the application embodiments of the present invention can be understood according to specific situations.

In the application examples of the present utility model, unless otherwise expressly specified and limited, the first feature "on" or "under" the second feature may include the direct contact between the first and second features, or may include the first feature "on" or "under" the second feature and the second feature is not in direct contact but through another feature between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level less than the second feature.

The following disclosure provides many different implementations or examples for implementing different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples, and are not intended to limit the embodiments of the present invention. In addition, the present application examples may repeat reference numerals and/or reference letters in different instances, such repetition is for the purpose of simplicity and clarity and does not in itself indicate differences between the various implementations and/or arrangements discussed. relation. In addition, the embodiments of the present application provide examples of various specific processes and materials, but those of ordinary skill in the art may appreciate the application of other processes and/or the use of other materials.

The embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

Example 1

As shown in FIG. 1 , an embodiment of the present application provides a traceable mash packaging jar, which includes a jar body 10 and a cover body 20 matching the opening of the jar body. The steamed rice and koji materials are regularly placed in the jar body 10 and sealed by the cover body 20 .

As shown in FIG. 1 and FIG. 2 , the cover body 20 of the packaging jar includes:

The cover plate 1 is held above the opening of the jar body 10 . The diameter of the cover plate 1 is larger than the diameter of the opening of the jar body 10, and the weight of the cover plate 1 is used to press and set above the opening of the jar body 10 to prevent the gas generated during the fermentation process from overflowing and damaging the sealing environment.

The neck 2 is hollow inside, fixed on the bottom of the cover plate 1, and protrudes into the opening of the jar body. The diameter of the neck 2 should be close to the diameter of the opening of the jar body 10 . The shrinkage of the existing packaging jar stabilizes the sealing relationship between the lid body 20 and the jar body 10 through its own weight and friction with the opening.

The temperature sensing box 3 has an internal accommodation space, and is movably connected and fixed with the constriction 2 . The bottom wall of the fixed temperature sensing box 3 is attached to the bottom of the constriction 2 to avoid contact between the bottom wall of the temperature sensing box 3 and the material in the jar body 10 . The temperature sensing box 3 exchanges heat with the environment in the jar body 10, and is finally consistent with the internal temperature of the jar body 10.

The passive RFID temperature measuring chip 4 is attached and fixed to the bottom wall of the temperature sensing box 3 . The passive RFID temperature measuring chip 4 measures the temperature of the bottom wall of the temperature sensing box 3 and records it according to the preset frequency.

The temperature sensing box 3 is made of food-grade stainless steel. On the one hand, the stainless steel material has excellent thermal conductivity, which can truly reflect the temperature in the jar 10 and transmit it to the passive RFID temperature measuring chip 4 to ensure the accuracy of the recorded data; on the other hand, the material conforms to the food safety requirements.

The RFID antenna 5 is attached and fixed to the upper surface of the cover plate 1 and is matched with the passive RFID temperature measuring chip 4 .

The jar body 10, the cover plate 1 and the constriction 2 are all made of ceramic materials. The traditional process is maintained, and at the same time, the ceramic material has less influence on the electromagnetic wave received by the passive RFID temperature measurement chip.

The cover plate 1 and the constriction 2 are integrally formed. The process is simple and easy to manufacture.

The outer wall of the constriction 2 and the inner wall of the temperature sensing box 3 are provided with mutually matching thread structures. In order to install and recycle the passive RFID temperature measuring chip 4, the temperature sensing box 3 can be disassembled and assembled.

The upper surface of the cover plate 1 is provided with a groove 6 , and the RFID antenna 5 is embedded and fixed in the groove 6 . In the fermentation and storage process, the jar body 10 is stacked to match, so as to avoid damage to the RFID antenna 5 .

The passive RFID temperature measuring chip 4 is wirelessly matched with the RFID antenna 5 . Wireless matching makes the manufacture of the cover 20 easier.

Instructions:

Determine the matching degree of the passive RFID temperature measuring chip and the RFID antenna, and use the thermal adhesive to fit the passive RFID temperature measuring chip and the RFID antenna to the center of the bottom wall and the groove of the temperature sensing box respectively, and then fix the side wall of the temperature sensing box. Tighten on the side wall of the constriction. Press the cover into the opening of the jar containing the material.

Put the packaging jar stack into the fermentation cellar or warehouse for fermentation or storage. Through the existing warehouse management system and RFID identification system, the temperature data of the packaging altar can be collected, and through data analysis, temperature control can be carried out to ensure product quality.

After consumers buy products, they can read traceability information such as product information and temperature curves through RFID readers or mobile phone programs.

Example 2

As shown in Figure 2, the difference between this embodiment and Embodiment 1 is that a through hole with a diameter larger than the constriction is opened in the center of the cover plate, and an inner cover plate 7 and a constriction made of transparent glass are embedded in the through hole through a sealing gasket. The RFID antenna is embedded in the groove on the upper surface of the inner cover plate 7.

The cover shown in this embodiment is not only beautiful, but also easy to check the appearance of the product in the jar and the state of the passive RFID temperature measuring chip.

Claims (10)

1. a traceable mash packaging jar, comprising a jar body, and a lid body that matches the opening of the jar body, it is characterized in that, the lid body comprises: The cover plate is held above the opening of the jar body; Narrow mouth, hollow inside, fixed at the bottom of the cover plate, and probed into the opening of the jar body; The temperature sensing box has an internal accommodation space and is movably connected and fixed with the necking mouth; Passive RFID temperature measurement chip, which is attached and fixed to the bottom wall of the temperature sensing box; The RFID antenna is attached and fixed on the top surface of the cover, matching with the passive RFID temperature measurement chip; Among them, the passive RFID temperature measurement chip has a data access function; the RFID antenna sends the data stored in the passive RFID temperature measurement chip to an external RFID identification system through a radio frequency signal. 2 . The packaging jar according to claim 1 , wherein the jar body, the cover plate and the constriction are all made of ceramic material. 3 . 3 . The packaging jar according to claim 2 , wherein the cover plate and the constriction are integrally formed. 4 . 4. The packaging jar according to claim 1, wherein the temperature sensing box is made of food-grade stainless steel. 5 . The packaging jar according to claim 1 , wherein the outer wall of the constriction and the inner wall of the temperature sensing box are provided with mutually matching thread structures. 6 . 6 . The packaging jar according to claim 1 , wherein a groove is provided on the upper surface of the cover plate, and the RFID antenna is embedded and fixed in the groove. 7 . 7 . The packaging jar according to claim 1 , wherein the passive RFID temperature measuring chip is wirelessly matched with the RFID antenna. 8 . 8 . The packaging jar according to claim 1 , wherein a through hole is opened in the center of the cover plate, and an inner cover plate and a constriction made of transparent glass material are embedded and fixed in the through hole, and the side wall of the temperature sensing box is fixed. 9 . It is movably fixed with the inner wall of the constriction, and the RFID antenna is fixed on the upper surface of the inner cover. 9 . The packaging jar according to claim 8 , wherein the diameter of the through hole is larger than the diameter of the constriction. 10 . 10 . The packaging jar according to claim 8 , wherein a groove for embedding and fixing the RFID antenna is formed on the upper surface of the inner cover. 11 .

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