CN211056157U - Electronic component pan feeding holding device - Google Patents
Electronic component pan feeding holding device Download PDFInfo
- Publication number
- CN211056157U CN211056157U CN201921317829.9U CN201921317829U CN211056157U CN 211056157 U CN211056157 U CN 211056157U CN 201921317829 U CN201921317829 U CN 201921317829U CN 211056157 U CN211056157 U CN 211056157U
- Authority
- CN
- China
- Prior art keywords
- base
- electronic component
- side guide
- pan feeding
- turntable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000000903 blocking effect Effects 0.000 claims description 20
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 7
- 230000014759 maintenance of location Effects 0.000 claims 3
- 230000004888 barrier function Effects 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000002513 implantation Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Specific Conveyance Elements (AREA)
Abstract
Description
技术领域technical field
本实用新型是有关一种入料装置,特别是指一种电子组件入料保持装置。The utility model relates to a feeding device, in particular to a feeding holding device for electronic components.
背景技术Background technique
随着科技发展,电子组件的尺寸逐渐变小、精密度亦逐渐提高,在制程中部分电子组件会附着细微的灰尘或是瑕疵,为了维持质量稳定,会先进行良率检测作业,待确认质量无虞后才会进行包装程序,以提升电子组件的良率及可靠度。With the development of science and technology, the size of electronic components has gradually become smaller and the precision has gradually improved. Some electronic components will adhere to fine dust or defects during the process. In order to maintain stable quality, yield testing will be performed first, and the quality will be confirmed. The packaging process will be carried out only after there is no danger to improve the yield and reliability of electronic components.
电子组件的检测、包装通过包装机进行,而检测、包装方式是将电子组件倒入震动盘,通过震动盘的震动,将各电子组件沿着震动盘周缘分别送出,再透过输送轨道将电子组件送至入料装置的转盘,进行检测封装。当电子组件被输送轨道送至该入料装置进行测试前,阻挡件会将电子组件阻文件于感测装置前,之后阻挡件降下并配合气流带动使电子组件通过并进入该转盘,而移动到下一步骤的设备进行测试。The detection and packaging of electronic components are carried out by the packaging machine, and the detection and packaging method is to pour the electronic components into the vibrating plate, and through the vibration of the vibrating plate, each electronic component is sent out along the periphery of the vibrating plate, and then the electronic components are sent out through the conveying track. The components are sent to the turntable of the feeding device for inspection and packaging. When the electronic components are sent to the feeding device for testing by the conveying track, the blocking member will block the electronic components in front of the sensing device, and then the blocking member will lower and cooperate with the airflow to drive the electronic components to pass through and enter the turntable, and move to the The next step is to test the device.
在实际使用时由于LED其本身成品有残留胶,易有成品两两相黏的问题,或是电子组件的特殊形状,如为有接脚的二极管,则有接脚相钩等无法避免的问题,在此情形下,当输送轨道将电子组件送至该转盘,阻挡件在升起时将抵顶到相黏的电子组件,而无法完全顺利升起,或是两个相黏的电子组件被同时吸附至该转盘,上述情况将致使设备发出异常讯号,最后只得由人工排除,都将造成时间成本上的浪费,而有无法提升作业效率的缺失,因此,如何保持平整的入料状态,为各方所面临与重视的课题。In actual use, because the LED itself has residual glue, it is easy to have the problem of two-to-two sticking of the finished product, or the special shape of the electronic components. If it is a diode with pins, there are unavoidable problems such as pin hook , in this case, when the conveying track sends the electronic components to the turntable, the blocking piece will push against the sticking electronic components when it is raised, and it cannot be lifted completely smoothly, or the two sticking electronic components are blocked. At the same time, it is adsorbed to the turntable. The above situation will cause the equipment to send out abnormal signals, and finally it has to be removed manually, which will result in a waste of time and cost, and there is a lack of improving the operation efficiency. Therefore, how to maintain a flat feeding state, for Issues faced and valued by all parties.
实用新型内容Utility model content
有鉴于此,本新型的目的,是提供一种电子组件入料保持装置,包含一入料单元、一导引单元,及一吸附件。In view of this, the purpose of the present invention is to provide an electronic component feeding holding device, which includes a feeding unit, a guiding unit, and an adsorption member.
该入料单元包括一基座、一开设于该基座表面的第一气流沟,及一设置于该基座上并与该第一气流沟连接的连接口,该导引单元包括一第一侧导件,及一设置于该第一侧导件表面并与该第一气流沟连接的第二气流沟,该第一、二气流沟与该连接口围绕界定出一与外界连通的气流通道,该吸附件与该连接口一端连接,当该吸附件作动会吸附靠近该气流信道周围的电子组件。The feeding unit includes a base, a first air flow groove opened on the surface of the base, and a connection port disposed on the base and connected to the first air flow groove. The guide unit includes a first air flow groove. A side guide, and a second airflow channel disposed on the surface of the first side guide and connected to the first airflow channel, the first and second airflow channels and the connecting port define an airflow channel that communicates with the outside world , the adsorption piece is connected with one end of the connection port, and when the adsorption piece is actuated, it will adsorb the electronic components near the airflow channel.
本新型的另一技术手段,是在于上述还包含一转动单元,其包括一设置于该基座上并位于该第一侧导件旁的转盘,及复数设置于该转盘周缘的承载槽,该电子组件自该基座进入该转盘的承载槽,再由该转盘带动远离该基座,且该转盘的周缘与该基座间定义有一分离界线。Another technical means of the present invention is that the above-mentioned further includes a rotating unit, which includes a turntable disposed on the base and beside the first side guide member, and a plurality of bearing grooves disposed on the periphery of the turntable. The electronic component enters the bearing slot of the turntable from the base, and is driven away from the base by the turntable, and a separation boundary is defined between the periphery of the turntable and the base.
本新型的又一技术手段,是在于上述的导引单元更包括一与该第一侧导件对向且间隔设置于该基座上的第二侧导件,且该基座与该第一、二侧导件围绕界定出一引导该电子组件进入该承载槽的传输通道。Another technical means of the present invention is that the above-mentioned guide unit further includes a second side guide opposite to the first side guide and disposed on the base at intervals, and the base is connected to the first side guide. . The two side guides define a transmission channel for guiding the electronic component into the carrying slot.
本新型的再一技术手段,是在于上述的第一侧导件与该基座围绕界定出一位于该第一侧导件的侧壁上的侧吸口,且该侧吸口与该气流通道相连通,当该吸附件作动会吸附靠近该侧吸口周围的电子组件。Still another technical means of the present novel is that the first side guide and the base define a side suction port on the side wall of the first side guide, and the side suction port communicates with the airflow channel , when the suction member is actuated, it will suction the electronic components near the side suction port.
本新型的另一技术手段,是在于上述的连接口与该第一侧导件的第一面相互垂直。Another technical means of the present invention is that the above-mentioned connecting port and the first surface of the first side guide are perpendicular to each other.
本新型的又一技术手段,是在于上述的入料单元更包括一设置于该基座中并可向上凸伸出该基座表面的阻挡件,及一用以驱动该阻挡件升降以分离相邻两电子组件的动力源,该阻挡件位于该分离界在线。Another technical means of the present invention is that the above-mentioned feeding unit further includes a blocking member disposed in the base and protruding upward from the surface of the base, and a blocking member for driving the blocking member to rise and fall to separate the phases. The power source of the two adjacent electronic components, the blocking member is located on the separation boundary line.
本新型的再一技术手段,是在于上述的第一侧导件具有一与该基座连接的第一面,及一相反的第二面。Yet another technical means of the present invention is that the above-mentioned first side guide has a first surface connected to the base, and an opposite second surface.
本新型的另一技术手段,是在于上述的入料单元更包括一与该基座的一侧连接的传送轨道,其具有一远离该基座的第一端,以及一靠近该基座的第二端,该电子组件会自该第一端前进至该第二端以进入该基座。Another technical means of the present invention is that the above-mentioned feeding unit further includes a conveying track connected to one side of the base, which has a first end away from the base, and a first end close to the base. Two ends, the electronic component will advance from the first end to the second end to enter the base.
本新型的又一技术手段,是在于上述的侧吸口比该阻挡件靠近该第一端设置。Another technical means of the present invention is that the above-mentioned side suction port is disposed closer to the first end than the blocking member.
本新型的再一技术手段,是在于上述的吸附件保持真空吸气状态。Yet another technical means of the present novel is that the above-mentioned adsorption member maintains a vacuum suction state.
本新型的有益功效在于,通过该气流信道将该吸附件的真空导引至该侧吸口,再由该侧吸口先吸附欲进入该承载槽的第一、二顺位的电子组件,之后由该阻挡件将两者分离,使该电子组件得以平整地进入该承载槽中,降低人工排除该电子组件黏料、卡料,或钩料等困扰,以确实提升作业效率。The beneficial effect of the present invention is that the vacuum of the suction member is guided to the side suction port through the air flow channel, and the first and second order electronic components to be entered into the bearing slot are first suctioned by the side suction port, and then The blocking piece separates the two, so that the electronic component can enter the bearing groove smoothly, reducing the trouble of manually removing the electronic component sticking material, jamming material, or hooking material, so as to improve the working efficiency.
附图说明Description of drawings
图1是一立体示意图,说明本新型电子组件入料保持装置的较佳实施例;FIG. 1 is a schematic perspective view illustrating a preferred embodiment of the novel electronic component feeding holding device;
图2是一立体示意图,说明该较佳实施例中一入料单元与设置于其上的导引单元的形态样式;FIG. 2 is a three-dimensional schematic diagram illustrating the shape of a feeding unit and a guiding unit disposed thereon in the preferred embodiment;
图3是一方块示意图,说明该较佳实施例中一动力源电连接一阻挡件的形态样式;FIG. 3 is a block diagram illustrating the form of a power source electrically connected to a blocking member in the preferred embodiment;
图4是一上视示意图,说明该较佳实施例的另一视角的形态样式;FIG. 4 is a schematic top view illustrating the form of another viewing angle of the preferred embodiment;
图5是一上视示意图,说明该较佳实施例中一侧吸口吸附两电子组件的形态样式;FIG. 5 is a schematic top view illustrating the shape of one side suction port for adsorbing two electronic components in the preferred embodiment;
图6是一立体示意图,说明该较佳实施例中该侧吸口的设置的形态样式;Fig. 6 is a three-dimensional schematic diagram illustrating the configuration of the side suction port in the preferred embodiment;
图7是一上视示意图,说明该较佳实施例中受吸附的电子组件抵靠于一承载槽左方的形态样式;FIG. 7 is a schematic top view illustrating the shape of the adsorbed electronic component against the left side of a bearing slot in the preferred embodiment;
图8是一立体示意图,说明该较佳实施例中一中心盖单元的形态样式;FIG. 8 is a three-dimensional schematic diagram illustrating the shape of a center cover unit in the preferred embodiment;
图9是一立体示意图,说明该较佳实施例中一上盖单元与一下盖单元的形态样式;及FIG. 9 is a three-dimensional schematic diagram illustrating the shape of an upper cover unit and a lower cover unit in the preferred embodiment; and
图10是一方块示意图,说明该较佳实施例中一空气源电连接一上通气口、一下通气口,及一植入通气口的形态样式。FIG. 10 is a block diagram illustrating the configuration of an air source electrically connected to an upper vent, a lower vent, and an implanted vent in the preferred embodiment.
具体实施方式Detailed ways
有关本新型的相关申请专利特色与技术内容,在以下配合参考图式的较佳实施例的详细说明中,将可清楚的呈现。The features and technical contents of the related applications of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings.
参阅图1、2,及3,为本新型电子组件入料保持装置的较佳实施例,适用于对一电子组件9进行测试、入料包装,其包含一入料单元 1、一导引单元2、一吸附件3、一转动单元4、一中心盖单元5、一上盖单元6、一下盖单元7,及一空气源8。Referring to FIGS. 1, 2, and 3, it is a preferred embodiment of the novel electronic component feeding holding device, which is suitable for testing, feeding and packaging an
于此,该电子组件9会自该入料单元1进入该导引单元2,再由该转动单元4带动进行检测及入料等作业。Here, the
该入料单元1包括一基座11、一开设于该基座11表面的第一气流沟12、一设置于该基座11上并与该第一气流沟12连接的连接口 13、一设置于该基座11中并可向上凸伸出该基座11表面的阻挡件14,及一用以驱动该阻挡件14升降以分离相邻两电子组件9的动力源15。The feeding unit 1 includes a
配合参阅图4、5,及6,该入料单元1更包括一与该基座11的一侧连接的传送轨道16,其中,该传送轨道16具有一远离该基座11 的第一端161,以及一靠近该基座11的第二端162,该电子组件9会自该第一端161前进至该第二端162以进入该基座11。4 , 5 , and 6 , the feeding unit 1 further includes a conveying
该导引单元2包括一第一侧导件21、一设置于该第一侧导件21 表面并与该第一气流沟12对向连接的第二气流沟22,及一与该第一侧导件21对向且间隔设置于该基座11上的第二侧导件23。The guiding
其中,该第一侧导件21具有一与该基座11连接的第一面211,及一相反的第二面212,于此,该第一侧导件21的第一面211与该连接口13相互垂直。The
此外,该基座11与该第一、二侧导件21、23围绕界定出一引导该电子组件9自该传送轨道16的第二端162进入该转动单元4的传输信道10,而该第一、二气流沟12、22与该连接口13围绕界定出一与外界连通的气流通道20,于此该气流通道20的用途为吸附欲进入该转动单元4的电子组件9。透过该传输信道10限制该电子组件9 于其中,避免该电子组件9左右摆动,以提升输送的稳定性。In addition, the
进一步地,该第一侧导件21与该基座11围绕界定出一位于该第一侧导件21的侧壁上的侧吸口24,且该侧吸口24与该气流通道20 相连通。而该侧吸口24比该阻挡件14靠近该传送轨道16的第一端 161设置。Further, the
该吸附件3与该连接口13的一端连接,且该吸附件3保持真空吸气状态,配合参阅图7,当该吸附件3作动会将气体输送至该气流通道20,使得与该气流通道20相连通的侧吸口24将两个位于该传输信道10上的电子组件9朝图5的箭头方向吸附,以令如LED般具有多面的电子组件9的其中一个面被该侧吸口24所吸附,以达平整顺畅的入料。The suction member 3 is connected to one end of the
该转动单元4包括一设置于该基座11上并位于该第一、二侧导件21、23旁的转盘41,及复数设置于该转盘41周缘的承载槽42,该电子组件9自该基座11进入该转盘41的承载槽42,再由该转盘 41带动(如图4的箭头的转动方向)远离该基座11。The rotating unit 4 includes a
再者,该转盘41的周缘与该基座11间定义有一分离界线410,而该承载槽42定义有一自该转盘41中心向该承载槽42垂直延伸的中心轴线420。该阻挡件14位于该分离界线410上。Furthermore, a
透过该阻挡件14的设置,除了可分离位于第一顺位的电子组件9 后方的第二顺位的电子组件9继续前进外,更可阻挡位于第二顺位的电子组件9后方的复数电子组件9前进,以避免一个以上的电子组件 9进入该转盘41的承载槽42中。于此,第一、二顺位的电子组件9 为进入该转盘41的电子组件9的顺序叙述。因此,在本较佳实施例中,该侧吸口24会先吸附欲进入该承载槽42的第一、二顺位的电子组件9,再由该阻挡件14将两者分离,以达平整入料的目的。Through the arrangement of the blocking
此外,远离该基座11的侧吸口24,使该电子组件9于进入该承载槽42前先受该侧吸口24吸附,调整该电子组件9的面向,可降低人工排除该电子组件9黏料、卡料,或钩料等困扰,以确实提升作业效率。In addition, being far away from the
配合参阅图8、9,及10,该中心盖单元5包括一板体51、一开设于该板体51的开口52、一开设于该板体51上且位于该开口52周缘的第一真空沟53,及一位于该开口52周缘的植入真空沟54,该转盘41是设置于该开口52上,该板体51概呈C型,该入料单元1设置于该板体51的C型缺口上。Referring to FIGS. 8 , 9 , and 10 , the
其中,该板体51具有一与该上、下盖单元6、7连接的上表面511,及一相反的下表面512,该第一真空沟53、及该植入真空沟54均位于该上表面511。而该第一真空沟53是倾斜一角度地设置于该开口 52周缘。The
该上盖单元6包括一上盖体61、一与该第一真空沟53对向连接的第二真空沟62,及一位于该上盖体61并与该第二真空沟62连接的上通气口63,该第一、二真空沟53、62与该上通气口63围绕界定出一第一真空通道60,其中,该上盖体61具有一与该板体51连接的第一上板面611,及一相反的第二上板面612,该第二真空沟62位于该第一上板面611上。The upper cover unit 6 includes an
该下盖单元7包括一下盖体71、一与该第一真空沟53对向连接的第三真空沟72,及一位于该下盖体71上并与该第三真空沟72连接的下通气口73,该第一、三真空沟53、72与该下通气口73围绕界定出一第二真空通道70,其中,该下盖体71具有一与该板体51连接的第一下板面711,及一相反的第二下板面712,该第三真空沟72位于该第一下板面711上。其中,该下盖体71位于该上盖体61的一侧。The
此外,该下盖单元7更包括一位于该第一下板面711并与该植入真空沟54对向连接的第四真空沟74,及一位于该下盖体71并与该第四真空沟74连接的植入通气口75,该植入真空沟54、该第四真空沟 74与该植入通气口75围绕界定出一第三真空通道50。In addition, the
该第一、二、三真空通道60、70、50会吸附周围的电子组件9,使其停止作动。于此,该第一、二真空通道60、70的用途为吸附欲进行检测的电子组件9,而该第三真空通道50则用以吸附欲承装该电子组件9于一料带(图未绘出)中的入料包装。当该上、下盖单元6、7 设置于该中心盖单元5上时,该转盘41会带动该电子组件9转动至该第一真空沟53与该第四真空沟74的设置位置,以进行检测及入料包装。The first, second and
在本较佳实施例中,该第一真空沟53的数量为3个,与该第一真空沟53配合设置的第二、三真空沟62、72数量分别为2个与1个,而该植入真空沟54的数量为1个,与该植入真空沟54配合设置的第四真空沟74的数量为1个,实际实施时,可依需求设置不同数量,不应以此为限。In this preferred embodiment, the number of the
由于该第一真空沟53是倾斜角度设置于该开口52周缘,而该第二、三真空沟62、72配合该第一真空沟53的倾斜角度设置,因此,该第一、二真空通道60、70亦为倾斜角度设置。Since the
此外,该上、下盖单元6、7更包括一分别位于该上、下盖体61、 71且对应该第一真空沟53的一端设置的检测窗口64。其中,该检测窗口64对应设置于该中心盖单元5的开口52的上方周缘处,以供该电子组件9的外观检查装置或人眼视觉检视的用。In addition, the upper and
该空气源8与该上、下通气口63、73、及该植入通气口75连接,当该空气源8作动会吸附靠近该第一、二、三真空通道60、70、50 周围的电子组件9,使其停止作动。The
由于该电子组件9的体积小于该承载槽42,当该电子组件9位于该承载槽42中时,会受该空气源8吸附而抵靠于该中心轴线420的左侧,也就是位于该承载槽42的左侧(如图7所示),以便于该电子组件9在同一位置且静止状态下稳地进行检测或入料,进而提升检测的准确性。Since the volume of the
透过该第一、二、三真空通道60、70、50将该空气源8的真空导引至该承载槽42旁,其中,该第一真空信道60旁的电子组件9朝图7中的实心单箭头方向吸附,该第二真空信道70旁的电子组件9 朝图7中的实心双箭头方向吸附,而该第三真空信道50旁的电子组件9则朝图7中的空心单箭头方向吸附,使该电子组件9平稳地抵靠于该承载槽42的左侧,因此固定该电子组件9的检测或入料位置,以提升缺陷检测的准确性。Through the first, second and
综上所述,本新型电子组件入料保持装置,经由该入料单元1、该导引单元2、该吸附件3、该转动单元4、该中心盖单元5、该上盖单元6、该下盖单元7,及该空气源8间相互设置,透过该气流通道 20将该吸附件3的真空导引至该侧吸口24,再由该侧吸口24先吸附欲进入该承载槽42的第一、二顺位的电子组件9,之后由该阻挡件 14将两者分离,使该电子组件9得以平整地进入该承载槽42中,而该第一、二、三真空通道60、70、50将该空气源8的真空导引至该承载槽42旁,使该电子组件9平稳地抵靠于该承载槽42的左侧,因此固定该电子组件9的检测或入料位置,以提升缺陷检测的准确性,故确实可以达成本新型的目的。To sum up, the novel electronic component feeding holding device, through the feeding unit 1 , the guiding
惟以上所述者,仅为本新型的较佳实施例而已,当不能以此限定本新型实施的范围,即大凡依本新型申请专利范围及新型说明内容所作的简单的等效变化与修饰,皆仍属本新型专利涵盖的范围内。However, the above are only the preferred embodiments of the present invention, and should not limit the scope of implementation of the present invention, that is, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description of the new model, All still fall within the scope of the present patent.
【符号说明】【Symbol Description】
1 入料单元1 feeding unit
10 传输通道10 transmission channels
11 基座11 Pedestal
12 第一气流沟12 The first air groove
13 连接口13 Connectors
14 阻挡件14 Stopper
15 动力源15 Power source
16 传送轨道16 Teleportation Tracks
161 第一端161 First End
162 第二端162 Second end
2 导引单元2 guide unit
20 气流通道20 airflow channels
21 第一侧导件21 First side guide
211 第一面211 first side
212 第二面212 Second side
22 第二气流沟22 Second air groove
23 第二侧导件23 Second side guide
24 侧吸口24 side suction ports
3 吸附件3 Adsorbers
4 转动单元4 Turn the unit
41 转盘41 Turntable
410 分离界线410 Separation Boundaries
42 承载槽42 Carrier slot
420 中心轴线420 Center axis
5 中心盖单元5 Center cover unit
50 第三真空通道50 Third vacuum channel
51 板体51 Board body
511 上表面511 upper surface
512 下表面512 Lower surface
52 开口52 openings
53 第一真空沟53 First vacuum trench
54 植入真空沟54 Implantation of vacuum grooves
6 上盖单元6 Cover unit
60 第一真空通道60 First vacuum channel
61 上盖体61 upper cover
611 第一上板面611 First upper deck
612 第二上板面612 Second upper deck
62 第二真空沟62 Second vacuum trench
63 上通气口63 Upper vent
64 检测窗口64 Detection window
7 下盖单元7 Lower cover unit
70 第二真空通道70 Second vacuum channel
71 下盖体71 Lower cover
711 第一下板面711 First lower deck
712 第二下板面712 Second lower deck
72 第三真空沟72 Third vacuum groove
73 下通气口73 Lower vent
74 第四真空沟74 Fourth vacuum trench
75 植入通气口75 Implanted vents
8 空气源8 Air source
9 电子组件。9 Electronic components.
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108204999U TWM586264U (en) | 2019-04-23 | 2019-04-23 | Electronic component feeding and holding device |
| TW108204999 | 2019-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211056157U true CN211056157U (en) | 2020-07-21 |
Family
ID=69189736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921317829.9U Active CN211056157U (en) | 2019-04-23 | 2019-08-14 | Electronic component pan feeding holding device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN211056157U (en) |
| TW (1) | TWM586264U (en) |
-
2019
- 2019-04-23 TW TW108204999U patent/TWM586264U/en unknown
- 2019-08-14 CN CN201921317829.9U patent/CN211056157U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM586264U (en) | 2019-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI460101B (en) | Workpiece insertion mechanism and workpiece insertion method | |
| CN109263243B (en) | Tear type paper device and have its tear type paper equipment that leaves | |
| TWI553758B (en) | Semiconductor wafer mounting method and semiconductor wafer mounting device | |
| TWI767067B (en) | Sawing apparatus of semiconductor materials | |
| CN103201073B (en) | Shot-blast equipment | |
| TWI556761B (en) | Assembly device for pull head and assembly method of pull head | |
| CN109335182A (en) | A camera module stripping device | |
| CN107521976A (en) | An automatic feeding device | |
| CN204367008U (en) | Light guide plate nozzle automatic cutting machine | |
| CN211056157U (en) | Electronic component pan feeding holding device | |
| CN204566871U (en) | Film stripping device and film tearing machine | |
| TWI712807B (en) | Electronic component conveying device and electronic component inspection device | |
| CN210150235U (en) | Auxiliary suction device of electronic assembly | |
| CN207183123U (en) | Timing disc automatic assembly machine | |
| TWM512575U (en) | Wafer testing machine | |
| CN220866636U (en) | A film separation device | |
| CN210147446U (en) | Automatic equipment of packing into of IC base plate | |
| CN111361965A (en) | Electronic component delivery method and device | |
| CN116441637A (en) | Aluminum strip cutting and testing equipment | |
| CN1625929A (en) | Device for transferring electronic components from an inclined supply track to another unit | |
| TWI635292B (en) | Electronic component conveying device and conveying method | |
| CN118299322B (en) | Chip sorting and grabbing device and working method thereof | |
| CN120282370B (en) | A charger welding and cutting integrated processing equipment | |
| CN222970366U (en) | Semiconductor picking device | |
| CN219135718U (en) | Automatic encapsulation equipment of PCBA board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |