CN211004911U - Modular copper-containing effluent treatment plant of high concentration - Google Patents
Modular copper-containing effluent treatment plant of high concentration Download PDFInfo
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- CN211004911U CN211004911U CN201921547192.2U CN201921547192U CN211004911U CN 211004911 U CN211004911 U CN 211004911U CN 201921547192 U CN201921547192 U CN 201921547192U CN 211004911 U CN211004911 U CN 211004911U
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 60
- 239000010949 copper Substances 0.000 title claims abstract description 60
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- 239000002351 wastewater Substances 0.000 claims abstract description 65
- 239000012528 membrane Substances 0.000 claims abstract description 60
- 238000005189 flocculation Methods 0.000 claims abstract description 49
- 230000016615 flocculation Effects 0.000 claims abstract description 42
- 238000001179 sorption measurement Methods 0.000 claims abstract description 38
- 238000004062 sedimentation Methods 0.000 claims abstract description 34
- 238000004065 wastewater treatment Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000004044 response Effects 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 62
- 238000009297 electrocoagulation Methods 0.000 claims description 28
- 238000010992 reflux Methods 0.000 claims description 17
- 230000006698 induction Effects 0.000 claims description 11
- 238000005273 aeration Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 230000000737 periodic effect Effects 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 abstract description 10
- 238000005374 membrane filtration Methods 0.000 abstract description 7
- 238000004064 recycling Methods 0.000 abstract description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 26
- 229910001431 copper ion Inorganic materials 0.000 description 26
- 238000000034 method Methods 0.000 description 16
- 239000008394 flocculating agent Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
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- 229910021645 metal ion Inorganic materials 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
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- 150000004679 hydroxides Chemical class 0.000 description 2
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- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
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- 229960004887 ferric hydroxide Drugs 0.000 description 1
- 230000003311 flocculating effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
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- 239000010842 industrial wastewater Substances 0.000 description 1
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 1
- 229910021506 iron(II) hydroxide Inorganic materials 0.000 description 1
- NCNCGGDMXMBVIA-UHFFFAOYSA-L iron(ii) hydroxide Chemical compound [OH-].[OH-].[Fe+2] NCNCGGDMXMBVIA-UHFFFAOYSA-L 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000001728 nano-filtration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
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Abstract
The utility model relates to a waste water treatment technical field discloses a modular high concentration copper-containing effluent treatment plant, the device is including the electrodeposition tank, electrolytic flocculation pond, sedimentation tank, adsorption tank and the membrane cisterna that connect gradually, be equipped with a plurality of electrodeposition anode plates and electrodeposition cathode plate in the electrodeposition tank, be equipped with electrolytic flocculation anode plate, response polar plate group and electrolytic flocculation cathode plate along the rivers direction in the electrolytic flocculation tank in proper order, be equipped with pipe chute and mud pipe in the sedimentation tank, be equipped with adsorbing material in the adsorption tank, be equipped with the membrane module in the membrane cisterna. The device integrates electro-deposition technology, electro-flocculation technology, adsorption technology and membrane filtration technology, not only has high treatment efficiency, but also relieves membrane pollution and realizes the recycling of copper resources in wastewater.
Description
Technical Field
The utility model relates to a waste water treatment technical field, in particular to modular high concentration copper-containing effluent treatment plant.
Background
Copper-containing wastewater is the most common industrial wastewater and generally comes from the fields of metallurgy, surface treatment, mechanical processing and the like. Copper ions in wastewater are biologically toxic and cannot be effectively degraded in nature. The untreated high-concentration copper-containing wastewater is discharged into nature, so that not only is metal resource waste caused, but also water and soil are polluted, and the polluted water and soil enter a food chain after being biologically enriched, so that the health of human beings is harmed. At present, common copper-containing wastewater treatment methods include a precipitation method, an electrochemical method, an adsorption method, a membrane filtration method, an ion exchange method and the like. However, the precipitation method consumes a large amount of chemical agents, and also generates hazardous waste copper-containing sludge, which is not economical and environment-friendly enough, and the general ion exchange method is suitable for treating low-concentration copper-containing wastewater.
The electrodeposition technology is a technology which uses an electrochemical principle to reduce certain metal ions in a solution into elementary substances on a cathode, and can be used for recovering metal copper in copper-containing wastewater. According to an electrochemical reduction mechanism, copper ions are reduced to copper simple substances on a cathode, the reduction efficiency is closely related to the concentration of the copper ions in the wastewater, the high-concentration copper-containing wastewater is beneficial to improving the current efficiency and the quality of the simple substance copper, and the low-concentration copper-containing wastewater not only causes the low recovery rate of copper but also is uneconomical. Therefore, the electrodeposition method is suitable for treating high-concentration copper-containing wastewater and recovering high-quality metallic copper.
The electrocoagulation technology is characterized in that under the action of direct current, metals such as iron and aluminum are oxidized and corroded as anodes to generate metal ions such as iron and aluminum, and finally flocculants such as hydroxides, various hydroxyl complexes and polynuclear hydroxyl complexes are formed through a series of hydrolysis, so that impurities and metal ions in wastewater are adsorbed and coagulated and precipitated. The electric flocculation has good treatment effect on copper ions in wastewater, does not need to add chemical agents, is environment-friendly and economic, but has limitation on low-concentration copper ion treatment efficiency due to higher energy consumption.
The adsorption technology carries out physical and chemical adsorption treatment on impurities and metal ions in the wastewater according to the special structure and properties of the adsorption material, so that copper ions in the wastewater can be effectively removed, but the problem of adsorption saturation exists. The membrane filtration technology is widely applied to the treatment of metal ion wastewater, but has the problem of membrane pollution.
In summary, although the electrochemical method, the adsorption method and the membrane filtration method have good treatment effects on the copper-containing wastewater, any single treatment technology has inevitable defects and cannot independently and efficiently treat the high-concentration copper-containing wastewater to reach the discharge standard.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a modular high concentration copper-containing effluent treatment plant, the device collect electrodeposition technique, electric flocculation technique, adsorption technique and membrane filtration technique four in an organic whole, and not only the treatment effeciency is high, alleviates the membrane moreover and pollutes and realize the recycle of copper resource in the waste water.
The utility model discloses a specifically adopt following technical scheme:
the utility model provides a modular copper-containing effluent treatment plant of high concentration, is including electrodeposition tank, electrolytic flocculation pond, sedimentation tank, adsorption tank and the membrane cisterna that connects gradually, be equipped with a plurality of electrodeposition anode plates and electrolytic flocculation negative plate in the electrodeposition tank, be equipped with electrolytic flocculation anode plate, response polar plate group and electrolytic flocculation negative plate along the rivers direction in the electrolytic flocculation tank in proper order, be equipped with pipe chute and mud pipe in the sedimentation tank, be equipped with adsorption material in the adsorption tank, be equipped with the membrane module in the membrane cisterna.
Preferably, electrodeposition tank, electrocoagulation pool, sedimentation tank, adsorption tank and membrane cisterna set up in same wastewater reaction treatment pond, be provided with 4 baffles that are used for separating each treatment tank in the wastewater reaction treatment pond, wherein, be used for separating electrodeposition tank is equipped with a plurality of water inlets with the bottom of the baffle of electrocoagulation pool, is used for separating be connected with the inlet tube on the baffle of electrocoagulation pool and sedimentation tank, be used for separating the sedimentation tank is equipped with out the basin with the top of the baffle of adsorption tank, is used for separating the filter screen is installed to the bottom of the baffle of adsorption tank and membrane cisterna.
Preferably, the device also comprises a reflux pump and a reflux pipe, wherein the water inlet end of the reflux pipe is positioned in the membrane tank, and the water outlet end of the reflux pipe is positioned in the electrocoagulation tank.
Preferably, the water inlet of the electrodeposition tank is connected with a water inlet pump, and the water outlet of the membrane tank is connected with a pressure gauge and a water outlet pump.
Preferably, the electrodeposition anode plates and the electrodeposition cathode plates are arranged in the electrodeposition tank in a parallel and staggered manner, a gap is reserved between the bottom end of each electrodeposition anode plate and the bottom surface of the electrodeposition tank, and the top end of each electrodeposition cathode plate is lower than the water surface of the electrodeposition tank; the electrodeposition anode plate is connected with the positive pole of the direct current power supply, and the electrodeposition cathode plate is connected with the negative pole of the direct current power supply.
Preferably, the electric flocculation anode plate, the induction electrode plate group and the electric flocculation cathode plate are arranged in a staggered and parallel mode and are fixed into a whole through a plurality of insulating screws and a plurality of insulating nuts, and the electric flocculation anode plate and the electric flocculation cathode plate are respectively connected with the positive pole and the negative pole of the periodic reversing power supply.
Preferably, the bottom of each of the electric flocculation tank and the membrane tank is provided with an aeration pipe.
The utility model has the advantages that: copper ions in the electrodeposition tank are reduced into elemental copper under the action of direct current and deposited on the cathode plate, so that the resource recovery of metal copper is realized; the copper-containing wastewater after electrodeposition is combined with a flocculating agent generated in an electrolytic flocculation tank to be coagulated and precipitated, so that the concentration of copper ions is further reduced; after the flocculated wastewater is efficiently precipitated by the sedimentation tank, the precipitated water flows into the adsorption tank to adsorb residual suspended matters and copper ions in the wastewater, so that membrane pollution is reduced; and finally, the adsorbed effluent flows into a membrane tank for membrane filtration, and the membrane effluent after membrane filtration reaches the dischargeable standard. The device adopts a combined process with a synergistic effect, can effectively exert the advantages of each process, makes up the respective disadvantages, and realizes the aims of low cost, high treatment efficiency, resource recycling and the like.
Drawings
FIG. 1 is a schematic top view of a combined high-concentration copper-containing wastewater treatment device according to an embodiment of the present invention;
FIG. 2 is a schematic sectional view of a combined high-concentration copper-containing wastewater treatment device according to an embodiment of the present invention;
FIG. 3 is a schematic side view of a section of a settling tank in the combined high-concentration copper-containing wastewater treatment plant according to an embodiment of the present invention;
FIG. 4 is a schematic side view of a sectional structure of a membrane tank in the combined high-concentration copper-containing wastewater treatment plant according to an embodiment of the present invention;
in the figure, 1: electrodeposition cell, 1.1: electrodeposition anode plate, 1.2 electrodeposition cathode plate, 1.3: card slot, 2: an electric flocculation tank, 2.1: electrocoagulation anode plate, 2.2: electrolytic flocculation cathode plate, 2.3: induction plate group, 3: sedimentation tank, 3.1: inclined tube, 3.2: mud pipe, 3.2.1 mud valve, 4: adsorption tank, 4.1: adsorbent, 5: membrane pool, 5.1: membrane module, 5.1.1: membrane element, 6: wastewater reaction treatment pool, 7: water inlet, 8: inlet tube, 9: water outlet groove, 10: filter screen, 11: reflux pump, 12: return pipe, 13: water inlet pump, 14: pressure gauge, 15: water outlet pump, 16: direct-current power supply, 17: periodic commutation power supply, 18: aeration pipe, 19: insulating screw, 20: and an insulating nut.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
As shown in figures 1-4, a combined high-concentration copper-containing wastewater treatment device comprises an electrodeposition tank 1, an electrocoagulation tank 2, a sedimentation tank 3, an adsorption tank 4 and a membrane tank 5 which are connected in sequence, wherein in order to make the whole device more compact and reduce the floor area, each treatment tank is arranged in the same wastewater reaction treatment tank 6, 4 baffle plates for separating each treatment tank are arranged in the wastewater reaction treatment tank 6, wherein a plurality of water inlets 7 are arranged at the bottoms of the baffle plates for separating the electrodeposition tank 1 from the electrocoagulation tank 2, a water outlet tank 9 is arranged at the top end of the baffle plate for separating the sedimentation tank 3 from the adsorption tank 4, a filter screen 10 is arranged at the bottom of the baffle plate for separating the adsorption tank 4 from the membrane tank 5, a water inlet pipe 8 is arranged between the electrocoagulation tank 2 and the sedimentation tank 3, the water inlet end of the water inlet pipe 8 penetrates through the baffle plate for separating the electrocoagulation tank 2 from the sedimentation tank 3 and extends into the upper part of the electrocoagulation tank 2 and is lower than the, the water outlet end of the water inlet pipe 8 is of a bent pipe structure and penetrates through the inclined pipe downwards, so that the pipe orifice of the water inlet pipe is lower than the bottom of the inclined pipe.
The device also comprises a reflux pump 11, a reflux pipe 12, a water inlet pump 13, a pressure gauge 14 and a water outlet pump 15. The reflux pipe 11 is connected with a reflux pump 12, the water inlet end of the reflux pipe 11 is positioned in the membrane tank 5 and is slightly lower than the water surface in the membrane tank 5, the pipe orifice of the water inlet end is closed, small holes are uniformly drilled on the pipe wall surface of the water inlet end, and the water outlet end of the reflux pipe 11 is positioned in the electrocoagulation tank 2; the reflux pump 12 is periodically opened, the copper-containing pollutants on the upper layer of the membrane pool 5 can be sucked out of the membrane pool and discharged into the electrolytic flocculation pool 2 through the reflux pipe 11, the copper-containing pollutants are flocculated and settled in the electrolytic flocculation pool 2 to be removed, and the membrane pollution is greatly reduced. And the water inlet pump 13 is connected with a water inlet of the electrodeposition tank 1 and is used for conveying the high-concentration copper-containing wastewater into the electrodeposition tank 1. The pressure gauge 14 and the water outlet pump 15 are positioned on a water outlet pipeline in the membrane pool 5, the water outlet pump 15 is used for pumping the wastewater out of the membrane pool, and the normal operation of the water outlet pump 15 can be protected by the arrangement of the pressure gauge 14.
A plurality of electrodeposition anode plates 1.1 and a plurality of electrodeposition cathode plates 1.2 are arranged in the electrodeposition tank 1, two ends of the electrodeposition anode plates 1.1 and two ends of the electrodeposition cathode plates 1.2 are fixed by clamping grooves 1.3 on the tank wall of the electrodeposition tank 1, and the electrodeposition anode plates 1.1 and the electrodeposition cathode plates 1.2 are distributed in the electrodeposition tank in a parallel staggered arrangement; a gap is reserved between the bottom end of the electrodeposition anode plate 1.1 and the bottom surface of the electrodeposition tank 1, and the top end of the electrodeposition cathode plate 1.2 is lower than the water surface of the electrodeposition tank 1; preferably, the fixing direction of the electrodeposition anode plate 1.1 and the electrodeposition cathode plate 1.2 is perpendicular to the water flow direction. The setting of polar plate can form the liquid circulation route that flows from top to bottom in the electrodeposition cell in 1, has both prolonged the route that the waste water flows, has increased the time of copper-containing waste water with the polar plate contact, has improved current efficiency again, improves the deposit effect, and waste water overcomes gravity and flows from top to bottom moreover, has reduced the torrent degree of waste water to the washing away of deposit copper on the negative plate has been reduced to the rivers.
The plurality of electrodeposition anode plates 1.1 are arranged in parallel and connected with the positive electrode of the direct current power supply 16, the plurality of electrodeposition cathode plates 1.2 are arranged in parallel and connected with the negative electrode of the direct current power supply 16, so that the current density is more uniform, and the stable deposition of copper ions is facilitated, wherein the electrodeposition anode plates 1.1 are one of DSA (dimensionally stable anode) plates, graphite plates or tin dioxide plates, and the electrodeposition cathode plates 1.2 are one of iron plates, aluminum plates, copper plates or nickel plates. In the electro-deposition pool 1, copper ions in the wastewater are reduced to nanoscale elemental copper on the negative plate and attached to the negative plate, so that the copper ions in the wastewater are reduced from high concentration to low concentration, and the resource recycling of metal copper is realized; because the electrodeposition anode plate 1.1 and the electrodeposition cathode plate 1.2 are fixed by the clamping grooves 1.3, the rapid replacement of the anode plate and the recovery of the deposited copper are ensured.
The water inlet 7 between the electric flocculation tank 2 and the electric sedimentation tank 1 is positioned at the bottom end of the tank wall so as to achieve the purposes of increasing the flow degree of wastewater and uniformly mixing the wastewater.
The electric flocculation anode plate 2.1, the induction electrode plate group 2.3 and the electric flocculation cathode plate 2.2 are sequentially arranged in the electric flocculation tank 2 along the water flow direction, the induction electrode plate group 2.3 at least comprises two induction electrode plates, and the electric flocculation anode plate 2.1, the electric flocculation cathode plate 2.2 and the induction electrode plates are aluminum, iron and titanium electrode plates. The electric flocculation anode plate 2.1, the crisscross parallel arrangement of response polar plate group 2.3 and electric flocculation cathode plate 2.2 and fixed into a whole through many insulating screw rods 19 and a plurality of insulated nut 20, this whole is put into the flocculation basin after, the top of every polar plate is higher than the flocculation basin liquid level and only has a side to meet with the cell wall of flocculation basin, the liquid circulation route that flows around the event forms in the electric flocculation basin, the route that the waste water flows has been prolonged, the time of copper-containing waste water and flocculating agent contact has been increased, the flocculation effect of flowing is improved, and higher waste water torrent degree, be favorable to reducing concentration polarization, alleviate the polar plate scale deposit.
The electrocoagulation anode plate 2.1 and the electrocoagulation cathode plate 2.2 are respectively connected with the anode and the cathode of the periodic reversing power supply 17, and the periodic reversing power supply 17 has a periodic reversing function, so that polarization of the polar plate is eliminated, scaling of the polar plate is relieved, and flocculation effect and treatment efficiency are improved. The working principle of the electric flocculation tank 2 is as follows: the electrocoagulation anode plate erodes metal cations under the action of direct current, and then hydrolyzes to form flocculating agents such as hydroxides, various hydroxyl complexes, polynuclear hydroxyl complexes and the like, so that the copper ions in the wastewater are effectively adsorbed and coagulated to further reduce the concentration of the copper ions in the wastewater. In addition, the number of the pole plates in the induction pole plate group 2.3 and the distance between the pole plates can be changed according to actual needs, so that the output of the flocculating agent can be flexibly adjusted, the flocculating effect is improved, and the copper ion removal efficiency is increased.
Further, in order to improve the stability of the electrocoagulation anode plate 2.1, the induction electrode plate group 2.3 and the electrocoagulation cathode plate 2.2, a plurality of insulation screws 19 are fixed on the electrocoagulation anode plate 2.1, the induction electrode plate group 2.3 and the electrocoagulation cathode plate 2.2 by adopting insulation nuts 20.
The bottom of the electric flocculation tank 2 is provided with an aeration pipe 18 for providing oxygen, furthermore, the aeration pipe 18 is positioned between each polar plate, the bubbles flowing upwards are beneficial to improving the opportunity that the flocculating agent captures copper ions, and the ferrous hydroxide flocculating agent can be oxidized into the ferric hydroxide flocculating agent, so that the flocculation effect is enhanced.
The pipe orifice of the water inlet end of the water inlet pipe 8 between the sedimentation tank 3 and the electric flocculation tank 2 is positioned between the liquid level of the electric flocculation tank 2 and the liquid level of the sedimentation tank 3, and the lower liquid level difference is favorable for reducing the flowing speed of wastewater and facilitating the sedimentation of flocs in the wastewater; the outlet end mouth of pipe of inlet tube 8 is located the below of pipe chute 3.1, and mouth of pipe department still is equipped with the reflecting plate moreover, and waste water gets into the pipe chute after the reflecting plate reflection, and the reflecting plate plays the effect that reduces water velocity and change rivers direction.
An inclined pipe 3.1 is arranged at the upper part in the sedimentation tank 3, and according to the shallow tank theory, the wastewater can be efficiently precipitated in the inclined pipe 3.1, so that the precipitation efficiency is improved; the bottom of the sedimentation tank 3 is of an inverted trapezoidal structure, so that sedimentation can be conveniently collected; the bottom of the sedimentation tank 3 is provided with a sludge discharge pipe 3.2 with a sludge discharge valve 3.2.1, the sludge discharge valve 3.2.1 is opened during sludge discharge, and sludge at the bottom of the sedimentation tank can be automatically discharged through static pressure due to a large liquid level difference between the liquid level of the sedimentation tank 3 and the sludge discharge pipe 3.2. In addition, in fig. 1, the inclined tube is not shown in the figure in order to show the specific situation in the sedimentation tank.
The top of the pool wall between the sedimentation pool 3 and the adsorption pool 4 is provided with a water outlet groove 9, and wastewater enters the adsorption pool from the sedimentation pool 3 through the water outlet groove 9 from top to bottom under the action of gravity and fully contacts with the adsorption material 4.1, so that the adsorption efficiency is high. The adsorbing material 4.1 in the adsorption tank 4 is one of activated carbon particle, silicate ceramic and cobble filter material, and adsorbing material 4.1's adsorption effect is better, and price economy and easily acquireing can effectively adsorb remaining suspended solid and copper ion in the waste water, reduce membrane pollution, when adsorbing material reaches the adsorption saturation, can change adsorbing material, and the adsorption tank goes out water and is low concentration copper-containing waste water.
A filter screen 10 for water flowing is arranged at the bottom of the tank wall between the adsorption tank 4 and the membrane tank 5, a membrane module 5.1 and an aeration pipe 18 are arranged in the membrane tank 5, wherein the membrane module 5.1 is a hollow fiber membrane or a flat membrane, the membrane module 5.1.1 in the membrane module 5.1 is an ultrafiltration membrane or a nanofiltration membrane, and the aeration pipe 18 is arranged at the bottom of the membrane tank 5. In the membrane tank 5, the wastewater flows from bottom to top after passing through the filter screen 10, the copper-containing pollutants deposited on the membrane surface are effectively washed by the aeration of the aeration pipe 18, the shaken copper-containing pollutants are wrapped by gas-liquid two-phase flow and enter the upper layer of the membrane tank 5, and then enter the electric flocculation tank through the return pipe to participate in reaction again.
And finally, separating and discharging the low-concentration copper-containing wastewater through a water outlet pump 15 by virtue of a pipeline connected to the membrane module 5.1 after membrane separation, wherein the discharged water reaches the discharge standard.
Example 2
The device provided in example 1 was used to treat high-concentration copper-containing wastewater, as follows:
introducing copper-containing wastewater with initial copper ion concentration of 6580 mg/L into an electrodeposition tank 1 through a water inlet pump 13, baffling the wastewater up and down between an electrodeposition anode plate 1.1 and an electrodeposition cathode plate 1.2 in the electrodeposition tank 1, reducing copper ions to deposit on the electrodeposition cathode plate 1.2, reducing the copper ion concentration of effluent water to 158 mg/L after the copper-containing wastewater stays in the electrodeposition tank 1 for 6 hours, taking the electrodeposition cathode plate 1.2 in the electrodeposition tank 1 out of a clamping groove 1.3, collecting deposited copper on the surface of the copper-containing wastewater, drying and weighing, and calculating the recovery rate of metal copper to be 94.06%.
The effluent of the electro-sedimentation tank 1 enters an electro-flocculation tank 2, the wastewater flows back and forth between an electro-flocculation anode plate 2.1, an electro-flocculation cathode plate 2.2 and an induction electrode plate group 2.3 and is fully contacted with a flocculating agent generated in the electro-flocculation tank 2 to flocculate and precipitate, the hydraulic retention time is 30min, and the concentration of copper ions in the effluent is reduced to 53.45 mg/L
The effluent after electrocoagulation enters a sedimentation tank 3, the copper ion concentration in the wastewater is reduced to 15.68 mg/L after the wastewater is efficiently precipitated through an inclined tube 3.1, the precipitated effluent enters an adsorption tank 4, the wastewater is fully contacted with an adsorption material 4.1 from top to bottom, the copper ion concentration of the effluent is reduced to 2.18 mg/L after the copper ions in the wastewater are effectively adsorbed by the adsorption material 4.1, finally the wastewater enters a membrane tank 5, most of the copper ions in the wastewater are effectively blocked outside a membrane by a membrane element 5.1.1, the membrane effluent is discharged out of a device through an effluent pump 15, the effluent concentration of the membrane tank 5 is 0.41 mg/L, and the effluent reaches GB18918-2002 urban sewage discharge standard, and Table 1 is the change value of the copper ion concentration in the wastewater treated by each process.
TABLE 1
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (9)
1. The utility model provides a modular copper-containing effluent treatment plant of high concentration, its characterized in that, including electrodeposition tank (1), electrocoagulation pool (2), sedimentation tank (3), adsorption tank (4) and membrane cisterna (5) that connect gradually, be equipped with a plurality of electrodeposition anode plates (1.1) and electrodeposition negative plate (1.2) in electrodeposition tank (1), be equipped with electrocoagulation anode plate (2.1), response polar plate group (2.3) and electrocoagulation negative plate (2.2) along the water flow direction in electrocoagulation pool (2) in proper order, be equipped with pipe chute (3.1) and mud pipe (3.2) in sedimentation tank (3), be equipped with adsorbing material (4.1) in adsorption tank (4), be equipped with membrane module (5.1) in membrane cisterna (5).
2. The combined high-concentration copper-containing wastewater treatment plant according to claim 1, the electro-deposition pool (1), the electro-flocculation pool (2), the sedimentation pool (3), the adsorption pool (4) and the membrane pool (5) are arranged in the same wastewater reaction treatment pool (6), the wastewater reaction treatment tank (6) is internally provided with 4 clapboards for separating each treatment tank, wherein a plurality of water inlets (7) are arranged at the bottom of the clapboard for separating the electro-sedimentation tank (1) and the electro-flocculation tank (2), a water inlet pipe (8) is connected on the clapboard for separating the electric flocculation tank (2) and the sedimentation tank (3), a water outlet groove (9) is arranged at the top end of the clapboard used for separating the sedimentation tank (3) and the adsorption tank (4), a filter screen (10) is arranged at the bottom of the clapboard for separating the adsorption tank (4) and the membrane tank (5).
3. The combined high-concentration copper-containing wastewater treatment device according to claim 1, characterized in that the device further comprises a reflux pump (11) and a reflux pipe (12), wherein the water inlet end of the reflux pipe (12) is positioned in the membrane tank (5), and the water outlet end of the reflux pipe (12) is positioned in the electroflocculation tank (2).
4. The combined high-concentration copper-containing wastewater treatment device according to claim 1, wherein a water inlet of the electrodeposition tank (1) is connected with a water inlet pump (13), and a water outlet of the membrane tank (5) is sequentially connected with a pressure gauge (14) and a water outlet pump (15).
5. The combined high-concentration copper-containing wastewater treatment device according to claim 1, characterized in that the electrodeposition anode plates (1.1) and the electrodeposition cathode plates (1.2) are arranged in parallel and staggered in the electrodeposition tank (1), a gap is left between the bottom end of the electrodeposition anode plates (1.1) and the bottom surface of the electrodeposition tank (1), and the top end of the electrodeposition cathode plates (1.2) is lower than the water surface of the electrodeposition tank (1).
6. The combined high-concentration copper-containing wastewater treatment device according to claim 5, characterized in that the electrodeposition anode plate (1.1) is connected with the positive pole of a direct current power supply (16), and the electrodeposition cathode plate (1.2) is connected with the negative pole of the direct current power supply (16).
7. The combined high-concentration copper-containing wastewater treatment device according to claim 1, wherein the electrocoagulation anode plate (2.1), the induction electrode plate group (2.3) and the electrocoagulation cathode plate (2.2) are arranged in a staggered and parallel manner and fixed into a whole by a plurality of insulating screws (19) and a plurality of insulating nuts (20).
8. The combined high-concentration copper-containing wastewater treatment device according to claim 7, characterized in that the electrocoagulation anode plate (2.1) and the electrocoagulation cathode plate (2.2) are respectively connected with the positive pole and the negative pole of the periodic reversing power supply (17).
9. The combined high-concentration copper-containing wastewater treatment device according to claim 1, characterized in that the bottoms of the electroflocculation tank (2) and the membrane tank (5) are provided with aeration pipes (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921547192.2U CN211004911U (en) | 2019-09-18 | 2019-09-18 | Modular copper-containing effluent treatment plant of high concentration |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921547192.2U CN211004911U (en) | 2019-09-18 | 2019-09-18 | Modular copper-containing effluent treatment plant of high concentration |
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| CN211004911U true CN211004911U (en) | 2020-07-14 |
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| CN201921547192.2U Expired - Fee Related CN211004911U (en) | 2019-09-18 | 2019-09-18 | Modular copper-containing effluent treatment plant of high concentration |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113830943A (en) * | 2021-10-08 | 2021-12-24 | 江苏京源环保股份有限公司 | Ultrasonic-combined efficient electric floating sewage treatment process and treatment equipment thereof |
| CN114307285A (en) * | 2022-01-10 | 2022-04-12 | 景津装备股份有限公司 | Unlocking and plate loosening cross operation automatic control device and corresponding filter chamber locking pressure maintaining mechanism |
-
2019
- 2019-09-18 CN CN201921547192.2U patent/CN211004911U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113830943A (en) * | 2021-10-08 | 2021-12-24 | 江苏京源环保股份有限公司 | Ultrasonic-combined efficient electric floating sewage treatment process and treatment equipment thereof |
| CN114307285A (en) * | 2022-01-10 | 2022-04-12 | 景津装备股份有限公司 | Unlocking and plate loosening cross operation automatic control device and corresponding filter chamber locking pressure maintaining mechanism |
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