CN210670721U - Electric control board with heat dissipation structure - Google Patents
Electric control board with heat dissipation structure Download PDFInfo
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- CN210670721U CN210670721U CN201921447178.5U CN201921447178U CN210670721U CN 210670721 U CN210670721 U CN 210670721U CN 201921447178 U CN201921447178 U CN 201921447178U CN 210670721 U CN210670721 U CN 210670721U
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- heat
- heat dissipation
- hole
- circuit board
- control board
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 239000004020 conductor Substances 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 239000003973 paint Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型揭示了一种具有散热结构的电控板，该具有散热结构的电控板包括：电路板、贴片元件、导热电极片、内壁覆盖有导热材料的第一通孔，以及散热片，电路板的正面设有覆铜导线，贴片元件和导热电极片设置在电路板的正面，且贴片元件固定连接在导热电极片上，第一通孔贯穿电路板，散热片设置在电路板的背面，导热电极片通过覆铜导线与第一通孔连接，散热片与第一通孔相连接。本实用新型贴片元件通过导热电极片、第一通孔，与电路板背面的散热片进行连接，使得贴片元件的热量能够通过第一通孔导入电路板背面的散热片上，实现对贴片元件的散热，散热效果显著，且不需要额外新增外置的散热器、或者替换功率更高的元器件，节约了生产成本。
The utility model discloses an electric control board with a heat dissipation structure. The electric control board with a heat dissipation structure comprises: a circuit board, a patch element, a heat-conducting electrode sheet, a first through hole whose inner wall is covered with a heat-conducting material, and a heat sink. , the front side of the circuit board is provided with copper-clad wires, the patch element and the heat-conducting electrode sheet are arranged on the front side of the circuit board, and the patch element is fixedly connected to the heat-conducting electrode sheet, the first through hole penetrates the circuit board, and the heat sink is arranged on the circuit board. On the back of the fin, the thermally conductive electrode sheet is connected to the first through hole through a copper-clad wire, and the heat sink is connected to the first through hole. The patch element of the utility model is connected with the heat sink on the back of the circuit board through the heat-conducting electrode sheet and the first through hole, so that the heat of the patch element can be introduced to the heat sink on the back of the circuit board through the first through hole, and the patch The heat dissipation of the components has a significant heat dissipation effect, and there is no need to add additional external heat sinks or replace components with higher power, which saves production costs.
Description
Technical Field
The utility model relates to air conditioner technical field especially involves an automatically controlled board with heat radiation structure.
Background
The current increase of current air conditioner makes output big, and the paster element heat dissipation provides higher requirement on automatically controlled board, and the life-span and whole automatically controlled stability of components and parts can be influenced to the heat dissipation harmfully, and current solution heat dissipation problem's method includes: 1) the components with higher power and larger volume are selected to bear higher upper limit current, so that the heating problem caused by overlarge load can be avoided, but the arrangement naturally increases the volume of the electric control board, is not beneficial to the layout of electronic components on the electric control board, and also increases the production cost of the electric control board; 2) adopt external radiator, this kind of mode is difficult for the assembly, increases the cost of labor, and the radiator needs special modes such as screw to fix, and its reliability is relatively poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an automatically controlled board with heat radiation structure aims at solving under the condition that does not increase automatically controlled board volume, how to improve the technological problem of the radiating effect of paster device.
In view of this, the utility model provides an automatically controlled board with heat radiation structure, this automatically controlled board with heat radiation structure includes: the heat-conducting chip comprises a circuit board, a chip element, a heat-conducting electrode plate and a radiating fin, wherein the inner wall of the circuit board is covered with a first through hole made of a heat-conducting material, the front side of the circuit board is provided with a copper-clad wire, the chip element and the heat-conducting electrode plate are arranged on the front side of the circuit board, the chip element is fixedly connected onto the heat-conducting electrode plate, the first through hole penetrates through the circuit board, the radiating fin is arranged on the back side of the circuit board, the heat-conducting electrode plate is connected with the first through hole through the copper-clad wire, and.
Further, the heat sink is provided with a second through hole corresponding to the first through hole.
Further, the second through hole is disposed at a geometric center of the heat sink.
Further, the distance between the heat-conducting electrode plate and the first through hole is 2-4 mm.
Further, the heat conducting material is metal tin or metal copper.
Further, the heat radiating fins are made of copper sheets.
Further, the copper skin thickness is between 8 microns and 12 microns.
Further, the patch element and the heat conducting electrode plate are integrally formed, and the heat conducting electrode plate is connected with the circuit board in a soldering mode.
Further, the surface of the radiating fin is coated with graphene radiating paint.
Further, the first through hole is arranged in a strip shape or a circular shape.
The utility model provides an automatically controlled board with heat radiation structure, because patch element passes through heat conduction electrode slice, first through-hole, is connected with the fin at the circuit board back for patch element's heat can be through on the exposed fin of large tracts of land at the bottom of the first through-hole will be led into the board, realizes dispelling the heat to patch element, and the radiating effect is showing, and does not need additionally newly-increased external radiator, perhaps replaces the higher components and parts of power, has practiced thrift manufacturing cost.
Drawings
Fig. 1 is a top view of an embodiment of an electric control board with a heat dissipation structure of the present invention;
fig. 2 is a front view of an embodiment of the electric control board with a heat dissipation structure of the present invention;
fig. 3 is a bottom view of an embodiment of the electric control board with a heat dissipation structure of the present invention.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As used herein, the singular forms "a", "an", "the" and "the" include plural referents unless the content clearly dictates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, units, modules, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, units, modules, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Referring to fig. 1-3, the utility model provides an automatically controlled board with heat radiation structure, this automatically controlled board with heat radiation structure includes circuit board 1, patch element 2, heat conduction electrode piece 3, the inner wall covers there is the first through-hole 4 of heat conduction material, and fin 5, the front of circuit board 1 is equipped with covers the copper wire (not marking in the picture), patch element 2 and heat conduction electrode piece 3 set up the front at circuit board 1, and patch element 2 fixed connection is on heat conduction electrode piece 3, first through-hole 4 runs through circuit board 1, fin 5 sets up the back at circuit board 1, heat conduction electrode piece 3 is connected with first through-hole 4 through covering the copper wire, fin 5 is connected with first through-hole 4.
The utility model connects the heat conducting electrode plate 3 on the front side of the circuit board 1 and the radiating fin 5 on the back side of the circuit board 1 through the first through hole 4 with the heat conducting material covered on the inner wall, wherein, in the manufacturing process of the circuit board 1, the front side of the circuit board 1 is distributed with copper-clad conducting wires, the heat conducting electrode plate 3 is fixed on the copper-clad conducting wires, and is connected with the first through hole 4 through the copper-clad conducting wires, when the patch element 2 works, heat is generated, because the patch element 2 is fixedly connected on the heat conducting electrode plate 3, therefore, the heat flows through the heat conducting electrode plate 3, further flows through the copper-clad conducting wires, and the heat is radiated through the heat conducting material on the first through hole 4 and is guided into the radiating fin 5 on the back side of the circuit board 1, thereby realizing the heat radiation of the patch element 2, the occupation area of the circuit board 1 can be reduced.
In the present embodiment, the heat sink 5 is provided with a second through hole corresponding to the first through hole 4. That is, the first through holes 4 penetrate the heat sink 5, and the first through holes 4 and the second through holes correspond to each other, so that when heat is conducted to the heat sink 5 through the first through holes 4, the heat can be conducted into the heat sink 5 from various directions, thereby improving the conduction efficiency and further increasing the heat dissipation efficiency.
Alternatively, the second through hole is provided at the geometric center of the heat sink 5, which arrangement may allow heat to be uniformly conducted on the heat sink 5, further increasing the heat dissipation efficiency.
Optionally, the distance between the heat-conducting electrode sheet 3 and the first through hole 4 is 2-4 mm, and the heat-conducting electrode sheet 3 and the first through hole 4 are connected in a close-distance manner through a copper-clad wire, so that heat transfer is facilitated.
In this embodiment, the heat conducting material is metal tin or metal copper, that is, the inner wall of the first through hole 4 is plated with copper, or a tin layer is coated in a tin furnace, and the heat of the chip component 2 can be quickly conducted to the heat sink 5 through the heat conducting capacity of the metal copper or tin, and of course, in practical application, other heat conducting materials or a combination of multiple materials can be used, for example, a layer of copper is plated on the inner wall of the first through hole 4, and then the surface of the copper metal is plated with heat conducting materials such as metal tin or nickel, so that on one hand, the oxidation resistance of the heat conducting layer is improved, and on the other hand, the heat conducting capacity is improved.
In this embodiment, the heat sink 5 is a copper sheet, and copper metal has good heat conductivity, and copper plating on the substrate is a mature technology at present, so that the copper sheet is used as the heat sink 5, and on one hand, the heat conduction effect is good, and the heat transfer of the patch element 2 can be satisfied, thereby achieving the purpose of heat dissipation, and on the other hand, the technology is mature, and the production cost is greatly reduced. Of course, according to actual production requirements, other materials with good heat conductivity can be selected as the heat sink 5, such as an aluminum sheet or an alloy sheet, and a tin furnace can be passed over a copper sheet, so that a layer of tin is coated on the surface of the copper sheet, and the oxidation resistance of the heat sink 5 is improved.
In this embodiment, the copper skin is between 8 microns and 12 microns thick. The thicker copper sheet makes the heat dissipation effect obvious.
In the present embodiment, the chip component 2 and the heat conductive electrode sheet 3 are integrally formed, and the heat conductive electrode sheet 3 is connected to the circuit board 1 by soldering. Because patch element 2 and heat conduction electrode piece 3 integrated into one piece to reduced welding process, reduced the existence of welding point, thereby reduced patch element 2 and the mutual risk that drops of heat conduction electrode piece 3. In addition, soldering is a welding method in which a metal solder having a low melting point is melted by heating and then penetrates into and fills a gap at a joint of metal members, and soldering enables the heat conductive electrode sheet 3 and the circuit board 1 to be fixedly connected, and a fillet of a tin alloy does not affect heat transfer.
In the present embodiment, the surface of the heat sink 5 is coated with the graphene heat dissipation coating, and the graphene has very good heat conduction performance. The pure defect-free single-layer graphene has the thermal conductivity coefficient as high as 5300W/mK, is the carbon material with the highest thermal conductivity coefficient so far, and is higher than that of a single-wall carbon nanotube (3500W/mK) and a multi-wall carbon nanotube (3000W/mK). When it is used as carrier, its thermal conductivity can be up to 600W/mK. The graphene heat dissipation coating is coated on the surface of the heat dissipation fin 5, so that the heat dissipation effect is greatly improved.
In this embodiment, the first through holes 4 are arranged in a strip shape or a circular shape, and the strip shape or the circular shape of the through holes can increase the heat conducting area and accelerate the heat transfer.
In some embodiments, the number of the first through holes 4 may be multiple, and may be determined according to the actual current and power of the patch element 2 on the circuit board 1, the wind flowing direction of the wind tunnel, and the like.
In some embodiments, the ratio of the area of the heat sink 5 to the area of the heat-conducting electrode sheet 3 is 3-5, and the heat sink 5 with a large area can accelerate heat dissipation.
In some embodiments, the electronic control board with the heat dissipation structure further comprises a heat dissipation protection board and insulating heat dissipation silica gel, the insulating heat dissipation silica gel is coated on the back surface of the heat dissipation protection board, the heat dissipation protection board is provided with heat dissipation stripes, during installation, the side coated with the insulating heat dissipation silica gel is tightly attached to the heat dissipation sheet 5, the insulating heat dissipation silica gel can conduct heat on the heat dissipation sheet 5 to the heat dissipation protection board, and due to the existence of the heat dissipation stripes, the contact area between the heat dissipation protection board and outside air is increased, so that the heat dissipation capacity can be increased, and the heat dissipation protection board also effectively prevents the circuit board from being impacted.
Optionally, the edge of the heat dissipation protection plate has at least two threaded holes, the circuit board 1 has a threaded hole matched with the threaded hole, and the heat dissipation protection plate and the circuit board 1 are fixedly connected with each other by using a bolt.
In some embodiments, the heat dissipation protection board includes heat dissipation district and grafting fixed area, the grafting fixed area sets up the both sides at the heat dissipation district, the heat dissipation stripe has been arranged to the heat dissipation district, the grafting fixed area is provided with the inserted sheet, be provided with the slot that corresponds with the inserted sheet on circuit board 1, wherein, inserted sheet surface and inserted groove inner wall are the sawtooth structure of mutual matching, with inserted sheet disect insertion slot, through the mutual interlock of sawtooth structure, can realize the fixed connection of heat dissipation protection board and circuit board 1, and then need not open the screw on circuit board and heat dissipation protection board, directly through grafting fixed connection, can improve the simplicity of equipment.
In actual production process, the engineer when setting up circuit board 1, mark suitable trompil position around paster element 2, carry out trompil on circuit board 1 according to the trompil position during the engineering manufacturing, when passing tin stove (tin stove welds, a welding mode) behind the 1 trompil of circuit board, the trompil that is filled up by soldering tin forms the heat conductor, and the tin stove welds the mode of irritating tin for the through-hole that opens, and the time of production has significantly reduced solves the cost of labor, the efficiency problem.
The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings or the direct or indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921447178.5U CN210670721U (en) | 2019-08-29 | 2019-08-29 | Electric control board with heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921447178.5U CN210670721U (en) | 2019-08-29 | 2019-08-29 | Electric control board with heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210670721U true CN210670721U (en) | 2020-06-02 |
Family
ID=70821380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921447178.5U Active CN210670721U (en) | 2019-08-29 | 2019-08-29 | Electric control board with heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210670721U (en) |
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2019
- 2019-08-29 CN CN201921447178.5U patent/CN210670721U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 1 by villagers' group of helongsha, Shengli village, Lishui Town, Nanhai District, Foshan City, Guangdong Province Patentee after: Guangdong Kaili HVAC Co.,Ltd. Address before: No. 1 by villagers' group of helongsha, Shengli village, Lishui Town, Nanhai District, Foshan City, Guangdong Province Patentee before: GUANGDONG CHIGO HEATING AND VENTILATION EQUIPMENT Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |