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CN210006957U - 电连接器 - Google Patents

电连接器 Download PDF

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Publication number
CN210006957U
CN210006957U CN201920641762.8U CN201920641762U CN210006957U CN 210006957 U CN210006957 U CN 210006957U CN 201920641762 U CN201920641762 U CN 201920641762U CN 210006957 U CN210006957 U CN 210006957U
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CN
China
Prior art keywords
portions
electrical connector
terminal
clamping
shielding
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Application number
CN201920641762.8U
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English (en)
Inventor
金左锋
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Priority to CN201920641762.8U priority Critical patent/CN210006957U/zh
Application granted granted Critical
Publication of CN210006957U publication Critical patent/CN210006957U/zh
Priority to US16/867,815 priority patent/US10971837B2/en
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Anticipated expiration legal-status Critical

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Abstract

本实用新型提供一种电连接器，包括：一基体，设有多个收容孔上下贯穿所述基体，一屏蔽件设于所述基体的下表面；多个端子，分别对应收容于所述收容孔，所述端子包括多个信号端子及至少一接地端子，所述接地端子与所述屏蔽件之间具有间隔，所述接地端子具有一导接部向下伸出所述收容孔，所述导接部通过焊料焊接于一主电路板，所述焊料接触所述导接部与所述屏蔽件；本实用新型通过所述焊料连接所述接地端子的导接部与所述屏蔽件，从而减少了寄生电荷，降低容性，改善高频。

Description

电连接器
【技术领域】
本实用新型涉及一种电连接器，尤其涉及一种屏蔽电连接器。
【背景技术】
专利号为CN200910305610.1的中国专利揭示的一种电连接装置用于连接一个芯片模块，其主要包括电路板及组装在电路板中的若干导电端子。电路板的上下表面镀有金属层且设有若干贯穿其厚度方向的端子孔，端子孔的内壁上具有导电层以与电路板中的信号路径相电性连通。导电端子分别容纳于端子孔中，并与其中导电层1电性接触。导电端子包括信号端子及接地端子，两种端子结构相同。每一导电端子包括一个基部、由基部分别向上和向下倾斜延伸的接触部及支撑部、以及位于基部两侧并垂直延伸的固持部。所述固持部与导电层相接触并将导电端子固持在端子孔中。此外，导电端子的接触部具有一个向后凸伸并与固持部不共面的驼背部，驼背部抵持在导电层上以与其接触。所述端子孔包括用于收容所述接地端子的端子孔以及用于收容所述信号端子的端子孔,所述端子孔的内壁上的导电层与所述金属层相连通，从而形成接地端子并联效应。所述端子孔的顶部设有附着于电路板上的绝缘胶体，并因绝缘胶体而使得所述端子孔的内壁上的导电层与金属层相电性隔离。
然而，因导电层与所述驼背部接触，导致寄生电荷增大，增加容性，影响高频。
因此，有必要设计一种电连接器，以克服上述问题。
【发明内容】
本实用新型的创作目的在于提供一种降低容性，从而改善高频的电连接器。
为了达到上述目的，本实用新型的电连接器采用如下技术方案：
一种电连接器，包括：一基体，设有多个收容孔上下贯穿所述基体，一屏蔽件设于所述基体的下表面；多个端子，分别对应收容于所述收容孔，所述端子包括多个信号端子及至少一接地端子，所述接地端子与所述屏蔽件之间具有间隔，所述接地端子具有一导接部向下伸出所述收容孔，所述导接部通过焊料焊接于一主电路板，所述焊料接触所述导接部与所述屏蔽件。
进一步，所述端子具有两夹持部用于夹持一对接元件的插接部，及两导引部分別自夹持部向后延伸形成，两导引部之间的距离大于两夹持部之间的距离，所述端子还具有一基部低于所述导引部，所述基部的正上方具有一收容空间,所述收容空间位于所述导引部的后方，当所述插接部被所述夹持部夹持时，所述插接部低于所述导引部的顶端的部分向前凸出于所述夹持部而被收容于相邻端子的收容空间。
进一步，所述插接部为球状，每一端子的两夹持部之间的距离从下向上逐渐变小，且两夹持部夹持所述插接部的位置高于所述插接部的水平中心线。
进一步，所述端子具有至少一固定部固定于所述收容孔，所述导接部自所述固定部向内倾斜且向下延伸形成且部分收容于所述收容孔。
进一步，所述固定部有两个，一第一通槽形成于两个所述固定部的前侧之间，一第二通槽形成于两个所述固定部的后侧之间。
进一步，所述导接部有两个且分开设置，一第一开口形成于两个所述导接部的前侧之间，一第二开口形成于两个所述导接部的后侧之间。
进一步，所述收容孔的横截面为圆形，所述固定部的表面为与所述收容孔的内壁匹配的弧面。
进一步，所述两固定部的前侧分别相向凸伸一凸部。
进一步，所述屏蔽件为金属镀层，且所述收容孔的内壁为绝缘。
进一步，所述基体上表面设有屏蔽层，所述屏蔽层与所述接地端子接触，所述屏蔽件通过所述接地端子与所述屏蔽层电性导通。
与现有技术相比，本实用新型的电连接器具有以下有益效果：
本实用新型通过所述焊料连接所述接地端子的导接部与所述屏蔽件，从而使所述接地端子与所述屏蔽件电性导通,不必为了使得所述接地端子与所述屏蔽件电性导通在所述收容孔的内壁设导电层，因而减少了寄生电荷，降低容性，改善高频。
【附图说明】
图1为本实用新型电连接器与对接元件插接,插接部移至夹持部时的立体视图；
图2为图1的分解视图；
图3为图1的右视图；
图4本实用新型电连接器与对接元件插接,插接部向下插入两导引部之间后未移至夹持部时的视图；
图5为本实用新型电连接器的俯视图；
图6为图5的B-B位置的剖视图；
图7为图3的C-C位置的剖视图；
图8本实用新型端子夹持所述插接部时的立体视图；
图9为图8的俯视图；
图10为本实用新型端子的主视图；
图11为图10的俯视图；
图12为图10的右视图；
图13为本实用新型的芯片模块与载板连接示意图；
图14为端子与主电路板焊接示意图。
具体实施方式的附图标号说明：
Figure BDA0002050875260000031
Figure BDA0002050875260000041
【具体实施方式】
为便于更好的理解本实用新型的目的、结构、特征以及功效等，现结合附图和具体实施方式对本实用新型作进一步说明。
如图1-14所示，本实用新型电连接器300及其对接元件400，用以电性连接一芯片模块500至一主电路板800，其包括一对接元件400及一电连接器300，所述对接元件400包括一载板4及设于所述载板4且向下伸出所述载板4的多个插接部2，所述插接部2为球状且由铜制成(当然,在其它实施例中,所述插接部2也可为细长的圆柱状或平板状或其它形状)，所述芯片模块500承载于所述载板4的上表面且两者电性连接；所述电连接器300位于所述主电路板800上，其包括一基体3及收容于所述基体3的多个端子1。
如图1、2、7所示，所述基体3为电路板(当然在其它实施例中并不限于此)，所述基体3上下贯穿有多个收容孔31，所述收容孔31的内壁没有导电层，即所述收容孔31的内壁为绝缘，所述收容孔31的横截面为圆形，多个所述收容孔31包括多个第一收容孔311和多个第二收容孔312，所述基体3上表面镀有一第三屏蔽层33，所述第三屏蔽层33覆盖至所述第二收容孔312的上边缘；所述基体3的上表面具有一绝缘区域32围设于所述第一收容孔311且位于所述第一收容孔311与所述第三屏蔽层33之间，使得所述第一收容孔311与所述第三屏蔽层33隔开；所述基体3下表面具有一屏蔽件34，所述屏蔽件34延伸至所述第二收容孔312的下边缘,所述屏蔽件34与所述第一收容孔311的下边缘之间具有间隔，在本实施例中，所述屏蔽件34为金属镀层。
如图8、9、12所示，所述端子1具有一基部13呈环状，所述基部13的前侧形成有一缺口16；自所述基部13向上延伸两连接部14，所述端子1还具有两个导引部12和两个夹持部11，两夹持部11用于夹持所述插接部2，两导引部12之间的距离大于两夹持部11之间的距离，从而两导引部12之间的距离大于所述插接部2的直径，从而实现所述插接部2以零插入力向下插入两导引部12之间，然后所述导引部12导引所述插接部2水平移动至所述夹持部11(如图4、5所示)，所述导引部12连接所述连接部14，所述夹持部11自所述导引部12向前延伸形成。沿自下向上的方向，所述连接部14向外扩张(当然，在其它实施例中，所述连接部14也可以只有一部分向外扩张)，且所述导引部12向内倾斜，也就是说，两连接部14之间的距离从下向上逐渐变大，两个导引部12之间的距离从下向上逐渐变小，从而两夹持部11之间的距离从下向上逐渐变小，以方便所述夹持部11夹持所述插接部2的位置高于所述插接部2的水平中心线L。当所述插接部2被所述夹持部11夹持时，如若所述夹持部11夹持所述插接部2的位置低于所述插接部2的水平中心线L，插接部2会受到来自夹持部11向上的推力，导致所述芯片模块500往上移。因而，在本实施例中，所述夹持部11夹持所述插接部2的位置高于所述插接部2的水平中心线L，从而使得所述夹持部11对插接部2形成一个向下的压力，避免了插接部2受向上的推力而导致芯片模块500往上移。所述基部13正上方具有一收容空间15，所述收容空间15位于所述导引部12的后方，如图3所示，当所述插接部2被所述夹持部11夹持时，所述插接部2低于所述夹持部11的顶端的部分向前凸出于所述夹持部11而被收容于相邻端子1的收容空间15中，即所述插接部2低于所述夹持部11的顶端的部分位于所述基部13正上方。所述基部13位于所述收容孔31外，自所述基部13向下延伸两固定部17(当然，在其它实施例中，也可以只有一个固定部)，所述夹持部11的前端向前超出所述固定部17，如图6所示，所述固定部17与所述收容孔31干涉配合而将所述端子1固定于所述收容孔31中，如图7所示，所述固定部17的表面为与所述收容孔31的内壁匹配的弧面，从而所述固定部17与所述收容孔31的内壁有更大的接触面积，使得所述端子1更牢固的固定于所述基体3，两固定部17的前侧分别相向凸设一凸部171，一第一通槽1a形成于两固定部17的前侧之间，一第二通槽1b形成于两固定部17的后侧之间。所述端子1还具有两个分开设置的导接部18(当然，在其它实施例中，也可以只有一个导接部)，从而一第一开口1c形成于两个所述导接部18的前侧之间，一第二开口1d形成于两个所述导接部18的后侧之间，所述第一通槽1a、所述第二通槽1b、所述第一开口1c、所述第二开口1d可以减少所述端子1的横截面积，增大特性阻抗，改善高频。所述导接部18自所述固定部17向下倾斜延伸，用于导引所述端子1插入所述收容孔31中，所述导接部18一部分位于所述收容孔31中另一部分伸出所述收容孔31以与所述主电路板800焊接。
如图5、6所示，多个所述端子1包括多个信号端子200分别对应收容于所述第一收容孔311中及至多个接地端子100分别对应收容于所述第二收容孔312中，所述信号端子200与所述第三屏蔽层33和所述屏蔽件34不导通，由于所述接地端子100的固定部17贴紧所述第二收容孔312的上边缘，使得所述接地端子100与所述第三屏蔽层33接触从而电性导通，如图14所示，因所述接地端子100的导接部18部分位于所述第二收容孔312，故所述导接部18与所述第二收容孔312的下边缘之间有间隔，通过焊料700将所述导接部18焊接于所述主电路板800时所述焊料700填充所述接地端子100的导接部18与所述屏蔽件34之间的间隔，从而使得所述焊料700均连接所述屏蔽件34和所述导接部18，使得所述屏蔽件34与所述接地端子100电性导通，从而所述第三屏蔽层33与所述屏蔽件34电性导通，也就是说，所述第三屏蔽层33通过所述接地端子100与所述屏蔽件34电性导通。
如图1、2、13所示，所述载板4的材质为印刷电路板，具体为FR4，所述载板4上表面与下表面之间具有多层印刷电路45，所述载板4的前侧面设有一被挡部41，自所述载板4的前侧面向内凹陷形成一防呆槽44。所述载板4的下表面具有一第一屏蔽层42，所述载板4的上表面具有一第二屏蔽层43。如图1、3所示，所述插接部2的顶部向上焊接于所述载板4的下表面，所述插接部2由铜制成，可为纯铜或铜合金，本实例中为铜合金，具体为98％重量的黄铜和2％重量的锡，另外所述插接部2表面镀有防氧化的镀层，所述镀层的材料为金。多个所述插接部2包括多个第一插接部21供所述信号端子200夹持和多个第二插接部22供所述接地端子100夹持。第一屏蔽层42延伸至所述第二插接部22从而所述第一屏蔽层42与所述第二插接部22导通，从而将多个所述第二插接部22相互串联，所述第一屏蔽层42与所述第一插接部21具有间隔从而使得第一屏蔽层42与第一插接部21不导通,但是所述第二屏蔽层43与所述印刷电路45连接且所述印刷电路45与所述第二插接部22连接,从而使得所述第二屏蔽层43与所述第二插接部22电性连接。如图13所示，所述载板4的上表面还具有多个焊接区46，所述芯片模块500具有多个导电体600焊接于多个所述焊接区46，所述导电体600与所述第二屏蔽层43之间有间隔从而所述导电体600与所述第二屏蔽层43不导通。所述导电体600通过多层印刷电路45与所述插接部2电性导通，相邻两所述插接部2之间的距离大于相邻两所述导电体600之间的距离，使得有足够的空间设置与所述导电体600数量相同的所述端子1。
如图1、2所示，一挡框5向下延伸有多个固定柱53分别对应向下插入所述固定孔35以将所述挡框5固定于基体3上，所述挡框5具有一挡止部51位于所述被挡部41的前方、以及具有一防呆部52，将所述载板4向下安装于所述电连接器300时，所述防呆部52收容于所述防呆槽44，避免装反。所述挡止部51沿前后方向与所述被挡部41重叠，所述插接部2水平移动至所述夹持部11时，所述挡止部51沿所述插接部2的水平移动方向向前抵挡所述被挡部41。
综上所述，本实用新型的电连接器300具有下列有益效果：
(1)本实用新型通过所述焊料700连接所述接地端子100的导接部18与所述屏蔽件34，从而使所述接地端子100与所述屏蔽件34电性导通,不必为了使得所述接地端子100与所述屏蔽件34电性导通在所述收容孔31的内壁设导电层，因而减少了寄生电荷，降低容性，改善高频。
(2)由于所述端子1的两个夹持部11之间的距离从下向上逐渐变小，且所述夹持部11夹持所述插接部2的位置高于插接部2的水平中心线L，从而使得所述夹持部11对插接部2形成一个向下的压力，避免了插接部2受向上的推力而导致芯片模块500往上移。
(3)本实用新型由于所述插接部2为球状，故所述插接部2沿上下方向的长度较短而宽度较大，所述插接部2有足够的强度抵抗受到的外力撞击，故所述插接部2不易变形，从而保证端子1与所述插接部2的良好接触。另外，由于所述插接部2沿上下方向的长度较短，故所述插接部2下端离其被所述夹持部11夹持的位置较近，因而可以改善木桩效应，从而改善高频。再者，由于所述插接部2由铜制成，故熔点较高，可以承受芯片模块500运行时的高温而不会发生蠕变或潜变而偏离所述夹持部11，影响芯片模块500与电连接器300电性连接的稳定性。另外，铜的硬度较好，故镀于铜表面的防氧化层不容易被夹持部刮擦损坏。
(4)由于所述插接部2低于所述导引部12的顶端的部分向前凸出于所述夹持部11而被收容于相邻端子1的收容空间15中，即所述插接部2低于所述夹持部11顶端的部分位于相邻端子1的基部13的正上方，可以缩短前后相邻两所述端子1之间的距离，从而更得端子1可以更密集的排列。
以上详细说明仅为本实用新型之较佳实施例的说明，非因此局限本实用新型的专利范围，所以，凡运用本创作说明书及图示内容所为的等效技术变化，均包含于本实用新型的专利范围内。

Claims (10)

1.一种电连接器，其特征在于：包括：
一基体，设有多个收容孔上下贯穿所述基体，一屏蔽件设于所述基体的下表面；
多个端子，分别对应收容于所述收容孔，所述端子包括多个信号端子及至少一接地端子，所述接地端子与所述屏蔽件之间具有间隔，所述接地端子具有一导接部向下伸出所述收容孔，所述导接部通过焊料焊接于一主电路板，所述焊料接触所述导接部与所述屏蔽件。
2.如权利要求1所述的电连接器，其特征在于：所述端子具有两夹持部用于夹持一对接元件的插接部，及两导引部分別自夹持部向后延伸形成，两导引部之间的距离大于两夹持部之间的距离，所述端子还具有一基部低于所述导引部，所述基部的正上方具有一收容空间,所述收容空间位于所述导引部的后方，当所述插接部被所述夹持部夹持时，所述插接部低于所述导引部的顶端的部分向前凸出于所述夹持部而被收容于相邻端子的收容空间。
3.如权利要求2所述的电连接器，其特征在于：所述插接部为球状，每一端子的两夹持部之间的距离从下向上逐渐变小，且两夹持部夹持所述插接部的位置高于所述插接部的水平中心线。
4.如权利要求1所述的电连接器，其特征在于：所述端子具有至少一固定部固定于所述收容孔，所述导接部自所述固定部向内倾斜且向下延伸形成且部分收容于所述收容孔。
5.如权利要求4所述的电连接器，其特征在于：所述固定部有两个，一第一通槽形成于两个所述固定部的前侧之间，一第二通槽形成于两个所述固定部的后侧之间。
6.如权利要求4所述的电连接器，其特征在于：所述导接部有两个且分开设置，一第一开口形成于两个所述导接部的前侧之间，一第二开口形成于两个所述导接部的后侧之间。
7.如权利要求4所述的电连接器，其特征在于：所述收容孔的横截面为圆形，所述固定部的表面为与所述收容孔的内壁匹配的弧面。
8.如权利要求4所述的电连接器，其特征在于：所述固定部有两个，所述两固定部的前侧分别相向凸伸一凸部。
9.如权利要求1所述的电连接器，其特征在于：所述屏蔽件为金属镀层，且所述收容孔的内壁为绝缘。
10.如权利要求1所述的电连接器，其特征在于：所述基体的上表面设有屏蔽层，所述屏蔽层与所述接地端子接触，所述屏蔽件通过所述接地端子与所述屏蔽层电性导通。
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