CN210006917U - surface wave isolators for large-array millimeter wave system application - Google Patents
surface wave isolators for large-array millimeter wave system application Download PDFInfo
- Publication number
- CN210006917U CN210006917U CN201920850117.7U CN201920850117U CN210006917U CN 210006917 U CN210006917 U CN 210006917U CN 201920850117 U CN201920850117 U CN 201920850117U CN 210006917 U CN210006917 U CN 210006917U
- Authority
- CN
- China
- Prior art keywords
- metal
- plane
- metal plane
- surface wave
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 236
- 239000002184 metal Substances 0.000 claims abstract description 236
- 150000002739 metals Chemical class 0.000 claims description 31
- 239000007787 solid Substances 0.000 claims description 10
- 238000002955 isolation Methods 0.000 abstract description 8
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 230000010354 integration Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005388 cross polarization Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Details Of Aerials (AREA)
Abstract
The utility model relates to a kind of surface wave isolator towards big array millimeter wave system application, including setting up above the second metal layer metal layer, metal layer includes the parallel coplane of a plurality of and has the line type metal of constant spacing, be located metal plane and the second metal plane at line type metal both ends, connect a plurality of metal through-hole in metal plane and second metal plane below, the both ends of line type metal are connected with metal plane and second metal plane respectively, all be provided with clearances on the line type metal, the clearance sets up in the side that is close to metal plane or second metal plane, the clearance on the adjacent line type metal sets up respectively in different sides, the second metal layer includes the ground connection metal plane of being connected with the metal through-hole lower extreme, the utility model discloses a surface wave isolator circuit structure is simple novel, in wide operating frequency within range, can effectively restrain the transmission of surface wave between the antenna, is showing the isolation that improves between the antenna array.
Description
Technical Field
The utility model belongs to the technical field of the millimeter wave, particularly, relate to surface wave isolators who use towards big array millimeter wave system.
Background
The antenna is a key component in millimeter wave wireless communication systems, and is respectively located at the extreme end of a transmitter and the extreme end of a receiver for radiating and receiving millimeter wave signals.a silicon-based semiconductor process has the advantages of low cost, low power consumption and high integration degree.with the rapid development of the semiconductor process, a millimeter wave monolithic fully integrated system based on the silicon-based semiconductor process has been successfully verified.in these advanced electronic systems, the integration mode between the front end of the transceiver and the antenna is mainly divided into two modes of on-chip integration and off-chip integration.
However, the electromagnetic band gap structure is complex, the size is large, the working frequency is , the microwave frequency band is the same as the electromagnetic band gap, and the cross polarization technology can well inhibit the propagation of surface waves to the extent of , but the working frequency band is narrow and the polarization interference phenomenon exists, so the traditional antenna isolation technology has the obvious defects of , and the application of the traditional antenna isolation technology in a large-array millimeter wave system is greatly limited.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides an kind are towards the surface wave isolator of big array millimeter wave system application, can improve the isolation degree between the antenna in wide operating frequency range.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
as shown in fig. 1, 2 and 3, surface wave isolators applied to a large-array millimeter wave system include or more 0 metal layers disposed on a second metal layer, the metal layer includes a plurality of parallel coplanar linear metals 1 with fixed spacing, metal planes 2 and 3 located at two ends of the linear metals 1, and a plurality of metal vias 4 connected below the metal plane 2 and the second metal plane 3, two ends of the linear metals 1 are respectively connected with the metal plane 2 and the second metal plane 3, gaps 6 are disposed on the linear metals 1, the gaps 6 are disposed on sides close to the metal plane 2 or the second metal plane 3, the gaps on the adjacent linear metals 1 are respectively disposed on different sides, and the second metal layer includes a ground metal plane 5 connected with a lower end of the metal via 4.
In the technical scheme, steps are further carried out, two ends of the linear metal 1 are respectively and directly electrically connected with the metal plane 2 and the second metal plane 3, the metal through hole 4 is directly and electrically connected with the metal plane 2 and the second metal plane 3, and the metal through hole 4 is directly and electrically connected with the grounding metal plane 5.
, the surface wave isolator includes two or more layers of metal layers, the metal via 4 of the metal layer on the upper layer is directly electrically connected to the metal plane 2 and the second metal plane 3 on the lower layer, and the metal via 4 of the metal layer on the lowest layer is directly electrically connected to the ground metal plane 5.
, the metal vias 4 are solid cylinders or solid prisms.
, the ground metal plane 5 covers the th metal layer.
Further , the gap 6 is a rectangular parallelepiped gap.
Further , the gaps 6 of the spaced linear metals 1 are identical in position and size.
Further , the linear metal 1 is in a linear type, a zigzag type or a serpentine type.
, the material of the line metal 1, the th metal plane 2, the second metal plane 3, the metal via 4 and the ground metal plane 5 can be any metal, such as copper, aluminum, iron, etc.
The surface wave isolator is characterized in that coplanar arrays are formed by series of linear metals 1 at intervals of through interdigital interlocking, electromagnetic field coupling exists between the adjacent linear metals, two ends of each linear metal 1 are respectively connected with a th metal plane 2 and a second metal plane 3, and for any two adjacent linear metals 1, a gap 6 exists between adjacent to metal plane 2, a gap 6 exists between adjacent to two metal planes 3, and electromagnetic field coupling exists between the gaps 6.
As shown in fig. 4, th metal plane 2, second metal plane 3 and ground metal plane 5 are connected by vertical metal vias 4. when the surface wave isolator operates in the vicinity of the resonant frequency, it exhibits high impedance characteristics.
Specifically, the electrical characteristics of the surface wave isolator structure can be described as an equivalent parallel LC network, which exhibits high impedance characteristics when operating at resonant frequencies, at which time the surface wave isolator exhibits a strong surface impedance that can act as an band-stop filter to suppress the propagation of surface waves, wherein the surface current flowing through the linear metals 1 forms an effective inductance L, and the fringing electric fields between the linear metals 1 form an effective capacitance C, the values of the effective inductance L and the effective capacitance C can be approximated by the following equations, respectively,
here,. mu.0And ε0Respectively, the permeability and permittivity of free space. EpsilonrDenotes the dielectric constant of the substrate, h is the thickness of the substrate, a is the length of the metal layer,b is the width of the metal layer and s is the gap width between adjacent metal layers. The impedance and the resonant frequency of the equivalent parallel LC network may be respectively formulated as follows,
it can be seen from equation (3) that the impedance of the surface wave isolator is very large when the operating frequency is close to the resonant frequency, which is related to the length, width, shape, number, spacing of the line type metal 1 and the number of th metal layers and the spacing between adjacent th metal layers.
Advantageous effects
1. The surface wave isolator circuit of the technical scheme is simple and novel in structure, can effectively inhibit the surface wave transmission among the antennas within wide working frequency ranges, obviously improves the isolation among the antenna arrays, and is very suitable for being applied to millimeter wave high-frequency ends with the working frequency more than 100 GHz.
2. The surface wave isolator has the advantages of compact integral structure, greatly reduced circuit area, low manufacturing cost, capability of providing more compact low-cost solutions for the integration of a large-array millimeter wave wireless communication system, and obvious advantages and scientific application value in the millimeter wave wireless communication system.
Drawings
The present invention will be further described in with reference to the following drawings and examples.
Fig. 1 is a schematic perspective view of a surface wave isolator according to embodiment 1 of the present invention.
Fig. 2 is a schematic perspective view of a surface wave isolator according to embodiment 2 of the present invention.
Fig. 3 is a schematic side view of a surface wave isolator according to embodiment 2 of the present invention.
Fig. 4 is a schematic diagram of the surface wave isolator of the present invention.
Fig. 5 is a graph showing the test results of the isolation performance between the surface wave isolators according to the present invention and the array antennas.
In the drawings:
1. line type metal 2, th metal plane 3, second metal plane 4, metal through hole
5. Ground metal plane 6, gap
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in detail below in with reference to the following embodiments.
Example 1:
as shown in fig. 1, surface wave isolators applied to a large-array millimeter wave system include a resonant circuit and a ground unit, where the resonant circuit includes 7 parallel coplanar line-type metals 1 with a fixed pitch of , and 0 th metal planes 2 and second metal planes 3 located at two ends of the line-type metals 1, two ends of the line-type metals 1 are respectively connected to the th metal plane 2 and the second metal plane 3, the line-type metals 1 are provided with gaps 6 near the end of the th metal plane 2 or the second metal plane 3, the positions of the gaps 6 of adjacent line-type metals 1 are opposite, the ground unit includes 16 metal vias 4 vertically connected below the th metal plane 2 and the second metal plane 3, 8 metal vias 4 are respectively connected below the th metal plane 2 and the second metal plane 3, the ground metal plane 5 connected to lower ends of the metal vias 4, the line-type metals 1, the th metal plane 2, the second metal plane 3 and the metal vias 4 form a th metal layer, and the ground metal plane 5 forms a second metal layer.
In this embodiment, two ends of the linear metal 1 are respectively and electrically connected to the th metal plane 2 and the second metal plane 3, the metal via 4 is directly and electrically connected to the th metal plane 2 and the second metal plane 3, and the metal via 4 is directly and electrically connected to the ground metal plane 5.
The metal through hole 4 is a solid cylinder or a solid prism, and in this embodiment, the metal through hole 4 is a solid cylinder.
The ground metal plane 5 covers the th metal layer.
The gap 6 is a rectangular parallelepiped space.
The positions and sizes of the gaps 6 of the spaced linear metals 1 are the same.
In this embodiment, the surface wave isolator includes a single th metal layer.
The linear metal 1 is linear, zigzag, or serpentine. In this embodiment, the linear metal 1 is linear.
In this embodiment, the material of the line metal 1, the th metal plane 2, the second metal plane 3, the metal via 4 and the ground metal plane 5 is copper.
As shown in fig. 5, when comparing the performance of the isolation between the array antennas including the surface wave isolator of the present embodiment with that without the surface wave isolator, the result shows that the isolation between the adjacent antennas is improved by about 8dB to 15dB in the range of the operating frequency of 120GHz to 140 GHz.
Example 2:
as shown in fig. 2 and fig. 3, surface wave isolators applied to a large-array millimeter wave system include a resonant circuit and a ground unit, where the resonant circuit includes a plurality of parallel coplanar line-type metals 1 with a fixed spacing of , and -th metal planes 2 and second metal planes 3 located at two ends of the line-type metals 1, two ends of the line-type metals 1 are respectively connected to the -th metal plane 2 and the second metal plane 3, gaps 6 are provided at ends of the line-type metals 1 close to the -th metal plane 2 or the second metal plane 3, the positions of the gaps 6 of adjacent line-type metals 1 are opposite, the ground unit includes a plurality of metal vias 4 vertically connected below the -th metal plane 2 and the second metal plane 3, and a ground metal plane 5 connected to lower ends of the metal vias 4, the line-type metals 1, the -th metal plane 2, the second metal plane 3 and the metal vias 4 form an -th metal layer, and the ground metal plane 5 forms the second metal layer.
In this embodiment, two ends of the linear metal 1 are respectively and electrically connected to the th metal plane 2 and the second metal plane 3, the metal via 4 is directly and electrically connected to the th metal plane 2 and the second metal plane 3, and the metal via 4 is directly and electrically connected to the ground metal plane 5.
The metal through hole 4 is a solid cylinder or a solid prism, and in this embodiment, the metal through hole 4 is a solid cylinder.
The ground metal plane 5 covers the th metal layer.
The gap 6 is a rectangular parallelepiped space.
The positions and sizes of the gaps 6 of the spaced linear metals 1 are the same.
In this embodiment, the surface wave isolator includes two th metal layers, the upper and lower layers are the same, each layer includes 7 linear metals 1, 16 metal vias 4 are connected below the th metal plane 2 and the second metal plane 3 of each layer, 8 metal vias 4 are connected below the th metal plane 2 and the second metal plane 3 respectively, the metal via 4 of the upper layer is directly electrically connected with the th metal plane 2 and the second metal plane 3 of the lower layer, and the metal via 4 of the th metal layer of the lower layer is directly electrically connected with the grounding metal plane 5.
The linear metal 1 is linear, zigzag, or serpentine. In this embodiment, the linear metal 1 is linear.
In this embodiment, the linear metal 1, the th metal plane 2, the second metal plane 3, the metal via 4 and the ground metal plane 5 are made of iron.
Example 3:
in this embodiment, the linear metal 1 of the surface wave isolator is a broken line type, and the other structure is the same as that of embodiment 1.
Example 4:
in this embodiment, the linear metal 1 of the surface wave isolator is of a serpentine type, and the other structure is the same as that of embodiment 2.
The above is only a preferred embodiment of the present invention, and it should be noted that: for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be considered as the protection scope of the present invention.
Claims (8)
- The surface wave isolator applied to the large-array millimeter wave system is characterized by comprising over th metal layers arranged on a second metal layer, wherein the th metal layer comprises a plurality of parallel coplanar line-type metals with fixed spacing, a th metal plane and a second metal plane which are positioned at two ends of the line-type metals, and a plurality of metal through holes connected below the th metal plane and the second metal plane, two ends of the line-type metals are respectively connected with the th metal plane and the second metal plane, gaps are arranged on the line-type metals, the gaps are arranged on the side close to the th metal plane or the second metal plane, the gaps on the adjacent line-type metals are respectively arranged on different sides, and the second metal layer comprises a grounding metal plane connected with the lower ends of the metal through holes.
- 2. The surface wave isolator of claim 1 wherein the linear metal is electrically connected at its ends directly to the th and second metal planes, respectively, the metal via is electrically connected directly to the th and second metal planes, and the metal via is electrically connected directly to the ground metal plane.
- 3. The surface wave isolator of claim 1 comprising two or more th metal layers, the metal via of the th metal layer of the upper layer being in direct electrical connection with the th metal plane and the second metal plane of the lower layer, and the metal via of the th metal layer of the lowest layer being in direct electrical connection with the ground metal plane.
- 4. The surface wave isolator of claim 1, wherein: the metal through holes are solid cylinders or solid prisms.
- 5. The surface wave isolator of claim 1 wherein the ground metal plane overlies the th metal layer.
- 6. The surface wave isolator of claim 1, wherein: the gap is a cuboid gap.
- 7. The surface wave isolator of claim 1, wherein: the spacing of the spaced linear metal gaps is the same in position and size.
- 8. The surface wave isolator of claim 1, wherein: the linear metal is linear, fold-line or snake-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920850117.7U CN210006917U (en) | 2019-06-06 | 2019-06-06 | surface wave isolators for large-array millimeter wave system application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920850117.7U CN210006917U (en) | 2019-06-06 | 2019-06-06 | surface wave isolators for large-array millimeter wave system application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210006917U true CN210006917U (en) | 2020-01-31 |
Family
ID=69309232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920850117.7U Expired - Fee Related CN210006917U (en) | 2019-06-06 | 2019-06-06 | surface wave isolators for large-array millimeter wave system application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210006917U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112568A (en) * | 2019-06-06 | 2019-08-09 | 中电国基南方有限公司 | A kind of surface isolator towards the application of big array millimeter-wave systems |
-
2019
- 2019-06-06 CN CN201920850117.7U patent/CN210006917U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112568A (en) * | 2019-06-06 | 2019-08-09 | 中电国基南方有限公司 | A kind of surface isolator towards the application of big array millimeter-wave systems |
| CN110112568B (en) * | 2019-06-06 | 2024-01-23 | 中电国基南方集团有限公司 | Surface wave isolator applied to large-array millimeter wave system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1215601C (en) | Double-antenna and radio apparatus | |
| KR101571345B1 (en) | 2 system for interconnecting two substrates each comprising at least one transmission line | |
| EP0617478B1 (en) | Laminated dielectric resonator and dielectric filter | |
| CN113097715B (en) | Planar composite left-right hand transmission line type 5G mobile phone MIMO antenna | |
| US8115569B2 (en) | Monoblock dielectric multiplexer capable of processing multi-band signals | |
| CN108039591B (en) | Double-linear polarization rectifying antenna with harmonic suppression capability | |
| CN110233349B (en) | Multiple-input multiple-output antenna and terminal equipment | |
| CN109904607A (en) | A kind of simple and compact Wide stop bands filtering paster antenna | |
| CN109687129A (en) | A kind of filter antenna array | |
| CN105337009A (en) | LTCC filter for coupling inhibition of third and fifth harmonics based on frequency selectivity | |
| CN108847532A (en) | A kind of aerial array and its vertical isolation fence structure | |
| CN110649380A (en) | Millimeter wave broadband filtering antenna | |
| KR101812490B1 (en) | Designs and methods to implement surface mounting structures of SIW | |
| CN110676542B (en) | Port coupling structure, filter and radio frequency assembly | |
| CN210006917U (en) | surface wave isolators for large-array millimeter wave system application | |
| TWI815365B (en) | Slot antenna | |
| CN115911838A (en) | Differentially fed dual-mode patch antenna and antenna array with broadband common-mode absorption | |
| CN107404010B (en) | A dual-band filtered MIMO antenna | |
| KR102521291B1 (en) | Radiation amplifiers, radiation systems and radio devices in radio devices | |
| US9520634B2 (en) | Resonance device | |
| CN114530675B (en) | Filtering device, base station antenna and base station equipment | |
| US10811755B2 (en) | Microstrip capacitors with complementary resonator structures | |
| CN110112568B (en) | Surface wave isolator applied to large-array millimeter wave system | |
| CN112186345B (en) | Three-order filtering base station antenna based on resonator type dipole | |
| CN110444887B (en) | A kind of antenna electromagnetic wave isolation device and isolation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200131 Termination date: 20200606 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |