CN219918703U - Power module assembly, frequency converter and air conditioner - Google Patents

Abstract

The utility model discloses a power module assembly, a frequency converter and an air conditioner, wherein the power module assembly comprises: the power module and the circuit board are respectively provided with a first connecting surface and a second connecting surface on one side, facing each other, of the power module and the circuit board, and at least one of the first connecting surface and the second connecting surface is provided with a first array pin extending towards each other; the protection plate is arranged between the first connecting surface and the second connecting surface and supported between the power module and the circuit board, a first array pin through hole is formed in the protection plate, and at least part of the first array pin is accommodated in the first array pin through hole. According to the power module assembly designed according to the utility model, the protection plate is arranged between the power module and the circuit board, so that the stress of the first pins can be reduced, the breakage of the first pins can be avoided, and the structural reliability of the power module assembly is better.

Description

Power module assembly, frequency converter and air conditioner

Technical Field

The utility model relates to the field of hardware products, in particular to a power module assembly, a frequency converter and an air conditioner.

Background

In the related art, a power semiconductor module of a driver or a frequency converter is generally welded on a power panel, the power semiconductor module is provided with array pins, in the prior art, the array pins are directly welded on preset points of the power panel, when the driver or the frequency converter vibrates, relative displacement is easy to occur between the power semiconductor module and the power panel, and at the moment, the array pins are easy to break due to stress, so that the work of the power semiconductor module is affected.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. To this end, an object of the present utility model is to propose a power module assembly. According to the power module assembly designed according to the utility model, the protection plate is arranged between the power module and the circuit board, so that the stress of the first pins can be reduced, the breakage of the first pins can be avoided, and the structural reliability of the power module assembly is better.

The utility model further provides a frequency converter comprising the power module assembly.

The utility model further provides an air conditioner comprising the frequency converter.

The power module assembly according to the present utility model includes: the power module and the circuit board are respectively provided with a first connecting surface and a second connecting surface on one side, facing each other, of the power module and the circuit board, and at least one of the first connecting surface and the second connecting surface is provided with a first array pin extending towards each other; the protection plate is arranged between the first connecting surface and the second connecting surface and supported between the power module and the circuit board, a first array pin through hole is formed in the protection plate, and at least part of the first array pin is accommodated in the first array pin through hole.

According to the power module assembly, the protection plate is arranged between the power module and the circuit board so as to bear most of force applied by the power module to the circuit board and most of force applied by the circuit board to the power module, so that the stress of the first pins is reduced, the breakage of the first pins is avoided, and the structural reliability of the power module assembly is improved.

According to some embodiments of the utility model, a protection convex column is formed on the protection plate, and a first positioning hole suitable for being matched with the protection convex column is formed on the power module or the circuit board; wherein the first pin array via holes are formed in the protection convex columns.

According to some embodiments of the utility model, the protection board is provided with the protection post on a side facing the circuit board, and an end of the protection post is configured to gradually decrease in diameter in a direction away from the protection board to form a guide slope at the end of the protection post.

According to some embodiments of the utility model, the circuit board is formed with a first positioning portion, the protection plate is formed with a second positioning portion, and the first positioning portion and the second positioning portion are matched in a positioning manner so as to limit the protection plate to move relative to the circuit board in a plane perpendicular to the extending direction of the first pins.

According to some embodiments of the utility model, the protective posts and the first array of feet are configured in a one-to-one correspondence in a plurality of rows, and the first positioning portion is disposed between two adjacent rows of the protective posts.

According to some embodiments of the utility model, the power module assembly further comprises: the rectifying module, rectifying module or the circuit board is provided with the second array foot, be formed with on the guard plate set up in the circuit board with rectifying module mounting panel between the rectifying module, be formed with on the rectifying module mounting panel and be suitable for acceping the second array foot via hole of second array foot.

According to some embodiments of the utility model, a rectifying module avoiding groove is formed on the rectifying module mounting plate, and at least part of the rectifying module is accommodated in the rectifying module avoiding groove.

According to some embodiments of the utility model, the power module assembly further comprises: the first fastener sequentially penetrates through the circuit board and the protection plate.

According to some embodiments of the utility model, the power module assembly further comprises: the heat dissipation piece, the heat dissipation piece set up in power module deviates from the one side of circuit board, the heat dissipation piece with be provided with the heat conduction layer between the power module.

According to some embodiments of the utility model, the power module assembly further comprises: the second fastening piece sequentially penetrates through the protection plate, the power module and the heat dissipation piece, and the second fastening piece is suitable for fixing the heat dissipation piece and the power module.

A frequency converter according to another embodiment of the present utility model is briefly described below.

The frequency converter according to the utility model comprises the power module assembly according to any one of the embodiments, and is stable in operation and not susceptible to vibration because the frequency converter according to the utility model is provided with the power module assembly according to the embodiment.

An air conditioner according to another embodiment of the present utility model is briefly described as follows.

The air conditioner comprises the frequency converter according to the embodiment, and the air conditioner is reliable in operation and better in user experience because the frequency converter according to the embodiment is arranged.

In summary, the power module assembly according to the present utility model has the protection plate disposed between the power module and the circuit board, and the protection plate is supported between the power module and the circuit board, so as to reduce the stress of the first pins, avoid the breakage of the first pins, and improve the structural reliability of the power module assembly.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

fig. 1 is a side view of a power module assembly according to an embodiment of the utility model.

Fig. 2 is a partial exploded view of a power module assembly according to an embodiment of the present utility model.

Fig. 3 is a circuit board structure diagram according to an embodiment of the present utility model.

Fig. 4 is a structural diagram of a protection plate matched with a power module and a rectifying module according to an embodiment of the present utility model.

Fig. 5 is a structural view of a shield plate according to an embodiment of the present utility model.

Fig. 6 is a block diagram of a power module according to an embodiment of the present utility model.

Fig. 7 is a structural diagram of a rectifying module according to an embodiment of the present utility model.

Fig. 8 is a structural view of a heat sink according to an embodiment of the present utility model.

Reference numerals:

1. a power module assembly;

10. a power module; 10a, a second fixing hole; 11. a first array foot;

20. a circuit board; 20a, a first positioning hole; 20b, second positioning holes; 20c, a first through hole; 20d, mounting holes;

30. a protection plate; 30a, a first fixing hole; 30b, a second through hole; 30c, first fastening holes;

31. a power module mounting plate; 311. a protective post; 311a, first pin array vias; 3111. a guide slope; 312. positioning the bulge;

32. a rectifier module mounting plate; 32a, second array pin via holes;

40. a rectifying module; 40a, second fastening holes; 41. second array feet;

50. a second fastener; 60. a heat sink; 60a, a third fixing hole.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may communicate with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the related art, a power semiconductor module of a driver or a frequency converter is generally welded on a power panel, the power semiconductor module is provided with array pins, in the prior art, the array pins are directly welded on preset points of the power panel, when the driver or the frequency converter vibrates, relative displacement is easy to occur between the power semiconductor module and the power panel, and at the moment, the array pins are easy to break due to stress, so that the work of the power semiconductor module is affected.

A power module assembly 1 according to an embodiment of the present utility model is described below with reference to fig. 1-8.

As shown in fig. 1-2, a power module assembly 1 according to the present utility model includes: power module 10, circuit board 20 and shield plate 30. A first connection surface and a second connection surface are respectively formed on one side of the power module 10 and the circuit board 20 facing each other, and at least one of the first connection surface and the second connection surface is provided with a first array of pins 11 extending towards each other; the protection plate 30 is disposed between the first connection surface and the second connection surface and supported between the power module 10 and the circuit board 20, a first array pin via hole 311a is formed in the protection plate 30, and at least a portion of the first array pin 11 is accommodated in the first array pin via hole 311a. Specifically, in some embodiments, one of the power module 10 and the circuit board 20 is provided with a first array pin 11, and the other of the power module 10 and the circuit board 20 is provided with a plurality of preset soldering points, and the first array pin 11 is soldered with the plurality of preset soldering points to fix the power module 10 and the circuit board 20. The force applied by the power module 10 to the circuit board 20 and the force applied by the circuit board 20 to the power module 10 are both transmitted by the first array pins 11, in order to reduce the stress of the first array pins 11, a protection plate 30 is disposed between the power module 10 and the circuit board 20, the protection plate 30 is supported between the power module 10 and the circuit board 20 to bear most of the force applied by the power module 10 to the circuit board 20 and most of the force applied by the circuit board 20 to the power module 10, and the first array pin through holes 311a on the protection plate 30 are penetrated by the first array pins 11 to be exposed on the surface of the protection plate 30, so as to be welded with the plurality of preset welding points. It can be understood that when the power module 10 is provided with the first array pin 11, a plurality of preset welding points can be set on the circuit board 20, when the circuit board 20 is provided with the first array pin 11, the power module 10 is provided with a plurality of preset welding points, when both the power module 10 and the circuit board 20 are provided with the first array pin 11, the power module 10 can be provided with a preset welding point corresponding to the first array pin 11 on the circuit board 20, and the circuit board 20 is provided with a preset welding point corresponding to the first array pin 11 on the power module 10, which is not limited herein.

According to the power module assembly 1 disclosed by the utility model, the protection plate 30 is arranged between the power module 10 and the circuit board 20 so as to bear most of the force applied by the power module 10 to the circuit board 20 and most of the force applied by the circuit board 20 to the power module 10, so that the stress of the first array pins 11 is reduced, the first array pins 11 are prevented from being broken, and the structural reliability of the power module assembly 1 is improved.

According to some embodiments of the present utility model, as shown in fig. 1 to 5, a protection post 311 is formed on the protection plate 30, and a first positioning hole 20a adapted to be matched with the protection post 311 is provided on the power module 10 or the circuit board 20; the protective stud 311 has a first stud via 311a formed therein. Specifically, one of the power module 10 and the circuit board 20 is provided with a first array pin 11, the other of the power module 10 and the circuit board 20 is provided with a first positioning hole 20a, and the first positioning holes 20a are in one-to-one correspondence with preset welding points. The protection plate 30 is provided with a protection convex column 311, at least part of the first array pin 11 can be accommodated in a first array pin through hole 311a of the protection convex column 311, the protection convex column 311 protrudes towards the power module 10 or the circuit board 20 provided with the first positioning hole 20a, after the power module 10 and the circuit board 20 are welded, the protection plate 30 is supported between the power module 10 and the circuit board 20, and the protection convex column 311 can protect at least part of the first array pin 11 after the first array pin 11 and a preset welding point are welded. More specifically, the protection protruding columns 311 are matched with the first positioning holes 20a, so that the first array pins 11 in the first array pin through holes 311a can be guided to penetrate through the first positioning holes 20a and correspond to preset welding points, the protection plate 30 is provided with the protection protruding columns 311 to protect the first array pins 11 and guide the first array pins 11 to correspond to the preset welding points, and the assembly accuracy of the power module 10 and the circuit board 20 can be improved while the stress of the first array pins 11 is reduced and the first array pins 11 are protected.

According to some embodiments of the present utility model, as shown in fig. 5, a side of the shielding plate 30 facing the circuit board 20 is provided with a shielding protrusion 311, and an end of the shielding protrusion 311 is configured to gradually decrease in diameter in a direction away from the shielding plate 30 to form a guide slope 3111 at an end of the shielding protrusion 311. Specifically, the power module 10 is provided with the first array pin 11, the circuit board 20 is provided with the first positioning hole 20a, the protection convex column 311 of the protection plate 30 accommodates at least part of the first array pin 11, and the protection convex column 311 protrudes towards the circuit board 20, and in the process of matching the protection convex column 311 with the first positioning hole 20a, the guide inclined plane 3111 can guide the protection convex column 311 to match with the first positioning hole 20a, so that the first array pin 11 is guided to penetrate through the first positioning hole 20a and correspond to a preset welding point, and the assembly accuracy of the power module 10 and the circuit board 20 is better improved, so that the assembly efficiency and the qualification rate of the power module assembly 1 are improved.

According to some embodiments of the present utility model, the circuit board 20 is formed with a first positioning portion, and the protection board 30 is formed with a second positioning portion, and the first positioning portion and the second positioning portion are in positioning fit to limit the protection board 30 to move relative to the circuit board 20 in a plane perpendicular to the extending direction of the first pins 11. In some embodiments, as shown in fig. 1-5, one of the first positioning portion and the second positioning portion may be configured as a second positioning hole 20b, and the other of the first positioning portion and the second positioning portion may be configured as a positioning protrusion 312, the positioning protrusion 312 protruding into the second positioning hole 20b to positionally engage the circuit board 20 with the shielding plate 30, thereby restricting the shielding plate 30 from moving relative to the circuit board 20 in a plane perpendicular to the extending direction of the first pins 11. It will be appreciated that one of the first positioning portion and the second positioning portion may also be configured as a clamping groove, and the other of the first positioning portion and the second positioning portion may be configured as a clamping protrusion, where at least a portion of the clamping protrusion is received in the clamping groove to match the circuit board 20 with the protection board 30 in a clamping manner; or one of the first positioning portion and the second positioning portion is configured as a nut, the other one of the first positioning portion and the second positioning portion is configured as a bolt, the nut is in threaded fit with the bolt to position and fit the circuit board 20 with the protection board 30, the first positioning portion and the second positioning portion are not limited to the configurations in the above embodiments, and the first positioning portion and the second positioning portion can be satisfied to restrict the protection board 30 from moving in a plane perpendicular to the extending direction of the first pins 11 relative to the circuit board 20 after being in positioning fit, which is not limited herein.

According to some embodiments of the present utility model, as shown in fig. 1-5, the protection posts 311 and the first pins 11 are configured into a plurality of rows corresponding to each other, the power module 10 is provided with a plurality of rows of first pins 11, the circuit board 20 is provided with a plurality of rows of first positioning holes 20a, the first positioning holes 20a are in a one-to-one correspondence with preset welding points, after the first positioning parts and the second positioning parts are matched, the first pins 11 can be inserted into the corresponding first positioning holes 20a, wherein the first positioning parts are arranged between two adjacent rows of protection posts 311, so as to stably match the protection plate 30 with the circuit board 20, avoid uneven stress of the plurality of rows of first pins 11, and improve the structural reliability of the power module assembly 1.

According to some embodiments of the present utility model, as shown in fig. 1, 2, 4 and 7, the power module assembly 1 further includes a rectifying module 40, where the rectifying module 40 or the circuit board 20 is provided with a second array pin. The protection plate 30 includes a power module mounting plate 31 and a rectifying module mounting plate 32, wherein the power module mounting plate 31 is disposed between the circuit board 20 and the power module 10, the rectifying module mounting plate 32 is disposed between the circuit board 20 and the rectifying module 40, the power module mounting plate 31 is formed with a first array pin via hole 311a adapted to accommodate the first array pin 11, and the rectifying module mounting plate 32 is formed with a second array pin via hole 32a adapted to accommodate the second array pin 41. In some embodiments, one of the rectifying module 40 and the circuit board 20 is provided with a second array pin 41, and the other of the rectifying module 40 and the circuit board 20 is provided with a plurality of preset soldering points, and the second array pin 41 is soldered with the plurality of preset soldering points to fix the rectifying module 40 and the circuit board 20. The force applied by the power module 10 to the circuit board 20 and the force applied by the circuit board 20 to the power module 10 are transmitted by the first array pins 11, and the force applied by the rectifying module 40 to the circuit board 20 and the force applied by the circuit board 20 to the rectifying module 40 are transmitted by the second array pins 41, so that the power module mounting plate 31 is arranged between the power module 10 and the circuit board 20 to reduce the stress of the first array pins 11, the rectifying module mounting plate 32 is arranged between the rectifying module 40 and the circuit board 20 to reduce the stress of the second array pins 41, and the protection plate 30 is arranged to prevent the first array pins 11 and the second array pins 41 from being broken, thereby improving the structural reliability of the power module assembly 1.

According to some embodiments of the present utility model, the rectifier module mounting plate 32 has a rectifier module avoidance slot (not shown) formed therein, and the rectifier module 40 may be secured to the rectifier module mounting plate 32 by a fastener, the rectifier module avoidance slot being adapted to avoid and receive at least a portion of the rectifier module 40.

According to some embodiments of the present utility model, as shown in fig. 3-5, the power module assembly 1 further comprises a first fastener (not shown). The circuit board 20 is formed with first through hole 20c, be formed with the second through hole 30b on the guard plate 30, first fastener passes first through hole 20c on the circuit board 20 and the second through hole 30b on the guard plate 30 in proper order, in order to be connected fixedly with circuit board 20 and guard plate 30, guard plate 30 passes through the location cooperation of protection projection 311 and first locating hole 20a on the circuit board 20, the location cooperation of second location portion and first location portion on the circuit board 20 and the fixed connection of first fastener in order to be connected with circuit board 20 multiple spot, the relative movement between guard plate 30 and the circuit board 20 has been restricted better, the guard effect of guard plate 30 to first array foot 11 is promoted, and then the structural reliability of power module assembly 1 is promoted.

According to some embodiments of the present utility model, as shown in fig. 1, 2 and 8, the power module assembly 1 further includes a heat dissipation element 60, where the heat dissipation element 60 is adapted to dissipate heat of the power module assembly 1, and the heat dissipation element 60 is disposed on a side of the power module 10 facing away from the circuit board 20, and a heat conducting layer is disposed between the heat dissipation element 60 and the power module 10, and when the power module 10 is in operation, the heat dissipation element 60 can exchange heat with the power module 10 to maintain a required operating temperature of the power module 10. The heat dissipation element 60 and the power module 10 may be bonded by a heat conductive adhesive, which is the heat conductive layer, and the heat dissipation element 60 and the power module 10 may also be engaged with each other by other structures, such as a threaded engagement, without limitation.

According to some embodiments of the utility model, as shown in fig. 2, the power module assembly 1 further comprises a second fastener 50. As shown in fig. 4, 5, 6 and 8, the protection plate 30 is formed with a first fixing hole 30a, the power module 10 is formed with a second fixing hole 10a, the heat sink 60 is formed with a third fixing hole 60a, and the second fastening member 50 sequentially passes through the first fixing hole 30a on the protection plate 30, the second fixing hole 10a on the power module 10 and the third fixing hole 60a on the heat sink 60 to fix the heat sink 60 with the power module 10, under the action of the second fastening member 50, the protection plate 30 applies pressure to the power module 10 and simultaneously the power module 10 applies pressure to the heat sink 60, and the heat sink 60 applies reverse pressure to the power module 10, so that the gap between the heat sink 60 and the power module 10 is reduced as much as possible, the power module 10 is fully contacted with the heat sink 60, and the heat dissipation efficiency of the power module assembly 1 is improved. In some embodiments, the second fastening member 50 is configured in a plurality, as shown in fig. 6, the power module mounting plate 31 is formed with a first fastening hole 30a, a portion of the second fastening member 50 sequentially passes through the first fastening hole 30a, the second fastening hole 10a and the third fastening hole 60a to fasten the heat sink 60 to the power module 10, as shown in fig. 7, the rectification module mounting plate 32 is formed with a first fastening hole 30c, the rectification module 40 is formed with a second fastening hole 40a, and another portion of the second fastening member 50 sequentially passes through the first fastening hole 30c of the rectification module mounting plate 32 and the second fastening hole 40a of the rectification module 40 to fasten the rectification module 40 to the rectification module mounting plate 32, i.e., the fastening member.

In some embodiments, as shown in fig. 3, the circuit board 20 is formed with mounting holes 20d so that the second fasteners 50 pass through the circuit board 20 and secure the heat sink 60 to the power module 10 or secure the rectifying module 40 to the rectifying module mounting plate 32.

In some embodiments, as shown in fig. 4 to 5, the shielding plate 30 is formed with a boss in which the second through hole 30b is formed. The boss protrudes towards the circuit board 20 and the end face of the protruding end is suitable for stopping with the circuit board 20, so that the protection plate 30 can be supported between the power module 10 and the circuit board 20, stress of the first array foot 11 and the second array foot 41 is reduced, breakage of the first array foot 11 and the second array foot 41 is avoided, and structural reliability of the power module assembly 1 is improved.

In some embodiments, as shown in fig. 4 to 5, the shielding plate 30 is formed with a sinking stage having a first fixing hole 30a formed therein.

In some embodiments of the present utility model, the power module assembly 1 includes a power module 10, a circuit board 20, a rectifying module 40, a protection board 30, and a heat sink 60. The power module 10 is provided with a first array pin 11, the rectifying module 40 is provided with a second array pin 41, the circuit board 20 is provided with a plurality of preset welding points suitable for welding the first array pin 11 and the second array pin 41, the protection plate 30 comprises a power module mounting plate 31 and a rectifying module mounting plate 32, the power module mounting plate 31 is arranged between the circuit board 20 and the power module 10, one side of the power module mounting plate 31 facing the circuit board 20 is provided with a protection convex column 311, at least part of the first array pin 11 is accommodated in the protection convex column 311 and supported between the power module 10 and the circuit board 20, the power module mounting plate 31 is provided with a first array pin through hole 311a suitable for accommodating the first array pin 11, and the first array pin 11 penetrates through the first array pin through hole 311a to be welded with the preset welding point; the rectifying module mounting board 32 is disposed between the circuit board 20 and the rectifying module 40, and a second array pin via hole 32a adapted to accommodate the second array pin 41 is formed on the rectifying module mounting board 32, and the second array pin 41 penetrates through the second array pin via hole 32a to be welded with a preset welding point.

The end of the protective boss 311 is gradually reduced in diameter in a direction away from the power module mounting plate 31 to form a guide inclined surface 3111 at the end of the protective boss 311, the circuit board 20 is provided with a first positioning hole 20a, and the guide inclined surface 3111 guides the protective boss 311 to be engaged with the first positioning hole 20a in the course of engagement of the protective boss 311 with the first positioning hole 20a; the circuit board 20 is also provided with a second positioning hole 20b, the power module mounting plate 31 is provided with a positioning protrusion 312, and the positioning protrusion 312 extends into the second positioning hole 20b to match the circuit board 20 with the protection plate 30 in a positioning way; the circuit board 20 is formed with a first through hole 20c, the power module mounting board 31 is formed with a second through hole 30b, and the first fastener sequentially passes through the first through hole 20c and the second through hole 30b to connect and fix the circuit board 20 and the power module mounting board 31; the power module mounting plate 31 is formed with a first fixing hole 30a, the power module 10 is formed with a second fixing hole 10a, the heat sink 60 is formed with a third fixing hole 60a, and a portion of the second fastening member 50 sequentially passes through the first fixing hole 30a, the second fixing hole 10a and the third fixing hole 60a to fix the heat sink 60 with the power module 10; the rectifying module mounting plate 32 is formed with a first fastening hole 30c, the rectifying module 40 is formed with a second fastening hole 40a, and another portion of the second fastening member 50 sequentially passes through the first fastening hole 30c and the second fastening hole 40a to fix the rectifying module 40 to the rectifying module mounting plate 32.

The power module assembly 1 of the utility model is provided with the protection plate 30 between the circuit board 20 and the power module 10 and the rectifying module 40 so as to bear most of the force applied by the power module 10 and the rectifying module 40 to the circuit board 20 and most of the force applied by the circuit board 20 to the power module 10 and the rectifying module 40, so that the stress of the first array foot 11 and the second array foot 41 can be reduced, and the first array foot 11 and the second array foot 41 are protected.

A frequency converter according to another embodiment of the present utility model is briefly described below.

The frequency converter according to the utility model comprises the power module assembly 1 according to any of the above embodiments, and is stable in operation and not susceptible to vibrations, since the frequency converter according to the utility model is provided with the power module assembly 1 according to the above embodiments.

An air conditioner according to another embodiment of the present utility model is briefly described as follows.

The air conditioner comprises the frequency converter according to the embodiment, and the air conditioner is reliable in operation and better in user experience because the frequency converter according to the embodiment is arranged.

In summary, the power module assembly 1 according to the present utility model is provided with the protection plate 30 between the power module 10 and the circuit board 20, and the protection plate 30 is supported between the power module 10 and the circuit board 20, so that the stress of the first array pins 11 can be reduced, the first array pins 11 are prevented from breaking, and the structural reliability of the power module assembly 1 is improved.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

Although embodiments of the present utility model have been shown and described above, variations, modifications, substitutions and alterations are possible to the above embodiments.

Claims (12)

1. A power module assembly, comprising:

the power module and the circuit board are respectively provided with a first connecting surface and a second connecting surface on one side, facing each other, of the power module and the circuit board, and at least one of the first connecting surface and the second connecting surface is provided with a first array pin extending towards each other;

the protection plate is arranged between the first connecting surface and the second connecting surface and supported between the power module and the circuit board, a first array pin through hole is formed in the protection plate, and at least part of the first array pin is accommodated in the first array pin through hole.

2. The power module assembly of claim 1, wherein the protective plate is formed with a protective post, and the power module or the circuit board is provided with a first positioning hole adapted to cooperate with the protective post; wherein the method comprises the steps of

The first pin array through holes are formed in the protection convex columns.

3. The power module assembly according to claim 2, wherein the protection plate is provided with the protection post on a side thereof facing the circuit board, and an end of the protection post is configured to gradually decrease in diameter in a direction away from the protection plate to form a guide slope at the end of the protection post.

4. The power module assembly of claim 2, wherein the circuit board has a first positioning portion formed thereon and the shield plate has a second positioning portion formed thereon, the first positioning portion and the second positioning portion being in positioning engagement to limit movement of the shield plate relative to the circuit board in a plane perpendicular to the direction in which the first pins extend.

5. The power module assembly of claim 4, wherein the guard posts are configured in a one-to-one correspondence with the first pins in a plurality of rows, and the first positioning portion is disposed between two adjacent rows of the guard posts.

6. The power module assembly of claim 1, further comprising: the rectifying module, rectifying module or the circuit board is provided with the second array foot, be formed with on the guard plate set up in the circuit board with rectifying module mounting panel between the rectifying module, be formed with on the rectifying module mounting panel and be suitable for acceping the second array foot via hole of second array foot.

7. The power module assembly of claim 6, wherein the rectifier module mounting plate has a rectifier module relief slot formed therein, and wherein at least a portion of the rectifier module is received within the rectifier module relief slot.

8. The power module assembly of claim 1, further comprising: the first fastener sequentially penetrates through the circuit board and the protection plate.

9. The power module assembly of claim 1, further comprising: the heat dissipation piece, the heat dissipation piece set up in power module deviates from the one side of circuit board, the heat dissipation piece with be provided with the heat conduction layer between the power module.

10. The power module assembly of claim 9, further comprising: the second fastening piece sequentially penetrates through the protection plate, the power module and the heat dissipation piece, and the second fastening piece is suitable for fixing the heat dissipation piece and the power module.

11. A frequency converter comprising the power module assembly of any one of claims 1-10.

12. An air conditioner comprising the inverter of claim 11.