CN219039426U - Optical module - Google Patents
Optical module Download PDFInfo
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- CN219039426U CN219039426U CN202223082524.9U CN202223082524U CN219039426U CN 219039426 U CN219039426 U CN 219039426U CN 202223082524 U CN202223082524 U CN 202223082524U CN 219039426 U CN219039426 U CN 219039426U
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- 230000003287 optical effect Effects 0.000 title claims abstract description 59
- 239000002344 surface layer Substances 0.000 claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims description 65
- 230000008054 signal transmission Effects 0.000 claims description 23
- 230000005693 optoelectronics Effects 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 16
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 239000011889 copper foil Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The disclosure relates to the technical field of optical transmission, and particularly discloses an optical module. The optical module comprises a packaging structure, and an optical transmitting module and/or an optical receiving module are/is packaged in the packaging structure; the electronic device comprises a hard circuit board assembly, a first electronic component and a second electronic component, wherein the hard circuit board assembly comprises a hard circuit board and the electronic component arranged on the hard circuit board, the hard circuit board comprises a first surface layer and a second surface layer which are oppositely arranged, and the electronic component comprises a digital signal processor; and one end of the first flexible circuit board is electrically connected with the light emitting module and/or the light receiving module, and the other end of the first flexible circuit board extends between the first surface layer and the second surface layer of the hard circuit board and is electrically connected with the digital signal processor. The anti-interference capacity of the method is stronger, the crosstalk between the multiplexing channels on the first flexible circuit board is reduced, the occupied space of welding spots on the surface of the hard circuit board is reduced, the crosstalk between the multiplexing channels is reduced, and meanwhile, the link bandwidth and the ornament space are also improved.
Description
Technical Field
The present application relates to the field of optical transmission technologies, and in particular, to an optical module.
Background
The airtight packaging mode in the optical module is divided into two types, namely TO packaging and BOX packaging, wherein the TO packaging is generally used for single-path packaging, and the BOX packaging is generally used for multi-path packaging. Fig. 1 is a schematic diagram of connection between a typical BOX package and a PCB, i.e., connection between the BOX package and the PCB is implemented by front and back soldering, and the upper and lower flexible boards are microstrip line structures. With the improvement of the transmission rate, the bandwidth required by the high speed is also continuously improved, but in the connection mode, the welding point on the surface of the PCB occupies a large space, an impedance discontinuity point is introduced, and meanwhile, the anti-interference capability of the microstrip line structure is poor, so that the crosstalk problem between channels for transmitting signals at the high speed is serious, and meanwhile, the bandwidth of a link is not easy to improve.
Disclosure of Invention
In view of the above, it is necessary to provide an optical module.
An optical module, the optical module comprising:
the packaging structure is internally packaged with a light emitting module and/or a light receiving module;
the electronic device comprises a hard circuit board assembly, a first electronic component and a second electronic component, wherein the hard circuit board assembly comprises a hard circuit board and the electronic component arranged on the hard circuit board, the hard circuit board comprises a first surface layer and a second surface layer which are oppositely arranged, and the electronic component comprises a digital signal processor;
and one end of the first flexible circuit board is electrically connected with the light emitting module and/or the light receiving module, and the other end of the first flexible circuit board extends between the first surface layer and the second surface layer of the hard circuit board and is electrically connected with the digital signal processor.
In one embodiment, a portion of the first flexible circuit board between the first skin and the second skin of the rigid circuit board forms a quad-leaded stripline structure.
In one embodiment, the strip line structure sequentially comprises an upper layer, a middle layer and a lower layer, the middle layer of the strip line structure comprises a signal transmission line, the upper layer and the lower layer of the strip line structure are both grounding layers, two ends of the signal transmission line are connected with grounding transmission lines, and the grounding transmission lines are electrically connected with the grounding layers of the upper layer and the lower layer through conductive holes.
In one embodiment, a portion of the first flexible circuit board exposed outside the hard circuit board forms a microstrip line structure or a stripline structure; the microstrip line structure comprises a signal transmission line and grounding transmission lines arranged on two sides of the signal transmission line, and the grounding transmission lines and the signal transmission lines are arranged in parallel along the direction that the first flexible circuit board extends out of the hard circuit board.
In one embodiment, the packaging structure includes an airtight box and an electrical signal connection end exposed out of the airtight box, the electrical signal connection end is used for transmitting radio frequency or high frequency signals, and the electrical signal connection end is electrically connected with the first flexible circuit board; the light emitting module and/or the light receiving module is/are arranged inside the airtight box, and the electric signal connecting end is/are electrically connected with the light emitting module and/or the light receiving module.
In one embodiment, the packaging structure comprises a carrier plate and a photoelectric chip fixed on the carrier plate, wherein the photoelectric chip comprises the light emitting module and/or the light receiving module; one end of the first flexible circuit board is fixed on the carrier plate and is electrically connected with the photoelectric chip.
In one embodiment, the first flexible circuit board and the hard circuit board are combined together in a pressing mode.
In one embodiment, the digital signal processor is disposed on the first surface layer, the hard circuit board is provided with a conductive via, and the first flexible circuit board disposed on the inner layer of the hard circuit board is electrically connected with the digital signal processor on the surface of the hard circuit board through the conductive via.
In one embodiment, the electrical signal connection end is used for transmitting the electrical signal sent by the light receiving module to the digital signal processor through the first flexible circuit board; and transmitting an electrical signal output by the digital signal processor and transmitted to the electrical signal connection terminal through the first flexible circuit board to the light emitting module.
In one embodiment, the electrical signal comprises a high-speed digital signal.
In one embodiment, the packaging structure further comprises a protruding portion protruding out of the packaging structure, the protruding portion is provided with upper and lower surfaces which are arranged in a back-to-back mode, the electric signal connection end is arranged on the upper surface of the protruding portion, power supply ends are distributed on the lower surface of the protruding portion, and the power supply ends are used for transmitting power supply signals; the power supply end is connected with a power supply module in the packaging structure; the optical module further comprises a second flexible circuit board which is arranged in parallel with the first flexible circuit board, and the power supply end is connected to the hard circuit board through the second flexible circuit board.
In one embodiment, the second flexible circuit board and the first flexible circuit board are connected to different circuit layers of the rigid circuit board.
In one embodiment, the packaging structure further comprises a protruding portion protruding out of the packaging structure, the protruding portion is provided with upper and lower surfaces which are arranged in a back-to-back mode, the electric signal connection end is arranged on the upper surface of the protruding portion, power supply ends are distributed on the lower surface of the protruding portion, and the power supply ends are used for transmitting power supply signals; the power supply end is connected with the power supply module in the packaging structure, and the power supply end is connected to the hard circuit board through a connector or the hard circuit board.
In one embodiment, the first flexible circuit board is used for transmitting high-speed signals, and the second flexible circuit board is used for transmitting low-speed signals.
In one embodiment, the length of the first flexible circuit board exposed outside the rigid circuit board is between 3 mm and 8 mm.
Above-mentioned optical module, the electrical signal link on the packaging structure is connected to the stereoplasm circuit board through first flexible circuit board, first flexible circuit board is not the direct welding on the stereoplasm circuit board, but through the technological process of soft-hard combined plate, extend to the inlayer of stereoplasm circuit board, and then with digital signal processor electric connection, namely, adopt the connected mode that soft-hard combined realizes packaging structure and stereoplasm circuit board, because most of first flexible circuit board all is the inlayer that is located the stereoplasm circuit board, be the ribbon line form that adopts four bread ground, compare in traditional microstrip line structure, interference killing feature is stronger, the crosstalk between multichannel transmission channel on the first flexible circuit board has been reduced, and because first flexible circuit board does not weld at stereoplasm circuit board surface, the occupation space on stereoplasm circuit board surface has been reduced, and bandwidth loss that the discontinuous point brought has been reduced through the mode that reduces a solder joint, link bandwidth and goods space have been improved simultaneously.
Drawings
Fig. 1 is a schematic structural view of an optical module in the prior art;
fig. 2 is a schematic structural diagram of an optical module according to an embodiment of the present application.
Fig. 3 is an enlarged partial schematic view at M in fig. 2.
Fig. 4 is a schematic structural diagram of another optical module according to an embodiment of the present application.
Reference numerals illustrate:
100. a package structure; 110. an electrical signal connection terminal; 120. an optical interface; 130. a power supply end; 140. an airtight box;
200. a rigid circuit board assembly; 210. a digital signal processor; 220. a hard circuit board; 222. a first skin layer; 224. a second skin layer; 230. a conductive contact; 240. a conductive via;
300. a first flexible circuit board; 310. a microstrip line structure; 320. a stripline structure;
400. and a second flexible circuit board.
Detailed Description
In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. The drawings illustrate preferred embodiments of the present application. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
As described in the background, for multiplexing signal transmission in an optical module, a BOX package structure is generally adopted. Specifically, referring to fig. 1, the BOX package structure is externally connected with a flexible circuit board, and the flexible circuit board and the PCB circuit board are welded together, so as to realize electrical connection between the BOX package and the PCB circuit board, and a microstrip line structure is generally adopted on the flexible circuit board. However, the flexible circuit board and the PCB are connected by adopting a welding manner, that is, a welding point is formed on the PCB, the welding point needs to be assembled and matched, and additional tolerance is introduced, which can lead to degradation of bandwidth and crosstalk, and the existence of the welding point and the microstrip line structure can lead to crosstalk between transmission channels of high-speed signals on the flexible circuit board, and the bandwidth of the link is also smaller, thereby reducing the performance of the optical module.
For this purpose, the present application proposes an optical module. Referring to fig. 2 and 3, the optical module provided in this embodiment includes a housing, a package structure 100, a hard circuit board assembly 200, and a first flexible circuit board 300. The package structure 100, the hard circuit board assembly 200, and the first flexible circuit board 300 are disposed inside the housing. Wherein:
the package structure 100 is internally packaged with a light emitting module and/or a light receiving module (not shown in the drawings), and the package structure 100 includes the light emitting module and/or the light receiving module; the hard circuit board assembly 200 includes a hard circuit board 220 and electronic components disposed on the hard circuit board 220, such as a digital signal processor 210 disposed on the hard circuit board 220; the rigid circuit board includes a first skin 222 and a second skin 224 disposed opposite each other. In this embodiment, the first surface layer 222 and the second surface layer 224 of the hard circuit board are the outermost upper and lower circuit layers of the hard circuit board, and in other embodiments, the first surface layer 222 and the second surface layer 224 may be any two circuit layers between the outermost circuit layers, or one of the two circuit layers is the outermost circuit layer, and the other is the circuit layer between the outermost circuit layers; that is, the rigid circuit board may be more than three layers, which may be four, five, seven or more layers of circuit boards, the first and second skin layers being two of the layers of circuit boards, and the first flexible circuit board being one or more layers of circuit boards formed between the first and second skin layers. One end of the first flexible circuit board 300 is electrically connected to the light emitting module and/or the light receiving module, and the other end extends between the first surface layer 222 and the second surface layer 224 of the hard circuit board 220 and is electrically connected to the digital signal processor 210.
In the above optical module, the hard circuit board 220 may further be provided with other electronic components, such as an IC chip (Integrated Circuit Chip), a substrate for fixing the electronic components, and the like. The end of the hard circuit board 220 far away from the package structure 100 is provided with a conductive contact 230, and the hard circuit board 220 can be connected with an external device in a pluggable manner through the conductive contact 230. The package structure 100 may be an airtight Box package, or an open carrier structure. The package structure 100 is connected to the hard circuit board 220 through the first flexible circuit board 300, and the first flexible circuit board 300 is not directly welded on the hard circuit board 220, but extends between the first surface layer 222 and the second surface layer 224 of the hard circuit board 220, and is further electrically connected to the digital signal processor 210, that is, the connection mode of combining the soft board and the hard board is adopted to realize the electrical connection between the package structure 100 and the hard circuit board 220, because most of the first flexible circuit board 300 is located in the inner layer of the hard circuit board 220, that is, the strip line form of four-sided land is adopted. Compared with the traditional microstrip line structure, the anti-interference capability is stronger, the crosstalk between multiple transmission channels on the first flexible circuit board 300 is reduced, and as the first flexible circuit board 300 is not directly welded on the surface of the hard circuit board 220, the discontinuous points generated by welding the flexible circuit board 300 and the hard circuit board 220 are reduced, and as the occupation space of welding spots is reduced, the wiring length can be reduced, the crosstalk between multiple transmission channels is further reduced, and meanwhile, the link bandwidth and the ornament space are also improved.
In particular, the light emitting module packaged in the package structure 100 may include a light emitting chip, such as a laser chip, etc., as long as a device capable of electrically converting light is suitable for the present application.
In one embodiment, referring to fig. 4, a portion of the first flexible circuit board 300 located between the first surface layer 222 and the second surface layer 224 of the hard circuit board 220 forms a strip line structure 320 with four sides, and a portion of the first flexible circuit board 300 exposed outside the hard circuit board 220 forms a microstrip line structure 310, i.e., a region between the electrical signal connection terminal 110 and the edge of the hard circuit board 200 is the microstrip line structure 310.
In this embodiment, the strip line structure 320 sequentially includes an upper layer, an intermediate layer, and a lower layer, the intermediate layer of the strip line structure 320 includes a signal transmission line, where the signal transmission line of the strip line structure 320 may be disposed on the first flexible circuit board 300, and a dielectric may be filled between the upper layer, the intermediate layer, and the lower layer of the strip line structure 320. The upper layer and the lower layer of the strip line structure 320 are both ground layers, two ends of the signal transmission line are connected with ground transmission lines, and the ground transmission lines are electrically connected with the ground layers of the upper layer and the lower layer through conductive holes. The ground layers of the upper and lower layers of the stripline structure 320 may be ground layers independently disposed, or may be disposed on opposite sides of the first surface layer 222 and the second surface layer 224 of the hard circuit board 220. The microstrip line structure 310 sequentially comprises a signal layer and a lower layer, the microstrip line structure 310 comprises a signal transmission line and grounding transmission lines arranged on two sides of the signal transmission line, and the grounding transmission lines and the signal transmission lines are arranged in parallel along the direction that the first flexible circuit board extends out of the hard circuit board.
In the present embodiment, the area between the electrical signal connection terminal 110 and the edge of the hard circuit board 200 may also be configured as a strip line structure, i.e., the area between the electrical signal connection terminal 110 and the edge of the hard circuit board 200 is a microstrip line structure or a strip line structure.
In one embodiment, with continued reference to fig. 2, the package structure 100 employs an airtight Box package, and the package structure 100 includes an airtight Box 140 and an electrical signal connection terminal 110 exposed out of the airtight Box 140, where the electrical signal connection terminal 110 is electrically connected to the first flexible circuit board 300. The light emitting module and/or the light receiving module are provided inside the airtight box 140. The electrical signal connection terminal 110 is electrically connected to the light emitting module and/or the light receiving module.
The electrical signal connection terminal 110 is used for transmitting an electrical signal output by the digital signal processor 210 and transmitted to the electrical signal connection terminal 110 through the first flexible circuit board 300 to the light emitting module.
The optical transmitting module may be connected to the electrical signal connecting end 110 through the connecting wire in the packaging structure 100, the electrical signal connecting end 110 is electrically connected to the digital signal processor 210 on the hard circuit board 220 through the first flexible circuit board 300, and therefore, the electrical signal generated by the digital signal processor 210 may be transmitted to the electrical signal connecting end 110 through the first flexible circuit board 300, and further transmitted to the optical transmitting module in the packaging structure 100 through the electrical signal connecting end 110, and the optical transmitting module may convert the electrical signal into an optical signal and output the optical signal to the outside.
The light receiving module packaged in the package structure 100 may include an optical signal detecting device such as a photodiode capable of converting light into electricity, and the package structure 100 may transmit an electrical signal emitted from the light receiving module to the digital signal processor 210 through the first flexible circuit board 300 via the electrical signal connection terminal 110.
The light receiving module can be connected to the electrical signal connection terminal 110 through the connection wire in the package structure 100, and the light receiving module and the light emitting module adopt parallel connection wires and do not interfere with each other. The electrical signal connection end 110 is electrically connected with the digital signal processor 210 on the hard circuit board 220 through the first flexible circuit board 300, so that the electrical connection between the digital signal processor 210 and the light receiving module is realized, the light receiving module converts the light signal into an electrical signal after receiving the light signal, then the electrical signal is transmitted to the electrical signal connection end 110, and the electrical signal is transmitted to the digital signal processor 210 on the hard circuit board 220 through the electrical signal connection end 110.
The signal transmission channels among the light receiving module, the electric signal connecting end 110 and the digital signal processor 210 are arranged in parallel with the signal transmission channels among the light emitting module, the electric signal connecting end 110 and the digital signal processor 210, and do not interfere with each other.
In this embodiment, the electrical signal sent by the digital signal processor 210 and the electrical signal converted by the light receiving module may all include high-speed digital signals.
In this embodiment, the package structure 100 further includes an optical interface 120, where the optical interface 120 is connected to the optical receiving module, and is configured to receive an external optical signal, send the received optical signal to the optical receiving module, and convert the optical signal into an electrical signal by the optical receiving module, and output the electrical signal to the electrical signal connection end 110.
In this embodiment, the electrical signal connection terminal 110 is exposed outside the main body of the package structure 100, so as to facilitate the connection between the electrical signal connection terminal 110 and the first flexible circuit board 300. The first flexible circuit board 300 and the electrical signal connection terminal 110 may be electrically connected by soldering or ACF bonding. Meanwhile, the first flexible circuit board 300 extends into the inner layer of the hard circuit board 220, that is, in the embodiment, the first flexible circuit board 300 is disposed inside the hard circuit board 220, and the connection between the first flexible circuit board 300 and the hard circuit board 220 is realized in a manner of combining the soft board and the hard board, unlike the conventional manner of welding the first flexible circuit board 300 to the surface of the hard circuit board 220.
Generally, the portion of the first flexible circuit board 300 extending to the inner layer of the rigid circuit board 220 penetrates the rigid circuit board 220 along the extending direction, because if the thickness of the rigid circuit board 220 is not uniform and the first flexible circuit board 300 does not penetrate the inner layer of the rigid circuit board 220, the thickness of the first flexible circuit board 300 is greater at the position where the first flexible circuit board 300 is present than at the position where the first flexible circuit board 300 is not present, and the thickness of the portion where the thickness is smaller needs to be increased during the manufacturing process, which makes the manufacturing complicated. In this embodiment, the first flexible circuit board 300 penetrates the hard circuit board 220, so that the thickness of the hard circuit board 220 is consistent throughout, and the manufacturing process is simplified.
In this embodiment, the first flexible circuit board 300 and the hard circuit board 220 are connected by a pressing manner. The first flexible circuit board 300 may include a substrate and copper foil layers disposed on the substrate, and in the actual manufacturing process, the above-mentioned structural layers of the first flexible circuit board 300 may be laminated together as circuit layers in the hard circuit board 220 to form a soft and hard combined board.
The design of the soft and hard combined board does not need to be welded, compared with the first flexible circuit board 300 assembled with the hard circuit board 220 in a welding manner, the number of welding points is reduced, namely, the number of discontinuous points on the signal transmission channel is reduced. In addition, for the traditional welding mode, due to the reasons of circuit manufacturing tolerance of a board factory, assembly deviation tolerance of welding, tin amount control and the like, a high-frequency link is deviated from an actual design model, so that high-frequency performance is damaged, and the problem of high-frequency signal damage caused by the welding mode is effectively avoided due to the design of the soft and hard combined board in the embodiment.
In one embodiment, the package structure 100 employs a non-airtight carrier structure, and the package structure 100 includes a carrier, and an optoelectronic chip fixed on the carrier, where the optoelectronic chip may include a light emitting module and/or a light receiving module. One end of the first flexible circuit board 300 is fixed on the carrier and electrically connected to the optoelectronic chip, for example, through gold wires.
In one embodiment, the length of the first flexible circuit board 300 exposed outside the rigid circuit board 220 is between 3 mm and 8 mm.
In the conventional art, the first flexible circuit board 300 is soldered to the surface of the hard circuit board 220, and the first flexible circuit board 300 is basically exposed, and the exposed length is at least 10 mm, so that the more the first flexible circuit board is exposed, the more microstrip line structures are, and crosstalk is more likely to occur between signal transmission channels. In this application, most of the area of the first flexible circuit board 300 is located in the inner layer of the hard circuit board 220, the exposed area is only the area between the electrical signal connection end 110 and the edge of the hard circuit board 220, the length of the area is only 3 mm to 8 mm, which is far less than the traditional 10 mm, that is, on the signal transmission channel, the strip line structure is mostly adopted, and the microstrip line structure only occupies 3 mm to 8 mm, so that the crosstalk problem caused by the traditional microstrip line structure is effectively reduced.
In one embodiment, the hard circuit board 220 has a conductive via 240 thereon, and the first flexible circuit board 300 disposed between the first surface layer 222 and the second surface layer 224 of the hard circuit board 220 is electrically connected to the digital signal processor 210 on the surface of the hard circuit board 220 through the conductive via 240.
The first flexible circuit board 300 extending into the hard circuit board 220 needs to communicate with the digital signal processor 210 on the surface layer of the hard circuit board 220 to electrically connect the light receiving module or the light emitting module with the digital signal processor 210. In this embodiment, conductive vias are disposed at positions corresponding to the digital signal processor 210 on the hard circuit board 220, so that the conductive vias can communicate the digital signal processor 210 with the first flexible circuit board 300, and the digital signal processor 210 is electrically communicated with the first flexible circuit board 300 by disposing conductive materials such as metal in the conductive vias.
In practical applications, there may be a plurality of digital signal processors 210 on the hard circuit board 220, and the digital signal processors 210 associated with the light receiving module and the light emitting module may be electrically connected to the first flexible circuit board 300.
In one embodiment, digital signal processor 210 comprises a DSP chip.
With the increase of the speed, the bandwidth required by the high-speed is continuously increased from single channel 25G to 53G and 100G, when the 53G backward speed is used, the DSP chip needs to be used by the digital signal processor 210, the DSP chip occupies a larger space, which has a higher space requirement on the hard circuit board 220, if the hard circuit board 220 needs to be provided with a pad required when being connected with the first flexible circuit board 300 in a conventional manner, the pad and the reserved avoiding space for the welding operation occupy a larger space on the hard circuit board 220, which may cause that the hard circuit board 220 does not have enough space for configuring the DSP chip, the hard circuit board 220 needs to be lengthened or a sub-motherboard structure needs to be used to expand the space, but the sub-motherboard structure can bring about the problem of influencing the heat dissipation.
In view of the above problems, in the solution of this embodiment, the number of pads on the hard circuit board 220 is reduced by adopting the manner of combining the soft board and the hard board, so that space is saved for the hard circuit board 220, and enough space is provided on the hard circuit board 220 for distributing the components, so that the space utilization rate of the hard circuit board 220 is effectively improved, and based on this, a DSP chip can be configured on the hard circuit board 220, so as to ensure transmission and processing of high-speed signals, and the whole high-speed link design management and control is easier. Meanwhile, due to the design of the soft and hard combined plates, the channel distance from the DSP chip to the light receiving (or transmitting) module is shortened, the discontinuous points are reduced, and the bandwidth of the link is improved.
In this embodiment, the package structure 100 further includes an exposed power supply end 130, the power supply end 130 is connected to the surface of the hard circuit board 220 through the second flexible circuit board 400, and the power supply end 130 is disposed opposite to the electrical signal connection end 110. The power supply terminal 130 is electrically connected to the power module in the package structure 100. The power module herein refers to a module in the package structure 100 that needs power supply, such as a light emitting module; i.e., the power module in the package structure 100 may be powered through the power terminal 130. Since the power supply terminal 130 is connected to the surface of the hard circuit board 220 through the second flexible circuit board 400, the hard circuit board 220 can supply power to related devices in the package structure 100 through the second flexible circuit board 400. In other embodiments, the optical module may also include only the first flexible circuit board, and the hard circuit board may simultaneously realize power supply and signal transmission to the package structure through the first flexible circuit board.
The second flexible circuit board 400 and the hard circuit board 220 may be connected by a connector or soldering. The process operability and assembly tolerances are improved.
In one embodiment, the package structure 100 further includes an exposed power supply terminal 130, the power supply terminal 130 is disposed opposite to the electrical signal connection terminal 110, the power supply terminal 130 is connected to the power module in the package structure 100, and the power supply terminal 130 is connected to the second surface of the hard circuit board 220 through a connector (such as a pin) or a circuit board.
In one embodiment, the first flexible circuit board 300 is used to transmit high-speed signals and the second flexible circuit board 400 is used to transmit low-speed signals.
As described above, the first flexible circuit board 300 may provide a high-speed signal path between the light receiving (or transmitting) module and the digital signal processor 210, and the second flexible circuit board 400 may be used to provide low-speed signals such as power to the hard circuit board 220. That is, there is a transmission of a high-speed signal and a transmission of a low-speed signal between the package structure 100 and the hard circuit board 220, and the application sets the first flexible circuit board 300 for the high-speed signal and performs a joint lamination with the hard circuit board 220 to form a soft and hard board structure, so that the crosstalk problem which is easy to occur during multiplexing of the high-speed signal can be pertinently reduced, and meanwhile, the link bandwidth is improved; for low-speed signals, a second flexible circuit board 400 is provided, and the package structure 100 and the hard circuit board 220 are connected by the second flexible circuit board 400 to transmit low-speed signals. The low-speed signals and the high-speed signals are transmitted through different flexible circuit boards, so that different signals can be conveniently distinguished and transmitted, and the problems of the different signals in the transmission process can be solved in a targeted manner.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the patent. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application shall be subject to the appended claims.
Claims (15)
1. An optical module, characterized in that the optical module comprises:
the packaging structure is internally packaged with a light emitting module and/or a light receiving module;
the electronic device comprises a hard circuit board assembly, a first electronic component and a second electronic component, wherein the hard circuit board assembly comprises a hard circuit board and the electronic component arranged on the hard circuit board, the hard circuit board comprises a first surface layer and a second surface layer which are oppositely arranged, and the electronic component comprises a digital signal processor;
and one end of the first flexible circuit board is electrically connected with the light emitting module and/or the light receiving module, and the other end of the first flexible circuit board extends between the first surface layer and the second surface layer of the hard circuit board and is electrically connected with the digital signal processor.
2. The optical module of claim 1, wherein a portion of the first flexible circuit board between the first skin and the second skin of the rigid circuit board forms a quad-leaded stripline structure.
3. The optical module according to claim 2, wherein the strip line structure comprises an upper layer, a middle layer and a lower layer in sequence, the middle layer of the strip line structure comprises a signal transmission line, the upper layer and the lower layer of the strip line structure are both ground layers, two ends of the signal transmission line are connected with ground transmission lines, and the ground transmission lines are electrically connected with the ground layers of the upper layer and the lower layer through conductive holes.
4. An optical module as claimed in claim 3, wherein the portion of the first flexible circuit board exposed outside the rigid circuit board forms a microstrip line structure or a stripline structure; the microstrip line structure comprises a signal transmission line and grounding transmission lines arranged on two sides of the signal transmission line, and the grounding transmission lines and the signal transmission lines are arranged in parallel along the direction that the first flexible circuit board extends out of the hard circuit board.
5. The optical module according to any one of claims 1 to 4, wherein the packaging structure comprises an airtight box and an electrical signal connection end exposed to the airtight box, the electrical signal connection end is used for transmitting radio frequency or high frequency signals, and the electrical signal connection end is electrically connected with the first flexible circuit board; the light emitting module and/or the light receiving module is/are arranged inside the airtight box, and the electric signal connecting end is/are electrically connected with the light emitting module and/or the light receiving module.
6. The optical module according to claim 5, wherein the packaging structure comprises a carrier plate, and an optoelectronic chip fixed on the carrier plate, and the optoelectronic chip comprises the optical emission module and/or the optical receiving module; one end of the first flexible circuit board is fixed on the carrier plate and is electrically connected with the photoelectric chip.
7. The optical module of claim 5, wherein the first flexible circuit board and the rigid circuit board are bonded together by a press fit.
8. The optical module of claim 5, wherein the digital signal processor is disposed on the first surface layer, the hard circuit board has a conductive via, and the first flexible circuit board disposed on the inner layer of the hard circuit board is electrically connected to the digital signal processor on the surface of the hard circuit board through the conductive via.
9. The optical module of claim 5, wherein the electrical signal connection terminal is configured to transmit an electrical signal emitted by the optical receiving module to the digital signal processor via the first flexible circuit board; and transmitting an electrical signal output by the digital signal processor and transmitted to the electrical signal connection terminal through the first flexible circuit board to the light emitting module.
10. The optical module of claim 9, wherein the electrical signal comprises a high-speed digital signal.
11. The optical module according to claim 5, wherein the package structure further comprises a protruding portion protruding from the package structure, the protruding portion having upper and lower surfaces disposed opposite to each other, the electrical signal connection terminal being disposed on the upper surface of the protruding portion, and power supply terminals being disposed on the lower surface of the protruding portion, the power supply terminals being configured to transmit a power signal; the power supply end is connected with a power supply module in the packaging structure; the optical module further comprises a second flexible circuit board which is arranged in parallel with the first flexible circuit board, and the power supply end is connected to the hard circuit board through the second flexible circuit board.
12. The optical module of claim 11, wherein the second flexible circuit board and the first flexible circuit board are connected to different circuit layers of the rigid circuit board.
13. The optical module according to claim 5, wherein the package structure further comprises a protruding portion protruding from the package structure, the protruding portion having upper and lower surfaces disposed opposite to each other, the electrical signal connection terminal being disposed on the upper surface of the protruding portion, and power supply terminals being disposed on the lower surface of the protruding portion, the power supply terminals being configured to transmit a power signal; the power supply end is connected with the power supply module in the packaging structure, and the power supply end is connected to the hard circuit board through a connector or the hard circuit board.
14. The optical module of claim 11, wherein the first flexible circuit board is configured to transmit high speed signals and the second flexible circuit board is configured to transmit low speed signals.
15. The optical module of claim 5, wherein a length of the first flexible circuit board exposed outside the rigid circuit board is between 3 millimeters and 8 millimeters.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223082524.9U CN219039426U (en) | 2022-11-21 | 2022-11-21 | Optical module |
| PCT/CN2023/120337 WO2024109303A1 (en) | 2022-11-21 | 2023-09-21 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223082524.9U CN219039426U (en) | 2022-11-21 | 2022-11-21 | Optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219039426U true CN219039426U (en) | 2023-05-16 |
Family
ID=86279201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223082524.9U Active CN219039426U (en) | 2022-11-21 | 2022-11-21 | Optical module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN219039426U (en) |
| WO (1) | WO2024109303A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024109303A1 (en) * | 2022-11-21 | 2024-05-30 | 苏州旭创科技有限公司 | Optical module |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6903934B2 (en) * | 2002-09-06 | 2005-06-07 | Stratos International, Inc. | Circuit board construction for use in small form factor fiber optic communication system transponders |
| US9204537B2 (en) * | 2012-09-20 | 2015-12-01 | Finisar Corporation | High-speed pluggable rigid-end flex circuit |
| US9016956B2 (en) * | 2013-08-05 | 2015-04-28 | Chih-Shou WANG | Optoelectronic transmission module |
| CN104503044B (en) * | 2014-12-31 | 2016-08-24 | 苏州旭创科技有限公司 | Optical module |
| US10681811B2 (en) * | 2018-02-15 | 2020-06-09 | Tongqing Wang | Connecting optical sub-assembly to main printed circuit board |
| CN216792516U (en) * | 2021-12-30 | 2022-06-21 | 成都旭创光通科技有限公司 | Multichannel radio frequency optical module |
| CN114371537B (en) * | 2022-02-17 | 2024-06-25 | Nano科技(北京)有限公司 | Split type integrated packaging optical module |
| CN217639669U (en) * | 2022-07-29 | 2022-10-21 | 青岛海信宽带多媒体技术有限公司 | Light receiving assembly and optical module |
| CN219039426U (en) * | 2022-11-21 | 2023-05-16 | 苏州旭创科技有限公司 | Optical module |
-
2022
- 2022-11-21 CN CN202223082524.9U patent/CN219039426U/en active Active
-
2023
- 2023-09-21 WO PCT/CN2023/120337 patent/WO2024109303A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024109303A1 (en) * | 2022-11-21 | 2024-05-30 | 苏州旭创科技有限公司 | Optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024109303A1 (en) | 2024-05-30 |
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