CN218550258U

CN218550258U - Rigid-flex board and electronic equipment

Info

Publication number: CN218550258U
Application number: CN202221903030.XU
Authority: CN
Inventors: 傅志杰; 林原宇; 吴明锦
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2022-07-18
Filing date: 2022-07-18
Publication date: 2023-02-28
Anticipated expiration: 2032-07-18

Abstract

The application provides a rigid-flex board and electronic equipment, rigid-flex board includes printed circuit board, flexible circuit board and piezoelectric material layer. The flexible circuit board is arranged on one side of the printed circuit board in a stacked mode, and the second circuit layer of the flexible circuit board is electrically connected with the first circuit layer of the printed circuit board. The piezoelectric material layer is embedded in the flexible circuit board and is electrically connected with the second circuit layer. This application soft or hard combines board and electronic equipment combines soft board and piezoelectric material, makes soft board signal transmission function and piezoelectric material's two unifications of function of charging, can realize the interconversion of mechanical vibration and alternating current, has increased the rigidity and the incorruptibility of soft board again. The rigid-flex board can provide emergency power for the electronic equipment, and the endurance time of the battery of the electronic equipment is prolonged.

Description

Rigid-flex board and electronic equipment

Technical Field

The application relates to the technical field of printed circuit boards, in particular to a rigid-flex board and an electronic device comprising the rigid-flex board.

Background

With the increasing pace of life, electronic devices such as mobile phones have become an indispensable part of life of people. However, as the dependence degree of people on mobile phones is higher and higher, the problem of weak battery power of mobile phones is one of the most serious problems of consumers.

Piezoelectric materials are crystalline materials that develop a voltage across their terminals when subjected to a compressive force, and the amount of charge generated is proportional to the force. The interconversion between mechanical vibration (sound wave) and alternating current can be achieved by using this property of piezoelectric materials. Piezoelectric materials play an important role in the high and new technology fields as functional materials for electromechanical conversion.

Therefore, it is necessary to provide an element capable of applying a piezoelectric material to a cellular phone and supplying power to the cellular phone.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application provides a rigid-flex board capable of generating electric energy when being folded, and the rigid-flex board can be applied to electronic devices such as mobile phones to supply power to the electronic devices.

An embodiment of the present application provides a rigid-flex board, including:

a printed circuit board including a first circuit layer;

the flexible circuit board is arranged on one side of the printed circuit board in a laminated mode and comprises a second circuit layer, and the second circuit layer is electrically connected with the first circuit layer; and

and the piezoelectric material layer is embedded in the flexible circuit board and is electrically connected with the second circuit layer.

In one embodiment, the printed circuit board further includes a first substrate layer, and the first circuit layer is formed on the first substrate layer.

In one embodiment, the flexible circuit board further comprises a second substrate layer and an insulating layer. The second substrate layer is positioned between the insulating layer and the second circuit layer, and part of the insulating layer extends towards the direction close to the printed circuit board and covers part of the surface of the printed circuit board.

In one embodiment, the flexible circuit board further comprises a protection layer formed in the second wiring layer.

In one embodiment, the rigid-flex board further comprises a conductive hole. The conductive hole penetrates through the insulating layer and the second base material layer, and the piezoelectric material layer and the second circuit layer are electrically connected through the conductive hole.

In one embodiment, the material of the second substrate layer includes polyimide or mylar.

In one embodiment, the rigid-flex board further comprises a protective layer disposed on a side of the flexible circuit board away from the printed circuit board.

In one embodiment, the protective layer is further disposed on a side of the printed circuit board away from the flexible circuit board.

In one embodiment, the piezoelectric material layer comprises a piezoelectric material comprising polyvinylidene fluoride or a piezoelectric ceramic.

Another aspect of the present application provides an electronic device, which includes the above-mentioned flexible-rigid printed circuit board, and the flexible-rigid printed circuit board can supply power to the electronic device.

This application soft or hard combines board and electronic equipment combines soft board and piezoelectric material, makes soft board signal transmission function and piezoelectric material's two unifications of function of charging, can realize the interconversion of mechanical vibration and alternating current, has increased the rigidity and the incorruptibility of soft board again. The rigid-flex board can provide emergency power for the electronic equipment, and the endurance time of the battery of the electronic equipment is prolonged.

Drawings

Fig. 1 is a schematic cross-sectional view of a rigid-flex board according to an embodiment of the present disclosure.

Fig. 2 is a schematic cross-sectional view of a rigid-flex board according to another embodiment of the present application.

Fig. 3 to 7 are schematic cross-sectional views illustrating a process for manufacturing a rigid-flex board according to an embodiment of the present disclosure.

Fig. 8 is a block diagram of an electronic device according to an embodiment of the present disclosure.

Description of the main elements

Rigid-

flex board

100, 200

Printed circuit board 10

Flexible circuit board 20

Piezoelectric material layer 30

Protective layer 40

First wiring layer 11

First base material layer 12

Second wiring layer 21

Second substrate layer 22

Insulating layer 23

Protective layer 24

Conductive via 101

Blind hole 201

Layer of conductive material 202

Resist film 203

Electronic equipment 1

The following detailed description will further illustrate embodiments of the application in conjunction with the above-described figures.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments of this application belong. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application.

It should be noted that all directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

It will be understood that when a layer is referred to as being "on" another layer, it can be directly on the other layer or intervening layers may be present. In contrast, when a layer is referred to as being "directly on" another layer, there are no intervening layers present.

Moreover, descriptions in this application as relating to "first," "second," etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.

Embodiments of the present application are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate constructions) of the present application. Thus, variations in the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the present application should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of the device and are not intended to limit the scope of the application.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following embodiments and features of the embodiments may be combined with each other without conflict.

Implementation mode one

Referring to fig. 1, an embodiment of the present invention provides a rigid-flex board 100, which includes a printed circuit board 10 (PCB, also called a hard board), a flexible circuit board 20 (FPC, also called a soft board), and a piezoelectric material layer 30. In this embodiment, the number of the printed circuit boards 10 is two, and the two printed circuit boards 10 are connected to two ends of the flexible circuit board 20 in the extending direction and are spaced apart from each other. The printed circuit board 10 includes a first circuit layer 11, and the first circuit layer 11 is disposed adjacent to the flexible circuit board 20. The flexible circuit board 20 includes a second circuit layer 21, and the second circuit layer 21 is disposed adjacent to the printed circuit board 10 and electrically connected to the first circuit layer 11. The piezoelectric material layer 30 is embedded in the flexible circuit board 20 and electrically connected to the second circuit layer 21.

In some embodiments, the piezoelectric material layer 30 includes a piezoelectric material, which may be, but is not limited to, polyvinylidene fluoride (PVDF), piezoelectric ceramic (PZT), or the like. Preferably, the material of the piezoelectric material layer 30 is polyvinylidene fluoride. The polyvinylidene fluoride has light weight and the density of the polyvinylidene fluoride is only one fourth of that of common piezoelectric ceramics; the material has high elasticity and better flexibility, and can be processed into any shape to be completely attached to any surface; the output voltage is high, and the output voltage is 10 times higher than that of the piezoelectric ceramics under the same stress condition.

In some embodiments, the printed circuit board 10 further includes a first substrate layer 12. The first circuit layer 11 is formed on the first base material layer 12, and the first circuit layer 11 is located between the flexible circuit board 20 and the first base material layer 12. The material of the first substrate layer 12 may be, but not limited to, polyimide (PI), polyester resin (PET), polyethylene naphthalate (PEN), liquid Crystal Polymer (LCP), and Modified Polyimide (MPI).

In some embodiments, the flexible circuit board 20 further includes a second substrate layer 22 and an insulating layer 23. The second substrate layer 22 is located between the insulating layer 23 and the second circuit layer 21, and the second circuit layer 21 is disposed close to the printed circuit board 10. And, a part of the insulating layer 23 extends toward a direction close to the printed circuit board 10 and covers a part of the surface of the printed circuit board 10.

Further, in some embodiments, the material of the second substrate layer 22 may be, but is not limited to, polyimide (PI) or polyester film (PET).

In some embodiments, the flexible circuit board 20 further includes a protection layer 24, and the protection layer 24 is formed in the second circuit layer 21. The protective layer 24 is used to protect the second circuit layer 21 and prevent the second circuit layer 21 from collapsing.

In some embodiments, the rigid-flex board 100 further includes a conductive via 101. The conductive hole 101 penetrates the insulating layer 23 and the second base material layer 22, and the piezoelectric material layer 30 and the second wiring layer 21 are electrically connected through the conductive hole 101.

In some embodiments, the rigid-flexible board 100 may further include a protective layer 40. The protective layer 40 is disposed on a side of the flexible circuit board 20 away from the printed circuit board 10, that is, on a side (upper side in fig. 1) of the insulating layer 23 away from the second substrate layer 22. The protection layer 40 is further disposed on a side of the printed circuit board 10 away from the flexible circuit board 20, that is, on a side (lower side in fig. 1) of the first substrate layer 12 away from the first circuit layer 11. In this embodiment, the protective layer 40 is a solder mask layer, and in other embodiments, the protective layer 40 may also be a cover-lay (CVL) layer. The protective layer 40 is used for the printed circuit board 10 and the flexible circuit board 20 to prevent from being invaded by external moisture or being scratched by foreign matters, etc.

Second embodiment

Referring to fig. 2, another embodiment of the present disclosure provides a rigid-flex board 200. The rigid-flex board 200 shown in fig. 2 differs from the rigid-flex board 100 in fig. 1 only in that: in the present embodiment, the printed circuit board 10 is a multilayer wiring board. The remaining technical features are the same as those of the first embodiment, and are not described herein again.

A specific process for preparing the rigid-flex board 100 (200) will be described below.

Referring to fig. 3, first, the printed circuit board 10 and the flexible circuit board 20 are pressed together. The printed circuit board 10 is a multilayer circuit board. Of course, the printed circuit board 10 may be replaced with a single layer circuit board as shown in fig. 1. The outermost side of the printed circuit board 10 is a first circuit layer 11 and a first base material layer 12. The flexible circuit board 20 includes a second circuit layer 21, a second substrate layer 22, an insulating layer 23, and a protective layer 24, the second substrate layer 22 is located between the insulating layer 23 and the second circuit layer 21, and the protective layer 24 is formed in the second circuit layer 21. The cross section of the insulating layer 23 is substantially in a shape of a Chinese character 'ao', and both ends of the insulating layer in the extending direction extend in the thickness direction until being flush with the surface of the second circuit layer 21 facing away from the second base material layer 22. Before lamination, the first circuit layer 11 and the second circuit layer 21 are arranged oppositely; after lamination, the first circuit layer 11 is electrically connected to the second circuit layer 21, the insulating layer 23 fills the exposed surface of the first substrate layer 12 of the first circuit layer 11, and the insulating layer 23 and the second circuit layer 21 completely cover the surface of the printed circuit board 10.

Referring to fig. 4, blind vias 201 can be formed on the flexible circuit board 20 by, but not limited to, mechanical drilling, laser drilling, etc. The blind hole 201 penetrates through the insulating layer 23 and the second substrate layer 22, and a part of the surface of the second circuit layer 21, which is close to the second substrate layer 22, is exposed through the blind hole 201. The number of the blind holes 201 may be one or more, and in the present embodiment, the number of the blind holes 201 is two.

Referring to fig. 5, a Plated Through Hole (PTH) is formed by plating a conductive material layer 202 on a side of the insulating layer 23 away from the printed circuit board 10 and on an inner wall of the blind via 201. The conductive material layer may be, but is not limited to, copper or the like.

Referring to fig. 6, the blind via 201 is formed with a conductive via 101 by performing processes such as lamination (e.g., laminating a resist 203 on the outer side of the conductive material layer 202), development, pattern plating, and removal of the resist 203.

Next, referring to fig. 7, the piezoelectric material layer 30 is laminated to the flexible circuit board 20, and the piezoelectric material layer 30 is embedded in the insulating layer 23 of the flexible circuit board 20.

Finally, referring to fig. 1 or fig. 2, a protective layer 40 is respectively disposed on a side of the flexible circuit board 20 away from the printed circuit board 10 and a side of the printed circuit board 10 away from the flexible circuit board 20, so as to obtain a rigid-flex board 200 (100).

Referring to fig. 8, another aspect of the present application provides an electronic device 1, where the electronic device 1 includes the rigid-flex board 100 (200) as described above. The rigid-flex board 100 (200) can supply power to the electronic device 1. The electronic device may be, but is not limited to, a folding screen mobile phone, and the rigid-flexible printed circuit board 100 (200) may be disposed at a foldable portion of the folding screen mobile phone.

The battery of the folding screen mobile phone can be divided into two modules, wherein one module is a 5000mA common battery (about 95% of the total space of the battery), and the other module is a 100mA emergency standby battery capable of charging weak current (about 5% of the total space of the battery). Normally, the printed circuit board 10 in the rigid-flex circuit board 100 (200) can be combined with other electronic components to normally charge to a normal battery or normally use the power of the normal battery. When the folding screen mobile phone is powered off, weak current of about 5v can be generated instantaneously by the piezoelectric material layer 30 in the folding mobile phone and the rigid-flex board 100 (200), and the generated weak current is led out through the flexible circuit board 20 and stored in the emergency backup battery. When the common battery is dead, the battery can be operated by low current for emergency use, and the endurance time is prolonged.

The soft and hard combined board 100 (200) and the electronic device 1 combine the soft board with the piezoelectric material, so that the soft board signal transmission function and the piezoelectric material charging function are combined into a whole, the mutual conversion between mechanical vibration and alternating current can be realized, and the rigidity and durability of the soft board are increased. The rigid-flex board 100 (200) can provide emergency power for the electronic device 1, and the endurance time of the battery of the electronic device 1 is prolonged.

The above description is a few specific embodiments of the present application, but in practical applications, the present application is not limited to these embodiments. Other modifications and variations to the technical concept of the present application should fall within the scope of the present application for those skilled in the art.

Claims

1. A rigid-flex board, comprising:

a printed circuit board including a first circuit layer;

2. The rigid-flex board of claim 1, wherein the printed circuit board further comprises a first substrate layer, and the first circuit layer is formed on the first substrate layer.

3. The flexible-rigid printed circuit board according to claim 1, wherein the flexible circuit board further includes a second substrate layer and an insulating layer, the second substrate layer is located between the insulating layer and the second circuit layer, and a part of the insulating layer extends toward a direction close to the printed circuit board and covers a part of a surface of the printed circuit board.

4. The board according to claim 3, wherein the flexible circuit board further comprises a protective layer formed in the second wiring layer.

5. The board according to claim 3, further comprising a conductive hole penetrating through the insulating layer and the second substrate layer, wherein the piezoelectric material layer and the second circuit layer are electrically connected through the conductive hole.

6. The board of claim 3, wherein the material of the second substrate layer comprises polyimide or mylar.

7. The board of claim 1, wherein the board further comprises a protective layer disposed on a side of the flexible circuit board facing away from the printed circuit board.

8. The board of claim 7, wherein the protective layer is further disposed on a side of the printed circuit board facing away from the flexible circuit board.

9. The board according to claim 1, wherein the layer of piezoelectric material comprises a piezoelectric material comprising polyvinylidene fluoride or a piezoelectric ceramic.

10. An electronic device, characterized in that the electronic device comprises the rigid-flex board according to any one of claims 1-9.