CN218301800U - HDI pulse blind hole filling system for thin-surface copper - Google Patents
HDI pulse blind hole filling system for thin-surface copper Download PDFInfo
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- CN218301800U CN218301800U CN202222350712.9U CN202222350712U CN218301800U CN 218301800 U CN218301800 U CN 218301800U CN 202222350712 U CN202222350712 U CN 202222350712U CN 218301800 U CN218301800 U CN 218301800U
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- pressure spray
- liquid medicine
- spray set
- hdi
- blind hole
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- 239000010949 copper Substances 0.000 title claims abstract description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 38
- 239000007788 liquid Substances 0.000 claims abstract description 82
- 239000003814 drug Substances 0.000 claims abstract description 72
- 239000007921 spray Substances 0.000 claims abstract description 60
- 238000005507 spraying Methods 0.000 claims abstract description 28
- 238000009713 electroplating Methods 0.000 claims abstract description 22
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910001447 ferric ion Inorganic materials 0.000 claims abstract description 15
- 230000009467 reduction Effects 0.000 claims abstract description 14
- 238000005086 pumping Methods 0.000 claims description 25
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 230000008021 deposition Effects 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 12
- 229910001431 copper ion Inorganic materials 0.000 description 12
- 239000000284 extract Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 229910001448 ferrous ion Inorganic materials 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009469 supplementation Effects 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides a blind hole system is filled out to thin face copper's HDI pulse, cut down device, high-pressure spray set and low pressure spray set including electroplating box, liquid medicine chamber, ferric ion, the ferric ion cuts down the device and connects on high-pressure spray set, high-pressure spray set and low pressure spray set's output all sets up in electroplating box, high-pressure spray set and low pressure spray set's input portion all communicates with the liquid medicine chamber. The high-pressure spray device and the ferric ion reduction device are matched to work to ensure that Cu is contained 0 Can be fully deposited in the blind hole and form metal lattices under the action of a light agent, the quality and the efficiency of filling copper in the blind hole are improved, and the Cu is sprayed by a low-pressure spraying device 0 The deposition thickness on the outer surface of the high-density interconnection board is reduced, namely the copper plating thickness of the outer surface is reduced, so that the consumption cost of copper materials can be saved, and the yield of subsequent processes can be greatly improved.
Description
Technical Field
The utility model relates to a material electrochemistry technical field specifically is a blind hole system is filled out to HDI pulse of thin face copper.
Background
In the production process of high density interconnection board (HDI), there is a blind hole to fill out the copper preface and need electroplate the blind hole on the high density interconnection board and fill in the hole, this process accessible is perpendicular to be electroplated the line and is accomplished at present, perpendicular electroplating line is including filling out blind hole equipment and negative pole clamping mobile device, it includes the electroplating box to fill out blind hole equipment, liquid medicine chamber and spray set, install the positive pole with the electric current switch-on in the liquid medicine intracavity, the liquid medicine chamber sets up on the electroplating box, spray set includes many shower and pumping system, many shower all communicate with liquid medicine chamber through pumping system and are located the electroplating box, negative pole clamping mobile device includes negative pole hanger and mobile device, the negative pole hanger is installed on the mobile device and is located the electroplating box, high density interconnection board is installed on the negative pole hanger and is just put through with the electric current.
When the blind hole copper filling process is executed, the moving device drives the cathode hanger to drive the high-density interconnection plate to perform linear motion, meanwhile, the pumping system extracts liquid medicine in the liquid medicine cavity, the liquid medicine is sprayed to the front and the back of the high-density interconnection plate through the plurality of spraying pipes, the liquid medicine is plating solution and comprises copper sulfate and ferrous sulfate, and copper oxide powder in the liquid medicine is Cu 2+ The main source of supplementation, the reaction of ferrous ions on the anode is Fe 2+ -e→Fe 3+ Fe in the liquid medicine when the liquid medicine is in contact with the high-density interconnection plate 3+ And Cu 2+ Both from the outer surface of the high density interconnect board and within the blind via, i.e. Fe 3+ +e→Fe 2+ And Cu 2+ +2e→Cu 0 Final Cu 0 The copper is absorbed in the blind holes and forms metal lattices under the action of a light agent in the liquid medicine, and the process of filling copper in the blind holes is finished.
Disclosure of Invention
An object of the utility model is to provide a blind hole system is filled out to HDI pulse of thin face copper to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the HDI pulse blind hole filling system for the thin-surface copper comprises an electroplating box, a liquid medicine cavity, a ferric ion reduction device, a high-pressure spraying device, a low-pressure spraying device and a control device, wherein the ferric ion reduction device is connected to the high-pressure spraying device;
high pressure spray set is arranged in extracting the liquid medicine in the liquid medicine chamber so that the liquid medicine obtains high concentration metal ion plating liquid medicine and sprays high concentration metal ion plating liquid medicine to the blind hole of work piece through the ferric ion reduction device reaction, low pressure spray set is arranged in extracting the liquid medicine in the liquid medicine chamber and sprays the liquid medicine to the work piece.
Further, the output parts of the high-pressure spray device and the low-pressure spray device are arranged alternately.
Further, high pressure spray set includes pumping system and many injection pipes that are linear arrangement, many the injection pipe all is located the electroplating box and all communicates with the liquid medicine chamber through pumping system.
Further, the first pumping system comprises a first pipeline, and a first liquid pump, a first flow control valve, a first digital flow meter and a first jet main pipe which are all connected to the first pipeline, wherein the first liquid pump, the first flow control valve and the first digital flow meter are all electrically connected with the control device.
Furthermore, a plurality of first nozzles are arranged on the injection pipe, and the first nozzles are linearly arranged along the axial direction of the injection pipe.
Furthermore, the low-pressure spraying device comprises a second pumping system and a plurality of spraying pipes which are linearly arranged, and the plurality of spraying pipes are positioned in the electroplating box and are communicated with the liquid medicine cavity through the second pumping system.
Further, the second pumping system comprises a second pipeline, and a second liquid pump, a second flow control valve, a second digital flow meter and a second jet main pipe which are all connected to the second pipeline, wherein the second liquid pump, the second flow control valve and the second digital flow meter are all electrically connected with the control device.
Furthermore, a plurality of second nozzles are arranged on the spray pipe, and the second nozzles are linearly arranged along the axial direction of the spray pipe.
Furthermore, the second nozzles on the adjacent spray pipes are arranged in a staggered manner.
The utility model has the advantages that:
the liquid medicine in the liquid medicine cavity contains high-concentration Fe 3+ The high-pressure spraying device extracts the liquid medicine in the liquid medicine cavity, so that the liquid medicine reacts with copper particles in the liquid medicine cavity when passing through the ferric ion reduction device, namely 2Fe 3+ +Cu 0 →2Fe 2+ +Cu 2+ To obtain high-concentration copper ion liquid medicine with Cu added 2+ And effectively reduces Fe 3+ In a concentration of reduced Fe 3+ For Cu 0 The high-pressure spray device sprays high-concentration copper ion liquid medicine onto the high-density interconnection board, and the high-concentration copper ion liquid medicine entering the blind holes contains Cu 2+ Obtaining electrons, i.e. Cu, from blind holes 2+ +2e→Cu 0 Cu in high concentration copper ion liquid medicine 2+ High concentration of Cu 0 The copper filling material can be fully deposited in the blind holes and form metal lattices under the action of a light agent, and finally, the quality and the efficiency of filling copper in the blind holes are effectively improved;
meanwhile, the low-pressure spraying device extracts the liquid medicine in the liquid medicine cavity and sprays the liquid medicine onto the high-density interconnection plate, and the high-concentration Fe in the liquid medicine 3+ Getting more electrons, i.e. Fe, from the outer surface of the high density interconnect board 3+ +e→Fe 2+ To reduce electrons on the outer surface of the high-density interconnection plate, by this method, cu in the high-concentration copper ion solution is made 2+ Electrons obtained from the outer surface of the high-density interconnection board are reduced so thatGet Cu 0 The deposition thickness on the outer surface of the high-density interconnection board is reduced, namely the copper plating thickness of the outer surface is reduced, so that the consumption cost of copper materials can be saved, the yield of subsequent procedures can be greatly improved, and the quality defects of residual copper, wire breakage and the like are reduced.
Drawings
FIG. 1: the partial front view of the utility model.
FIG. 2: the utility model discloses a high pressure spray set looks sideways at the schematic diagram.
FIG. 3: the utility model discloses a low pressure spray set look sideways at the schematic diagram.
FIG. 4: the utility model discloses a low pressure spray set's local foresight schematic diagram.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
please refer to fig. 1 to 3, a HDI pulse blind hole filling system for thin-surface copper, which comprises an electroplating tank 1, a liquid medicine cavity 2, a ferric ion reduction device 3, a high-pressure spray device 4, a low-pressure spray device 5 and a control device, wherein the liquid medicine cavity 2 is installed on the electroplating tank 1, an anode 21 is arranged in the liquid medicine cavity 2, the ferric ion reduction device 3 adopts a copper-dissolving filter barrel disclosed in the chinese utility model (publication) No. CN216338060U, publication (publication) No. 2022-04-19), the ferric ion reduction device 3 is connected to the high-pressure spray device 4, the output parts of the high-pressure spray device 4 and the low-pressure spray device 5 are both arranged in the electroplating tank 1, and the input parts of the high-pressure spray device 4 and the low-pressure spray device 5 are both communicated with the liquid medicine cavity 2;
high pressure spray set 4 is used for extracting the liquid medicine in liquid medicine chamber 2 so that make the liquid medicine pass through ferric ion reduction device 3 reaction and obtain high concentration copper ion liquid medicine and spray high concentration copper ion liquid medicine in the blind hole of high density interconnection board, low pressure spray set 5 is used for extracting the liquid medicine in liquid medicine chamber 2 and spray liquid medicine on the high density interconnection board, high pressure spray set 4 and low pressure spray set 5 all are connected with the controlling means electricity, the controlling means is used for controlling high pressure spray set 4 and low pressure spray set 5, high pressure spray set 4, low pressure spray set 5 and controlling means all are connected with the power electricity.
Referring to fig. 1 and 2, the high pressure spraying device 4 includes a pumping system 41 and a plurality of spraying pipes 42 arranged linearly, the plurality of spraying pipes 42 are all located in the electroplating tank 1 and are all communicated with the liquid medicine cavity 2 through the pumping system 41, in this embodiment, the spraying pipes 42 are arranged in two rows and are arranged oppositely along the front-back direction.
Referring to fig. 1 and 2, the pumping system 41 includes a first pipe 411, a first liquid pump 412, a first flow control valve 413, a first digital flow meter 414, and a first jet manifold 415 that are all connected to the first pipe 411, the first jet manifold 415 is fixed in the electroplating tank 1, and the first liquid pump 412, the first flow control valve 413, and the first digital flow meter 414 are all electrically connected to the control device.
Referring to fig. 2, the injection pipe 42 is provided with a plurality of first nozzles 421, the plurality of first nozzles 421 are linearly arranged along the axial direction of the injection pipe 42, and the first nozzles 421 are cone-shaped nozzles.
Referring to fig. 1 and 3, the low pressure spraying device 5 includes a second pumping system 51 and a plurality of spraying pipes 52 arranged linearly, the plurality of spraying pipes 52 are all located in the electroplating tank 1 and are all communicated with the liquid medicine cavity 2 through the second pumping system 51, in this embodiment, the spraying pipes 52 are arranged in two rows and are arranged oppositely along the front-back direction.
Referring to fig. 1 and 3, the second pumping system 51 includes a second pipe 511, a second liquid pump 512, a second flow control valve 513, a second digital flow meter 514, and a second jet flow header 515, which are all connected to the second pipe 511, the second jet flow header 515 is fixedly disposed in the electroplating tank 1, and the second liquid pump 512, the second flow control valve 513, and the second digital flow meter 514 are electrically connected to the control device.
The flow of the pumping system 41 and the flow of the pumping system 51 can be effectively distributed through the first flow control valve 413 and the second flow control valve 513, so that different requirements on the flow on the outer surface of the high-density interconnection board and the blind hole can be met, different flow parameters can be configured for different high-density interconnection boards, the flow data of the pumping system 41 and the pumping system 51 can be well fed back to the control device through the first digital flow meter 414 and the second digital flow meter 514, and electroplating parameters of different high-density interconnection boards can be optimized and adjusted conveniently.
Referring to fig. 1 and 3, the spray pipes 42 and the shower pipes 52 are alternately arranged. The spray pipe 52 is provided with a plurality of second nozzles 521, the plurality of second nozzles 521 are linearly arranged along the axial direction of the spray pipe 52, and the second nozzles 521 are diffusion mixed flow nozzles.
Referring to fig. 4, the second nozzles 521 of the adjacent shower pipes 52 are disposed in a staggered manner to ensure uniformity of the spraying region.
The working principle is as follows:
the liquid medicine in the liquid medicine cavity 2 contains high-concentration Fe 3+ The high-pressure spraying device 4 extracts the liquid medicine in the liquid medicine cavity 2, so that the liquid medicine reacts with copper particles in the ferric ion reduction device 3 when passing through the ferric ion reduction device, namely 2Fe 3+ +Cu 0 →2Fe 2+ +Cu 2+ To obtain high-concentration copper ion liquid medicine with Cu added 2+ And effectively reduces Fe 3+ In a concentration of reduced Fe 3+ For Cu 0 The high-pressure spray device 4 sprays high-concentration copper ion liquid medicine onto the front and back surfaces of the high-density interconnection board under the influence of deposition, and the high-concentration copper ion liquid medicine entering the blind holes of the high-density interconnection board contains Cu 2+ Obtaining electrons, i.e. Cu, from blind holes 2+ +2e→Cu 0 Cu in high concentration copper ion liquid medicine 2+ High concentration of Cu 0 The copper filling material can be fully deposited in the blind holes and form metal lattices under the action of a light agent, and finally, the quality and efficiency of copper filling of the blind holes are effectively improved;
simultaneously low pressure spray set 5 extracts the liquid medicine in liquid medicine chamber 2 and sprays the liquid medicine on the front and the back of high density interconnection board, makes high concentration Fe in the liquid medicine 3+ Getting more electrons, i.e. Fe, from the outer surface of the high density interconnect board 3+ +e→Fe 2+ To reduce electrons on the outer surface of the high-density interconnection plate, by this method, cu in the high-concentration copper ion solution is made 2+ Reduction of electrons obtained from the outer surface of high density interconnect boardsSo that Cu 0 The deposition thickness on the outer surface of the high-density interconnection board is reduced, namely the copper plating thickness of the outer surface is reduced, so that the consumption cost of copper materials can be saved, the yield of subsequent processes can be greatly improved, and the quality defects of residual copper, wire fineness and the like are reduced.
The above is not intended to limit the technical scope of the present invention, and any modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are all within the scope of the technical solution of the present invention.
Claims (9)
1. The utility model provides a blind hole system is filled in HDI pulse of thin face copper which characterized in that: including electroplating case, liquid medicine chamber, ferric ion reduction device, high pressure spray set and low pressure spray set, ferric ion reduction device connects on high pressure spray set, high pressure spray set and low pressure spray set's output all sets up in electroplating the case, high pressure spray set and low pressure spray set's input portion all communicates with the liquid medicine chamber.
2. The HDI pulsed blind via system for thin face copper according to claim 1, wherein: the output parts of the high-pressure spray device and the low-pressure spray device are arranged alternately.
3. The HDI pulse blind hole filling system for thin face copper according to claim 1, characterized in that: the high-pressure spraying device comprises a pumping system and a plurality of spraying pipes which are linearly arranged, and the spraying pipes are all positioned in the electroplating box and are communicated with the liquid medicine cavity through the pumping system.
4. The HDI pulse blind hole filling system for thin face copper according to claim 3, characterized in that: the first pumping system comprises a first pipeline, a first liquid pump, a first flow control valve, a first digital flow meter and a first jet main pipe which are all connected to the first pipeline.
5. The HDI (high Density interconnect) pulse blind hole filling system for thin-sided copper according to claim 3, wherein: the injection pipe is provided with a plurality of first nozzles which are linearly arranged along the axial direction of the injection pipe.
6. The HDI pulsed blind via system for thin face copper according to claim 1, wherein: the low-pressure spraying device comprises a second pumping system and a plurality of spraying pipes which are linearly arranged, and the spraying pipes are all positioned in the electroplating box and are communicated with the liquid medicine cavity through the second pumping system.
7. The HDI pulse blind hole filling system for thin face copper according to claim 6, characterized in that: and the pumping system II comprises a pipeline II, and a liquid pump II, a flow control valve II, a digital flow meter II and a jet flow main pipe II which are all connected to the pipeline II.
8. The HDI (high Density interconnect) pulse blind hole filling system for thin-sided copper according to claim 6, wherein: and the spraying pipe is provided with a plurality of second nozzles which are linearly arranged along the axial direction of the spraying pipe.
9. The HDI pulsed blind via system for thin face copper according to claim 8, wherein: and the second nozzles on the adjacent spray pipes are arranged in a staggered manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222350712.9U CN218301800U (en) | 2022-09-05 | 2022-09-05 | HDI pulse blind hole filling system for thin-surface copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222350712.9U CN218301800U (en) | 2022-09-05 | 2022-09-05 | HDI pulse blind hole filling system for thin-surface copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218301800U true CN218301800U (en) | 2023-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222350712.9U Active CN218301800U (en) | 2022-09-05 | 2022-09-05 | HDI pulse blind hole filling system for thin-surface copper |
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| Country | Link |
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| CN (1) | CN218301800U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116209177A (en) * | 2022-09-05 | 2023-06-02 | 东莞市速铜科技有限公司 | HDI pulse blind hole filling system for thin-surface copper |
-
2022
- 2022-09-05 CN CN202222350712.9U patent/CN218301800U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116209177A (en) * | 2022-09-05 | 2023-06-02 | 东莞市速铜科技有限公司 | HDI pulse blind hole filling system for thin-surface copper |
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