CN216451609U

CN216451609U - Bonding device for processing circuit board

Info

Publication number: CN216451609U
Application number: CN202123117714.5U
Authority: CN
Inventors: 李长德; 李家华; 谢贤山
Original assignee: Longyan Wuping Xinda Electronics Co ltd
Current assignee: Longyan Wuping Xinda Electronics Co ltd
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2022-05-06
Anticipated expiration: 2031-12-07

Abstract

The application discloses bonding device is used in circuit board processing, including centre gripping subassembly and bonding subassembly, the centre gripping subassembly includes the bottom plate, two slide bars, and four grip blocks, two slide bar symmetry slidable mounting are in the bottom plate top, four average slidable mounting of grip block are in two slide bar tops, four grip block cross-sections all are the L type, four grip block notch lateral walls are relative setting, the bonding subassembly includes the telescopic link, the carrier bar, lug and sucking disc, the telescopic link is installed in the bottom plate top, the carrier bar is installed in the telescopic link top, the lug is installed in the carrier bar bottom, the sucking disc is installed in the lug bottom, the sucking disc is relative setting with the bottom plate top. This scheme, the phenomenon that the skew takes place for the second piece circuit board when effectively having avoided bonding, and then be convenient for first piece circuit board and the complete coincidence of second piece circuit board, the off-the-shelf quality of effectual improvement, and be applicable to the circuit board bonding work of different length and different width.

Description

Bonding device for processing circuit board

Technical Field

The application relates to the technical field of circuit board processing, in particular to a bonding device for processing a circuit board.

Background

The double-sided board is a medium layer in the middle, and the two sides are wiring layers. The multilayer board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers and can be made to be very thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated in an insulating board. The electrical connection between them is usually achieved by means of plated-through holes in the cross-section of the circuit board.

When the present two-sided board of two block circuit boards synthesis, at first treat the bonding circuit board with first piece and put at the workstation top, later treat the bonding circuit board with the second piece again and treat the bonding circuit board with first piece and carry out processes such as bonding to it, but at the bonding in-process, first piece circuit board and second piece circuit board all are not spacing, and for workman manual bonding, and then the second piece circuit board has the phenomenon of skew when can leading to bonding, influences off-the-shelf quality.

SUMMERY OF THE UTILITY MODEL

The present application is directed to a bonding apparatus for processing a circuit board, which can solve the problems of the related art.

In order to achieve the purpose, the application provides a bonding device for processing a circuit board, which comprises a clamping assembly and a bonding assembly.

The clamping assembly comprises a bottom plate, two sliding rods and four clamping blocks, the two sliding rods are symmetrically slidably mounted at the top of the bottom plate, the four clamping blocks are symmetrically slidably mounted at the tops of the two sliding rods, the cross sections of the four clamping blocks are L-shaped, and the side walls of notches of the four clamping blocks are oppositely arranged.

The bonding assembly comprises a telescopic rod, a bearing rod, a convex block and a sucker, the telescopic rod is installed at the top of the bottom plate, the bearing rod is installed at the top of the telescopic rod, the convex block is installed at the bottom of the bearing rod, the sucker is installed at the bottom of the convex block, and the sucker and the top of the bottom plate are oppositely arranged.

In one embodiment of the application, two slide bars are provided with T-shaped sliding blocks at the bottoms, and a sliding groove matched with the T-shaped sliding block is arranged at the top of the bottom plate.

In an embodiment of the application, a fixed block is installed on the side wall of the T-shaped sliding block, a threaded rod is installed on the side wall of the fixed block in a threaded mode, and the end portion of the threaded rod is abutted to the side wall of the sliding groove.

In an embodiment of the present application, the side wall of the T-shaped slider and the side wall of the sliding chute are both smooth surfaces.

In an embodiment of the application, four guide blocks are symmetrically installed at the bottoms of the clamping blocks, and the side walls of the guide blocks are inconsistent with the side walls of the sliding rods.

In an embodiment of this application, four the locating lever is installed to the equal screw thread in grip block top, the locating lever tip with the slide bar top is inconsistent.

In an embodiment of this application, the telescopic link includes outer tube, inner tube and spring, the outer tube install in the bottom plate top, the spring mounting in inside the outer tube, the inner tube peg graft install in inside the outer tube, the inner tube tip with the spring is inconsistent, the carrier bar install in the inner tube top.

In an embodiment of this application, the inner tube is in the inside tip periphery of outer tube installs the spacing collar, outer tube end install with spacing collar complex stopper.

Compared with the prior art, the beneficial effects of this application are: through the bonding device for processing the circuit board with the design, when in use, two slide bars and four clamping blocks are slid according to the length and the width of the circuit board to be bonded, so that the distance between the two slide bars is increased or decreased, the distance between the two clamping blocks on the same slide bar is increased or decreased, the circuit boards to be bonded with different lengths and different widths are convenient to place, the first circuit board to be bonded is placed at the top of the slide bar, at the moment, the four clamping blocks respectively limit the first circuit board to be bonded from four corners of the circuit board to be processed, the first circuit board to be bonded is prevented from being deviated, then the second circuit board to be bonded is adsorbed at the bottom of the sucker, the bearing rod is further pressed to shorten the telescopic rod, the position of the second circuit board to be bonded is lowered, in the lowering process, if the position of the second circuit board to be bonded is not correct, can be inconsistent with the top of grip block, and then make the second treat that the bonding circuit board can only follow and treat that the processing circuit board position is relative from the first piece descends, and then treat the bonding circuit board with the first piece and accomplish the bonding, and at this in-process, the first piece is treated the bonding circuit board and is treated the bonding circuit board with the second piece and all carried on spacingly by four grip blocks, the phenomenon that the skew takes place for the second piece circuit board when effectively having avoided bonding, and then be convenient for first piece circuit board and second piece circuit board coincide completely, effectual improvement off-the-shelf quality, and be applicable to the circuit board bonding work of different length and different width.

Drawings

Fig. 1 is a schematic front sectional view of an adhesion device for processing a circuit board according to an embodiment of the present application;

fig. 2 is a schematic top sectional view of an adhesion device for processing a circuit board according to an embodiment of the present application;

fig. 3 is a schematic front view of an adhesion device for processing a circuit board according to an embodiment of the present application.

In the figure: 100. a clamping assembly; 110. a base plate; 120. a slide bar; 121. a T-shaped slider; 122. a chute; 123. a fixed block; 124. a threaded rod; 130. a clamping block; 131. a guide block; 132. positioning a rod; 200. bonding the assembly; 210. a telescopic rod; 211. an outer tube; 212. an inner tube; 213. a spring; 214. a limiting ring; 215. a limiting block; 220. a carrier bar; 230. a bump; 240. and (4) sucking discs.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

In addition, the term "plurality" shall mean two as well as more than two.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Example 1

Referring to fig. 1-3, the present application provides a bonding apparatus for processing a circuit board, including a clamping assembly 100 and a bonding assembly 200, wherein the bonding assembly 200 is mounted on a sidewall of the bonding assembly 200 by using screws, the clamping assembly 100 is used for positioning a circuit board to be bonded, and the bonding assembly 200 is used for bonding two circuit boards.

Referring to fig. 1, 2 and 3, the clamping assembly 100 includes a bottom plate 110, two sliding rods 120, and four clamping blocks 130, the two sliding rods 120 are symmetrically slidably mounted on the top of the bottom plate 110, in an embodiment, T-shaped sliding blocks 121 are disposed at the bottoms of the two sliding rods 120, a sliding slot 122 matched with the T-shaped sliding blocks 121 is disposed at the top of the bottom plate 110, the sliding slot 122 is used for guiding and limiting the T-shaped sliding blocks 121, the four clamping blocks 130 are averagely slidably mounted on the tops of the two sliding rods 120, in an embodiment, guide blocks 131 are symmetrically welded at the bottoms of the four clamping blocks 130, side walls of the guide blocks 131 are abutted against side walls of the sliding rods 120, the guide blocks 131 are used for guiding and limiting the clamping blocks 130, cross sections of the four clamping blocks 130 are L-shaped, side walls of notches of the four clamping blocks 130 are oppositely disposed, and the clamping blocks 130 are used for guiding and positioning a circuit board to be bonded.

During specific implementation, a fixing block 123 is welded to the side wall of the T-shaped sliding block 121, a threaded rod 124 is installed on the side wall of the fixing block 123 in a threaded mode, the end portion of the threaded rod 124 is abutted to the side wall of the sliding groove 122, and the threaded rod 124 is used for positioning the T-shaped sliding block 121, so that the sliding rod 120 can be conveniently positioned after sliding.

During specific implementation, T type slider 121 lateral wall all is the smooth surface setting with spout 122 lateral wall, the effectual frictional force that reduces between T type slider 121 and the spout 122, and then the slip of the T type slider 121 of being convenient for.

In specific implementation, the top of each of the four clamping blocks 130 is provided with a positioning rod 132 through threads, the end of each positioning rod 132 is abutted against the top of the corresponding sliding rod 120, and the positioning rods 132 are used for positioning the clamping blocks 130 after sliding.

Referring to fig. 1, 2 and 3, the bonding assembly 200 includes a telescopic rod 210, a bearing rod 220, a bump 230 and a suction cup 240, the telescopic rod 210 is mounted on the top of the bottom plate 110 by screws, the bearing rod 220 is mounted on the top of the telescopic rod 210 by screws, the bump 230 is mounted on the bottom of the bearing rod 220 by screws, the suction cup 240 is mounted on the bottom of the bump 230 by bonding, the suction cup 240 is disposed opposite to the top of the bottom plate 110, in specific implementation, the bearing rod 220 is pressed to shorten the telescopic rod 210, so that the bump 230 descends, and the suction cup 240 is driven to descend, thereby facilitating subsequent work.

In this embodiment, the telescopic rod 210 includes an outer tube 211, an inner tube 212 and a spring 213, the outer tube 211 is installed on the top of the bottom plate 110 by using screws, the spring 213 is installed inside the outer tube 211 by using screws, the inner tube 212 is installed inside the outer tube 211 in an inserting manner, the end of the inner tube 212 is abutted to the spring 213, and the bearing rod 220 is installed on the top of the inner tube 212.

During specific implementation, the inner tube 212 is in the inside tip periphery welding of outer tube 211 and installs spacing collar 214, and outer tube 211 tip uses the screw to install with spacing collar 214 complex stopper 215, and stopper 215 is used for blockking spacing collar 214, avoids spacing collar 214 to break away from outer tube 211, and then keeps away from inner tube 212 and breaks away from outer tube 211.

Specifically, this bonding device is used in circuit board processing's theory of operation: when the circuit board to be bonded is used, the two slide bars 120 and the four clamping blocks 130 are slid according to the length and the width of the circuit board to be bonded, so that the distance between the two slide bars 120 is increased or decreased, the distance between the two clamping blocks 130 on the same slide bar is increased or decreased, the circuit boards to be bonded with different lengths and different widths are convenient to place, the first circuit board to be bonded is placed at the top of the slide bar 120, at the moment, the four clamping blocks 130 respectively limit the first circuit board to be bonded from four corners of the circuit board to be processed, the first circuit board to be bonded is prevented from being deviated, then the second circuit board to be bonded is adsorbed at the bottom of the sucking disc 240, the bearing bar 220 is further pressed, the inner pipe 212 is subjected to pressure reduction, the lug 230 drives the sucking disc 240 to descend, in the descending process, if the position of the second circuit board to be bonded is not correct, can be inconsistent with the top of grip block 130, and then make the second treat that the bonding circuit board can only follow and treat that the processing circuit board relative place descends in position with the first piece, and then treat that the bonding circuit board accomplishes the bonding with the first piece, and at this in-process, the first piece is treated the bonding circuit board and is treated the bonding circuit board with the second piece and all carried on spacingly by four grip blocks 130, the phenomenon that the skew takes place for the second piece circuit board when effectively having avoided bonding, and then be convenient for first piece circuit board and second piece circuit board coincide completely, the effectual quality that improves the finished product, and be applicable to the circuit board bonding work of different length and different width.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A bonding device for processing a circuit board is characterized by comprising

The clamping assembly (100) comprises a bottom plate (110), two sliding rods (120) and four clamping blocks (130), the two sliding rods (120) are symmetrically and slidably mounted at the top of the bottom plate (110), the four clamping blocks (130) are averagely and slidably mounted at the tops of the two sliding rods (120), the cross sections of the four clamping blocks (130) are L-shaped, and the side walls of notches of the four clamping blocks (130) are oppositely arranged;

the adhesive component (200) comprises an expansion link (210), a bearing rod (220), a convex block (230) and a sucker (240), wherein the expansion link (210) is installed at the top of the bottom plate (110), the bearing rod (220) is installed at the top of the expansion link (210), the convex block (230) is installed at the bottom of the bearing rod (220), the sucker (240) is installed at the bottom of the convex block (230), and the sucker (240) and the top of the bottom plate (110) are oppositely arranged.

2. The bonding device for processing the circuit board according to claim 1, wherein a T-shaped slider (121) is disposed at the bottom of each of the two sliding bars (120), and a sliding slot (122) engaged with the T-shaped slider (121) is disposed at the top of the bottom plate (110).

3. The bonding device for processing the circuit board according to claim 2, wherein a fixed block (123) is mounted on a side wall of the T-shaped slider (121), a threaded rod (124) is mounted on a side wall of the fixed block (123) in a threaded manner, and an end of the threaded rod (124) abuts against a side wall of the sliding groove (122).

4. The bonding device for processing the circuit board according to claim 2, wherein the side walls of the T-shaped slider (121) and the side walls of the sliding groove (122) are smooth.

5. The bonding apparatus for processing circuit board according to claim 1, wherein the bottom of each of the four clamping blocks (130) is symmetrically provided with a guide block (131), and the side wall of the guide block (131) is abutted against the side wall of the sliding rod (120).

6. The bonding apparatus for processing circuit board as claimed in claim 1, wherein a positioning rod (132) is threadedly mounted on top of each of said four holding blocks (130), and the end of said positioning rod (132) is abutted against the top of said sliding rod (120).

7. The bonding device for processing the circuit board according to claim 1, wherein the expansion link (210) comprises an outer tube (211), an inner tube (212) and a spring (213), the outer tube (211) is mounted on the top of the bottom plate (110), the spring (213) is mounted inside the outer tube (211), the inner tube (212) is inserted into the outer tube (211), the end of the inner tube (212) is abutted against the spring (213), and the bearing rod (220) is mounted on the top of the inner tube (212).

8. The bonding device for processing the circuit board according to claim 7, wherein a limiting ring (214) is installed on the periphery of the end portion of the inner tube (212) located inside the outer tube (211), and a limiting block (215) matched with the limiting ring (214) is installed on the end portion of the outer tube (211).