CN215912396U

CN215912396U - Radiator, electronic device and vehicle

Info

Publication number: CN215912396U
Application number: CN202121197313.2U
Authority: CN
Inventors: 李霁阳; 武昊; 张伟龙
Original assignee: Huawei Digital Power Technologies Co Ltd
Current assignee: Huawei Digital Power Technologies Co Ltd
Priority date: 2021-05-31
Filing date: 2021-05-31
Publication date: 2022-02-25
Anticipated expiration: 2031-05-31

Abstract

The application provides a radiator, an electronic device and a vehicle, and relates to the technical field of heat dissipation. Wherein, the radiator is composed of a bottom plate, a cover plate and fins. By folding the fins, a plurality of flow channels are formed, and the adjacent flow channels have different widths, and a plurality of flow-around fins are arranged on the first part, The fin is then arranged in the cavity structure formed between the bottom plate and the cover plate, the first part corresponding to the wider flow channel is connected to the bottom plate, and the second part corresponding to the narrower flow channel is connected to the cover plate. There is gas or liquid flowing in and out of the cavity structure, and more gas or liquid flows into the wider flow channel, and through the flow fins in the flow channel, the gas or liquid flow is increased, thereby greatly improving the radiator. heat radiation.

Description

Radiator, electronic device and vehicle

Technical Field

The present invention relates to the field of heat dissipation technologies, and in particular, to a heat sink, an electronic device, and an electronic apparatus.

Background

With the development of the semiconductor industry, many high-power semiconductor devices, such as Insulated Gate Bipolar Transistors (IGBTs), integrated gate-commutated thyristors (IGCTs), etc., are available in the existing electronic equipment. However, the high-power semiconductor device has a relatively high heat flux density, and generates a large amount of heat during operation, and if the high-power semiconductor device cannot be well radiated, the high-power semiconductor device not only limits the use environment of the high-power semiconductor device, but also influences the performance of the product performance.

With the development of electronic devices toward miniaturization and integration, the space of a heat dissipation assembly for dissipating heat of a high-power semiconductor device is relatively small. Therefore, in a limited space, a heat dissipation assembly with better heat dissipation performance is designed, which is a current focus research direction.

Disclosure of Invention

In order to solve the above problems, embodiments of the present application provide a heat sink, an electronic device, and an electronic apparatus, where a subject structure of the heat sink is composed of a bottom plate, a cover plate, and fins, flow channels are formed by folding and molding the fins, widths of adjacent flow channels are different, a bottom surface corresponding to a wider flow channel is welded to the bottom plate, a flow-around sheet is disposed on the bottom surface, a bottom surface corresponding to a narrower flow channel is connected to the cover plate, and then the fins are disposed in a cavity structure formed between the bottom plate and the cover plate.

Therefore, the embodiment of the application adopts the following technical scheme:

in a first aspect, the present application provides a heat sink comprising: the cover plate is coupled with the bottom plate to form a cavity structure; the fin is arranged in the cavity structure and comprises at least one first part, at least one second part and at least one connecting part, and the at least one first part and the at least one second part are sequentially arranged at intervals and are connected through the at least one connecting part; wherein a first surface of the at least one first portion is coupled with a first surface of the base plate constituting the cavity structure, and the at least one second portion is coupled with a second surface of the cover plate constituting the cavity structure; the first part comprises at least one bypass sheet, the at least one bypass sheet is arranged on the second surface of the first part along a first direction, the first direction is a direction perpendicular to a connecting line between two adjacent first parts, and the first surface of the first part and the second surface of the first part are two opposite surfaces on the first part.

In this embodiment, the heat sink is composed of a base plate, a cover plate and fins, a plurality of flow channels are formed by folding and molding the fins, a plurality of flow-around pieces are arranged on a first part, then the fins are arranged in a cavity structure formed between the base plate and the cover plate, the first part is connected to the base plate, a second part is connected to the cover plate, when gas or liquid flows in and out in the cavity structure, the flow-around pieces in the flow channels formed between the first part and two adjacent connecting parts increase the flow-around of the gas or liquid in the flow channels, and therefore the heat dissipation effect of the heat sink is greatly improved.

In one embodiment, the width of the first portion is larger than the width of the second portion, the width is a length in a second direction, and the second direction is a direction of a connecting line between two adjacent first portions or two adjacent second portions.

In this embodiment, since the heat in the heat generating device is transferred to the first portion through the bottom plate, and the heat dissipation manner can be carried out by the gas or liquid flowing into the cavity structure formed by the bottom plate and the cover plate, and can also be transferred to the cover plate through the second portion for heat dissipation, the process of transferring the heat in the heat generating device to the heat sink is important. Therefore, when the fins are designed, the width of the first part is larger than that of the second part, more gas or liquid flows into a flow channel formed between the first part and the two connecting parts, and heat on the heating device can be better transferred to the gas or the liquid in the flow channel, so that the heat dissipation effect is enhanced, and the heating device is better cooled.

In one embodiment, the at least one first portion is in a plane, the at least one second portion is in a plane, and the at least one first portion is parallel to the at least one second portion.

In this embodiment, if the plurality of first portions and the plurality of second portions are not aligned, when the plurality of first portions are coupled to the base plate and the plurality of second portions are coupled to the cover plate, it may occur that some of the first portions are not perfectly coupled to the base plate without a seam and the second portions are not perfectly coupled to the cover plate without a seam, thereby reducing the effect of transferring heat.

In one embodiment, the at least one bypass fin is disposed on the first portion at equal intervals in the first direction.

In the embodiment, the first part is perforated, the perforated material is turned over, the turned material is the flow-around sheet, and a plurality of flow-around sheets are arranged in the flow channel formed between the first part and the two connecting parts at equal intervals, so that the gas or liquid flow-around is increased, the gas or liquid flow can uniformly flow in the flow channel, the gas or liquid circulation is prevented from being influenced, and the heat exchange efficiency is improved.

In one embodiment, the angle between the bypass fin and the connecting portion is between 10 ° and 80 °.

In this embodiment, if the included angle between the bypass flow sheet and the connecting portion on one side is too small, the bypass flow sheet is too close to the connecting portion, so that a gap is easily formed on the side of the bypass flow sheet opposite to the flowing direction of the gas or liquid, and the gas or liquid cannot flow into the gap, so that the caliber of the flow channel is reduced, and the flowing property of the gas or liquid is affected; if the included angle between the bypass sheet and the connecting part on one side is too large, the bypass sheet is perpendicular to the flowing direction of the gas or the liquid, so that the flowing of the gas or the liquid is directly blocked, and the liquidity of the gas or the liquid is influenced.

In one embodiment, at least one of the bypass flow tabs on each first portion, one of two adjacent bypass flow tabs, is adjacent to the connecting portion on one side of the first portion; and the other bypass sheet of the two adjacent bypass sheets is close to the connecting part at the other side of the first part.

In this embodiment, two adjacent bypass pieces on one first part, one near the left side connecting part and one near the right side connecting part, are staggered on the first part, and are parallel to each other, so that the airflow direction of the gas or the liquid is changed to increase the heat dissipation surface, and the airflow direction of the gas or the liquid is not disturbed to influence the liquidity of the gas or the liquid.

In one embodiment, the shape of the bypass flow sheet is one of rectangular, square, trapezoidal and triangular.

In one embodiment, the method further comprises: the first through hole is arranged on the bottom plate and/or the cover plate and is used for guiding external gas or liquid into the cavity structure; the second through hole is arranged on the bottom plate and/or the cover plate and is used for guiding outside gas or liquid out of the cavity structure.

In this embodiment, set up two kinds of through-holes on bottom plate and/or apron, all switch on recess and the external world in the middle of the apron, then let two kinds of through-holes and external tube coupling, realize that a through-hole leads into the cavity structure that constitutes between bottom plate and the apron with liquid or gas to liquid or gas are derived the external world in with the cavity structure through another kind of through-hole, thereby take the heat in the cavity structure out of the external world, realize the device cooling that generates heat.

In a second aspect, the present application provides an electronic device comprising: a component and at least one heat sink as in each possible implementation of the first aspect, wherein a base plate in the heat sink is coupled to the component.

In a third aspect, the present application provides a vehicle, characterized by comprising: at least one electronic device as in the second aspect.

Drawings

The drawings that accompany the detailed description can be briefly described as follows.

Fig. 1 is a schematic cross-sectional view of an electronic device provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a cover plate according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of a fin provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of a fin provided in an embodiment of the present application;

fig. 5 is a schematic structural diagram of a fin provided in an embodiment of the present application;

fig. 6 is a schematic structural diagram of a fin provided in an embodiment of the present application;

FIG. 7 is a schematic view of a prior art fin configuration;

fig. 8 is a schematic structural diagram of a fin in the prior art.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the description of the present application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may include, for example, a fixed connection, a detachable connection, an interference connection, or an integral connection; the specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Fig. 1 is a schematic cross-sectional view of an electronic device provided in an embodiment of the present application. As shown in fig. 1, the electronic device includes a heat generating device 1 and a heat sink 2. Wherein, radiator 2 sets up on the outside surface (or the shell) of generating heat device 1, through constantly changing gas or liquid to radiator 1 is inside, realizes lowering the temperature to generating heat device 1.

In this application, the heating device 1 may be a basic component such as an IGBT and an IGCT, or may be an integrated device such as a Motor Controller Unit (MCU), a Central Processing Unit (CPU), a Printed Circuit Board (PCB), or even an electronic device such as a battery pack, a mobile phone, and a notebook computer, and this application is not limited herein.

The heat sink 2 designed by the present application includes a base plate 21, a cover plate 22, and fins 23. Wherein, the base plate 21 is disposed on the outer surface or the outer shell of the heat generating device 1, the cover plate 22 is coupled with the base plate 21 to form a cavity structure, and the fins 23 are disposed inside the cavity structure.

The base plate 21 may be a separate component or may be a part of the housing of the heat generating device 1. If the bottom plate 21 is an independent component, the bottom plate 21 can be disposed on the housing of the heat generating device 1 by welding, bonding, or the like, so that the bottom plate 21 and the heat generating device 1 are connected seamlessly, and the heat on the heat generating device 1 can be transferred to the bottom plate 21 well. Preferably, the material of the base plate 21 is generally the same as the material of the housing of the heat generating device 1, and may be aluminum, copper, or the like, so that the heat on the heat generating device 1 is better transferred to the base plate 21.

If the base plate 21 is a part of the housing of the heat generating device 1, the heat on the heat generating device 1 is better transferred than if the base plate 21 is a separate part, in this case the base plate 21. Moreover, a part of the outer shell of the heat generating device 1 is used as the bottom plate 21, so that the thickness of the whole device can be reduced, and the advantages of material saving, cost reduction and the like can be realized. Preferably, in the embodiment of the present application, a part of the housing of the heat generating device 1 is generally used as the bottom plate 21.

The base plate 21 may be a horizontal planar structure. Illustratively, when the base plate 21 is a part of the housing of the heat generating device 1, the horizontal surface of the heat generating device 1 is taken as the base plate 21, which prevents the base plate 21 from having uneven surface, and the fins 23 are subsequently coupled to the base plate 21, which may limit the shape of the fins 23 and the flow of gas affecting the flow of gas or liquid.

Of course, the bottom plate 21 may have other structures such as a groove shape, a convex shape, etc., and the present application is not limited thereto. Compared with a horizontal plane structure, the bottom plate 21 is in the shape of other structures, so that the heat dissipation area can be effectively increased, and the heat dissipation of the heating device 1 can be better realized.

The cover plate 22 is generally designed in a groove-shaped structure, and forms a cavity structure by being coupled with the base plate 21. Illustratively, as shown in fig. 2, the outer surface of the cover plate 22 has a rectangular structure, and the shape of the middle groove has a rectangular structure. If the base plate 21 is a horizontal planar structure, the shape of the central groove of the cover plate 22 is correlated with the shape of the fin 23, and the depth of the central groove is correlated with the thickness of the fin 23 so that the fin 23 can be disposed in the groove.

The external shape of the cover plate 22 is not limited to the rectangular structure shown in fig. 2, and may also be regular shapes such as square, trapezoid, etc., and may also be other irregular shapes, even associated with the shape of the heat generating device 1, so that the shape of the whole heat sink 2 is reasonably matched with that of the heat generating device 1, and the electronic device can be reasonably arranged inside the electronic device.

The internal shape of the cover plate 22 is not limited to the rectangular configuration shown in fig. 2, and may be a regular shape such as a square, a trapezoid, or the like, or may be other irregular shapes, particularly in association with the shape of the fins 23, so that the fins 23 may be disposed in the cavity structure formed between the cover plate 22 and the base plate 21. Preferably, the surfaces of the middle groove of the cover plate 22 are horizontal plane structures, so that the unevenness of the surfaces of the middle groove of the cover plate 22 is avoided, and the subsequent arrangement of the fins 23 in the cavity structure can limit the shapes of the fins 23 and influence the gas flow of gas or liquid.

The coupling between the cover plate 22 and the base plate 21 may be welding, adhesive bonding, screw fastening, mechanical clamping, etc., and the present application is not limited thereto. In the present application, the cavity structure formed between the cover plate 22 and the bottom plate 21 is a sealing structure, so as to avoid leakage from the coupling position between the two when gas or liquid flows into the cavity structure.

The material of the cover plate 22 is generally the same as that of the base plate 21, and may be aluminum, copper, etc., so that the cover plate 22 and the base plate are better connected when coupled by welding.

In the present application, a plurality of through holes 221 are provided on one side of the middle groove of the cover plate 22, and a plurality of through holes 222 are provided on the opposite other side of the middle groove. The through hole 221 and the through hole 222 communicate the middle groove of the cover plate 22 with the outside, and then the through hole 221 and the through hole 222 are connected with an external pipeline, so that liquid or gas is introduced into the cavity structure formed between the base plate 21 and the cover plate 22 through the through hole 221 (or the through hole 222), and the liquid or gas in the cavity structure is led out of the outside through the through hole 222 (or the through hole 221), thereby taking heat in the cavity structure out of the outside, and cooling the heating device 1 is realized.

The number of through

holes

221 and 222 is not limited herein, and may be any number; the shape of the through

holes

221 and 222 may be circular as shown in fig. 2, or may be any other shape such as oval, square, etc., and the present application is not limited thereto; the arrangement of the through

holes

221 and 222 is not limited herein, and the plurality of through holes may be arranged in a straight line as shown in fig. 2, or may be arranged in any shape such as a circle, a trapezoid, or a square.

As shown in fig. 2, the through-

holes

221 and 222 are provided on both side edges of the cover plate 22. However, the through

holes

221 and 222 may be formed on the bottom plate 21, and even at the coupling position between the bottom plate 21 and the cover plate 22, several through holes may be reserved at the coupling position as the through

holes

221 and 222, which is not limited herein.

As shown in fig. 3 and 4 in conjunction, the fin 23 includes a plurality of first portions 231, a plurality of second portions 232, and a plurality of connection portions 233. The plurality of first portions 231 and the plurality of second portions 232 are sequentially arranged at intervals, and the first portions 231 and the second portions 232 are connected through the connecting portions 233, so that the fin 23 is of an integral structure.

In the present application, the fin 23 is generally made of a metal plate, such as aluminum or copper, by a stamping and folding method, so that the first portion 231, the second portion 232 and the connecting portion 233 are of an integral structure. In the above process of describing the structure of the fin 23, terms such as "connecting" and "coupling" are used for convenience to describe the specific structure of the fin 23. Of course, the fin 23 may be formed by splicing a plurality of first portions 231, a plurality of second portions 232, and a plurality of connecting portions 233, which is not limited herein.

The first portion 231 is a metal strip having a rectangular shape, and the first portion 231 is in contact with the base plate 21 when the fins 23 are disposed in the cavity structure formed by the base plate 21 and the cover plate 22. Alternatively, the first portion 231 may be welded, adhered, or the like, so that the first portion 231 may be seamlessly connected to the base plate 21, and the heat generated by the heat generating device 1 is better transferred to the first portion 231.

The plurality of first portions 231 on the fin 23 are spaced from each other by a second portion 232, and the plurality of first portions 231 are distributed in a straight line, if the plurality of first portions 231 are not in a straight line, when the plurality of first portions 231 are coupled with the base plate 21, it may occur that a portion of the first portions 231 cannot be perfectly coupled with the base plate 21 without a seam, thereby reducing the effect of transferring heat.

The second portion 232 is also in the form of a rectangular metal strip, and when the fins 23 are disposed in the cavity structure formed by the base plate 21 and the cover plate 22, the second portion 232 contacts the base plate and the cover plate 22. Alternatively, the second portion 232 may be welded, adhered, etc. to allow the second portion 231 to be seamlessly connected with the cover plate 22, so that the heat on the fins 23 is better transferred to the cover plate 22 and then transferred to the outside through the cover plate 22.

The plurality of second portions 232 of the fin 23 are spaced from each other by a first portion 231, and the plurality of second portions 232 are distributed in a straight line, and if the plurality of second portions 232 are not in a straight line, when the plurality of second portions 232 are coupled with the cover plate 22, it may occur that a portion of the second portions 232 cannot be coupled with the cover plate 22 without a seam, thereby reducing the effect of transferring heat.

The side length of the first portion 231 is the same as that of the second portion 232, and the width of the first portion 231 may be the same as that of the second portion 232, or may be different. Here, the side length refers to a length perpendicular to a direction of a line (hereinafter, referred to as a "first direction") between two adjacent first portions 231 (or two adjacent second portions 232), and the width refers to a length in a direction of a line (hereinafter, referred to as a "second direction") between two adjacent first portions 231 (or two adjacent second portions 232).

Preferably, the width of the first portion 231 is longer than the width of the second portion 232. Since the heat in the heat generating device 1 is transferred to the first portion 231 through the bottom plate 21, and the heat can be dissipated by taking out the gas or liquid flowing into the cavity structure formed by the bottom plate 21 and the cover plate 22, and also transferred to the cover plate 22 through the second portion 232, the process of transferring the heat in the heat generating device 1 to the heat sink 2 is important. Therefore, when the fins 23 are designed, the width of the first portion 231 is larger than that of the second portion 232, so that more gas or liquid flows into the flow channel formed between the first portion 231 and the two connecting portions 233, and the heat on the heat generating device 1 can be better transferred to the gas or liquid in the flow channel, thereby enhancing the heat dissipation effect and better cooling the heat generating device 1.

The connecting portions 233 are also shaped as rectangular metal strips, and when the fins 23 are disposed in the cavity structure formed by the base plate 21 and the cover plate 22, the included angle between the connecting portions 233 and the upper surface of the base plate 21 or the cover plate 22 is greater than 0, that is, the included angle between each connecting portion 233 and the first portion 231 or the second portion 232 is present. Taking the angle between the connecting portion 223 and the first portion 231 (between 0 ° and 90 °) as an example, when the angle is larger, the distance between the plane in which the first portion 231 is located and the plane in which the second portion 232 is located is larger; as the angle is smaller, the distance between the plane of the first portion 231 and the plane of the second portion 232 is smaller.

Preferably, the angle between the connecting portion 223 and the first portion 231 is 90 °, and the angle between the connecting portion 223 and the second portion 232 is 90 °. The effect of transferring the heat in the heat generating device 1 to the heat sink 2 is related to the number of the first portions 231, that is, the greater the number of the first portions 231, the better the heat dissipation effect; the heat dissipation effect of the heat sink 2 is related to the number of the second portions 232 and the distance between the plane where the first portion 231 is located and the plane where the second portion 232 is located, that is, the larger the number of the second portions 232 is, the larger the distance between the plane where the first portion 231 is located and the plane where the second portion 232 is located is, the better the heat dissipation effect of the heat sink 2 is. Therefore, in the case that the cavity structure formed by the bottom plate 21 and the cover plate 22 has a certain volume, the connecting portion 233 is perpendicular to the first portion 231 and the second portion 232, respectively, so that the number of the first portion 231 and the second portion 232, and the distance between the plane of the first portion 231 and the plane of the second portion 232 can be maximized.

As shown in fig. 3 and 4, a plurality of bypass pieces 234 are also disposed on the first portion 231. The plurality of flow-around pieces 234 are arranged at equal intervals along the side length direction of the first part 231, and a heat dissipation meter can be enlarged in a flow channel formed between one first part 231 and two connecting parts 233, so that when gas or liquid flows through the flow channel, heat in the heat sink 2 can be better taken away.

It should be noted that, in the present application, the plurality of flow-around pieces 234 on the first part 231 are formed by punching the first part 231 and folding the punched material, and the folded material is the flow-around piece 234. Of course, the bypass flow plate 234 may be a separate component, and coupled to the first portion 231 by welding, bonding, or the like, which is not limited herein.

The height of the bypass flow tab 234 generally does not exceed the width of the connecting portion 233. Wherein the height refers to the length of the bypass flow tab 234 normal to the first portion 231. If the height of the bypass piece 234 is equal to or greater than the width of the connecting portion 233, the diameter of the flow passage is greatly reduced, thereby hindering the flow of gas or liquid. Preferably, the height of the bypass flow piece 234 is about half of the width of the connection portion 233.

The angle between the circumferential fin 234 and the connecting portion 233 on one side is generally between 10 and 80. If the included angle between the bypass piece 234 and the connecting part 233 at one side is too small, the bypass piece 234 is too close to the connecting part 233, so that a gap is easily formed at the side of the bypass piece 234 opposite to the flowing direction of the gas or liquid, and the gas or liquid cannot flow into the gap, so that the caliber of the flow channel is reduced, and the liquidity of the gas or liquid is influenced; if the angle between the bypass flow piece 234 and the connecting portion 233 on one side is too large, the bypass flow piece 234 is perpendicular to the flowing direction of the gas or liquid, thereby directly blocking the flowing of the gas or liquid and influencing the flowing property of the gas or liquid.

The side length of the bypass flow tab 234 generally does not exceed the width of the first portion 231. Here, the side length refers to a length of the bypass piece 234 in a direction along a line connecting the two connection portions 233. If the side length of the bypass piece 234 is equal to or greater than the width of the first portion 231, the aperture of the flow channel is also greatly reduced, thereby hindering the gas or liquid to flow. Preferably, the side length of the bypass flow sheet 234 is about two-thirds of the width of the first portion 231.

The shape of the bypass flow tab 234 may be two small rectangles as shown in fig. 4. Wherein, two little rectangles set up along a straight line direction, and have the gap between two little rectangles, when letting gas or liquid pass through the runner, the air current direction is more smooth and easy, guarantees the circulation. The shape of the bypass flow sheet 234 may be a small rectangle as shown in fig. 5, a triangle as shown in fig. 6, or other shapes, which is not limited herein.

For the plurality of the flow guiding sheets 234 on the first portion 231, each flow guiding sheet 234 may be disposed as shown in fig. 4, that is, the material at each perforation on the first portion 231 is folded at the same position, so that the included angle between each folded material and the same connecting portion 233 is the same, and the distance between each folded material and the same connecting portion 233 is the same; as shown in fig. 5, that is, the materials at two adjacent perforations on the first part 231, one is turned over near the left connecting part 233, and the other is turned over near the right connecting part 233, so that the turned materials are parallel to each other, and one is near the left connecting part 233 and the other is near the right connecting part 233, the gas or liquid flow direction is changed by arranging the bypass pieces 234 on the first part 231 in an alternating manner, and each bypass piece 234 is parallel to each other, so as to increase the gas or liquid flow, and simultaneously, the gas or liquid flow direction is not disturbed, so that the gas or liquid flow is not influenced, and the heat exchange efficiency is improved; and other arrangements, as the present application is not limited thereto.

In the embodiment of the application, the radiator of design, by the bottom plate, apron and fin constitute, through with fin fold forming, form a plurality of runners, and adjacent runner width is inequality, the first part that the broad runner corresponds is connected on the bottom plate, the second part that the narrower runner corresponds is connected on the apron, and set up a plurality of sheets that flow around on the first part, then set up this fin in the cavity structure that constitutes between bottom plate and apron, there is the inflow outflow of gas or liquid in this cavity structure, have more gas or liquid to flow into in the runner that first part and two connecting portions constitute, and through the sheet that flows around in this runner, increase gas or liquid and flow around, thereby promote the radiating effect of radiator greatly.

When the application detects the heat dissipation effect of the radiator, the radiator designed in the patent (US2002/0074105A1) and the radiator designed in the patent (CN101725438A) are taken as reference. In the heat sink of the patent (US2002/0074105a1), as shown in fig. 7, compared with the heat sink of the present application, a plurality of fins are provided on each assembly 111a of fins (corresponding to the present application, i.e., a plurality of fins are also provided on the second portion), and the widths of all the assemblies 111a are the same (corresponding to the present application, i.e., the widths of the first portion and the second portion are the same). Although the bypass flow fins can increase the bypass flow of gas or liquid, the bypass flow fins hinder the circulation of the gas or liquid, so that the patent also arranges a plurality of bypass flow fins 111c on the upper assembly 111a of the fin, which affects the circulation of the whole radiator and causes the heat radiation effect to be inferior to that of the present application; moreover, the width of all the modules 111a is the same, so that the liquid flowing into the flow channel formed by the lower module 111a and the adjacent module 111b is less than that of the corresponding flow channel in the heat sink of the present application, and therefore, the heat dissipation effect is inferior to that of the present application.

As shown in fig. 8, in the heat sink designed in the patent (CN101725438A), compared with the heat sink designed in the present application, the flow channel formed by the first portion and the two connecting portions on the fin and the flow channel formed by the second portion and the two connecting portions on the fin are not linear, but are zigzag, a plurality of flow-around pieces are also arranged on the second portion of the fin, and the widths of the first portion and the second portion are the same. The above modules 122 are also provided with the bypass pieces 124a, and the widths of all the modules 122 are the same, which has the same defects as the above patents, and the detailed description of the present application is omitted. In this patent, the assembly 122 is designed to have a zigzag shape, which can increase the air or liquid circulation, but it also affects the heat dissipation effect of the heat sink because it hinders the air or liquid circulation.

The experimental effect shows that, under the identical condition, the radiator of this application design, two above-mentioned current radiators of comparison generate heat the device temperature and have reduced about 15% more, from this it can be seen that the radiating effect of the radiator of this application design is more obvious.

Embodiments of the present application also provide a vehicle including at least one electronic device, which may be the electronic device described in fig. 1-6 and corresponding description above. Because the vehicle includes the electronic device, the vehicle has all or at least some of the advantages of the electronic device.

Finally, the description is as follows: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A heat sink, comprising:

a bottom plate, a plurality of first connecting plates,

the cover plate is coupled with the bottom plate to form a cavity structure;

the fin is arranged in the cavity structure and comprises at least one first part, at least one second part and at least one connecting part, and the at least one first part and the at least one second part are sequentially arranged at intervals and are connected through the at least one connecting part; wherein a first surface of the at least one first portion is coupled with a first surface of the base plate constituting the cavity structure, and the at least one second portion is coupled with a second surface of the cover plate constituting the cavity structure;

the first part comprises at least one bypass sheet, the at least one bypass sheet is arranged on the second surface of the first part along a first direction, the first direction is a direction perpendicular to a connecting line between two adjacent first parts, and the first surface of the first part and the second surface of the first part are two opposite surfaces on the first part.

2. The heat sink as claimed in claim 1, wherein the width of the first portion is larger than the width of the second portion, the width is a length in a second direction, and the second direction is a direction of a line connecting two adjacent first portions or two adjacent second portions.

3. A heat sink according to claim 1 or 2, wherein said at least one first portion is in a plane, said at least one second portion is in a plane, and said at least one first portion is parallel to said at least one second portion.

4. A heat sink according to any one of claims 1-3, wherein the at least one bypass fin is arranged on the first portion at equal intervals in the first direction.

5. A heat sink according to any one of claims 1-4, wherein the angle between the fin and the connection portion is between 10 ° and 80 °.

6. The heat sink according to any one of claims 1-5, wherein at least one bypass fin on each first portion,

one of two adjacent flow sheets is close to the connecting part on one side of the first part; and the other bypass sheet of the two adjacent bypass sheets is close to the connecting part at the other side of the first part.

7. The heat sink as recited in any one of claims 1 to 6, wherein the shape of the bypass fin is one of rectangular, square, trapezoidal and triangular.

8. The heat sink as claimed in any one of claims 1 to 7, further comprising: a first through-hole and a second through-hole,

the first through hole is arranged on the bottom plate and/or the cover plate and is used for guiding outside gas or liquid into the cavity structure;

the second through hole is arranged on the bottom plate and/or the cover plate and is used for guiding outside gas or liquid out of the cavity structure.

9. An electronic device, comprising: a component and at least one heat sink as claimed in any one of claims 1 to 8, wherein a base plate in the heat sink is coupled to the component.

10. A vehicle, characterized by comprising: at least one electronic device as claimed in claim 9.