CN215301078U - PCB (printed circuit board) copper deposition device with ultrasonic wave - Google Patents

Abstract

The utility model provides a PCB copper deposition device with ultrasonic wave, which comprises a main groove, wherein two ends of the main groove are respectively marked as a board inlet end and a board outlet end, and a PCB moves from the board inlet end to the board outlet end horizontally; the moving direction of the PCB in the main groove is divided into a non-ultrasonic section and an ultrasonic section, an ultrasonic generator is arranged in the ultrasonic section, and the length of the ultrasonic section accounts for 1/3-2/3 of the total length of the main groove. The method can improve the hole filling capacity of the solution, improve the crystallization form of a copper deposition layer, improve the reliability of a copper deposition layer, avoid the separation of a catalyst layer and the reduction of the stability of the bath solution, and remarkably improve the processing capacity of small holes with high thickness-diameter ratio and micro blind holes.

Description

PCB (printed circuit board) copper deposition device with ultrasonic wave

Technical Field

The utility model belongs to the technical field of the heavy copper of PCB, a take ultrasonic PCB to sink copper device is related to.

Background

Through holes and blind holes on a PCB (printed circuit board) can be communicated with the circuit of the PCB and electronic components can be assembled after metallization, the hole metallization (copper deposition) refers to a process that each layer of printed conductor is plated with a layer of conductive metal on an insulated hole wall in a hole by using a chemical plating and electroplating method so as to ensure that the conductive metal is reliably communicated with each other, and the principle of the copper deposition process is as follows: a layer of copper of 0.3-1.0 um is added in the hole by utilizing the chemical reaction principle, so that the original non-conductive hole has conductivity, and the subsequent plate surface electroplating and pattern electroplating can be smoothly carried out, thereby completing the electrical intercommunication among the PCB circuits. The copper deposition process is the core of the PCB manufacturing process, so the copper deposition process has strict requirements, good mechanical toughness and electrical conductivity are required, and the copper layer is uniform and complete.

The whole copper deposition process mainly comprises 3 working procedures: removing drilling dirt, activating and depositing copper. The device condition of each process has obvious influence on the PCB processing effect and the consumption of the liquid medicine. For the PCB copper deposition device, the PCB copper deposition device has the function of containing copper deposition liquid, and the copper deposition liquid at each position in the groove has good exchange function through various modes, so that the aim of uniformly and stably dissolving the liquid is fulfilled, high-quality chemical copper plating of the PCB is guaranteed to be completed in the PCB copper deposition device, the service life of the chemical copper plating liquid is prolonged as far as possible, and the production cost is reduced.

The chemical copper deposition reaction is carried out in a chemical copper deposition solution, in the production process, copper powder, copper residues, powder scraps brought by a printed circuit board substrate and other impurities inevitably appear, the impurities not only accelerate the aging of the chemical copper deposition solution, but also easily cause the adverse problems of copper particle deposition on the surface of the chemical copper deposition solution, via hole blockage and the like, so that the surface and the holes of the printed circuit board have flaws, and the quality of a metalized coating on the surface of the printed circuit board is influenced.

CN107151794A discloses a PCB production technology is with heavy copper groove, this heavy copper groove comprises main tank and auxiliary tank, and liquid medicine can directly overflow to auxiliary tank from the main tank, be equipped with temperature-sensing ware in the main tank, be equipped with cooling device, heating device and liquid medicine concentration probe in the auxiliary tank.

CN207201097U discloses a PCB hole metallization device, which comprises an open water tank, wherein the open water tank is provided with a main tank body and an auxiliary tank body, a partition plate is arranged between the main tank body and the auxiliary tank body, and the upper end part of the partition plate is provided with a liquid through port; a main tank vent pipe, a main tank cooling pipe and a liquid circulating pipe are arranged in the main tank body; a filter screen is erected in the auxiliary tank body and is positioned below the liquid through port; and a liquid outlet is formed in the bottom of the auxiliary groove body and communicated with the liquid circulation pipe through an external pipeline.

CN208346300U discloses a PCB circuit board copper deposition device, comprising a vibrator, a copper deposition reaction box, a PCB board containing cylinder, wherein the copper deposition reaction box is arranged above the vibrator, the copper deposition reaction box comprises a box cover, a liquid discharge port and a liquid inlet, one end of the box cover is connected with the copper deposition reaction box through a spring shaft, the PCB board containing cylinder is arranged in the copper deposition reaction box, the PCB board containing cylinder comprises a main shaft and grid plates in the middle, a plurality of grid plates are uniformly arranged on the periphery of the main shaft in a radial shape, a layer of protective net cylinder is additionally arranged outside the grid plates, the protective net cylinder also comprises a bottom cover as the cylinder body of the PCB board containing cylinder, the main shaft penetrates through two ends of the PCB board containing cylinder and is fixed in the copper deposition reaction box, the liquid discharge port is communicated with a primary filter cylinder, a filter gauze is arranged at the opening of the primary filter cylinder, the opening of the side surface of the primary filter cylinder is connected with the water suction end of a suction pump, the water outlet end of the suction pump is communicated with a secondary filter cylinder, a fine filter screen is arranged in the secondary filter barrel, and an opening at the top of the secondary filter barrel is communicated with a liquid inlet of the copper deposition reaction box through a water pipe.

Traditional level sinks the copper groove and includes main tank and vice groove, and the two is installed the multiunit water sword through a plurality of pumps and multiunit infusion pipeline intercommunication on the infusion pipeline, and the water sword sets up in the main tank, plays the effect that improves solution and irritates the hole ability. With the requirement of highly dense interconnection design of circuit boards, the PCB comprises more and more small holes with high thickness-to-diameter ratio and micro blind holes, and the traditional copper deposition groove design cannot meet the requirement of the holes.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art exists, the utility model aims to provide a take ultrasonic PCB to sink copper device can improve the filling hole ability of solution, improves the crystallization form on copper sedimentary deposit, improves the reliability on heavy copper layer, can not lead to droing and the tank liquor stability of catalysis layer again, is showing the throughput who promotes height thickness to diameter ratio aperture and blind hole a little.

To achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a take ultrasonic PCB to sink copper installation, PCB sink copper installation include the master groove, the master groove both ends mark respectively into board end and play board end, the PCB board is held by the income board and is removed to a board end.

The main slot is divided into a non-ultrasonic section and an ultrasonic section along the moving direction of the PCB, an ultrasonic generator is arranged in the ultrasonic section, and the length of the ultrasonic section accounts for 1/3-2/3 of the total length of the main slot, such as 0.34, 0.36, 0.38, 0.4, 0.42, 0.44, 0.46, 0.48, 0.5, 0.52, 0.54, 0.56, 0.58, 0.6, 0.62, 0.64 or 0.66, but not limited to the values listed, and other values not listed in the range of the values are also applicable.

When ultrasonic wave acts on the solution, the solution has better dispersion capacity and hole filling capacity. However, the conventional horizontal copper deposition main tank does not adopt an ultrasonic device, and the main reason for analysis is that ultrasonic has cleaning capability, and is easy to remove foreign matters attached to the surface of an object, and when a PCB enters the main tank from a previous process, a catalytic seed layer is already deposited on the hole wall, and the catalytic seed layer is usually palladium atoms. If just carry out ultrasonic treatment to it when PCB just gets into the master tank, can lead to the catalysis seed layer to drop from PCB board surface, lead to catalytic effect impaired, simultaneously, the catalytic material who drops scatters in heavy copper tank liquor, can arouse the self-decomposition of tank liquor rapidly, lead to the tank liquor life-span to shorten, the copper particle that produces from the decomposition also can adhere in PCB board surface and downthehole, increase PCB quality abnormal risk, consequently also abandoned adopting ultrasonic device. And the utility model discloses when PCB conveys back end in the main tank, carry out ultrasonic treatment again, can show the physical properties who improves the filling hole ability and the copper sedimentary deposit of heavy copper liquid medicine, improve the reliability of the PCB board after heavy copper, can not lead to the catalysis seed layer to drop and influence catalytic performance again simultaneously, can not shorten tank liquid life-span, can show the throughput who promotes height thickness to radius ratio aperture and blind hole.

As a preferred embodiment of the present invention, a buffer area with a length of 0-30 cm, such as 5cm, 10cm, 15cm, 20cm, 25cm or 30cm, is reserved between the end of the ultrasonic section close to the plate outlet end and the plate outlet end, but the ultrasonic section is not limited to the listed values, and other values not listed in the numerical range are also applicable.

As an optimized technical scheme of the utility model, the master tank in be provided with horizontal conveyer, horizontal conveyer be used for with the PCB board by income board end conveying to a board end.

As an optimized technical scheme of the utility model, horizontal conveyer include the upper and lower two rows of rollers that set up side by side along the moving direction of PCB board.

As an optimized technical scheme of the utility model, the main tank in be provided with temperature sensor.

As an optimized technical scheme of the utility model, PCB heavy copper installation still include with the vice groove of main trough intercommunication, the heavy copper liquid in the main trough flows into vice groove.

As an optimized technical proposal, the connecting pipeline of the main tank and the auxiliary tank is provided with a filter pump.

As an optimized technical scheme of the utility model, the leakage fluid dram of auxiliary tank is taken out to the main tank through the circulation pumping and is realized recycling.

As an optimized technical scheme of the utility model, the auxiliary tank in be provided with concentration detector, concentration detector be used for detecting the concentration of heavy copper liquid.

Exemplarily, the utility model provides a PCB heavy copper installation's application method as follows:

the PCB conveyed from the upstream process enters the main tank from the board inlet end, the main tank is filled with copper deposition liquid and is carried under the action of the horizontal conveying deviceThe movable PCB moves towards the board outlet end, chemical copper is deposited in the PCB hole and the board surface in the moving process, and the main reaction is Cu²⁺+2HCHO+4OH^-→Cu↓+2HCOO^-+2H₂O+H₂×) @. When the PCB moves to the ultrasonic section, the ultrasonic generator sends ultrasonic waves to the copper precipitation liquid, the hole filling capacity of the copper precipitation liquid is enhanced, and the PCB is taken out from the board outlet end and sent to a downstream process.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses set up supersonic generator in the well back end of owner's groove, can show the physical properties who improves the irritate hole ability and the copper sedimentary deposit of heavy copper liquid medicine, improve the reliability of the PCB board behind the heavy copper, can not lead to the catalysis seed layer to drop and influence the catalytic performance again simultaneously, can not shorten tank liquor life-span, can show the throughput who promotes high thickness to diameter ratio aperture and micro blind hole.

Drawings

Fig. 1 is a schematic structural view of a main trough according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a PCB copper deposition device according to an embodiment of the present invention.

Wherein, 1-main groove; 2-a non-ultrasound segment; 3-an ultrasonic section; 4-a buffer region; 5-ultrasonic generator; 6-a filter pump; 7-a temperature sensor; 8-auxiliary groove; 9-concentration detector.

Detailed Description

It is to be understood that in the description of the present invention, the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for the purpose of convenience and simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

It should be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected" and "connected" in the description of the present invention are to be construed broadly, and may for example be fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

In a specific embodiment, the utility model provides a take ultrasonic PCB heavy copper installation, PCB heavy copper installation as shown in fig. 2, including main groove 1, as shown in fig. 1, 1 both ends in main groove are marked as into board end and play board end respectively, and the PCB board is held by income board and is removed to a board and hold. The main tank 1 is internally divided into a non-ultrasonic section 2 and an ultrasonic section 3 along the moving direction of the PCB, an ultrasonic generator 5 is arranged in the ultrasonic section 3, the length of the ultrasonic section 3 accounts for 1/3-2/3 of the total length of the main tank 1, and a buffer area 4 with the length of 0-30 cm is reserved between one end of the ultrasonic section 3 close to the board outlet end and the board outlet end.

The horizontal conveying device is arranged in the main groove 1 and used for conveying the PCB to the board outlet end from the board inlet end, the horizontal conveying device comprises an upper row of rolling shafts and a lower row of rolling shafts which are arranged side by side along the moving direction of the PCB, and a temperature sensor 7 is arranged in the main groove 1.

The PCB copper deposition device further comprises an auxiliary groove 8 (shown in figure 2) communicated with the main groove 1, copper deposition liquid in the main groove 1 flows into the auxiliary groove 8, a filter pump 6 is arranged on a connecting pipeline between the main groove 1 and the auxiliary groove 8, a concentration detector 9 is arranged in the auxiliary groove 8, and the concentration detector 9 is used for detecting the concentration of the copper deposition liquid.

The outlet of the auxiliary tank 8 is also communicated with the main tank 1, so that the copper precipitation liquid in the auxiliary tank 8 returns to the main tank 1 again after being filtered, and cyclic utilization is realized. As shown in FIG. 2, the liquid outlet of the sub tank 8 is pumped to the main tank 1 by a circulation pump for circulation.

In another embodiment, the utility model provides a use method of the heavy copper device of above-mentioned PCB, specifically includes:

the PCB that is conveyed by the upstream process enters the main tank 1 from the board inlet end, the main tank 1 is filled with copper deposition liquid, the PCB is driven to move towards the board outlet end under the action of the horizontal conveying device, chemical copper is deposited in the PCB hole and the board surface in the moving process, and the main reaction is Cu²⁺+2HCHO+4OH^-→Cu↓+2HCOO^-+2H₂O+H₂×) @. When the PCB moves to the ultrasonic section 3, the ultrasonic generator 5 sends ultrasonic waves to the copper precipitation liquid to enhance the hole filling capacity of the copper precipitation liquid, and the PCB is taken out from the board outlet end and sent to a downstream process.

The applicant states that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present invention are within the protection scope and the disclosure scope of the present invention.

Claims (9)

1. The PCB copper deposition device with the ultrasonic waves is characterized by comprising a main groove, wherein two ends of the main groove are respectively marked as a board inlet end and a board outlet end, and a PCB moves from the board inlet end to the board outlet end;

the moving direction of the PCB in the main groove is divided into a non-ultrasonic section and an ultrasonic section, an ultrasonic generator is arranged in the ultrasonic section, and the length of the ultrasonic section accounts for 1/3-2/3 of the total length of the main groove.

2. The PCB copper deposition device of claim 1, wherein a buffer area with a length of 0-30 cm is reserved between one end of the ultrasonic section close to the board outlet end and the board outlet end.

3. The PCB copper deposition device of claim 1, wherein a horizontal transfer device is arranged in the main slot, and the horizontal transfer device is used for transferring the PCB from the board inlet end to the board outlet end.

4. The PCB copper deposition apparatus of claim 3, wherein the horizontal transfer device comprises two rows of rollers arranged side by side along the moving direction of the PCB.

5. The PCB copper deposition device of claim 1, wherein a temperature sensor is arranged in the main groove.

6. The PCB copper deposition device of claim 1, wherein the PCB copper deposition device further comprises a secondary tank communicated with the main tank, and the copper deposition liquid in the main tank flows into the secondary tank.

7. The PCB copper deposition device of claim 6, wherein a filter pump is arranged on a connection pipeline between the main tank and the auxiliary tank.

8. The PCB copper deposition device of claim 6, wherein the liquid outlet of the secondary tank is pumped to the main tank by a circulating pump for recycling.

9. The PCB copper deposition device of claim 6, wherein a concentration detector is arranged in the auxiliary tank and used for detecting the concentration of the copper deposition solution.

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