CN203992821U - Flexible PCB stacking-type laser soldering device - Google Patents
Flexible PCB stacking-type laser soldering device Download PDFInfo
- Publication number
- CN203992821U CN203992821U CN201420485754.6U CN201420485754U CN203992821U CN 203992821 U CN203992821 U CN 203992821U CN 201420485754 U CN201420485754 U CN 201420485754U CN 203992821 U CN203992821 U CN 203992821U
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- China
- Prior art keywords
- flexible pcb
- laser instrument
- battle array
- soldering device
- mask plate
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- Withdrawn - After Issue
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 230000033001 locomotion Effects 0.000 claims abstract description 10
- 230000000630 rising effect Effects 0.000 claims abstract description 5
- 239000013078 crystal Substances 0.000 claims description 32
- 230000003028 elevating effect Effects 0.000 claims description 24
- 239000000498 cooling water Substances 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011889 copper foil Substances 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 238000009736 wetting Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 11
- 230000005669 field effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 230000008595 infiltration Effects 0.000 description 4
- 238000001764 infiltration Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model provides a kind of flexible PCB stacking-type laser soldering device, comprise the first driving mechanism that vertically a folded gust laser instrument, a mask plate that is positioned at vertical folded gust of laser instrument below, the vertical folded gust laser plane two dimensional motion of driving and vertical direction move up and down and the second driving mechanism that drives mask plate rising and descending motion, mask plate is provided with the fluting of welding region on corresponding flexible PCB, and the welding region that the laser that vertical folded battle array laser instrument sends passes on described fluting irradiation flexible PCB welds.The utility model adopts vertical folded battle array laser instrument to carry out the welding of flexible PCB, can within the extremely short time, complete region-wide welding simultaneously of moment, improves welding work efficiency; And the utility model is minimum to the heat affected area of acceptor, to the substrate of flexible PCB with cover Copper Foil and can accomplish harmlessly, accelerated the wetting velocity of scolding tin simultaneously, can improve welding quality.
Description
Technical field
The utility model relates to electronic circuit board welding technology field, specifically a kind of flexible PCB stacking-type laser soldering device.
Background technology
Flexible PCB is attached to Copper Foil in flexible plastic substrates and forms, in order to possess certain flexible nature, plastic base, Copper Foil are generally all done very thinly, are mainly used in signal transmission, mobile phone and other digital terminal thereof (such as landline telephone, MP4, calculator) of printhead in printer, all kinds of household electrical appliances (such as washing machine, micro-wave oven, refrigerator, smoke exhaust ventilator, intelligent electric cooker, intelligent sweeping), all kinds of Medical Instruments, Domestic use physiotherapeutic equipment, the mainboard of all types of industries control flow (paper money counter, door access machine) and the signal transmission of display screen etc.
Welding for flexible PCB, traditional welding method is being used manual soldering always, or the mode of automatic soldering iron soldering (be also referred to as hot bar welding) completes, but, along with scientific and technical progress, the miniaturization increasingly of each electric appliances, microminiaturized, as mobile phone, and other digital terminal etc., therefore, wire inner used, its diameter must tend to tinyization, miniaturization, use Hot bar to weld more and more difficult flexible PCB, simultaneously, also because the heat affected area of Hot bar is excessive, the substrate that will cause flexible PCB is overheated and damage, in addition, the pressure that Hot bar produces, also will be to wire, flexible circuit board substrate, and the Copper Foil on flexible base, board etc. causes mechanical failure, therefore, Hot bar can not do meticulousr welding substantially.
In addition, the principle of Hot bar welding, with be heat-conduction principle, that is: the high temperature of Hot bar solder horn must pass through the welded object of close contact, and high temperature is heated to welded object in heat conducting mode, due to heat conducting principle, it is intermolecular warm-up movement collision, and heat conducting formation also must have a necessary condition, that is exactly, there is thermograde, that is: the temperature of Hot bar solder horn is necessarily higher than welded piece, and be far above welded piece, could improve speed of welding like this, so, on welded piece, can form larger heat affected area, this will be destructive.
Utility model content
The utility model provide a kind of contactless, heat affected area is little, the flexible PCB stacking-type laser soldering device of gross area field-effect, harmless Welding Problems that can quick and high-quality solution flexible PCB.
A kind of flexible PCB stacking-type laser soldering device, comprise the first driving mechanism that vertically a folded gust laser instrument, a mask plate that is positioned at vertical folded gust of laser instrument below, the vertical folded gust laser plane two dimensional motion of driving and vertical direction move up and down and the second driving mechanism that drives mask plate rising and descending motion, mask plate is provided with the fluting of welding region on corresponding flexible PCB, and the welding region that the laser that vertical folded battle array laser instrument sends passes on described fluting irradiation flexible PCB welds.
Further, described the first driving mechanism comprises column and is slidably mounted on the longitudinal sliding block on column, the both sides of longitudinal sliding block are laterally provided with respectively a sideskid, the front end of each sideskid is provided with the two dimension of the folded battle array of fixed vertical laser instrument and adjusts mirror holder, and described two dimension is adjusted mirror holder and is used for driving vertical folded battle array laser instrument 1 to do two dimension adjustment.
Further, sideskid front end is fixed with half-nut slide block, and two dimension is adjusted mirror holder and is fixed on half-nut slide block, in the cavity between half-nut slide block and sideskid, is inlaid with micrometer adjusting screw, and micrometer adjusting screw is for the fine setting of vertical folded battle array laser instrument Z-direction.
Further, in the moving plate of mirror holder of two dimension adjustment mirror holder, laser instrument water-cooled block is installed, vertical folded battle array laser instrument is arranged on the front end of laser instrument water-cooled block, is provided with the turnover water channel that Cooling Water passes through in laser instrument water-cooled block.
Further, laser instrument water-cooled block is arranged on two dimension with connecting thread and adjusts in the moving plate of mirror holder of mirror holder, and connecting thread is used for realizing the angular deflection of vertical folded battle array laser instrument, and by holding screw fixing and locking.
Further, described the second driving mechanism comprises fixedly cantilever, the rising of driving cantilever of mask plate and the cam disc declining.
Further, mask plate the leaded light crystal fitting tightly is set below, the both sides of leaded light crystal are provided with the front end below that is arranged on from bottom to up cantilever for clamping the crystal clamping plate of leaded light crystal, add two crystal clamping plate holding leaded light crystal and mask plate.
Further, one end of cantilever is connected with elevating bracket, is provided with the cam that is positioned at elevating bracket below in cam disc, and cam is connected with the lifting arm of elevating bracket tail end, and rotating cam can drive elevating bracket to move up and down and then drive together lifting of cantilever.
Further, elevating bracket slides and is located at longitudinal rail, and moving up and down of elevating bracket is limited to longitudinal rail.
The beneficial effects of the utility model:
1, the utility model adopts vertical folded battle array laser instrument to carry out the welding of flexible PCB, what apply is the principle of field-effect radiation heating, not hot bar heat conduction heating used, it forms moment field-effect in specific region, within the extremely short time, complete region-wide welding simultaneously of moment, the latter is the several times of the former efficiency, has greatly improved work efficiency.
2, radiation heating can add the specific region (welding region of flexible PCB) of heat acceptor fast, and therefore, the heat affected area of acceptor is minimum, and transient heating fast, to flexible PCB, no matter is substrate, still covers Copper Foil and can accomplish harmless.
3, the utility model adopts field-effect radiation mechanism, can allow rapidly the gross area of acceptor specific region be warmed up to rapidly same temperature, the thermograde forming in the time of can not producing the heating of Hot bar conduction-type, therefore, in mechanism, do not have thermal part, can not cause unnecessary cause thermal damage to flexible PCB, and add to the difficulties can not to infiltration link yet.
4, being on the scene effect radiation mechanism is in brazing process, because can allow the gross area of acceptor specific region be warmed up to rapidly same temperature, thereby can well guarantee that scolding tin is from thawing-infiltration-curing process, particularly accelerated the wetting velocity of scolding tin, abundant and good infiltration is to guarantee good welds necessary condition, therefore, the mode with field-effect radiation heating, can improve welding quality.
Accompanying drawing explanation
Fig. 1 is the principle schematic of the utility model flexible PCB stacking-type laser soldering device;
Fig. 2 is the side sectional view of the utility model flexible PCB stacking-type laser soldering device;
Fig. 3 is A-A view in Fig. 2;
Fig. 4 is B-B view in Fig. 2;
Fig. 5 is the top view of the utility model flexible PCB stacking-type laser soldering device.
In figure: 1-vertical folded battle array laser instrument, 2-mask plate, 3-flexible PCB welding assembly, 3-1-display screen, 3-2-flexible PCB, 4-1-laser instrument water-cooled block, 4-1a-turnover water channel, 4-2-two dimension is adjusted mirror holder, 4-2a-mirror holder moves plate, 4-2b-connecting thread, 4-2c-holding screw, 4-3-half-nut slide block, 4-4-micrometer adjusting screw, 4-5-regulator bolts, 4-6-spring guide, 4-7-sideskid, 4-8-longitudinal rail, 4-9-longitudinal sliding block, 4-10-cam disc, 4-10a-cam, 4-10b-control crank, 4-11-column, 4-12-spring, 4-13-elevating bracket, 4-13a-lifting arm, 4-14-cantilever, 4-15-cooling water channel, 4-16-leaded light crystal, 4-17-crystal clamping plate, 5-fixture.
The specific embodiment
Below in conjunction with the accompanying drawing in the utility model, the technical scheme in the utility model is clearly and completely described.
Please refer to Fig. 1, the utility model flexible PCB stacking-type method for laser welding is to adopt vertical folded battle array laser instrument 1 in conjunction with the use of mask plate, flexible PCB to be welded.
Described vertical folded battle array laser instrument 1 (also referred to as stacking-type laser instrument) can be regarded as by the laser matrix forming without several laser beams, this is the technical progress of Development of Laser Technology to today, the laser that it sends is no longer a fine laser beam, but the laser energy spot of whole rectangular area, this is the radiant heat field-effect of whole rectangular area by what bring acceptor.
While utilizing 1 pair of flexible PCB of vertical folded battle array laser instrument to carry out soldering operation, general all huge thermal fields of have more than is needed whole rectangle, therefore, the utility model is provided with a mask plate 2 between vertical folded battle array laser instrument 1 and flexible PCB 3, mask plate 2 is provided with the fluting that 3-2 on corresponding flexible PCB needs territory, heated weld zone, and on mask plate 2, do not have slotted region, will cover the heating of unnecessary heat energy to the non-welding region of flexible PCB 3-2.
What the utility model adopted is the principle of field-effect radiation heating, not hot bar heat conduction heating used, therefore, welding to flexible PCB, can on acceptor, not produce the gradient of temperature, can be only in the gross area of specific region, to produce the same temperature with field-effect, this by well guarantee scolder melting-infiltrate-curing process in, there is good infiltration link, thereby improve welding quality.
Infiltration in brazing process is commonly called as climbs tin, the scolder namely melting can spread out fast and launch, pad (the Copper Foil that needs tin sticky that is covered with whole needs welding, the surface of copper coin), heat conduction soldering, existence due to thermograde, the wetting property of scolder is must be affected, in order to reduce the impact on soldering of thermograde, generally, hot bar adopts the method that improves temperature to improve the speed that infiltrates link more, this is by the excessive temperature that the causes hot bar solder horn non-welding region of flexible PCB of can burning, cause flexible PCB to damage, reduce the temperature of hot bar solder horn, can affect welding quality, this need to find an equalization point.And the utility model stack laser weld, what adopt is the radiation heating with field-effect, can specific region gross area be heated to same temperature in moment, never has the generation of thermograde.
The utility model has utilized the performance of stacking-type laser instrument, applied in the meticulous welding of flexible PCB, this will change the general modfel of meticulous welding, that is: change hot conduction-type welding into radiant heating type welding, the latter is by the several times that are the former efficiency, and welding quality has good guarantee.
Please also refer to Fig. 2, the utility model flexible PCB stacking-type laser soldering device comprises a vertical folded battle array laser instrument 1, be positioned at the mask plate 2 of vertical folded battle array laser instrument 1 below, drive the first driving mechanism that vertical folded battle array laser instrument 1 plane two dimensional motion and vertical direction move up and down and the second driving mechanism that drives mask plate 2 risings and descending motion.
Described mask plate 2 is one and is with slotted sheet metal, the leaded light crystal 4-16 (as shown in Figure 4) that setting fits tightly below of mask plate 2, the effect of leaded light crystal 4-16 has two, one, allow laser energy penetrate down irradiation acceptor, its two, can suppress the non-welding portion of welding portion, guarantee that the position of welding is reliable.The both sides of leaded light crystal 4-16 are provided with for clamping leaded light crystal 4-16 crystal clamping plate 4-17.
Incorporated by reference to reference to figure 3, described the first driving mechanism comprises column 4-11 and is slidably mounted on the longitudinal sliding block 4-9 on column 4-11, the both sides of longitudinal sliding block 4-9 are laterally provided with respectively a sideskid 4-7, the front end of each sideskid 4-7 is provided with the two dimension of the folded battle array of fixed vertical laser instrument 1 and adjusts mirror holder 4-2, described two dimension is adjusted mirror holder 4-2 and is used for driving a vertically folded battle array laser instrument 1 to do two dimension adjustment, and assurance laser energy is accurately aimed at welding region.
Because longitudinal sliding block 4-9 is fixed on column 4-11, in can be on a large scale, carry out vertical folded battle array laser instrument 1Z to the coarse adjustment of (namely above-below direction), coarse adjustment is herein in order to adapt to the reserved Z-direction adjustment of differing heights of different workpieces (comprising corresponding fixture).Preferably, sideskid 4-7 front end is fixed with half-nut slide block 4-3, two dimension is adjusted mirror holder 4-2 and is fixed on half-nut slide block 4-3, in cavity between half-nut slide block 4-3 and sideskid 4-7, be inlaid with micrometer adjusting screw 4-4, micrometer adjusting screw 4-4 is the fine setting to (namely above-below direction) for vertical folded battle array laser instrument 1Z.
Preferably, in the moving plate 4-2a of mirror holder of two dimension adjustment mirror holder 4-2, laser instrument water-cooled block 4-1 is installed, vertical folded battle array laser instrument 1 is arranged on the front end of laser instrument water-cooled block 4-1.
Please refer to Fig. 5, in an embodiment, laser instrument water-cooled block 4-1 is arranged on two dimension with connecting thread 4-2b and adjusts in the moving plate 4-2a of mirror holder of mirror holder 4-2 therein.The angular deflection of vertical folded battle array laser instrument 1, realizes deflection by the connecting thread 4-2b being adjusted by two dimension on mirror holder 4-2, and by holding screw 4-2c fixing and locking.Two dimension is adjusted the adjustment of mirror holder 4-2, will directly drive two dimension to adjust the adjustment of mirror holder 4-2, will directly drive vertical folded battle array laser instrument 1 to do the inching that two dimension swings.
Cooling water is flowed through the turnover water channel 4-1a by laser instrument water-cooled block 4-1 vertically to fold a battle array laser instrument 1, thereby gives vertical gust laser instrument 1 cooling of folding.Laser water-cooled block 4-1 except bear the machinery of vertical folded battle array laser instrument 1 fixing, also played the effect of an apparatus insulator, because system also must guarantee vertical folded battle array laser instrument 1 and body insulation simultaneously outside need to fixing to vertical folded battle array laser instrument 1 machinery.
Please also refer to Fig. 2, described the second driving mechanism comprises the cantilever 4-14 of fixing mask plate 2, the cam disc 4-10 that drives cantilever 4-14 to rise and decline, and adds the front end below that two crystal clamping plate 4-17 that hold leaded light crystal 4-16 and mask plate 2 are arranged on cantilever 4-14 from bottom to up.One end of cantilever 4-14 is connected with elevating bracket 4-13, in cam disc 4-10, be provided with the cam 4-10a that is positioned at elevating bracket 4-13 below, cam 4-10a is connected with the lifting arm 4-13a of elevating bracket 4-13 tail end, and rotating cam 4-10a can drive elevating bracket 4-13 to move up and down and then drive together lifting of cantilever 4-14.Concrete, described cam 4-10a can be by the control crank 4-10b driven rotary that is arranged on cam 4-10a below, control crank 4-10b is to lift or to put down elevating bracket 4-13 by the result of cam 4-10a rotation, and it is because cam is being lifted the lifting arm 4-13a on elevating bracket 4-13 that cam 4-10a lifts or put down elevating bracket 4-13.
The crystal clamping plate 4-17 of leaded light crystal 4-16 both sides, together with leaded light crystal 4-16, mask plate 2, be together fixed on below the front end of cantilever 4-14, so, elevating bracket 4-13 is when moving up and down, to together drive cantilever 4-14, leaded light crystal 4-16, crystal clamping plate 4-17, mask plate 2 to move up and down together, this action will make leaded light crystal 4-16 push down the non-welding region of flexible PCB, implement laser weld, after having welded, lift control crank 4-10b, namely lifted leaded light crystal 4-16, now, just can take and lay workpiece.
Preferably, elevating bracket 4-13 slides and is located at longitudinal rail 4-8, and moving up and down of elevating bracket 4-13 is to be limited to longitudinal rail 4-8, and therefore, elevating bracket 4-13 can only do accurate longitudinal sliding motion.Longitudinal rail 4-8 has ensured the accuracy of cantilever 4-14 when doing Z-direction lifting, has namely ensured the accuracy that leaded light crystal 4-16 moves up and down,
The object of cantilever 4-14 rise and fall is to make leaded light crystal 4-16 push down and decontrol the non-welding portion of flexible PCB, to implement the fixedly needs of welding.
The top of elevating bracket 4-13 is provided with the regulator bolts 4-5 being connected with regulator bolts 4-5, and leaded light crystal 4-16 is applied by spring 4-12 the pressure of flexible PCB, and its pressure large young pathbreaker regulated by regulator bolts 4-5.
The middle-end of cantilever 4-14 is provided with cooling water channel 4-15, takes away the unnecessary heat energy producing in laser beam welding by cooling water, thus protection leaded light crystal 4-16 and mask plate 2.
Two vertical folded battle array laser instruments 1 in the utility model, have been used, this is because vertical folded battle array laser instrument 1 rectangular light spot in fact out segments, that hot spot by many strips is formed, the gap location of bar shaped laser spot, to have energy blind spot, so, two vertical folded battle array laser instruments 1 are set and carry out the stack of hot spot, the gap that strip light spots is alternately made in the adjustment that utilizes two dimension to adjust mirror holder 4-2 up, just can guarantee the energy uniformity of whole large rectangular light spot.
Claims (9)
1. a flexible PCB stacking-type laser soldering device, it is characterized in that: comprise vertical folded battle array laser instrument (1), be positioned at the mask plate (2) of vertical folded battle array laser instrument (1) below, drive the first driving mechanism that in vertical folded battle array laser instrument (1) plane, two dimensional motion and vertical direction move up and down and drive mask plate (2) to rise and the second driving mechanism of descending motion, mask plate (2) is provided with the fluting of (3-2) welding region on corresponding flexible PCB, the welding region that the laser that vertical folded battle array laser instrument (1) sends passes (3-2) on described fluting irradiation flexible PCB welds.
2. flexible PCB stacking-type laser soldering device as claimed in claim 1, it is characterized in that: described the first driving mechanism comprises column (4-11) and is slidably mounted on the longitudinal sliding block (4-9) on column (4-11), the both sides of longitudinal sliding block (4-9) are laterally provided with respectively a sideskid (4-7), the front end of each sideskid (4-7) is provided with the two dimension of fixed vertical folded battle array laser instrument (1) and adjusts mirror holder (4-2), and described two dimension is adjusted mirror holder (4-2) for driving vertical folded battle array laser instrument 1 to do two dimension adjustment.
3. flexible PCB stacking-type laser soldering device as claimed in claim 2, it is characterized in that: sideskid (4-7) front end is fixed with half-nut slide block (4-3), two dimension is adjusted mirror holder (4-2) and is fixed on half-nut slide block (4-3), in cavity between half-nut slide block (4-3) and sideskid (4-7), be inlaid with micrometer adjusting screw (4-4), micrometer adjusting screw (4-4) is for the fine setting of vertical folded battle array laser instrument (1) Z-direction.
4. flexible PCB stacking-type laser soldering device as claimed in claim 2, it is characterized in that: in the moving plate (4-2a) of mirror holder of two dimension adjustment mirror holder (4-2), laser instrument water-cooled block (4-1) is installed, vertical folded battle array laser instrument (1) is arranged on the front end of laser instrument water-cooled block (4-1), is provided with the turnover water channel (4-1a) that Cooling Water passes through in laser instrument water-cooled block (4-1).
5. flexible PCB stacking-type laser soldering device as claimed in claim 4, it is characterized in that: laser instrument water-cooled block (4-1) is arranged on two dimension with connecting thread (4-2b) and adjusts in the moving plate (4-2a) of mirror holder of mirror holder (4-2), connecting thread (4-2b) is vertically folded a gust angular deflection for laser instrument (1) for realizing, and by holding screw (4-2c) fixing and locking.
6. the flexible PCB stacking-type laser soldering device as described in claim as arbitrary in claim 1-5, is characterized in that: described the second driving mechanism comprises fixedly cantilever (4-14), driving cantilever (4-14) rising of mask plate (2) and the cam disc (4-10) declining.
7. flexible PCB stacking-type laser soldering device as claimed in claim 6, it is characterized in that: the leaded light crystal (4-16) that setting fits tightly below of mask plate (2), the both sides of leaded light crystal (4-16) are provided with the front end below that is arranged on from bottom to up cantilever (4-14) for clamping the crystal clamping plate (4-17) of leaded light crystal (4-16), add two crystal clamping plate (4-17) of holding leaded light crystal (4-17) and mask plate (2).
8. flexible PCB stacking-type laser soldering device as claimed in claim 6, it is characterized in that: one end of cantilever (4-14) is connected with elevating bracket (4-13), in cam disc (4-10), be provided with the cam (4-10a) that is positioned at elevating bracket (4-13) below, cam (4-10a) is connected with the lifting arm (4-13a) of elevating bracket (4-13) tail end, and rotating cam (4-10a) can drive elevating bracket (4-13) to move up and down and then drive together lifting of cantilever (4-14).
9. flexible PCB stacking-type laser soldering device as claimed in claim 8, is characterized in that: elevating bracket (4-13) slides and is located at longitudinal rail (4-8), and moving up and down of elevating bracket (4-13) is limited to longitudinal rail (4-8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420485754.6U CN203992821U (en) | 2014-08-27 | 2014-08-27 | Flexible PCB stacking-type laser soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420485754.6U CN203992821U (en) | 2014-08-27 | 2014-08-27 | Flexible PCB stacking-type laser soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203992821U true CN203992821U (en) | 2014-12-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420485754.6U Withdrawn - After Issue CN203992821U (en) | 2014-08-27 | 2014-08-27 | Flexible PCB stacking-type laser soldering device |
Country Status (1)
| Country | Link |
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| CN (1) | CN203992821U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191091A (en) * | 2014-08-27 | 2014-12-10 | 武汉凌云光电科技有限责任公司 | Flexible printed circuit board stack type laser welding device and method |
| WO2020124580A1 (en) * | 2018-12-21 | 2020-06-25 | 深圳市柔宇科技有限公司 | Fixing method for metal sheet and flexible display equipment |
| CN112453688A (en) * | 2020-12-01 | 2021-03-09 | 强一半导体（苏州）有限公司 | Optical quasi-focus structure for MEMS probe laser etching device |
-
2014
- 2014-08-27 CN CN201420485754.6U patent/CN203992821U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191091A (en) * | 2014-08-27 | 2014-12-10 | 武汉凌云光电科技有限责任公司 | Flexible printed circuit board stack type laser welding device and method |
| CN104191091B (en) * | 2014-08-27 | 2015-11-11 | 武汉凌云光电科技有限责任公司 | Flexible PCB stacking-type laser soldering device and method |
| WO2020124580A1 (en) * | 2018-12-21 | 2020-06-25 | 深圳市柔宇科技有限公司 | Fixing method for metal sheet and flexible display equipment |
| CN112453688A (en) * | 2020-12-01 | 2021-03-09 | 强一半导体（苏州）有限公司 | Optical quasi-focus structure for MEMS probe laser etching device |
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