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CN203940289U - Omni-directional LED light source - Google Patents

Omni-directional LED light source Download PDF

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Publication number
CN203940289U
CN203940289U CN201420361502.2U CN201420361502U CN203940289U CN 203940289 U CN203940289 U CN 203940289U CN 201420361502 U CN201420361502 U CN 201420361502U CN 203940289 U CN203940289 U CN 203940289U
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China
Prior art keywords
light source
light
substrate
led light
substrates
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Expired - Fee Related
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CN201420361502.2U
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Chinese (zh)
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李金明
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Dongguna Wangfeng Nanometer Material Co ltd
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Dongguna Wangfeng Nanometer Material Co ltd
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Abstract

The utility model discloses an all-round luminous LED light source, including lamp holder, lamp shade and light-emitting component, light-emitting component includes the base plate of two transparent materials, two the base plate sets up just two relatively alternately on the base plate be provided with the LED chip, two space department between the base plate is filled there is sealing glue layer. Compared with the prior art, the omnibearing luminous LED light source provided by the utility model has two transparent substrates which are oppositely arranged, the LED chips are respectively arranged on the two substrates, and the sealing glue layer is filled in the gap between the two substrates, so that the LED chip is clamped between the two substrates, and the omnibearing luminous LED light source has good waterproof performance; the base plate is transparent material, and the light that the LED chip sent is refracted, transmitted through transparent substrate, changes the light-emitting direction of light for the light-emitting of all-round luminous LED light source is very even, can reach all-round luminous effect.

Description

全方位发光LED光源Omni-directional LED light source

技术领域technical field

本实用新型涉及一种照明灯具,尤其涉及一种LED光源。The utility model relates to a lighting fixture, in particular to an LED light source.

背景技术Background technique

LED光源为达到全方位发光的效果,通常于周向设置的基板上沿圆周方向设置多个小功率的LED芯片,LED芯片发光角度(通常为120°左右)内的光线射出LED光源,利用圆周方向设置的多个小功率LED芯片实现LED光源全方位发光。In order to achieve the omni-directional lighting effect of the LED light source, a plurality of low-power LED chips are usually arranged on the circumferentially arranged substrate along the circumferential direction. A plurality of low-power LED chips set in directions realizes omni-directional light emission of the LED light source.

由于多个LED芯片周向设置,不便对LED芯片加设密封胶;不加设密封胶又导致LED光源防水性、安全性不足。Since a plurality of LED chips are arranged circumferentially, it is inconvenient to add a sealant to the LED chips; if no sealant is added, the waterproofness and safety of the LED light source are insufficient.

因此,需要一种防水性能良好的全方位发光LED光源,以提高全方位发光LED光源的安全性。Therefore, there is a need for an all-round light-emitting LED light source with good waterproof performance, so as to improve the safety of the all-round light-emitting LED light source.

实用新型内容Utility model content

本实用新型的目的是提供需要一种防水性能良好的全方位发光LED光源,以提高全方位发光LED光源的安全性。The purpose of the utility model is to provide an all-round light-emitting LED light source with good waterproof performance, so as to improve the safety of the all-round light-emitting LED light source.

为了实现上述目的,本实用新型公开了一种全方位发光LED光源,包括灯头、灯罩和发光组件,所述发光组件连接于所述灯头,所述灯罩连接于所述灯头并笼罩所述发光组件,所述发光组件包括两透明材质的基板,两所述基板相对设置且两所述基板的相对内侧分别设置有LED芯片,两所述基板之间的空隙处填充有密封胶层。In order to achieve the above object, the utility model discloses an omnidirectional light-emitting LED light source, including a lamp holder, a lampshade and a light-emitting assembly, the light-emitting assembly is connected to the lamp holder, and the lampshade is connected to the lamp holder and covers the light-emitting assembly The light-emitting component includes two substrates of transparent material, the two substrates are arranged opposite to each other, and LED chips are respectively arranged on the inner sides of the two substrates, and the gap between the two substrates is filled with a sealant layer.

与现有技术相比,本实用新型提供的全方位发光LED光源,其具有两相向设置的透明基板,LED芯片分别设置于两基板上,并于两基板之间的空隙处填充密封胶层,使得LED芯片夹设于两基板之间,使得全方位发光LED光源的防水性能良好;基板呈透明材质,LED芯片发出的光线经透明基板进行折射、透射,改变光线的出光方向,使得全方位发光LED光源的出光非常均匀,能够达到全方位发光的效果。Compared with the prior art, the omni-directional light-emitting LED light source provided by the utility model has two transparent substrates arranged opposite to each other, the LED chips are respectively arranged on the two substrates, and the gap between the two substrates is filled with a sealant layer, The LED chip is sandwiched between the two substrates, so that the waterproof performance of the all-round light-emitting LED light source is good; the substrate is made of transparent material, and the light emitted by the LED chip is refracted and transmitted through the transparent substrate, changing the light-emitting direction of the light, so that it emits light in all directions The light output of the LED light source is very uniform, which can achieve the effect of all-round light.

较佳的,任一所述基板朝向另一所述基板的内侧设置有LED芯片,且分别设置于两所述基板上的LED芯片交叉排布;LED芯片分别设置于两基板上,且设置于两基板上的LED芯片交叉排布,使得任两LED芯片的距离较近,以减小全方位发光LED光源的体积,同时距离较近的任两LED芯片设置于不同的基板上,不影响对LED芯片进行散热。Preferably, any one of the substrates is provided with LED chips facing the inner side of the other substrate, and the LED chips respectively arranged on the two substrates are arranged in a cross; the LED chips are respectively arranged on the two substrates and arranged on the The LED chips on the two substrates are cross-arranged so that the distance between any two LED chips is relatively close to reduce the volume of the omnidirectional LED light source. The LED chips dissipate heat.

较佳的,所述发光组件外侧全包覆有荧光粉层;荧光粉层全包覆发光组件,使得LED芯片发出的光线必须经过荧光粉层,荧光粉层受激发发出荧光,提高全方位发光LED光源效率,同时亦进一步提高全方位发光LED光源出光的视觉效果。Preferably, the outside of the light-emitting component is fully covered with a phosphor layer; the phosphor layer fully covers the light-emitting component, so that the light emitted by the LED chip must pass through the phosphor layer, and the phosphor layer is excited to emit fluorescence, which improves the omnidirectional light emission. The efficiency of the LED light source also further improves the visual effect of the omni-directional LED light source.

较佳的,所述基板为玻璃、陶瓷或超薄光伏玻璃。Preferably, the substrate is glass, ceramic or ultra-thin photovoltaic glass.

较佳的,所述全方位发光LED光源为球泡灯或蜡烛灯。Preferably, the omnidirectional LED light source is a bulb lamp or a candle lamp.

附图说明Description of drawings

图1为本实用新型全方位发光LED光源的结构示意图。Fig. 1 is a structural schematic diagram of the omnidirectional LED light source of the utility model.

图2和图3为其他LED光源的结构示意图。2 and 3 are structural schematic diagrams of other LED light sources.

具体实施方式Detailed ways

为详细说明本实用新型的技术内容、构造特征、所实现目的及效果,以下结合实施方式并配合附图详予说明。In order to describe the technical content, structural features, achieved goals and effects of the present utility model in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

如图1所示的全方位发光LED光源,包括灯头100、灯罩200和发光组件300,发光组件300连接于灯头100,灯罩200连接于灯头100并笼罩发光组件300。更具体地:The omnidirectional light-emitting LED light source shown in FIG. 1 includes a lamp cap 100 , a lampshade 200 and a light-emitting component 300 . The light-emitting component 300 is connected to the lamp cap 100 . More specifically:

发光组件300包括两透明材质的基板310,两基板310相对设置且两基板310的相对内侧分别设置有LED芯片320,两基板310之间的空隙处填充有密封胶层330。更进一步地,任一基板310朝向另一基板310的内侧设置有LED芯片320,使得LED芯片320位于两基板310之间;设置于基板310上的LED芯片320均匀排布,且位于两基板310上的LED芯片320呈交叉的设置,使得两基板310之间的间隙较小、任两LED芯片320的距离较近,其一方面使得全方位发光LED光源的体积较小,另一方面,距离较近的任两LED芯片320设置于不同的基板310上,两基板310分别对两LED芯片320进行散热,使得LED芯片320温度不致过高而影响性能。The light-emitting component 300 includes two substrates 310 made of transparent materials. The two substrates 310 are disposed opposite to each other. LED chips 320 are respectively disposed on the inner sides of the two substrates 310 . The gap between the two substrates 310 is filled with a sealant layer 330 . Furthermore, any one substrate 310 is provided with LED chips 320 toward the inner side of the other substrate 310, so that the LED chips 320 are located between the two substrates 310; The LED chips 320 on the board are set in a cross, so that the gap between the two substrates 310 is small, and the distance between any two LED chips 320 is relatively close. On the one hand, it makes the volume of the omnidirectional LED light source smaller. Any two adjacent LED chips 320 are disposed on different substrates 310 , and the two substrates 310 dissipate heat for the two LED chips 320 respectively, so that the temperature of the LED chips 320 will not be too high to affect performance.

发光组件300外侧全包覆有荧光粉层340;荧光粉层340全包覆发光组件300,使得LED芯片320发出的光线必须经过荧光粉层340,荧光粉层340受激发发出荧光,提高全方位发光LED光源效率,同时亦进一步提高全方位发光LED光源出光的视觉效果。The outside of the light-emitting component 300 is fully covered with a phosphor layer 340; the phosphor layer 340 fully covers the light-emitting component 300, so that the light emitted by the LED chip 320 must pass through the phosphor layer 340, and the phosphor layer 340 is excited to emit fluorescence. The efficiency of the light-emitting LED light source is improved, and at the same time, the visual effect of the omnidirectional light-emitting LED light source is further improved.

较佳的,基板310为玻璃、陶瓷或超薄光伏玻璃。Preferably, the substrate 310 is glass, ceramic or ultra-thin photovoltaic glass.

在本实施例中,全方位发光LED光源为球泡灯,灯罩200为连接于灯头100并笼罩发光组件300的玻壳,两基板310呈长条形,设置于基板310上的LED芯片320呈直线型排列。在不同于本实施例的其他实施例中,全方位发光LED光源亦可以为蜡烛灯、面光源或其他形状,只需对应调整基板310形状和设置于基板310上的LED芯片320的排列方式即可。In this embodiment, the omnidirectional LED light source is a bulb lamp, the lampshade 200 is a glass bulb connected to the lamp holder 100 and covers the light-emitting component 300, the two substrates 310 are in the shape of a strip, and the LED chips 320 arranged on the substrate 310 are in the shape of Linear arrangement. In other embodiments different from this embodiment, the omni-directional light-emitting LED light source can also be a candle lamp, a surface light source or other shapes, only need to adjust the shape of the substrate 310 and the arrangement of the LED chips 320 on the substrate 310 accordingly. Can.

再请参阅图1所示,灯头100包括埋设于灯头内的基板110、和设置于基板110并朝向发光组件300的插接孔120,其中,插接孔120的数量可以设置多个;发光组件300还包括插接端350,在本实施例中,每一基板310均连接一插接端350,两插接端350分别于对应基板310上的LED芯片320电连接;两插接端350分别插接于一插接孔120内,从而方便地完成本实用新型全方位发光LED光源的组装。Referring again to FIG. 1, the lamp holder 100 includes a substrate 110 embedded in the lamp holder, and an insertion hole 120 disposed on the substrate 110 and facing the light-emitting assembly 300, wherein the number of insertion holes 120 can be set in multiples; the light-emitting assembly 300 also includes a plug-in terminal 350. In this embodiment, each substrate 310 is connected to a plug-in terminal 350, and the two plug-in terminals 350 are respectively electrically connected to the LED chip 320 on the corresponding substrate 310; the two plug-in terminals 350 are respectively It is plugged into an insertion hole 120, so as to conveniently complete the assembly of the omnidirectional LED light source of the utility model.

在不同于本实施例的其他结构中,如图2所示,灯头100的结构保持不变;两发光组件300’分别包括一基板310’、一LED芯片320’、包覆LED芯片320’的密封胶层330’、包覆发光组件300’的荧光粉层340’以及与基板310’连接的插接端350’。在该结构中,基板310’为不透明材质,譬如基板310’可以为具有反射、导热功能的材料,如白刚玉或其他有反射、导热功能的陶瓷;基板310’亦可以为具有导热功能、不具有反射功能的材料,如铝、钢、FR4等。此时,需要于基板310’与LED芯片320’之间的位置设置反射层,反射层可以涂覆或镀至基板310’上。荧光粉层340’仅包覆发光组件300’出光的区域。两发光组件300’的插接端350’分别插接于一插接孔120内,即发光组件300’与灯头100的组装。In other structures different from this embodiment, as shown in FIG. 2 , the structure of the lamp holder 100 remains unchanged; the two light-emitting components 300' respectively include a substrate 310', an LED chip 320', and a cover covering the LED chip 320'. The sealant layer 330', the phosphor layer 340' covering the light-emitting component 300', and the plug-in terminal 350' connected to the substrate 310'. In this structure, the substrate 310' is made of an opaque material. For example, the substrate 310' can be a material with reflective and heat-conducting functions, such as white corundum or other ceramics with reflective and heat-conducting functions; Materials with reflective functions, such as aluminum, steel, FR4, etc. At this time, a reflective layer needs to be disposed between the substrate 310' and the LED chip 320', and the reflective layer can be coated or plated on the substrate 310'. The phosphor layer 340' only covers the light-emitting area of the light-emitting component 300'. The insertion ends 350' of the two light-emitting components 300' are respectively plugged into one insertion hole 120, that is, the assembly of the light-emitting components 300' and the lamp holder 100.

在不同于前述结构的其他结构中,如图3所示,灯头100的结构仍保持不变;一发光组件300”包括一基板310”、一LED芯片320”、包覆LED芯片320”的密封胶层330”、包覆发光组件300”的荧光粉层340”以及与基板310”连接的插接端350”。在该结构中,基板310”为透明材质,如,玻璃或蓝宝石等。此时,荧光粉层340”全包覆发光组件300”。发光组件300”插接于任一插接孔120内,即发光组件300”与灯头100的组装。In other structures different from the aforementioned structure, as shown in FIG. 3 , the structure of the lamp cap 100 remains unchanged; a light emitting assembly 300 "comprises a substrate 310", an LED chip 320", and a sealing material covering the LED chip 320". The adhesive layer 330", the phosphor layer 340" covering the light-emitting component 300", and the plug terminal 350" connected to the substrate 310". In this structure, the substrate 310" is made of a transparent material, such as glass or sapphire. At this time, the phosphor layer 340" completely covers the light-emitting component 300". The light-emitting component 300 ″ is plugged into any insertion hole 120 , that is, the light-emitting component 300 ″ is assembled with the lamp holder 100 .

与现有技术相比,本实用新型提供的全方位发光LED光源,其具有两相向设置的透明基板310,LED芯片320分别设置于两基板310上,且LED芯片320位于于两透明基板310之间,使得LED芯片320夹设于两基板310之间,于两基板310之间填充密封胶层330,使得全方位发光LED光源的防水性能良好;基板310呈透明材质,LED芯片320发出的光线经透明的基板310进行折射、透射,改变光线的出光方向,使得全方位发光LED光源的出光非常均匀,能够达到全方位发光的效果;设置于基板310上的LED芯片320均匀排布,且位于两基板310上的LED芯片320呈交叉的设置,使得两基板310之间的间隙较小、任两LED芯片320的距离较近,其一方面使得全方位发光LED光源的体积较小,另一方面,距离较近的任两LED芯片320设置于不同的基板310上,两基板310分别对两LED芯片320进行散热,使得LED芯片320温度不致过高而影响性能。Compared with the prior art, the omnidirectional LED light source provided by the utility model has two transparent substrates 310 arranged opposite to each other, and the LED chips 320 are respectively arranged on the two substrates 310, and the LED chips 320 are located between the two transparent substrates 310 Between the two substrates 310, the LED chip 320 is sandwiched between the two substrates 310, and the sealant layer 330 is filled between the two substrates 310, so that the waterproof performance of the omnidirectional LED light source is good; The transparent substrate 310 carries out refraction and transmission, and changes the direction of light emission, so that the light emission of the omnidirectional LED light source is very uniform, and can achieve the effect of omnidirectional light emission; the LED chips 320 arranged on the substrate 310 are evenly arranged and located The LED chips 320 on the two substrates 310 are arranged crosswise, so that the gap between the two substrates 310 is small, and the distance between any two LED chips 320 is relatively close. On the one hand, any two LED chips 320 that are close to each other are disposed on different substrates 310 , and the two substrates 310 dissipate heat for the two LED chips 320 respectively, so that the temperature of the LED chips 320 will not be too high to affect performance.

以上所揭露的仅为本实用新型的优选实施例而已,当然不能以此来限定本实用新型之权利范围,因此依本实用新型申请专利范围所作的等同变化,仍属本实用新型所涵盖的范围。What is disclosed above is only the preferred embodiment of the present utility model, and of course the scope of rights of the present utility model cannot be limited with this. Therefore, the equivalent changes made according to the patent scope of the utility model still belong to the scope covered by the utility model .

Claims (5)

1. an Omnibearing luminous LED light source, comprise lamp holder, lampshade and luminescence component, described luminescence component is connected in described lamp holder, described lampshade is connected in described lamp holder and shrouds described luminescence component, it is characterized in that: described luminescence component comprises the substrate of two transparent materials, described in two substrate be oppositely arranged and described in two the relative inner of substrate be respectively arranged with LED chip, the gap described in two between substrate is filled with sealant layer.
2. Omnibearing luminous LED light source as claimed in claim 1, is characterized in that: arbitrary described substrate is provided with LED chip towards the inner side of substrate described in another, and is arranged at respectively the LED chip cross arrangement on substrate described in two.
3. Omnibearing luminous LED light source as claimed in claim 1, is characterized in that: described luminescence component outside is coated with phosphor powder layer entirely.
4. Omnibearing luminous LED light source as claimed in claim 1, is characterized in that: described substrate is glass, pottery or ultra-thin photovoltaic glass.
5. Omnibearing luminous LED light source as claimed in claim 1, is characterized in that: described Omnibearing luminous LED light source is bulb lamp or candle lamp.
CN201420361502.2U 2014-07-01 2014-07-01 Omni-directional LED light source Expired - Fee Related CN203940289U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104733449A (en) * 2014-11-28 2015-06-24 立达信绿色照明股份有限公司 Double-layered LED packaging structure
CN104835810A (en) * 2015-02-14 2015-08-12 吴鼎鼎 Long-life LED lamp light-emitting unit and long-life LED lamp
WO2016090580A1 (en) * 2014-12-10 2016-06-16 远东科技大学 Multi-directional light-emitting and heat-dissipating plate and lamp
CN105953101A (en) * 2016-03-11 2016-09-21 浙江英特来光电科技有限公司 LED bulb lamp with high heat dispersion performance

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104733449A (en) * 2014-11-28 2015-06-24 立达信绿色照明股份有限公司 Double-layered LED packaging structure
CN104733449B (en) * 2014-11-28 2019-08-23 漳州立达信光电子科技有限公司 Double-layer LED packaging structure
WO2016090580A1 (en) * 2014-12-10 2016-06-16 远东科技大学 Multi-directional light-emitting and heat-dissipating plate and lamp
CN104835810A (en) * 2015-02-14 2015-08-12 吴鼎鼎 Long-life LED lamp light-emitting unit and long-life LED lamp
CN104835810B (en) * 2015-02-14 2017-05-24 吴鼎鼎 Long-life LED lamp light-emitting unit and long-life LED lamp
CN105953101A (en) * 2016-03-11 2016-09-21 浙江英特来光电科技有限公司 LED bulb lamp with high heat dispersion performance

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