CN203912310U - An enhanced-type flexible circuit board - Google Patents
An enhanced-type flexible circuit board Download PDFInfo
- Publication number
- CN203912310U CN203912310U CN201420252661.9U CN201420252661U CN203912310U CN 203912310 U CN203912310 U CN 203912310U CN 201420252661 U CN201420252661 U CN 201420252661U CN 203912310 U CN203912310 U CN 203912310U
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- Prior art keywords
- layer
- flexible pcb
- circuit board
- flexible circuit
- conductive layer
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- Expired - Fee Related
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Abstract
The utility model discloses an enhanced-type flexible circuit board characterized in that the enhanced-type flexible circuit board comprises insulation base materials, a conducting layer and a surface insulating layer which are arranged from the bottom up; the lower surface of the insulation base materials is provided with a heat radiation layer; the conducting layer is covered by the surface insulating layer; several waveform projections form on the surface insulating layer; the end portion of the conducting layer is exposed outside the insulation base materials; and the exposed portion is comb-shaped. The enhanced-type flexible circuit board of the utility model is simple in structure and reasonable in design. A distant golden finger portion is designed to be the comb-shaped, so that mechanical strength of the flexible circuit board is increased; heat radiation capability is improved; and usage effects are substantially raised.
Description
Technical field
The utility model belongs to enhancement mode flexible PCB field, specifically, relates to a kind of enhancement mode flexible PCB.
Background technology
Flexible PCB is that a polyimides or polyester film are that the one that base material is made has height reliability, excellent flexible printed circuit, be called for short soft board or FPC, have that distribution density is high, lightweight, thin thickness, can free bend, folding, coiling and the feature such as thermal diffusivity is good, be widely used in mobile phone, computer, digital camera, medical treatment, automobile, space flight and military field.
Along with mobile phone products is to light, thin, little future development, flexible PCB also to be had higher requirement, the flexible PCB of same area must comprise that more circuit is to improve more function.Under prior art, in flexible PCB, conductive layer exposed portions serve forms so-called golden finger.Be fenestration design at the surface insulation layer at golden finger position, the mechanical strength at golden finger position is reduced, easily cause golden finger fracture, cause the electric property of flexible PCB greatly to reduce, the reliability of work cannot be guaranteed.
Utility model content
For solving the problem in background technology, the utility model provides a kind of reasonable in design, electric property of ensureing flexible PCB, also can ensure the enhancement mode flexible PCB of functional reliability.
The technical solution of the utility model is:
A kind of enhancement mode flexible PCB, is characterized in that: comprise insulating substrate, conductive layer and surface insulation layer from bottom to top; On the lower surface of described insulating substrate, be provided with heat dissipating layer; On described conductive layer, be coated with surface insulation layer, and on surface insulation layer, form some wavy bulge; Expose outside insulating substrate the end of described conductive layer, and exposed portions serve is comb teeth-shaped.
As a kind of technical scheme of optimization, the number of described wavy bulge is no less than three, and wavy bulge is uniformly distributed.
As a kind of technical scheme of optimization, described insulating substrate is that thickness is the polyimide plate of 0.5-3mm.
As a kind of technical scheme of optimization, the gross thickness of described heat dissipating layer, insulating substrate, conductive layer, surface insulation layer is 3-6mm.
Owing to having adopted technique scheme, compared with prior art, the utility model is simple in structure, reasonable in design, by away from golden finger position change into comb teeth-shaped design, increased the mechanical strength of flexible PCB, and increase heat-sinking capability, result of use is greatly improved, and meanwhile, flexible PCB, the flexible PCB of double-deck conductive layer and the flexible PCB of multilayer conductive layer thereof of the utility model to individual layer conductive layer is all suitable for.
Brief description of the drawings
Fig. 1 is the structural representation of a kind of embodiment of the utility model.
Embodiment
Embodiment
As shown in Figure 1, a kind of enhancement mode flexible PCB, comprises insulating substrate 3, conductive layer 2 and surface insulation layer 1 from bottom to top.On the lower surface of described insulating substrate 3, be provided with heat dissipating layer 4.On described conductive layer 2, be coated with surface insulation layer 1, and on surface insulation layer 1, form some wavy bulge 5.Expose outside insulating substrate the end of described conductive layer 2, and exposed portions serve is comb teeth-shaped.
In the present embodiment, the number of described wavy bulge 5 is no less than three, and wavy bulge 5 is uniformly distributed.The polyimide plate that described insulating substrate 3 is 0.5-3mm for thickness.
In the present embodiment, consider the use of the present embodiment on the flexible PCB of the flexible PCB of individual layer conductive layer, double-deck conductive layer and the flexible PCB of multilayer conductive layer thereof, the gross thickness of described heat dissipating layer 4, insulating substrate 3, conductive layer 2, surface insulation layer 1 is 3-6mm.
The utility model is simple in structure, reasonable in design, by away from golden finger position change into comb teeth-shaped design, increase the mechanical strength of flexible PCB, and increase heat-sinking capability, result of use is greatly improved, and meanwhile, flexible PCB, the flexible PCB of double-deck conductive layer and the flexible PCB of multilayer conductive layer thereof of the utility model to individual layer conductive layer is all suitable for.
The utility model is not limited to above-mentioned preferred implementation, and anyone should learn the structural change of making under enlightenment of the present utility model, every with the utlity model has identical or akin technical scheme, all belong to protection range of the present utility model.
Claims (4)
1. an enhancement mode flexible PCB, is characterized in that: comprise insulating substrate, conductive layer and surface insulation layer from bottom to top; On the lower surface of described insulating substrate, be provided with heat dissipating layer; On described conductive layer, be coated with surface insulation layer, and on surface insulation layer, form some wavy bulge; Expose outside insulating substrate the end of described conductive layer, and exposed portions serve is comb teeth-shaped.
2. enhancement mode flexible PCB according to claim 1, is characterized in that: the number of described wavy bulge is no less than three, and wavy bulge is uniformly distributed.
3. enhancement mode flexible PCB according to claim 2, is characterized in that: described insulating substrate is that thickness is the polyimide plate of 0.5-3mm.
4. enhancement mode flexible PCB according to claim 3, is characterized in that: the gross thickness of described heat dissipating layer, insulating substrate, conductive layer, surface insulation layer is 3-6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420252661.9U CN203912310U (en) | 2014-05-16 | 2014-05-16 | An enhanced-type flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420252661.9U CN203912310U (en) | 2014-05-16 | 2014-05-16 | An enhanced-type flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203912310U true CN203912310U (en) | 2014-10-29 |
Family
ID=51786550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420252661.9U Expired - Fee Related CN203912310U (en) | 2014-05-16 | 2014-05-16 | An enhanced-type flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203912310U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109686759A (en) * | 2018-12-05 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | Display screen component |
| US10923542B2 (en) | 2018-12-05 | 2021-02-16 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display screen assembly having a flexible circuit board with curved portions |
-
2014
- 2014-05-16 CN CN201420252661.9U patent/CN203912310U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109686759A (en) * | 2018-12-05 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | Display screen component |
| CN109686759B (en) * | 2018-12-05 | 2020-11-06 | 武汉华星光电半导体显示技术有限公司 | Display screen assembly |
| US10923542B2 (en) | 2018-12-05 | 2021-02-16 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display screen assembly having a flexible circuit board with curved portions |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20190516 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |