CN203883003U - Multi-surfaced display LED encapsulation structure - Google Patents
Multi-surfaced display LED encapsulation structure Download PDFInfo
- Publication number
- CN203883003U CN203883003U CN201420279258.5U CN201420279258U CN203883003U CN 203883003 U CN203883003 U CN 203883003U CN 201420279258 U CN201420279258 U CN 201420279258U CN 203883003 U CN203883003 U CN 203883003U
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- Prior art keywords
- glass
- conductive layer
- ito conductive
- groove
- surfaced
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- Expired - Fee Related
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- 238000005538 encapsulation Methods 0.000 title abstract description 8
- 239000011521 glass Substances 0.000 claims abstract description 46
- 229910052709 silver Inorganic materials 0.000 claims abstract description 25
- 239000004332 silver Substances 0.000 claims abstract description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- 239000007787 solid Substances 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 230000010354 integration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model discloses a multi-surfaced display LED encapsulation structure. The multi-surfaced display LED encapsulation structure comprises a multi-surfaced three-dimensional glass, at least one LED chip arranged on the glass and an encapsulation layer which wraps the chips; the surface of the multi-surfaced three-dimensional glass is provided with a plurality of hollow grooves; an ITO conducting layer is coated along the surface of the multi-surfaced three-dimensional glass which is provided with the plurality of hollow grooves; the ITO conducting layer at the bottoms of the grooves is provided with a silver plated layer; the silver plated layer is provided with the LED chips which are fixed through die bonding glue; and the encapsulation layer wraps the LED chips in the grooves. With the multi-surfaced display LED encapsulation structure of the utility model adopted, three-dimensional multi-surfaced light emission can be realized, and the light-emitting angle of a light source can be greatly increased. The multi-surfaced display LED encapsulation structure can satisfy requirements of light sources of different power and can be applicable to white-light or color-light light sources.
Description
Technical field
The utility model relates to LED encapsulation, the LED encapsulating structure that particularly a kind of multiaspect shows.
Background technology
Light-emitting diode is called for short LED, it is as a kind of emerging light emitting semiconductor device,, the advantage such as power consumption little, fast response time, discharge off gas, energy-conserving and environment-protective, long service life little with its volume, it is the lighting source of future generation of generally acknowledging in the industry, be expected in following 10 to 20 years, thoroughly replace conventional incandescent, be widely used at present illumination, landscape design, traffic sign and electronical display etc.
In current LED lighting field, use a plurality of LED chip integration packagings to become a kind of trend.Traditional multicore integration packaging has COB packing forms, this encapsulating structure comprises metal substrate, LED chip, fluorescent material, packaging silicon rubber, the light beam that chip excitated fluorescent powder sends need to be through reflection, by packaging silicon rubber, reflect away again, this has caused the loss of energy, thereby reduced amount of light, reduced light efficiency.And due to the restriction of packing forms, it is luminous that light source luminescent face can not be realized 360 degree conventionally, so limited light source luminescent angle, cannot meet the lighting demand of some particular place.
Utility model content
The purpose of this utility model is for the problems referred to above, the LED encapsulating structure that provides a kind of multiaspect to show, it is a kind of three-dimensional multifaceted light-emitting structure, has greatly increased the lighting angle of light source, the demand of different capacity light source be can meet, white light or glory light source gone for simultaneously.
For achieving the above object, the utility model has adopted following technical scheme:
The LED encapsulating structure that a kind of multiaspect shows, comprise a multi-face solid structure glass, be arranged at least one LED chip on glass and be wrapped in the encapsulated layer of chip exterior, the glass surface of described multi-face solid structure is provided with the groove of a plurality of hollow outs, along described in be provided with the groove of a plurality of hollow outs the glass outer surface of multi-face solid structure be coated with ITO conductive layer, bottom portion of groove ITO conductive layer is provided with silver coating, silver coating is provided with by the fixing LED chip of crystal-bonding adhesive, and encapsulated layer is wrapped in described groove on LED chip.
Further, the glass shape of described multi-face solid structure is square, cuboid, spherical or circle rib centrum.
Further, the ITO transparency conducting layer on described groove is provided with bottom portion of groove ITO conductive layer anode and the bottom portion of groove ITO conductive layer negative electrode forming through over etching.
Further, the ITO conductive layer of a side of the glass of described multi-face solid structure is provided with glass outer side ITO conductive layer anode and the glass outer side ITO conductive layer negative electrode forming through over etching.
Further, described glass outer side ITO conductive layer anode and glass outer side ITO conductive layer negative electrode are respectively equipped with glass outer side silver coating anode and glass outer side silver coating negative electrode outward.
Further, the silver coating on described bottom portion of groove ITO conductive layer is provided with bottom portion of groove silver coating anode and bottom portion of groove silver coating negative electrode.
The encapsulated layer of chip exterior can have two kinds of packaged types: one is mixed by silica gel and fluorescent material, uses blue chip blue-light LED chip to excite yellow fluorescent powder to realize the light source of white light structure; Two use silica gel packaging, and chip adopts the glory chips such as RGB to realize a kind of light source of colorful light structure.
Compared with prior art, the LED encapsulating structure that a kind of multiaspect described in the utility model shows at least has following beneficial effect:
1, the light that chip bottom is sent does not need to be shot out by the reflection of substrate, but directly by glass refraction, goes out, the light that has effectively utilized chip bottom to send;
2, whole encapsulating structure is tridimensional structure, and light source is almost that 360 degree are luminous, has greatly increased the lighting angle of light source.
3, glass structure can be selected arbitrarily size, therefore can encapsulate a plurality of LED chips, meets the demand of different capacity light source.
4, the light source that encapsulating structure described in the utility model had both gone for white light structure also goes for the light source of colorful light structure.
Accompanying drawing explanation
Fig. 1 is the LED encapsulating structure schematic diagram that a kind of multiaspect described in the utility model shows;
In figure, the glass of 1-multi-face solid structure, 2-ITO conductive layer, 2-1-bottom portion of groove ITO conductive layer anode, 2-2 bottom portion of groove ITO conductive layer negative electrode, 2-3-glass outer side ITO conductive layer anode, 2-4-glass outer side ITO conductive layer negative electrode, 3-silver coating, 3-1-bottom portion of groove silver coating anode, 3-2-bottom portion of groove silver coating negative electrode, 3-3-glass outer side silver coating anode, 3-4-glass outer side silver coating negative electrode, 4-LED chip, 5-encapsulated layer.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
As shown in Figure 1, provided the LED encapsulating structure that a kind of multiaspect of the present utility model shows, the glass 1 that comprises the multi-face solid structure of a square, on glass 1 surface of multi-face solid structure, be provided with the groove of a plurality of hollow outs, glass 1 outer surface along the multi-face solid structure of the groove of hollow out is coated with ITO conductive layer 2, bottom portion of groove ITO conductive layer 2 is provided with silver coating 3, and silver coating 3 is provided with by the fixing LED chip 4 of crystal-bonding adhesive, and encapsulated layer 5 is wrapped in described groove on LED chip 4.
Wherein, on the ITO transparency conducting layer 2 on glass groove, through over etching, bottom portion of groove ITO conductive layer anode 2-1 and bottom portion of groove ITO conductive layer negative electrode 2-2 have been formed.The ITO conductive layer 2 of glass 1 one sides of multi-face solid structure has formed glass outer side ITO conductive layer anode 2-3 and the glass outer side ITO conductive layer negative electrode 2-4 pin of whole integration packaging lamp pearl through over etching.Glass outer side ITO conductive layer anode 2-3 and glass outer side ITO conductive layer negative electrode 2-4 are respectively equipped with glass outer side silver coating anode 3-3 and glass outer side silver coating negative electrode 3-4 outward.
The encapsulated layer 5 of LED chip 4 outsides can have two kinds of packaged types: one is mixed by silica gel and fluorescent material, uses blue chip blue-light LED chip to excite yellow fluorescent powder to realize the light source of white light structure; Two use silica gel packaging, and chip adopts the glory chips such as RGB to realize a kind of light source of colorful light structure.
Traditional COB packing forms, has limited the luminous of chip bottom at present, has caused the loss of energy, thereby has reduced amount of light, has reduced light efficiency.And due to the restriction of packing forms, it is luminous that light source luminescent face can not be realized 360 degree conventionally, so limited light source luminescent angle, cannot meet the lighting demand of some particular place.The LED encapsulating structure that a kind of multiaspect that the utility model provides shows, it is a kind of three-dimensional multifaceted light-emitting structure, has greatly increased the lighting angle of light source, can meet the demand of different capacity light source, goes for white light or glory light source simultaneously.
The foregoing is only a kind of execution mode of the present utility model, it not whole or unique execution mode, the conversion of any equivalence that those of ordinary skills take technical solutions of the utility model by reading the utility model specification, is claim of the present utility model and contains.
Claims (6)
1. the LED encapsulating structure that a multiaspect shows, the glass (1) that comprises a multi-face solid structure, be arranged at least one LED chip (4) on glass and be wrapped in the encapsulated layer (5) of chip exterior, it is characterized in that, the glass of described multi-face solid structure (1) surface is provided with the groove of a plurality of hollow outs, along described in be provided with the groove of a plurality of hollow outs glass (1) outer surface of multi-face solid structure be coated with ITO conductive layer (2), bottom portion of groove ITO conductive layer (2) is provided with silver coating (3), silver coating (3) is provided with by the fixing LED chip of crystal-bonding adhesive (4), encapsulated layer (5) is wrapped on LED chip in described groove (4).
2. the LED encapsulating structure that a kind of multiaspect shows according to claim 1, is characterized in that: the glass of described multi-face solid structure (1) is shaped as square, cuboid, spherical or circle rib centrum.
3. the LED encapsulating structure that a kind of multiaspect shows according to claim 1, is characterized in that: the ITO conductive layer (2) on described groove is provided with bottom portion of groove ITO conductive layer anode (2-1) and the bottom portion of groove ITO conductive layer negative electrode (2-2) forming through over etching.
4. the LED encapsulating structure that a kind of multiaspect shows according to claim 1, is characterized in that: the ITO conductive layer (2) of a side of the glass of described multi-face solid structure (1) is provided with glass outer side ITO conductive layer anode (2-3) and the glass outer side ITO conductive layer negative electrode (2-4) forming through over etching.
5. the LED encapsulating structure that a kind of multiaspect shows according to claim 4, is characterized in that: outer glass outer side silver coating anode (3-3) and the glass outer side silver coating negative electrode (3-4) of being respectively equipped with of described glass outer side ITO conductive layer anode (2-3) and glass outer side ITO conductive layer negative electrode (2-4).
6. the LED encapsulating structure that a kind of multiaspect shows according to claim 1, is characterized in that: described bottom portion of groove ITO conductive layer (2) is provided with silver coating (3) and is provided with bottom portion of groove silver coating anode (3-1) and bottom portion of groove silver coating negative electrode (3-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420279258.5U CN203883003U (en) | 2014-05-28 | 2014-05-28 | Multi-surfaced display LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420279258.5U CN203883003U (en) | 2014-05-28 | 2014-05-28 | Multi-surfaced display LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203883003U true CN203883003U (en) | 2014-10-15 |
Family
ID=51683476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420279258.5U Expired - Fee Related CN203883003U (en) | 2014-05-28 | 2014-05-28 | Multi-surfaced display LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203883003U (en) |
-
2014
- 2014-05-28 CN CN201420279258.5U patent/CN203883003U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20180528 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |