CN203884072U - Antistatic circuit board - Google Patents
Antistatic circuit board Download PDFInfo
- Publication number
- CN203884072U CN203884072U CN201420242977.XU CN201420242977U CN203884072U CN 203884072 U CN203884072 U CN 203884072U CN 201420242977 U CN201420242977 U CN 201420242977U CN 203884072 U CN203884072 U CN 203884072U
- Authority
- CN
- China
- Prior art keywords
- antistatic
- layer
- circuit board
- prepreg
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 238000007731 hot pressing Methods 0.000 claims abstract description 6
- 238000010023 transfer printing Methods 0.000 claims abstract description 4
- 238000009413 insulation Methods 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000003068 static effect Effects 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 238000011161 development Methods 0.000 description 9
- 230000018109 developmental process Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
- 239000000347 magnesium hydroxide Substances 0.000 description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000013064 chemical raw material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model relates to an antistatic circuit board. The upper layer of the antistatic circuit board is an electric conduction copper foil layer, the middle layer is an epoxy resin insulating layer made of common insulating prepregs, and the lower layer is an antistatic layer made by pressing antistatic prepregs. The three layers are bonded through hot pressing. The antistatic circuit board is formed after film pasting, circuit diagram transfer printing, etching and stripping of the surface of the electric conduction copper foil layer. Through the treatment of the substrate of the printed board, the printed board not only has the performances of common printed boards, but also has excellent antistatic performance and high-temperature and high-pressure resisting performance. Therefore, the product assembly production of downstream enterprises is simpler and more convenient, time is saved, cost is reduced and large-scale production can be carried out. The printed board also has a static protection function for weak current components, so that the assembly production efficiency of the downstream enterprises can be favorably increased.
Description
Technical field
The present invention relates to a kind of printed wiring board, specifically a kind of antistatic wiring board.
Background technology
Static and static discharge lose nowhere in our daily life, but concerning electronic device, the slight static discharge that once we cannot discover just may cause serious damage to it.The fast development of electronic technology, allowed electronic product function from strength to strength, volume is but more and more less, but this to be all electrostatic discharge susceptivity taking electronic devices and components more and more higher as cost.This be because, high integrated level means that unit line can be more and more narrow, the ability of tolerance static discharge worse and worse, in addition, the material that a large amount of new special devices use is all also electrostatic sensitive material, thereby allow electronic devices and components, particularly semi-conducting material device requires more and more higher for the electrostatic control of environment in the processes such as production, assembling and maintenance.But, the production of electronic product, use and the process such as maintenance in, can use in a large number again the various macromolecular materials of easy generation static, this has brought a more difficult problem and challenge to undoubtedly the electrostatic defending of electronic product.
Electronic industry development in recent years is maked rapid progress, and sophisticated technologies, in the process that leads its upgrading, have played catalytic action.Various advanced persons, novel, complicated electronic product emerge in an endless stream, and in the industry cycle, the replacement in three months, has become normal phenomenon.The speed of this market demand and update, makes the assembling of quite a few electronic product, has little time automatic production line, need to manufacture by hand.In the time of artificial production line assembling, conventional printed wiring board exposes the deficiency of " electrostatic interference " gradually.Because common PCB does not possess electrostatic-proof function, downstream industry workpeople, in the time carrying out surface mount operation, just need to put on special special antistatic clothing, wears antistatic gloves and wrister, and workbench also needs to do special antistatic processing.
Utility model content
The purpose of this utility model is just to provide a kind of antistatic wiring board, does not have the problem of electrostatic-proof function to solve printed circuit board self.
The utility model is achieved in that a kind of antistatic wiring board, its upper strata is copper-foil conducting electricity layer, intermediate layer is the epoxy resins insulation layer made from common insulation prepreg, and lower floor is the antistatic backing being pressed into antistatic prepreg, and three by heat pressure adhesive together; On the surface of described copper-foil conducting electricity layer through pad pasting, transfer printing line map and etching, take off after film, form antistatic wiring board.
Described antistatic prepreg is to soak after sticky antistatic resin adhesive liquid with glass-fiber-fabric, the plates of making after hot pressing, oven dry.
Antistatic prepreg in the utility model adopts the chemical raw material pressings such as carborundum, magnesium hydroxide to form, add carbon dust, make plate face itself there is light current function, then itself and insulation prepreg and Copper Foil are pressed into wiring board, make wiring board itself there is electrostatic-proof function.This prepreg adopts antistatic material to add the method in base material to produce, and realizes the antistatic performance of printed board self on the basis of traditional base material.
The antistatic panel prepreg that this prepreg uses is epoxy resin thermosetting antistatic panel, is added after antistatic material resin by glass fabric dipping, forms through HTHP; Adopt upper and lower two-layer compound static release, volume resistance≤10 of carrying out
8 Ω, electrostatic attenuation phase 5000V is to time≤1.6S of 500V.Antistatic panel and ordinary epoxy resin prepreg are suppressed the compound copper-clad plate forming; the wiring board that via line plate processes is made, has permanently antistatic performance, can protect not destruction by electrostatic field of electronic product; not dust stratification dirt and to harm, acid-alkali-corrosive-resisting.
Antistatic wiring board has solved the trouble that need to add special anti-static device when surface mounted, has reduced production cost, has improved operating efficiency.
Anti-electrostatic substrate has the characteristic of high temperature high voltage resistant, exceeds 10～20 DEG C than conventional line plate is high temperature resistant, efficiently solve the difficult problem that lead-free product needs high-temperature soldering, and product has very superior heat conduction and heat radiation ability.
The utility model, by the processing to printed board substrate, makes printed board itself except having the performance of ordinary printed plate, and (resistance is 10 also to have had antistatic
6 ～10
8 Ω) and the premium properties of high temperature resistance high pressure (thermal coefficient of expansion is 16.8 × 10
-6 / DEG C, compression strength is the highest: 450MPa), make the Product Assembly production of down-stream enterprise easier, can save time, reduce costs, be beneficial to implementation large-scale production; And the present invention also makes printed board self have the electrostatic protection function to light current components and parts, the raising of the Assembling Production efficiency to down-stream enterprise, also plays good facilitation.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
As shown in Figure 1, antistatic wiring board of the present invention, its upper strata is copper-foil conducting electricity layer 1, intermediate layer is the epoxy resins insulation layer 2 made from common insulation prepreg, lower floor is the antistatic backing 3 being pressed into antistatic prepreg, and three by heat pressure adhesive together; On the surface of described copper-foil conducting electricity layer through pad pasting, transfer printing line map and etching, take off after film, form antistatic wiring board.Described antistatic prepreg is to soak after sticky antistatic resin adhesive liquid with glass-fiber-fabric, the plates of making after hot pressing, oven dry.
The concrete manufacture method of antistatic wiring board of the present invention is:
One, the preparation of antistatic resin adhesive liquid:
1, raw material proportioning is: epoxy resin 100 g, dimethyl formamide 200～250L, dicyandiamide 5～15 g, EGME 50～100L, 2-second methylimidazole 0.1～0.2 g, magnesium hydroxide 60～70 g, carborundum 20～30 g, carbon dust 20～30 g.
2, process for preparation is: 2-second methylimidazole is first dissolved in a small amount of dimethyl formamide, then is uniformly mixed with remaining dimethyl formamide and EGME, be made into mixed solvent; In mixed solvent, add dicyandiamide, after stirring and dissolving, then add epoxy resin, magnesium hydroxide, carborundum and carbon dust, continue to be uniformly mixed, then add the 2-second methylimidazole of above-mentioned dissolving, after fully stirring, park at least 8 hours antistatic resin adhesive liquid.
3, resin adhesive liquid technical requirement: solids content 65%～70%; Gel time (170 DEG C) 200～250s.
Two, the making of antistatic prepreg:
1, operation requirements: glass-fiber-fabric enters impregnation in the glue groove that is placed with antistatic resin adhesive liquid through guide roller after uncoiling in gluing machine, after impregnation, squeeze out unnecessary glue by Extruded roller, then enter baking oven and be dried processing, the temperature of baking oven is controlled at 140～280 DEG C; During passing through baking oven, remove the volatile matter in appended glue, and make resin in semi-cured state; Go out after baking oven, cut into piece by dimensional requirement, and fitly overlay on storage rack, antistatic prepreg.
2, parameter control: oven temperature is answered segmentation control; The transmission speed of gluing machine is controlled at 1.5～4.0m/s.
Three, prepare common insulation prepreg with conventional raw material in the usual way.
Four, the making of anti-electrostatic substrate: several common insulation prepregs of lay on an antistatic prepreg, at the top of common insulation prepreg lay Copper Foil, in the middle of regulating, the quantity of common insulation prepreg is to the thickness needing.The lamination plate stacking presses together by hot press, makes anti-electrostatic substrate.
The concrete operation step of hot pressing is: the described lamination plate stacking is sent in hot press, put into the steel plate through polishing, as cover plate between the upper and lower template of hot press and described lamination plate to be laminated; Purchase two juxtaposed temperature line, its one end is fixed between upper and lower template and cover plate with adhesive tape, and the other end is received on the master control computer of hot press, for measuring substrate temperature; When hot press is warming up to 80 DEG C, start to measure substrate temperature, continue to heat up, make the heating rate of substrate temperature remain on 1～3 DEG C/min, the pressure of hot press is controlled at 10～20kg/cm
2 , in the time that substrate temperature rises to 140 DEG C, insulation 10～20min; Then make substrate temperature rise to 170～175 DEG C, pressure is adjusted into 25～30kg/cm
2, insulation 60～70min; After insulation finishes, powered-down, in the time that substrate temperature is down to below 40 DEG C, unloads the goods from the airplane, and completes hot pressing operation.
The item should be noted that is: must keep smoothly, can not having distortion, scratch or injustice as the steel plate of cover plate; The steel plate thickness amount that flushes cover plate should meet the requirements, and the steel plate to thickness lower than 2.0mm can not re-use; The depth of parallelism test of the upper and lower mould of hot press, the thickness difference < 0.27mm of difference.Stop after hot press heating, keeping under the condition that pressure is constant, should make anti-electrostatic substrate be cooled to depanning again after room temperature, the demoulding.
Five, cutting edge and sawing sheet: anti-electrostatic substrate good pressing, by product design requirement, is used to cutter trimming, and the required size of the work that cuts into, wiring board.
Six, boring: utilize to bore and chew in high rotating speed and terminal-velocity situation, in the circuit board by product design requirement, with numerically controlled drill boring, in case the circuit on conducting wiring board two sides, components and parts convenient for assembly.
Seven, figure shifts: the line pattern of required processing is first made through CAD/CAM, draw out black film egative film with optical plotter again, then copy the azo sheet of production use with described black film egative film, again described azo sheet is affixed on to the surface of wiring board according to the mode of hole bit alignment, by the mode of exposure, development, form in the circuit board conducting wire.Exposure, the process conditions of developing are: vacuumize 650～750mmHg, 7～9 grades of exposure progression; Within 15 minutes, carry out development treatment standing, in developer solution, the concentration of sodium carbonate is 1.0% later, and the temperature of development is 30 ± 2 DEG C, and the pressure of development is 1.0～1.5 kg/cm
2 .
Eight, etching: by the acid CuCl in copper face region exposing after photographic fixing on described wiring board
2solution carries out corrosion dissolution, and then wet film and the dry film effect with the light that exposed to the sun by strong base solution, takes off the rete on line pattern, remains circuit and the copper face of figure, completes etching operation, becomes printed circuit board (PCB).The specific gravity control of etching solution used is 1.26～1.32, and content of copper ion is 110～170g/L, and acid equivalent is 1.0～2.0N, and etch temperature is 50 DEG C, and speed is controlled at 1.5m/min; Take off film section: NaOH chemical concentration is 2～3%, temperature is 50～60 DEG C.
Nine, anti-welding processing: evenly coat anti-welding material and element identifier by wire mark mode on described wiring board; Described printed circuit board (PCB) to etching and after taking off film and completing carries out the operation of silk-screen welding resistance ink in the usual way.Concrete operations mode is: first, by the whole plate of automatic screen printer printing one deck welding resistance ink, leave standstill more than 15 minutes, then in baking box prebake conditions 40～45 minutes, baking temperature is 72～75 DEG C, allows ink solidification; Then with the yellow film aligning of the production of making, exposure, vacuumize 650～750mmHg, 11～13 grades of exposure progression, then leave standstill more than 15 minutes; Substrate by contraposition, after having exposed develops, and in developer solution, the concentration of sodium carbonate is 1.0%, and the temperature of development is 30 ± 2 DEG C, and the pressure of development is 1.0～2.5kg/cm
2 , the speed of development is 2.5～3.5m/min.
Ten, text printout: by product design requirement, pass through screen process press silk-screen character on the plate face of described printed circuit board (PCB), for installation and the follow-up maintenance of user's element are provided convenience.After silk-screen, toast, baking condition is: 150 DEG C, and 60 minutes.
11, sharp processing: process the profile of described printed circuit board (PCB) with gong machine in the mode of milling, make it to reach the profile of product design requirement.
12, product inspection: finished product is tested, packaging, warehouse-in.
Claims (2)
1. an antistatic wiring board, is characterized in that, its upper strata is copper-foil conducting electricity layer, and intermediate layer is the epoxy resins insulation layer made from common insulation prepreg, and lower floor is the antistatic backing being pressed into antistatic prepreg, and three by heat pressure adhesive together; On the surface of described copper-foil conducting electricity layer through pad pasting, transfer printing line map and etching, take off after film, form antistatic wiring board.
2. antistatic wiring board according to claim 1, is characterized in that, described antistatic prepreg is to soak after sticky antistatic resin adhesive liquid with glass-fiber-fabric, the plates of making after hot pressing, oven dry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420242977.XU CN203884072U (en) | 2014-05-13 | 2014-05-13 | Antistatic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420242977.XU CN203884072U (en) | 2014-05-13 | 2014-05-13 | Antistatic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203884072U true CN203884072U (en) | 2014-10-15 |
Family
ID=51684529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420242977.XU Expired - Fee Related CN203884072U (en) | 2014-05-13 | 2014-05-13 | Antistatic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203884072U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103945640B (en) * | 2014-05-13 | 2017-01-11 | 邢台市海纳电子科技有限责任公司 | Anti-static circuit board and manufacturing method thereof |
-
2014
- 2014-05-13 CN CN201420242977.XU patent/CN203884072U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103945640B (en) * | 2014-05-13 | 2017-01-11 | 邢台市海纳电子科技有限责任公司 | Anti-static circuit board and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103945640B (en) | Anti-static circuit board and manufacturing method thereof | |
| CN103945641B (en) | High heat conducting circuit board and preparation method thereof | |
| US9713261B2 (en) | Fabrication process of stepped circuit board | |
| CN103945644B (en) | Flush wiring board and preparation method thereof | |
| CN101951727B (en) | A kind of production method of circuit board electroplating board edge | |
| CN107072048A (en) | A kind of production technology optimization method of single-sided aluminum-base plate | |
| CN105188269A (en) | Ultra-thick copper circuit board and manufacturing method thereof | |
| CN104202922B (en) | Method for manufacturing rigid-flex printed circuit board with rigid areas different in thickness | |
| CN103950057A (en) | Laminating base plate for boring and preparing method thereof | |
| CN101909407B (en) | Method for etching V-CUT on iron substrate | |
| CN110099524A (en) | Lamination production method of multilayer circuit board | |
| CN104540320B (en) | The preparation method of filling holes with resin in a kind of PCB | |
| CN105131897B (en) | High heat conductive insulating Adhesive composition, high thermal conductivity aluminum matrix plate and its preparation technology | |
| CN102248202B (en) | Cover board or backing board for drilling printed circuit board, and processing method thereof | |
| CN111107717A (en) | Processing method of PCB capable of preventing finger from scratching | |
| CN203884072U (en) | Antistatic circuit board | |
| CN106034378A (en) | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof | |
| CN109714890A (en) | A method of preparing the acyclic electric hole of flexible circuit thin plate | |
| CN111836484A (en) | A processing method for back-to-back design of PCB boards | |
| CN101772270B (en) | Preprocessing method for image transfer of flexible PCB (printed circuit board) | |
| CN105338735B (en) | A kind of mixing material printed wiring board new producing method | |
| CN104812181B (en) | The photoresistance film of rigid-flex combined board with flexible structure outer layer keeps away infiltration technique | |
| CN203872427U (en) | High heat conduction circuit board | |
| CN105744766A (en) | Fabrication method of high density interconnector (HDI) plate | |
| CN206353884U (en) | A kind of complex function substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: XINGTAI HAINA ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHANG BOPING Effective date: 20150128 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 054000 XINGTAI, HEBEI PROVINCE TO: 054700 XINGTAI, HEBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150128 Address after: 054700 Weixian County Economic Development Zone, Hebei Province, open road, No. 3, No. Patentee after: Xingtai Haina Electronics Technology Co., Ltd Address before: 054000 Weixian County Hebei Xingtai Open Road No. 1 Haina electronics company Patentee before: Zhang Boping |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20170513 |