CN203871321U - Packaging structure of integrated drive circuit of brushless direct current motor - Google Patents

Abstract

The utility model relates to a packaging structure of an integrated drive circuit of a brushless direct current motor. The package structure includes a lead frame, a plurality of chips are adhered to a base island of the lead frame and electrically connected with the lead frame, and the chips and the lead frame are packaged through packaging plastic and then solidified. According to the package structure in the utility model, three IC chips and six field-effect tubes are packaged in the same circuit, and thus the integrated drive circuit of the brushless direct current motor is obtained, thereby greatly simplifying design of an application circuit, improving the integration level of the application circuit, improving stability and reliability of the application circuit, and decreasing the volume of the drive circuit. According to the package structure of the integrated drive circuit of the brushless direct current motor in the utility model, screening of electrical parameters of a device is not needed, cost can be reduced obviously, and production efficiency can be improved.

Description

Packaging structure of brushless DC motor integrated drive circuit

technical field

The utility model relates to the technical field of integrated circuit packaging, in particular to a packaging structure for an integrated drive circuit of a brushless DC motor.

Background technique

At present, most of the brushless DC motor drive circuits use a combination of discrete components. The brushless DC motor drive circuit designed with discrete components has the following two problems: first, the integration level is low, the circuit structure is relatively complex, and the reliability is low. As shown in Figure 1, the electrical parameters of 3 IC chips and 6 FETs are relatively consistent, so that the circuit can operate reliably. Therefore, the electrical parameters of IC chips and FETs must be tested and paired when making PCB boards. , The test is more complicated and time-consuming, which not only reduces the production efficiency, but also increases the production cost; second, the brushless DC motor drive circuit designed with discrete components is relatively large, which is not conducive to the miniaturization of the product.

Utility model content

The purpose of the utility model is to provide a package structure of a brushless DC motor integrated drive circuit with small volume, which can greatly simplify application circuit design and improve circuit integration and reliability.

In order to achieve the above purpose, the utility model adopts the following technical solutions: a packaging structure of a brushless DC motor integrated drive circuit, including a lead frame, a plurality of chips are bonded to the base island of the lead frame and electrically connected to the lead frame , the chip and the lead frame are encapsulated by encapsulating plastic and then post-cured.

The chip includes three IC chips and six field effect transistors, three base islands for IC chip bonding are arranged on one side of the lead frame, and three base islands for bonding the field effect transistors are arranged on the other side of the lead frame. There are six base islands, and a plurality of pins are arranged on the periphery of the base islands.

The encapsulation plastic adopts epoxy resin.

The IC chip and the pins of the lead frame, the IC chip and the field effect tube, and the field effect tube and the pins of the lead frame are all connected by bonding wires.

Both the IC chip and the field effect transistor are bonded on the base island of the lead frame through a chip adhesive, and the chip adhesive is silver glue.

The bonding wires are gold wires or copper wires.

It can be seen from the above technical scheme that the utility model packs 3 IC chips and 6 field effect transistors in the same circuit to obtain a brushless DC motor integrated drive circuit, which greatly simplifies the design of the application circuit and is suitable for large-scale application ; Since 3 IC chips and 6 field effect transistors are packaged in the same circuit, firstly the integration of the application circuit is improved, secondly the stability and reliability of the application circuit are improved, and the volume of the drive circuit is reduced , which is conducive to the miniaturization of products. The utility model does not need to screen the electrical parameters of the device, and can obviously reduce the cost and improve the production efficiency during application.

Description of drawings

Fig. 1 is a drive circuit diagram of a brushless DC motor designed using discrete components in the prior art;

Fig. 2 is the structural representation of lead frame in the utility model;

Fig. 3 is the schematic diagram after IC chip and field effect tube are bonded in lead frame among the utility model;

Fig. 4 is a schematic diagram of bonding and wire bonding of the present utility model;

Fig. 5 is a top view of the package appearance of the utility model;

Fig. 6 is a side view of the package appearance of the present invention.

Detailed ways

A packaging structure for a brushless DC motor integrated drive circuit, including a lead frame 1, a plurality of chips bonded on the base island 2 of the lead frame 1 and electrically connected to the lead frame 1, the chips and the lead frame 1 are encapsulated by plastic Encapsulation and curing, as shown in Figures 2, 3, 4, 5, and 6.

As shown in Figures 2 and 3, the chip includes three IC chips 3 and six field effect transistors 4, and three base islands 2 for bonding IC chips 3 are arranged on one side of the lead frame 1, and the lead frame On the other side of 1, six base islands 2 for bonding field effect transistors 4 are arranged, and a plurality of pins 5 are arranged on the periphery of the base islands 2 . The IC chip 3 and the field effect transistor 4 are bonded on the base island 2 of the lead frame 1 through a chip adhesive, and the chip adhesive is silver glue. A total of two chip bonding is required. For the first time, three IC chips 3 are bonded to the base island 2 of the lead frame 1 through a chip adhesive; for the second time, six field effect transistors 4 are bonded through a chip adhesive Bonded on the base island 2 of the lead frame 1.

As shown in Figure 4, between the IC chip 3 and the pin 5 of the lead frame 1, between the IC chip 3 and the field effect tube 4, and between the field effect tube 4 and the pin 5 of the lead frame 1 The bonding wires are connected, and the bonding wires are gold wires or copper wires. the

When the utility model is packaged, at first, three IC chips 3 and six field effect tubes 4 are bonded on the base island 2 of the lead frame 1 by a chip adhesive using an automatic chip bonder; 3 and the lead frame 1 of the field effect tube 4 are placed in an oven filled with nitrogen for high-temperature baking at a temperature of 175°C for 1 hour, so that the chip adhesive is cured, and then automatic bonding is performed; machine to electrically connect between the IC chip 3 and the lead frame 1, between the IC chip 3 and the field effect tube 4, and between the field effect tube 4 and the lead frame 1; finally, use an injection molding machine to bond the IC chip 3 and the lead frame 1 of the field effect tube 4 are encapsulated and post-cured, and the encapsulating plastic adopts epoxy resin. The encapsulating material in the utility model is the KL4000-1TF model molding compound of Henkel Warwick, and the molding compound The post-curing temperature is 175°C, which needs to be heated for 4 hours; after encapsulation and post-curing, the pin 5 on the outside of the lead frame 1 is plated with a tin layer using an electroplating machine. The thickness of the tin layer is 5-15um. Tin plating is convenient for end customers Use; use the automatic laser marking machine to mark the product model, batch number and other information on the surface of the plastic package; use the automatic cutting and bending machine to cut and bend the entire packaging structure.

In summary, the utility model packs three IC chips 3 and six field effect transistors 4 in the same circuit to obtain a brushless DC motor integrated drive circuit, which greatly simplifies the design of the application circuit and improves the performance of the application circuit. The integration level improves the stability and reliability of the application circuit and reduces the size of the drive circuit. The utility model does not need to screen the electrical parameters of the device, can obviously reduce the cost and improve the production efficiency.

Claims (6)

1. the encapsulating structure of a brshless DC motor integrated drive electronics, it is characterized in that: comprise lead frame (1), multiple die bondings above and with lead frame (1) are electrically connected on lead frame (1) Ji island (2), and chip and lead frame (1) solidify afterwards by sealing plastic encapsulation again.

2. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 1, it is characterized in that: described chip comprises three IC chips (3) and six field effect transistor (4), in one side of described lead frame (1), arrange for the bonding San Geji of IC chip (3) island (2), on the opposite side of lead frame (1), arrange for the bonding Liu Geji of field effect transistor (4) island (2), the periphery of Ji Dao (2) arranges multiple pins (5).

3. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 1, is characterized in that: described in seal plastics adopt epoxy resin.

4. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 2, is characterized in that: between described IC chip (3) and the pin (5) of lead frame (1), between IC chip (3) and field effect transistor (4), be all connected by bonding lead between field effect transistor (4) and the pin (5) of lead frame (1).

5. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 2, it is characterized in that: it is upper that described IC chip (3), field effect transistor (4) are all bonded in lead frame (1) Ji island (2) by die adhesive, and described die adhesive is elargol.

6. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 4, is characterized in that: described bonding lead adopts gold thread or copper cash.