CN203817634U - Multihead efficient laser processing system - Google Patents
Multihead efficient laser processing system Download PDFInfo
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- CN203817634U CN203817634U CN201420143379.7U CN201420143379U CN203817634U CN 203817634 U CN203817634 U CN 203817634U CN 201420143379 U CN201420143379 U CN 201420143379U CN 203817634 U CN203817634 U CN 203817634U
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- 238000012545 processing Methods 0.000 title claims abstract description 94
- 230000007246 mechanism Effects 0.000 claims description 34
- 238000003754 machining Methods 0.000 claims description 32
- 239000000523 sample Substances 0.000 claims description 21
- 238000003698 laser cutting Methods 0.000 claims description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 11
- 230000008901 benefit Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 26
- 230000008569 process Effects 0.000 description 23
- 238000002310 reflectometry Methods 0.000 description 18
- 230000005540 biological transmission Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
- 238000010147 laser engraving Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009851 ferrous metallurgy Methods 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of laser processing and discloses a multihead efficient laser processing system. The system comprises a laser, a first light splitter, a detector, a light splitting device and laser processing heads, wherein the first light splitter corresponds to the laser, the detector is arranged on a transmitted light path of the first light splitter, the light splitting device is arranged on a reflected light path of the first light splitter, laser reflected by the first light splitter is split into at least two split laser beams of equal energy by the light splitting device, and the laser processing heads are respectively arranged on all the split laser beams. The system has the advantages of high laser utilization ratio and processing efficiency.
Description
Technical field
The utility model relates to technical field of laser processing, in particular, and particularly a kind of multi-head high-efficiency laser-processing system.
Background technology
Laser, due to its high brightness, high directivity, high monochromaticity and high coherence's advantage, has been widely used in the importance of the national products such as scientific research, national defence, industry.At industrial circle, Laser Processing is as advanced manufacturing technology, have advantages of that efficient, high accuracy, high-quality, scope are wide, energy-conserving and environment-protective can realize flexibility and process and ultra tiny processing, be widely used in fields such as automobile, electronic circuit, electrical equipment, Aero-Space, Ferrous Metallurgy, machine-building, and such as, reached higher level in some industry (automobile, electron trade etc.).To improving the quality of products, labor productivity, automation, pollution-free, reduce material consumption etc. and play more and more important effect.
Along with the development of laser technology, laser application technique is also furtherd investigate, wherein with the fastest developing speed in the application of industrial aspect of laser technology.Because laser can be realized the processing to most of materials, and crudy is reliable and stable, laser is processed the special material such as high rigidity, high fragility in addition, therefore extensive use in industrial processes of Laser Processing, for example, at aspects such as laser labelling, laser engraving, laser cutting, laser weld, laser melting coating, laser roughening, laser three-D printings, all there is corresponding industrial integrated equipment, be widely used among industrial production and processing.But, because laser technology belongs to hi-tech industry, the businessman that grasps this technology is also few, so comprise that the price such as laser instrument, laser optics sheet is high, cause laser process equipment expensive, and many laser process equipments of batch production needs, increase processing or production cost, cause laser process equipment cannot be applied to widely the production of every profession and trade.
In order to reduce the cost of laser process equipment, enhance productivity, someone has designed double laser process equipment, add man-hour when a station enters laser process equipment, another station can carry out the operations such as material loading, blanking, in the time of first station process finishing, second station enters machining state immediately, can maximizedly utilize like this laser beam, improve Laser Processing efficiency, but still be difficult to meet the efficient requirement of industrial production.Cause the large batch of industrial processes must large batch of equipment, cause cost to roll up, seriously reduced and produced or the benefit of processing.And, at present, along with the development of laser technique, high power laser is more and more ripe, and common laser process equipment is not high to the utilization rate of laser power, cause great waste, therefore in order to improve the cost of laser process equipment, improve laser instrument utilization rate, reduce the use cost of laser process equipment, increase the benefit of Laser Processing or production, reduce the resource cost on Laser Processing product, reduce the cost of single converted products, improve the price competitiveness of single Laser Processing product, the laser instrument of laser process equipment need to be made full use of, ensure that laser instrument is to be similar to saturated state running, use to greatest extent laser instrument, so the light beam of laser instrument need to be assigned in multiple processing heads, thereby use multiple processing heads to process simultaneously.
Utility model content
The purpose of this utility model is for the technical problem existing in prior art, and a kind of multi-head high-efficiency laser-processing system that improves laser instrument utilization rate and working (machining) efficiency is provided.
In order to solve problem set forth above, the technical solution adopted in the utility model is:
A kind of multi-head high-efficiency laser-processing system, this system comprises laser instrument, first spectroscope corresponding with laser instrument, be arranged on the detector on first spectroscopical transmitted light path, be arranged on the light-dividing device on first spectroscopical reflected light path, the laser that described light-dividing device reflects the first spectroscope is divided into the equal laser beam splitter of at least two group energy, and this system also comprises the laser Machining head being arranged on every group of laser beam splitter.
According to a preferred embodiment of the present utility model: described light-dividing device comprises at least one second spectroscope, and be arranged on the first speculum on second spectroscopical transmitted light path, and the energy of laser beam splitter on the reflected light path of laser beam splitter on described second spectroscopical reflected light path and the first speculum equates.
According to a preferred embodiment of the present utility model: be equipped with the second speculum on described second spectroscopical reflected light path and on the reflected light path of the first speculum.
According to a preferred embodiment of the present utility model: described laser Machining head is probe, is also provided with the 3rd speculum between each probe and the second speculum.
According to a preferred embodiment of the present utility model: described probe comprises body, and be located at intrinsic X-axis galvanometer motor, X-axis galvanometer eyeglass, Y-axis galvanometer motor, Y-axis galvanometer eyeglass and scanning lens, described X-axis galvanometer eyeglass is rotatable to be arranged on X-axis galvanometer motor, described Y-axis galvanometer eyeglass is rotatable to be arranged on Y-axis galvanometer motor, the reflected light path of described the 3rd speculum is corresponding with the input path of X-axis galvanometer eyeglass, described X-axis galvanometer lens reflecting light path is corresponding with the input path of Y-axis galvanometer eyeglass, described scanning lens is corresponding with X-axis galvanometer eyeglass and Y-axis galvanometer eyeglass.
According to a preferred embodiment of the present utility model: described laser Machining head is laser cutting head.
According to a preferred embodiment of the present utility model: also comprise pedestal, portal frame and platform, described portal frame is installed on a side of pedestal, described platform is installed on portal frame, described laser instrument, the first spectroscope, detector and light-dividing device are all installed on platform, and described laser Machining head is liftable to be installed on portal frame.
According to a preferred embodiment of the present utility model: also comprise the X-axis travel mechanism being located on pedestal, be installed on the y-axis shift actuation mechanism in X-axis travel mechanism, be installed on the processing platform in y-axis shift actuation mechanism, and described laser Machining head is installed on portal frame by Z axis travel mechanism.
According to a preferred embodiment of the present utility model: also comprise the casing for this system of processing is installed, be also provided with window, function button, display and signal alarm lamp on described casing.
Compared with prior art, the beneficial effects of the utility model are:
1, laser beam is divided into multi beam by the utility model, and wherein a branch of as detecting light beam, the output of monitoring laser in real time, ensure that laser instrument output need to be consistent with machining, and the mean power of other laser beam splitter or energy all equate, therefore can provide laser beam splitter that multi beam is identical to laser Machining head, realize and ensure precision machined quality, and multiple laser beam splitting can be processed simultaneously, can greatly enhance productivity, improve the mean power of laser instrument or the utilization rate of energy, reduce the input of laser process equipment, thereby raising productivity effect.
2, the utility model uses minimum optics, and light channel structure is simple, convenient adjusting, and carry out optical path arrangement, and make whole light path system compact conformation, occupy little space, be applicable to Precision Machining process equipment.
Brief description of the drawings
Fig. 1 is the light path schematic diagram of multi-head high-efficiency laser-processing system of the present utility model.
Fig. 2 is the stereogram of multi-head high-efficiency laser-processing system of the present utility model.
Fig. 3 is the structural representation of the embodiment mono-of multi-head high-efficiency laser-processing system of the present utility model.
Fig. 4 is the structural representation of the embodiment mono-of multi-head high-efficiency laser-processing system of the present utility model.
Fig. 5 is the structural representation of probe in the embodiment bis-of multi-head high-efficiency laser-processing system of the present utility model.
Fig. 6 is the light path schematic diagram of the embodiment tri-of multi-head high-efficiency laser-processing system of the present utility model.
Fig. 7 is the structural representation of the embodiment tetra-of multi-head high-efficiency laser-processing system of the present utility model.
Description of reference numerals: 1, laser instrument, 2, the first spectroscope, 3, detector, 4, light-dividing device, 8, laser cutting head, 9, portal frame, 10, X-axis travel mechanism, 11, y-axis shift actuation mechanism, 12, Z axis travel mechanism, 13, casing, 14, window, 15, function button, 16, display, 17, signal alarm lamp, 18, platform, 19, pedestal, 41, the second spectroscope, 42, the first speculum, 5, the second speculum, 6, the 3rd speculum, 7, probe, 71, body, 72, X-axis galvanometer motor, 73, X-axis galvanometer eyeglass, 74, Y-axis galvanometer motor, 75, Y-axis galvanometer eyeglass, 76, scanning lens.
Detailed description of the invention
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.In accompanying drawing, provide preferred embodiment of the present utility model.But the utility model can be realized in many different forms, be not limited to embodiment described herein.On the contrary, providing the object of these embodiment is to make to the understanding of disclosure of the present utility model more thoroughly comprehensively.
Unless otherwise defined, all technology that use are herein identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term using in description of the present utility model herein, just in order to describe the object of specific embodiment, is not intended to be restriction the utility model.
Embodiment mono-
Consult shown in Fig. 1～Fig. 2, a kind of multi-head high-efficiency laser-processing system that the present embodiment provides, this system comprises laser instrument 1, first spectroscope 2 corresponding with laser instrument 1, be arranged on the detector 3 on the transmitted light path of the first spectroscope 2, be arranged on the light-dividing device on the reflected light path of the first spectroscope 2, the laser that described light-dividing device reflects the first spectroscope 2 is divided into the equal laser beam splitter of at least two group energy, and this system also comprises the laser Machining head being arranged on every group of laser beam splitter.
The laser beam S1 that in the present embodiment, laser instrument 1 sends, if now the energy of laser beam is P, first arrive the first spectroscope 2, the eyeglass that it is A that the first spectroscope 2 adopts laser beam reflectivity, it is 1-A to the transmissivity of laser beam, wherein 90%<A<98%, therefore, seldom the laser beam transmission of portion of energy is crossed the first spectroscope 2, form and survey beam splitting T1, the energy of surveying beam splitting T1 is P(1-A), survey beam splitting T1 and arrive detector 3, and detector 3 can be selected mean power detector, or pulsed laser energy detector, or be laser pulse time width detector, or exploring laser light mean power simultaneously, pulse energy, the integrated detector of burst length width.Mean power by detector 3 to detection beam splitting T1 or pulsed laser energy or laser pulse width are surveyed, for example: in the time adopting integrated detector, exploring laser light mean power, pulse energy, burst length width simultaneously, therefore, detector 3 can real-time collecting, detection laser mean power, pulse energy, burst length width parameter.
In the time of concrete use, for different application scenarios, can select dissimilar detector, thereby obtain the parameter of the detection beam splitting needing.Detector 3 is sent to the parameter of the detection beam splitting T1 of real-time collecting in the Industrial Control Computer of whole equipment, by Industrial Control Computer according to the transmissivity of the first spectroscope 2, can calculate the parameter of laser beam, process needed parameter while not meeting when finding parameters of laser beam and equipment, can transmit a signal to laser instrument 1, change the output of laser instrument 1, change the parameters of laser beam of being launched by laser instrument, until meet the parameter that equipment machining needs, therefore the multi-head high-efficiency laser-processing system of the present embodiment can ensure the stability of laser instrument in equipment running process, the parameter running that laser instrument is needed with the equipment machining of setting always.
Described light-dividing device comprises at least one second spectroscope 41, and be arranged on the first speculum 42 on the transmitted light path of the second spectroscope 41, and the energy of laser beam splitter on the reflected light path of laser beam splitter on the reflected light path of described the second spectroscope 41 and the first speculum 42 equates.In the time that the second spectroscope 41 is selected different number, the parameter of each the second spectroscope 41 is inconsistent, the reflectivity and the transmissivity that is to say each the second spectroscope 41 are inconsistent, in the time that the second spectroscope 41 is one, the ratio of its reflectivity and transmissivity is: 50%:50%, and in the time that the second spectroscope 41 exceedes one, second reflectivity of spectroscope 41 and the ratio of transmissivity increase successively (doing respectively below concrete introduction in embodiment bis-, three and four) on optical path direction.The energy that can ensure like this energy of laser beam splitter on the reflected light path of each the second spectroscope 41 and the laser beam splitter on the reflected light path of the first speculum 42 equates.
In the present embodiment, adopting the second spectroscope 41 is two, the first speculum 42 is one, above-mentioned laser beam is laser beam S2 through the light beam after the first spectroscope 2, its energy is PA, laser beam S2 arrives first the second spectroscope 41, the reflectivity of this second spectroscope 41 to laser and the ratio of transmissivity are: 33.3%:66.6%, that is to say that 1/3 beam energy is reflected, form laser beam splitter S3, therefore the energy of this laser beam splitter S3 is 1/3PA, and the beam energy of residue 2/3 is transmitted, light beam after transmission, arrive second the second spectroscope 41 through transmission, the reflectivity of this second spectroscope 41 to laser and the ratio of transmissivity are 50%:50%, that is to say that the laser beam energy reflecting through the second spectroscope 41 is 50%*2/3PA=1/3PA, that is to say that 1/3 beam energy is reflected, form laser beam splitter S4, and be 50%*2/3PA=1/3PA through the beam energy of the second spectroscope 41 transmissions, arrive the first speculum 42, reflected by the first speculum 42, the first speculum 42 is 100% to the reflectivity of laser, therefore the energy of the laser beam splitter S5 reflecting through the first speculum 42 is also 1/3PA.Like this, the present embodiment has only used 2, two the second spectroscopes 41 of the first spectroscope and first speculum 42, has realized laser beam is divided into four parts, wherein the effect of detecting light beam T1 is as detecting and monitoring use, and the energy of the laser beam splitter S3, the S4 that obtain and S5 equates, be all 1/3PA, can use the laser beam that this three beams is identical to process, and whole light path system is simple in structure, convenient adjusting, the area that takes up space is few, is applicable to various laser accurate systems of processing.
The present embodiment is equipped with the second speculum 5 on the reflected light path of described the second spectroscope 41 and on the reflected light path of the first speculum 42.
Consult shown in Fig. 3, the laser Machining head that the present embodiment adopts is probe 7, between each probe 7 and the second speculum 5, is also provided with the 3rd speculum 6.Using after light path in Fig. 1 obtains laser beam splitter that three beam energies are identical, wherein laser beam splitter S3 is reflected by first second speculum 5, vertical sand shooting downwards, the reflectivity of this second speculum 5 is 100%, under this second speculum 5, there is first the 3rd speculum 6 to reflect, enter first probe 7, first the 3rd speculum 6 is 100% to the reflectivity of laser, for laser beam splitter S4 and laser beam splitter S5, equally, respectively by second the second speculum 5 and second the 3rd speculum 6, the 3rd the second speculum 5 and the 3rd the 3rd speculum 6 reflect, enter respectively second probe 7 and the 3rd probe 7, and second the second speculum 5, second the 3rd speculum 6, the 3rd the second speculum 5 and the 3rd the 3rd speculum 6 are all that laser 100% is reflected.
Consult shown in Fig. 4, probe 7 in the present embodiment comprises body 71, and be located at intrinsic X-axis galvanometer motor 72, X-axis galvanometer eyeglass 73, Y-axis galvanometer motor 74, Y-axis galvanometer eyeglass 75 and scanning lens 76, described X-axis galvanometer eyeglass 73 is rotatable to be arranged on X-axis galvanometer motor 72, described Y-axis galvanometer eyeglass 75 is rotatable to be arranged on Y-axis galvanometer motor 74, the reflected light path of described the 3rd speculum 6 is corresponding with the input path of X-axis galvanometer eyeglass 73, described X-axis galvanometer eyeglass 73 reflected light paths are corresponding with the input path of Y-axis galvanometer eyeglass 75, described scanning lens 76 is corresponding with X-axis galvanometer eyeglass 73 and Y-axis galvanometer eyeglass 75.Respectively through laser beam splitter S3, S4 and the S5 of three the 3rd speculums 6, first arrive the X-axis galvanometer eyeglass 73 of probe 7 inside, X-axis galvanometer eyeglass 73 is 100% to the reflectivity of laser, X-axis galvanometer eyeglass 73 is arranged on X-axis galvanometer motor 72, driven by X-axis galvanometer motor 72, can rotate around central shaft.Laser incides Y-axis galvanometer eyeglass 75 after being reflected by X-axis galvanometer eyeglass 73, and same, Y-axis galvanometer eyeglass 75 is also fixed on Y-axis galvanometer motor 74, and can be around its central shaft rotation.The laser reflecting through Y-axis galvanometer eyeglass 75 incides scanning lens 76, scanning lens 76 is 100% to the transmissivity of laser beam, scanning lens 76 can be common field flattening lens, be f-theta lens, or telecentric lens, this scanning lens 76 can focus on laser beam, and the laser beam after scanning lens 76 is focusing trend, and the highest in focal position energy density, therefore can carry out Laser Processing.
Consult again shown in Fig. 3, the system of processing of the present embodiment also comprises pedestal 19, portal frame 9 and platform 18, described portal frame 9 is installed on a side of pedestal 19, described platform 18 is installed on portal frame 9, described laser instrument 1, the first spectroscope 2, detector 3 and light-dividing device are all installed on platform 18, and described laser Machining head is liftable to be installed on portal frame 9.And comprise the X-axis travel mechanism 10 being located on pedestal 19, be installed on the y-axis shift actuation mechanism 11 in X-axis travel mechanism 10, be installed on the processing platform (not shown) in y-axis shift actuation mechanism 11, and described laser Machining head is installed on portal frame 9 by Z axis travel mechanism 12.
Above-mentioned X-axis travel mechanism 10 and y-axis shift actuation mechanism 11 form cross platform, under the control of Industrial Control Computer, X-axis travel mechanism 10 can move along directions X processing platform (not shown), y-axis shift actuation mechanism 11 can make platform move along Y-direction, and X-axis travel mechanism 10 and y-axis shift actuation mechanism 11 are all arranged on marmorean pedestal 19, and adopt marmorean portal frame 9, ensure that X-axis travel mechanism 10 and y-axis shift actuation mechanism 11 are in the time of high-speed motion, the stability of laser-processing system entirety, avoid causing vibrations, affect machining accuracy.
Three probes 7 are all arranged in Z axis travel mechanism 12, and three probes 7 installation site in Z axis travel mechanism 12 is a horizontal line and distributes, and therefore three probes 7 are identical apart from the distance of cross processing platform (JiXZhou travel mechanism 10 forms workbench with y-axis shift actuation mechanism 11).Under the control of Industrial Control Computer, three probes 7 can move up and down along with Z axis travel mechanism 12.Therefore,, in the time selecting the scanning lens 76 of different focal, can, by the upper-lower position of Industrial Control Computer control Z axis travel mechanism 12, can, by the focal adjustments of scanning lens 76 to cross processing platform, can carry out Laser Processing.
Consult shown in Fig. 2, the efficient laser-processing system of the present embodiment adopts Industrial Control Computer to control, the system of processing of the present embodiment also comprises the casing 13 for this system of processing is installed, on described casing 13, be also provided with window 14, function button 15, display 16 and signal alarm lamp 17, concrete, signal alarm lamp 17, at the front of equipment upper right quarter, in the time that equipment is worked, provides alarm signal.Display 16 in the positive upper right corner, by display, can show in real time the procedure of Industrial Control Computer control, editting function is also provided.Function button 15, below display, comprises power-on button, starts processing, stops waiting button.Window 14, in front, hits exactly side on the upper side, can carry out the operations such as material loading, blanking.
Adopt the multiple head laser system of processing shown in Fig. 3, increase the scope of time processing scanning, due to the Laser Processing of existing common single probe, the scope of its scanning machining is limited by scanning lens, when scanning lens one timing, its maximum machinable scope is certain, therefore, in the time that the scope of needs processing is greater than the maximum scan scope of scanning lens, must first complete the processing within the scope of scanning lens maximum scan, then stop Laser output, then make cross processing platform move certain distance, then opening laser, and then scan, like this, the whole scope that needs processing is divided among a small circle multiple, one of every processing among a small circle, all will mobile cross workbench, all to carry out corresponding laser switch action, greatly reduce working (machining) efficiency.And because laser instrument is in the time starting to export, power and energy are unstable, cause Precision Machining Quality Down, have reduced the yields of product.Use the multi-head high-efficiency laser accurate system of processing of the present embodiment, sweep limits can be brought up to original three times, be disposable three times of can scan single probe sweep limits, therefore, for the laser processing workpiece of common size, can one-off scanning completion of processing, and for large-sized laser processing workpiece, can pass through mobile cross processing platform, but, due to the increase of sweep limits, can greatly reduce the mobile number of times of cross processing platform, greatly improve the efficiency of Laser Processing.
Multiple head laser precision machining system in the present embodiment shown in Fig. 3, can complete the Laser Processings such as the laser cutting of such as laser labelling, laser-induced thermal etching, laser engraving and thin material (thickness is lower than 0.3mm).
In the present embodiment, the wavelength of selected laser instrument 1 can be 200nm～1300nm, and 9.0 μ m～11 μ m; And laser instrument 1 can be selected optical fiber laser, all solid state laser or CO2 laser instrument as required.
The advantage of the present embodiment is: laser beam is divided into multi beam 1., and wherein a branch of as detecting light beam, the output of monitoring laser in real time, ensure that laser instrument output need to be consistent with machining, and the mean power of other laser beam splitter or energy all equate, therefore can provide laser beam splitter that multi beam is identical to laser Machining head, realize and ensure precision machined quality, and multiple laser beam splitting can be processed simultaneously, can greatly enhance productivity, improve the mean power of laser instrument or the utilization rate of energy, reduce the input of laser process equipment, thereby raising productivity effect.2, the present embodiment uses minimum optics, and light channel structure is simple, convenient adjusting, and carry out optical path arrangement, and make whole light path system compact conformation, occupy little space, be applicable to Precision Machining process equipment.
Embodiment bis-
To the laser accurate processing of thicker material (thickness is greater than 0.3mm), due to the shortcoming of scanning type laser processing itself, be difficult to realize, so providing the mode of cutting, processes the present embodiment.
Consult shown in Fig. 5, the present embodiment and embodiment mono-are basic identical, and difference is: the laser Machining head that the present embodiment is selected is laser cutting head 8, and its course of work is:
Laser beam splitter S3, S4 and S5 are reflected by three the second speculums 5 respectively, and incide vertically downward respectively three laser cutting heads 8, owing to all containing the eyeglass that laser beam is focused in three laser cutting heads 8, can focus on laser, thereby complete Laser Processing.And three laser cutting heads 8 are fixed in Z axis travel mechanism 12 and in the same horizontal line, three laser cutting heads 8 can move up and down along with Z axis travel mechanism 12.Due to the common laser-processing system of only having a cutting head, in process, need first to move to by cross processing platform the position that needs processing, then laser instrument is opened, and cutting head is motionless, cross processing platform is processed according to process requirements, and then laser instrument cuts out, cross processing platform moves to the next position that needs processing, again open laser instrument, process, in the time processing for example intensive aperture, cross processing platform need to repeatedly move, Efficiency Decreasing.So adopt the multi-head high-efficiency laser accurate system of processing of the present embodiment, for the smaller processing work of size, can three workpiece of disposable processing, be about to the below that three workpieces to be processed are put in respectively three laser cutting heads 8, open laser instrument 1, cross processing platform is according to graphics processing campaign, and the disposable Precision Machining that can complete three workpieces to be processed, has improved working (machining) efficiency greatly.And for example, for the processing (: the aperture of processing intensive rule on large scale material) of similar multiple figures of larger-size workpiece, intensive figure to be processed can be divided into three regions, the figure in each region is identical, therefore can adopt three laser cutting heads 8, a region of each cutting head processing, makes the efficiency of processing improve three times.
Embodiment tri-
Consult shown in Fig. 6, the present embodiment is basic identical with enforcement one or embodiment bis-, difference is: the number of the second spectroscope 41 is chosen as one, the first speculum 42 is one, that is to say, laser beam splitter always has 2 bundles, in this case, if the energy of the laser beam S1 that laser instrument 1 sends is P, first arrive the first spectroscope 2, the eyeglass that it is A that the first spectroscope 2 adopts laser beam reflectivity, it is 1-A to the transmissivity of laser beam, wherein 90%<A<98%, the energy of surveying beam splitting T1 is P (1-A), the light beam S2 reflecting through the first spectroscope 2, energy is PA, again through the second spectroscope 41, reflectivity and the transmissivity ratio of the second spectroscope 41 to laser beam is: 50%:50%, the energy of the light beam therefore reflecting through the second spectroscope 41 is 50%PA, and be 50%PA through the energy of the light beam of the second spectroscope 41 transmissions, and inferior through the first speculum 42, the first speculum 42 is 100% to the reflectivity of laser, therefore energy is 50%PA, so obtained 2 beam energies and be all the laser beam splitter of 50%PA.
Embodiment tetra-
Consult shown in Fig. 7, the present embodiment is basic identical with enforcement one or embodiment bis-, and difference is: the number of the second spectroscope 41 is chosen as three, and the first speculum 42 is one, that is to say, laser beam splitter always has 4 bundles, in this case;
If the energy of the laser beam S1 that laser instrument 1 sends is P, first arrive the first spectroscope 2, the eyeglass that it is A that the first spectroscope 2 adopts laser beam reflectivity, it is 1-A to the transmissivity of laser beam, wherein 90%<A<98%, the energy of surveying beam splitting T1 is P (1-A), the energy of the light beam S2 reflecting through the first spectroscope 2 is PA, pass through again first the second spectroscope 41, reflectivity and the transmissivity ratio of first second spectroscope 41 to laser beam is 1:3, therefore the energy of the light beam of these second spectroscope, 41 reflections of process and transmission is respectively: 1/4PA, 3/4PA, the energy of reflecting part is 1/4PA, be laser beam splitter S3, wherein transmitted light beam portion of energy is 3/4PA, arrive second the second spectroscope 41, reflectivity to laser beam of second the second spectroscope 41 and transmissivity are than being 1:2, so the energy through the light beam of second the second spectroscope 41 reflection and transmission is respectively: 3/4PA*1/3=1/4PA, 3/4PA*2/3=1/2PA, the energy of reflecting part is 1/4PA, is laser beam splitter S4, wherein transmissive portion energy is 1/2PA, arrive the 3rd the second spectroscope 41, reflectivity to laser beam of the 3rd the second spectroscope 41 and transmissivity are than being 1:1, therefore be respectively through the energy of the light beam of the 3rd the second spectroscope 41 reflection and transmission: 1/2PA*1/2=1/4PA, 1/2PA*1/2=1/4PA, the energy of reflecting part is 1/4PA, is laser beam splitter S5, wherein transmissive portion, again through the reflection of the first speculum 42, forms laser beam splitter S6, and the first speculum 42 is 100% to laser reflectivity, so the energy of laser beam splitter S6 is 1/4PA.Like this, just obtain identical laser beam splitter S3, S4, S5 and the S6 of four beam energies.
Above-described embodiment is preferably embodiment of the utility model; but embodiment of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify; for example: the quantity that changes the second spectroscope 41; laser beam splitter is made as to five bundles, six bundle or multi beams more; all should be equivalent substitute mode, within being included in protection domain of the present utility model.
Claims (9)
1. a multi-head high-efficiency laser-processing system, it is characterized in that: this system comprises laser instrument (1), first spectroscope (2) corresponding with laser instrument (1), be arranged on the detector (3) on the transmitted light path of the first spectroscope (2), be arranged on the light-dividing device on the reflected light path of the first spectroscope (2), the laser that described light-dividing device reflects the first spectroscope (2) is divided into the equal laser beam splitter of at least two group energy, and this system also comprises the laser Machining head being arranged on every group of laser beam splitter.
2. multi-head high-efficiency laser-processing system according to claim 1, it is characterized in that: described light-dividing device comprises at least one second spectroscope (41), and be arranged on the first speculum (42) on the transmitted light path of the second spectroscope (41), and the energy of laser beam splitter on the reflected light path of laser beam splitter on the reflected light path of described the second spectroscope (41) and the first speculum (42) equates.
3. multi-head high-efficiency laser-processing system according to claim 2, is characterized in that: on the reflected light path of described the second spectroscope (41) and on the reflected light path of the first speculum (42), be equipped with the second speculum (5).
4. multi-head high-efficiency laser-processing system according to claim 3, is characterized in that: described laser Machining head is probe (7), is also provided with the 3rd speculum (6) between each probe (7) and the second speculum (5).
5. multi-head high-efficiency laser-processing system according to claim 4, it is characterized in that: described probe (7) comprises body (71), and be located at intrinsic X-axis galvanometer motor (72), X-axis galvanometer eyeglass (73), Y-axis galvanometer motor (74), Y-axis galvanometer eyeglass (75) and scanning lens (76), described X-axis galvanometer eyeglass (73) is rotatable to be arranged on X-axis galvanometer motor (72), described Y-axis galvanometer eyeglass (75) is rotatable to be arranged on Y-axis galvanometer motor (74), the reflected light path of described the 3rd speculum (6) is corresponding with the input path of X-axis galvanometer eyeglass (73), described X-axis galvanometer eyeglass (73) reflected light path is corresponding with the input path of Y-axis galvanometer eyeglass (75), described scanning lens (76) is corresponding with X-axis galvanometer eyeglass (73) and Y-axis galvanometer eyeglass (75).
6. multi-head high-efficiency laser-processing system according to claim 1, is characterized in that: described laser Machining head is laser cutting head (8).
7. according to the multi-head high-efficiency laser-processing system described in claim 1～6 any one, it is characterized in that: also comprise pedestal (19), portal frame (9) and platform (18), described portal frame (9) is installed on a side of pedestal (19), described platform (18) is installed on portal frame (9), it is upper that described laser instrument (1), the first spectroscope (2), detector (3) and light-dividing device are all installed on platform (18), and described laser Machining head is liftable to be installed on portal frame (9).
8. multi-head high-efficiency laser-processing system according to claim 7, it is characterized in that: also comprise the X-axis travel mechanism (10) being located on pedestal (19), be installed on the y-axis shift actuation mechanism (11) in X-axis travel mechanism (10), be installed on the processing platform in y-axis shift actuation mechanism (11), and described laser Machining head is installed on portal frame (9) by Z axis travel mechanism (12).
9. multi-head high-efficiency laser-processing system according to claim 7, it is characterized in that: also comprise the casing (13) for this system of processing is installed, on described casing (13), be also provided with window (14), function button (15), display (16) and signal alarm lamp (17).
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