CN203816971U - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
- Publication number
- CN203816971U CN203816971U CN201420169763.4U CN201420169763U CN203816971U CN 203816971 U CN203816971 U CN 203816971U CN 201420169763 U CN201420169763 U CN 201420169763U CN 203816971 U CN203816971 U CN 203816971U
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- CN
- China
- Prior art keywords
- hole
- wafer
- cylinder
- cleaning device
- gas injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 80
- 238000002347 injection Methods 0.000 claims abstract description 37
- 239000007924 injection Substances 0.000 claims abstract description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 239000012530 fluid Substances 0.000 claims description 16
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical group O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 3
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 64
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 239000013078 crystal Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 238000001259 photo etching Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 206010019133 Hangover Diseases 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012940 design transfer Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a wafer cleaning device. The wafer cleaning device at least comprises a wafer, a cleaning main body, a first through hole, a second through hole, a gas injection hole, a ring-shaped closed groove and a liquid cavity, wherein the cleaning main body is located on the upper surface of the wafer; the first through hole and the second through hole penetrate through the upper surface and the lower surface of the cleaning main body; one ends of the first through hole and the second through hole located in the upper surface of the cleaning main body are respectively connected with a water injection pump and a water suction pump; the gas injection hole penetrates through the upper surface of the cleaning main body and does not penetrate through the lower surface of the cleaning main body; the gas injection hole is connected with a gas pump; the ring-shaped closed groove penetrates through the lower surface of the cleaning main body and is communicated with the gas injection hole; the ring-shaped closed groove surrounds the first through hole and the second through hole; a gap is formed between the lower surface of the cleaning main body and the upper surface of the wafer; a horizontal plane area enclosed by the ring-shaped closed groove and the gap form the liquid cavity; the other ends of the first through hole and the second through hole are communicated with the liquid cavity. According to the wafer cleaning device, the cleaning main body is additionally provided with a water injection hole and a water outlet to form a liquid circulation system, so that the effect on cleaning the surface of the wafer can be effectively improved, and the manufacture yield of the product is boosted.
Description
Technical field
The utility model relates to a kind of semiconductor manufacturing facility, particularly relates to a kind of wafer cleaning device.
Background technology
In semiconductor fabrication process, photoetching process has very important status.Before carrying out Implantation or etching, need to form photoetching agent pattern by photoetching process, to pre-define out the region of to be etched or Implantation.Thereby the quality of photoetching process directly affects the result of etching or Implantation, and final impact forms the electrical of semiconductor devices.
The key step of photoetching process has: first, and spin coating photoresist layer on semiconductor crystal wafer.Then, carry out soft baking process, remove the solvent in photoresist layer, and increase the adhesiveness of described photoresist at semiconductor wafer surface.After completing soft baking, described wafer is sent to exposure sources, after a series of alignment actions, to the photoresist exposure of described crystal column surface, by exposure, by design transfer predetermined on mask plate to described photoresist layer, on described photoresist layer, be exposed the photoresist generation photochemical reaction in region, according to the difference of photoresist kind, for positive photoetching rubber, dissolve in developer solution through the photoresist of overexposure.Afterwards, the standing wave when photoresist layer after overexposure on described wafer is toasted to eliminate exposure again reacts, and improves the side wall profile of photoetching agent pattern.Afterwards, the photoresist on described wafer is carried out to developing process.To described photoresist surface spray developer solution, thereby the region being exposed in described photoresist layer and developer solution generation chemical reaction are dissolved in developer solution, by deionized water, the photoresist dissolving are removed afterwards.After developing, carry out hard curing process, form photoengraving pattern.
In prior art, after developing with the device of deionized water removal hangover on wafer surface as shown in Figure 1, in the vertical pipeline 11 being connected with movable part 10, be assigned liquid, this liquid is the deionized water for cleaning the rear residue that develops, described liquid drops in the center on wafer 13 surfaces of described nozzle 12 belows through being connected to the nozzle 12 of described pipeline 11 belows, described wafer 13 is carried on the sucker 14 being supported by pedestal 15, and described sucker 14 of while rotarily drives described wafer 13 and rotates.The liquid that drops in described crystal column surface center is got rid of other positions at described crystal column surface under the centrifugal action of wafer rotation.
In prior art, wafer needs High Rotation Speed deionized water comparatively could be evenly distributed in to each position on wafer.There is deformation in the pattern that the High Rotation Speed of wafer very easily makes crystal column surface form, bring defect, thereby finally affect the yield of chip manufacturing to subsequent technique under the effect of larger centrifugal force; Deionized water is difficult on described wafer by centrifugal force evenly being applied simultaneously, and the residue that is simultaneously deposited on wafer surface connected in star region can not effectively be removed under the effect of centrifugal force, thereby after causing developing, hangover on wafer surface is removed not thorough.Therefore, be necessary to propose a kind of wafer cleaning device and avoid the generation of the problems referred to above, needn't the in the situation that of High Rotation Speed, improve wafer cleaning effect at wafer, thereby improve chip manufacturing yield.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of wafer cleaning device, the problem that causes wafer to lose efficacy because crystal column surface cleaning performance is not good for solving prior art.
For achieving the above object and other relevant objects, the utility model provides a kind of wafer cleaning device, wafer and be positioned at described wafer upper surface and have the cleaning body on upper and lower surface; Through first, second through hole on the upper and lower surface of described cleaning body; Described first, second through hole one end that is positioned at cleaning body upper surface is connected with respectively water injecting pump and suction pump; In described first, second through hole, be marked with liquid; Through described cleaning body upper surface and not through the gas injection hole of its lower surface; Described gas injection hole is connected with air pump and is marked with gas; The ring seal groove connecting through described cleaning body lower surface and with described gas injection hole; Described ring seal groove is around described first, second through hole; Between described cleaning body lower surface and described wafer upper surface, be provided with space; The fluid chamber that the horizontal surface areas being surrounded by described ring seal groove and described space form; Described first, second through hole other end and described fluid chamber connect.
As a kind of preferred version of wafer cleaning device of the present utility model, described cleaning body is made up of with the second cylinder that is positioned at described the first cylinder upper surface the first cylinder of central axes; Described the second body diameter is less than the diameter of described the first cylinder.
As a kind of preferred version of wafer cleaning device of the present utility model, described the first through hole passes the upper surface of described the second cylinder and the lower surface of the first cylinder and is positioned on described first, second cylindrical center's axis.
As a kind of preferred version of wafer cleaning device of the present utility model, described the second through hole is through the upper and lower surface of described the first cylinder.
As a kind of preferred version of wafer cleaning device of the present utility model, described the second through hole has two, and described two the second through holes are symmetrical about described the second cylinder.
As a kind of preferred version of wafer cleaning device of the present utility model, described gas injection hole is through the upper surface of described the first cylinder.
As a kind of preferred version of wafer cleaning device of the present utility model, described gas injection hole has two, and these two gas injection holes are symmetrical about described the second cylinder.
As a kind of preferred version of wafer cleaning device of the present utility model, the gas injecting in described body hand-hole is carbon dioxide; Liquid in described first, second through hole is deionized water.
As a kind of preferred version of wafer cleaning device of the present utility model, the horizontal cross sectional geometry of described ring seal groove is annulus, and the diameter of described annulus is described diameter wafer 1/3 to 1/2.
As a kind of preferred version of wafer cleaning device of the present utility model, this device also comprises the sucker that adsorbs described wafer and the pedestal that supports described sucker.
As mentioned above, wafer cleaning device of the present utility model, there is following beneficial effect: the development residue that effectively cleans described wafer upper surface by described cleaning body being increased to described apopore and water injection hole in order to form the fluid chamber of circulation at described wafer upper surface, reduce the defect of wafer, improved the yield of chip production.
Brief description of the drawings
Fig. 1 is the wafer cleaning device schematic diagram of prior art.
Fig. 2 is wafer cleaning device generalized section of the present utility model.
Element numbers explanation
10 movable parts
11 pipelines
12 nozzles
13,203 wafers
14,204 suckers
15,205 pedestals
20 cleaning bodies
201 first cylinders
202 second cylinders
21 water injection holes
22 apopores
23 water injecting pumps
24 suction pumps
25 gas injection holes
26 air pumps
27 ring seal grooves
28 fluid chamber
29,30 pipelines
Detailed description of the invention
By particular specific embodiment, embodiment of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this description.
Refer to Fig. 2.Notice, appended graphic the illustrated structure of this description, ratio, size etc., all contents in order to coordinate description to disclose only, understand and read for person skilled in the art scholar, not in order to limit the enforceable qualifications of the utility model, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the utility model can produce and the object that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this description, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, changing under technology contents, when being also considered as the enforceable category of the utility model without essence.
As shown in Figure 2, the utility model provides a kind of wafer cleaning device, and in Fig. 2, described cleaning body 20 has upper surface and lower surface, and described wafer 203 is positioned at the upper surface of described cleaning body; Preferably, in this device, described wafer is adsorbed by described sucker 204, and the pedestal 205 of its bottom surface is fixed in described sucker 204 lower ends.In the utility model, the shape of described cleaning body is unfixing, no matter but the described cleaning body of any shape all has upper surface and lower surface.As a kind of preferred version of the present utility model, described cleaning body 20 has two parts to form: a part is the first cylinder 201 simultaneously; Another part is the second cylinder 202 that is positioned at described the first cylinder upper surface; The axial line of described the first cylinder and described the second cylinder overlaps.Meanwhile, as a kind of preferred version of the present utility model, in the present embodiment, described the second body diameter is less than the diameter of described the first cylinder.In order to make follow-up described water injection hole and apopore rationally distributed, in the present embodiment, the diameter of described the second cylinder is 1/3 of described the first body diameter.
This device also comprises: through the upper surface of described cleaning body 20 and the first through hole 21 of lower surface and the second through hole 22; Preferably, in the utility model, described the first through hole 21 passes the upper surface of described the second cylinder 202 and the lower surface of the first cylinder 201 and is positioned on described first, second cylindrical center's axis, that is described the first through hole overlaps with the axial line of described the first cylinder and described the second cylinder.Simultaneously, preferably, in the utility model, described the second through hole 22 is through the upper and lower surface of described the first cylinder 201, be that described the second through hole runs through in the body of described the first cylinder and upper and lower surface, simultaneously described first, second through hole meets the condition not connecting each other in described cleaning body inside.
Its number in the situation that meeting this device and normally working of the second through hole described in the utility model does not limit, in the present embodiment, preferably, the number of described the second through hole is two, and described two the second through holes are symmetric about described the second cylinder, be the both sides that described two the second through holes are distributed in described the second cylinder, the axial line of described two the second through holes and described the second cylinder point-blank simultaneously.
This device also comprises: water injecting pump 23 and suction pump 24; As shown in Figure 2, described water injecting pump 23 is connected to described the first through hole 21 and is positioned at one end of described cleaning body upper surface; Described suction pump 24 is connected to described the second through hole 22 and is positioned at one end of described cleaning body upper surface; In the present embodiment, described water injecting pump is connected to the first through hole 21 and is arranged in one end of described cleaning body the second cylinder upper surface; Described suction pump is connected to described the second through hole 22 and is arranged in one end of described cleaning body the first cylinder upper surface.In described the first through hole and described the second through hole, be marked with liquid.Described liquid, after described water injecting pump enters in described the first through hole, then is taken away from described the second through hole by the suction pump being connected with described the second through hole.Therefore,, in the utility model, between described the first through hole, described the second through hole and described water injecting pump and suction pump, form the fluid circulation system of a sealing.Preferably, liquid described in the present embodiment is deionized water.
This device also comprises: gas injection hole 25, described gas injection hole 25 is through the upper surface of described cleaning body, and not through its lower surface, preferably, in the present embodiment, described gas injection hole 25 is through the upper surface of described the first cylinder 201.In the utility model, described gas injection hole is connected with air pump 26 and is marked with gas.Preferably, described gas injection hole has two, these two gas injection holes are symmetrical about described the second cylinder, that is described two gas injection holes be distributed in described the second cylinder both sides simultaneously described two gas injection holes and described the second cylinder axial line point-blank.In the present embodiment, preferably, described gas is carbon dioxide.
This device also comprises: the ring seal groove 27 that passes described cleaning body lower surface and connect with described gas injection hole 25; In the present embodiment, the upper end of described gas injection hole 25 is connected with air pump, and its lower end and described ring seal groove 27 connect.Described ring seal groove of while is around described the first through hole and the second through hole, that is the horizontal cross-section of described the first through hole and the second through hole is at the ring-shaped inner part of the horizontal cross-section of described ring seal groove; In the utility model, preferably, the horizontal cross sectional geometry of described ring seal groove is annular.
In the utility model, between the lower surface of described cleaning body and the upper surface of described wafer, be provided with space; Preferably, the width in described space is one millimeter to two millimeters, makes described gas under the effect of air pressure, can effectively support described liquid by described gas injection hole.
In this device, also comprise: the fluid chamber 28 that the horizontal surface areas being surrounded by described ring seal groove as shown in Figure 2 and described space form; The other end of described the first through hole and described the second through hole and described fluid chamber 28 form and connect simultaneously.In this device, the condition that forms described fluid chamber is that described gas injection hole equates at the pressure of equal altitudes corresponding to described wafer upper surface with described liquid at the air pressure of described wafer upper surface equal altitudes, therefore under the driving of the gas in described ring seal groove of the liquid in described fluid chamber, makes described liquid be unlikely to leak outside and realizes dynamic equilibrium in remaining on this fluid chamber.
Preferably, in the present embodiment, the diameter of the ring seal groove of described annular is described diameter wafer 1/3 to 1/2, the beneficial effect of this preferred version is: can make fluid chamber described in this cleaning body and described wafer upper surface form liquid-circulating and contact, simultaneously the described cleaning body of this device can the upper surface of described wafer move around increase described fluid chamber with this in liquid in the mobility of described wafer upper surface, thereby effectively remove the residue of described wafer upper surface.
The operation principle of this device is: in the time need to removing the residue of described wafer upper surface, start described water injecting pump, suction pump and air pump, liquid in described water injecting pump flows into described wafer upper surface by described the first through hole, simultaneously because the gas in described air pump constantly enters described ring seal groove by described gas injection hole, enter again afterwards the outside of the described ring seal groove of described wafer upper surface, if described liquid does not have gas effect at described crystal column surface, liquid can flow to these crystal column surface all directions, and in ring seal groove under the driving of gas atmosphere, force the liquid of crystal column surface to be strapped in this ring seal groove inside, due to a same-action of described suction pump, described liquid is constantly extracted out from described fluid chamber, described cleaning body carries out its inner water cycle process on one side, move around and realize effective removing of described hangover on wafer surface at described crystal column surface on one side.
In sum, wafer cleaning device of the present utility model is by increasing described apopore and water injection hole by described cleaning body, effectively clean the development residue in described wafer upper surface figure connected in star in order to the fluid chamber that forms circulation at described wafer upper surface, reduce the defect of wafer, improved the yield of chip production.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (10)
1. a wafer cleaning device, is characterized in that, this device at least comprises:
Wafer and be positioned at described wafer upper surface and there is the cleaning body on upper and lower surface;
Through first, second through hole on the upper and lower surface of described cleaning body;
Described first, second through hole one end that is positioned at cleaning body upper surface is connected with respectively water injecting pump and suction pump;
In described first, second through hole, be marked with liquid;
Through described cleaning body upper surface and not through the gas injection hole of its lower surface; Described gas injection hole is connected with air pump and is marked with gas; The ring seal groove connecting through described cleaning body lower surface and with described gas injection hole; Described ring seal groove is around described first, second through hole;
Between described cleaning body lower surface and described wafer upper surface, be provided with space;
The fluid chamber that the horizontal surface areas being surrounded by described ring seal groove and described space form; Described first, second through hole other end and described fluid chamber connect.
2. wafer cleaning device according to claim 1, is characterized in that: described cleaning body is made up of with the second cylinder that is positioned at described the first cylinder upper surface the first cylinder of central axes; Described the second body diameter is less than the diameter of described the first cylinder.
3. wafer cleaning device according to claim 2, is characterized in that: described the first through hole passes the upper surface of described the second cylinder and the lower surface of the first cylinder and is positioned on described first, second cylindrical center's axis.
4. wafer cleaning device according to claim 3, is characterized in that: described the second through hole is through the upper and lower surface of described the first cylinder.
5. wafer cleaning device according to claim 4, is characterized in that: described the second through hole has two, and described two the second through holes are symmetrical about described the second cylinder.
6. wafer cleaning device according to claim 5, is characterized in that: described gas injection hole is through the upper surface of described the first cylinder.
7. wafer cleaning device according to claim 6, is characterized in that: described gas injection hole has two, and these two gas injection holes are symmetrical about described the second cylinder.
8. wafer cleaning device according to claim 1, is characterized in that: the gas injecting in described gas injection hole is carbon dioxide; Liquid in described first, second through hole is deionized water.
9. wafer cleaning device according to claim 1, is characterized in that: the horizontal cross sectional geometry of described ring seal groove is annulus, and the diameter of described annulus is described diameter wafer 1/3 to 1/2.
10. wafer cleaning device according to claim 1, is characterized in that: this device also comprises the sucker that adsorbs described wafer and the pedestal that supports described sucker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420169763.4U CN203816971U (en) | 2014-04-09 | 2014-04-09 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420169763.4U CN203816971U (en) | 2014-04-09 | 2014-04-09 | Wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203816971U true CN203816971U (en) | 2014-09-10 |
Family
ID=51472514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420169763.4U Expired - Fee Related CN203816971U (en) | 2014-04-09 | 2014-04-09 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203816971U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114582749A (en) * | 2020-12-02 | 2022-06-03 | 美光科技公司 | Methods of cleaning and disposing of microelectronic devices and related tools and assemblies |
-
2014
- 2014-04-09 CN CN201420169763.4U patent/CN203816971U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114582749A (en) * | 2020-12-02 | 2022-06-03 | 美光科技公司 | Methods of cleaning and disposing of microelectronic devices and related tools and assemblies |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140910 Termination date: 20190409 |
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| CF01 | Termination of patent right due to non-payment of annual fee |