CN203814114U - Heat dissipator for large-capacity reactive compensation device - Google Patents

Abstract

The utility model discloses a heat dissipator for a large-capacity reactive compensation device. The heat dissipator comprises a substrate, heat dissipating fins, and heat dissipating modules, wherein the heat dissipating fins are arranged on the outer side of the substrate and fixedly connected with the substrate; the inner side face of the substrate is provided with the four heat dissipation modules along the transverse direction of the substrate; each heat dissipation module comprises multiple heat pipes arranged along the longitudinal direction of the substrate; the inner side of the substrate is provided with grooves in shapes matched with those of the heat pipes; the heat pipes are arranged in the grooves and fixedly connected with the substrate; and the outer side faces of the heat pipes and the inner side face of the substrate are in a same plane. The heat pipes are distributed on the substrate in a more uniform and reasonable manner so that heat of an IGBT can be effectively spread on the substrate of the whole heat dissipator. At the same time, as the heat pipes are mainly arranged along the longitudinal direction of the heat dissipator, the problem of excessive temperature difference in the longitudinal direction of the substrate of the heat dissipator can be solved. Such a heat dissipator design enables the substrate to have better temperature uniformity and enables the heat dissipation performance of the heat dissipator to be improved greatly.

Description

For the radiator of large capacity reactive compensation device

Technical field

The utility model relates to the heat dissipation technology in power transmission and distribution field in power industry, more particularly, relates to a kind of radiator for large capacity reactive compensation device.

Background technology

In the power transmission and distribution field of power industry, SVG need to use radiator, but existing radiator weak point is: heat pipe is arranged along the length direction of radiator, and only concentrates on IGBT installation region, and this makes heat pipe fail to be evenly covered with whole foot of radiator.This heat pipe arrangement has only been strengthened the heat conduction of IGBT installing zone along radiator length direction, and the heat of IGBT is mainly expanded in heat pipe installation region.On foot of radiator without heat pipe region, because the capacity of heat transmission of aluminium is far below heat pipe, excessive along radiator Width upper substrate thermal resistance, heat cannot effectively expand on radiator without heat pipe district, this makes on radiator base plate the broad ways temperature difference very large, when the IGBT hear rate of installing on radiator is larger, and when multiple arranged in series, IGBT easily exceedes its serviceability temperature and causes IGBT to lose efficacy.

Utility model content

For the defect existing in prior art, the purpose of this utility model is to provide a kind of radiator for large capacity reactive compensation device.

For achieving the above object, the utility model adopts following technical scheme:

For a radiator for large capacity reactive compensation device, comprise substrate, radiating fin and radiating module, described radiating fin is located at the outside of substrate and is fixedly connected with substrate;

Laterally be provided with 4 groups of radiating modules along substrate on the medial surface of described substrate, every group of radiating module comprises the heat pipe that the some longitudinal directions along substrate arrange, the inner side of described substrate offers the conduit matching with described heat pipe shape, and described heat pipe is located in conduit and is fixedly connected with substrate; The lateral surface of described heat pipe and the medial surface of substrate are in same plane.

In described every group of radiating module, be provided with 3 heat pipes.

Being shaped as with lower one of the interior any heat pipe of described every group of radiating module: U-shaped structure, C shape structure or " one " character form structure.

Compared with prior art, adopt a kind of radiator for large capacity reactive compensation device of the present utility model to there is following beneficial effect:

Heat pipe is arranged more evenly rationally on substrate, can effectively IGBT heat be expanded on whole radiator base plate, simultaneously because heat pipe is mainly arranged along radiator longitudinal direction, can effectively solve the excessive problem of radiator base plate longitudinal direction temperature difference, this fansink designs makes substrate have better uniform temperature, and the heat dissipation of radiator is promoted greatly.

Brief description of the drawings

Fig. 1 is the front view of a kind of radiator for large capacity reactive compensation device of the present utility model;

Fig. 2 is the rearview of the radiator of Fig. 1.

Embodiment

Further illustrate the technical solution of the utility model below in conjunction with drawings and Examples.

Refer to a kind of radiator for large capacity reactive compensation device shown in Fig. 1, Fig. 2, comprise substrate 11, radiating fin 12 and radiating module 13, radiating fin 12 is located at the outside of substrate 11 and is fixedly connected with substrate 11; Laterally be provided with 4 groups of radiating modules 13 along substrate on the medial surface of substrate 11, every group of radiating module comprises the heat pipe 14 that 3 longitudinal directions along substrate arrange, and in every group of radiating module, any heat pipe is shaped as U-shaped structure, C shape structure or " one " character form structure.The inner side of substrate processes with CNC after the conduit 15 matching with heat pipe shape, heat pipe 14 is imbedded in conduit 15, closely cooperate through the modes such as interference fit, cementing, soldering and radiator base plate, finally with CNC, the medial surface of whole substrate 11 is made to a smooth flat.

Because heat pipe embedded on substrate is along radiator longitudinal direction, be arranged vertically with fin direction, instead of arrange along radiator horizontal direction, make like this heat pipe arrange more even, heat is spread at radiator Width more fully, and the length of " one " font directly-heated pipe approaches with radiator width as far as possible, the dogleg section of the heat pipe of U-shaped or C shape extends as far as possible, and vertical with airflow direction.

When use, radiator of the present utility model is corresponding to the 4IGBT module on a PCB circuit board, heat IGBT module being produced by the heat pipe of the longitudinal direction setting along substrate expands to after a complete substrate as much as possible, heat is delivered to radiating fin by substrate again, and by flowing as the air-flow F of the direction of arrow in Fig. 1 (being the horizontal direction of radiator), the heat of radiator 11 is taken away, heat pipe adopts the longitudinal direction setting along substrate, can make the direction of heat pipe and air-flow perpendicular, improve the effect of heat radiation.Especially for the heat pipe that adopts U-shaped structure or C shape structure, can improve the efficiency of heat pipe and substrate heat exchange, improve the efficiency of heat radiation.And to the radiator in air-flow rear, the air-flow of taking away its heat has two-way, be more conducive to its heat radiation.

The utility model is by the reasonable Arrangement of opposite heat tube, can give full play to the feature of its high-efficiency heat conduction, IGBT heat is expanded to rapidly on the substrate of whole radiator, make the Temperature Distribution of substrate more even, heat conducts to radiating fin transmission through heat again, the heat that conducts to radiating fin, through forced-convection heat transfer, is taken away by air-flow, thereby reaches the object of heat delivery.

Those of ordinary skill in the art will be appreciated that, above embodiment is only for the purpose of this utility model is described, and not with opposing restriction of the present utility model, the quantity of for example heat pipe differs and is decided to be 3, can also have as required increase and decrease.As long as in essential scope of the present utility model, variation, modification to the above embodiment all will drop in the scope of claim of the present utility model.

Claims (3)

1. for a radiator for large capacity reactive compensation device, it is characterized in that,

Comprise substrate, radiating fin and radiating module, described radiating fin is located at the outside of substrate and is fixedly connected with substrate;

Laterally be provided with 4 groups of radiating modules along substrate on the medial surface of described substrate, every group of radiating module comprises the heat pipe that the some longitudinal directions along substrate arrange, the inner side of described substrate offers the conduit matching with described heat pipe shape, and described heat pipe is located in conduit and is fixedly connected with substrate; The lateral surface of described heat pipe and the medial surface of substrate are in same plane.

2. radiator according to claim 1, is characterized in that:

In described every group of radiating module, be provided with 3 heat pipes.

3. radiator according to claim 1, is characterized in that:

Being shaped as with lower one of the interior any heat pipe of described every group of radiating module: U-shaped structure, C shape structure or " one " character form structure.