CN203800046U - Combined diver board type LED packaging device - Google Patents

Abstract

The utility model discloses an LED packaging device with integrated lamp driving, which comprises a driving chip, an LED light-emitting chip, a packaging substrate and a packaging colloid. A driving chip and four groups of LED light-emitting chips are correspondingly installed on the packaging substrate, and the driving chip is installed in a rectangular package. In the center of the upper surface of the substrate, 4 groups of LED light-emitting chips are distributed on the four corners of the upper surface of the packaging substrate. Each group of LED light-emitting chips includes one red, green and blue LED light-emitting chip, and the encapsulating colloid covers the entire upper surface of the packaged device. After colloidal encapsulation, an LED light-emitting device with a fixed pixel pitch is formed; the drive chip includes 12 individually adjustable drive output ports, and the drive output ports are connected to the LED light-emitting chip in a 1-to-1 manner. The utility model is suitable for high-resolution LED display screens, not only reduces the difficulty of the traditional technology, but also reduces the cost.

Description

A kind of LED packaging device with integrated light driving

technical field

The utility model relates to the field of LED packaging devices, in particular to an LED packaging device with integrated lamp driving. the

Background technique

In recent years, LED displays have developed rapidly. From the initial large-pitch, low-definition outdoor display to the current small-pitch, ultra-high-definition indoor high-end display, the technical difficulty is constantly escalating, and customers' requirements for display performance are also increasing. higher. Traditional high-density LED display screens are generally realized by patching discrete LED lamp bead devices and scanning drive chips. As shown in Figures 1 and 2, LED light-emitting chips of three colors, R, G, and B, are packaged on the front of the PCB. , the anodes and grounding interface electrodes of the three LED light-emitting chips are set on the back of the PCB board, but this method has problems such as too many external contact points (pins) of the LED lamp bead, high wiring density, and high process complexity. Product quality and production costs have brought many difficulties and risks. At the same time, the current LED display device is scan-driven, and multiple LED light-emitting chips are driven by one output channel, which is not conducive to the consistency adjustment of each LED chip. At present, the industry generally uses software to perform point-by-point correction, but this method will lead to gray display. The sacrifice of the order and the reduction of the refresh rate cannot achieve the optimal display effect. the

Utility model content

In order to overcome at least one defect (deficiency) of the above-mentioned prior art, the utility model provides an LED packaging device with simpler packaging and better display effect. the

For solving the problems of the technologies described above, the technical scheme of the utility model is as follows:

An LED packaging device with integrated lamp and driver, including a driver chip, an LED light-emitting chip, a packaging substrate and a packaging colloid. A driver chip and 4 sets of LED light-emitting chips are correspondingly installed on the packaging substrate, and the driver chip is installed in the center of the upper surface of the packaging substrate. , 4 groups of LED light-emitting chips are distributed on the four corners of the upper surface of the packaging substrate. Each group of LED light-emitting chips includes three LED light-emitting chips that form three colors of red, green and blue. The packaging colloid covers the upper surface of the entire packaging device. After colloidal encapsulation, an LED light-emitting device with a fixed pixel pitch is formed;

Wherein, the driving chip includes 12 individually adjustable driving output ports, and the driving output ports are connected to the LED light emitting chip in a 1-to-1 manner.

Compared with the prior art, the beneficial effects of the technical solution of the utility model include:

(1) An LED packaging device in this utility model is a driver chip and 4 groups of LED light-emitting chips packaged on the packaging substrate, the driver chip is arranged in the center of the packaging substrate, and 4 groups of LED light-emitting chips are distributed at the four corners of the packaging substrate. The distribution of the chips is even and regular, and the dot pitch of the pixel dot matrix is fixed, which can avoid the problem of different reliability of the bonding wires caused by the different distances between the LED light-emitting chipsets and the driver chip, reduces the difficulty of the wiring process, and facilitates the driving. The chip is connected to the LED light-emitting chip by bonding wires, and the length of the bonding wires is uniform, which improves process reliability and is also the best solution for improving material utilization.

(2) Compared with the traditional way of using one driver chip to drive one group of LED light-emitting chips, the packaging method of one driver chip driving four groups of LED light-emitting chips in the utility model saves cost and power consumption more; compared with one driver chip driving 6 One group of LED light-emitting chips or more groups of LED light-emitting chips, one driver chip of the utility model can drive four groups of LED light-emitting chips to ensure that the distance between each LED light-emitting chip and the driver chip is equal, and the LED light-emitting chip and the driver chip are installed in the package It is easier to control the packaging position of each chip when it is on the substrate, and it can overcome the problems of different reliability due to different distances, high process difficulty caused by long distances, and prone to defective or broken lights. the

(3) The traditional LED packaging device adopts the scan driving mode, one output channel drives multiple LED light-emitting chips, which is not conducive to the adjustment of the light emission consistency of each LED light-emitting chip, but the utility model adopts a non-scanning drive of one driving and one driving, which can realize Low current/low voltage static drive. Moreover, the one-to-one driving mode of the utility model enables each LED light-emitting chip to individually adjust its light emission through the corresponding driving output port, without sacrificing the display gray scale and reducing the refresh frequency, thereby realizing optimal display. the

Description of drawings

Figure 1 is a schematic diagram of a traditionally packaged LED. the

FIG. 2 is a schematic diagram of electrode distribution on the back of a traditionally packaged LED. the

Fig. 3 is a schematic diagram of the structure of a light-emitting unit fabricated by a front-mount process (wire bonding). the

Fig. 4 is a schematic diagram of the structure of a light-emitting unit fabricated by a flip-chip process (wireless bonding). the

FIG. 5 is a schematic diagram of electrode distribution on the back of the lamp bead 1 . the

FIG. 6 is a top view of the LED lamp bead structure of Embodiment 2. FIG. the

FIG. 7 is a schematic diagram of the side structure of the LED lamp bead of Embodiment 2. FIG. the

FIG. 8 is a top view of the LED lamp bead structure of Embodiment 3. FIG. the

FIG. 9 is a schematic diagram of the side structure of the LED lamp bead of Embodiment 3. FIG. the

FIG. 10 is a top view of the LED lamp bead structure of Embodiment 4. FIG. the

FIG. 11 is a schematic diagram of the side structure of the LED lamp bead of Embodiment 4. FIG. the

Among them, 1 is the LED packaging device (LED lamp bead), 2 is the red LED light-emitting chip, 3 is the green LED light-emitting chip, 4 is the blue LED light-emitting chip, 5 is the driver chip (IC), 6 is the packaging substrate, 7 is Electrode, 8 is the connection line, 9 is the anode of the red LED light-emitting chip, 10 is the anode of the green LED light-emitting chip, 11 is the anode of the blue LED light-emitting chip, 12 is the gray-scale data interface electrode, 13 is the gray-scale clock interface electrode, 14 is PWM clock interface electrode, 15 is the data latch signal interface electrode, 16 is the gray scale data loop output interface electrode, 17 is the power interface electrode, 18 is the ground interface electrode (cathode), 19 is the isolation channel, 20 is the block , 21 is a lens. the

Detailed ways

The accompanying drawings are for illustrative purposes only and cannot be construed as limitations on this patent;

In order to better illustrate this embodiment, some parts in the drawings will be omitted, enlarged or reduced, and do not represent the size of the actual product;

For those skilled in the art, it is understandable that some well-known structures and descriptions thereof may be omitted in the drawings.

The technical scheme of the utility model is further described below in conjunction with the accompanying drawings and embodiments. the

Example 1

As shown in Figures 3 and 5, an LED packaging device 1 with integrated lamp driving includes a driving chip 5, an LED light-emitting chip, a packaging substrate 6 and a packaging colloid, and a driving chip 5 and 4 groups of LEDs are installed on the packaging 6 to emit light. chip, the drive chip 5 is installed in the center of the upper surface of the packaging substrate 6, and 4 groups of LED light-emitting chips are distributed on the four corners of the upper surface of the packaging substrate 6. Each group of LED light-emitting chips includes three LEDs that form three colors of red, green and blue light. Light-emitting chips, a group of LED light-emitting chips represent an RGB pixel, the encapsulating colloid covers the upper surface of the entire LED package device 1, and the encapsulating colloid is packaged to form an LED light-emitting device with a fixed pixel pitch; the driver chip 5 includes 12 individually adjustable The drive output port is connected to the LED light-emitting chip in a 1-to-1 manner.

Different from the traditional LED packaging device shown in Figure 1-2, the utility model integrates a driver chip 5 and 4 groups of LED light-emitting chips on a package substrate 6, and the driver chip 5 is integrated into the LED light-emitting unit, so that it can Driving the LED light-emitting chip to emit light, this method avoids the difficulty of dense wiring between the lamp and the driving chip 5, and is more conducive to realizing high resolution. Moreover, the driving chip 5 is arranged in the center of the packaging substrate 6 during packaging, and the four groups of LED light-emitting chips are distributed on the four corners of the packaging substrate 6. The distribution of the chips is uniform and regular, which makes the wiring on the packaging substrate simpler and reduces the cost of the packaging process. Difficulty, but also reduce the cost. At the same time, the utility model drives an LED light-emitting chip through a drive output port to realize static display, and the display effect is better than that of a display screen using a traditional LED packaging device, and the one-to-one driving mode enables each LED light-emitting chip to be driven by a corresponding driver. The output port can be used to adjust its luminescence independently, without sacrificing the display gray scale and reducing the refresh rate, so as to achieve optimal display. the

In the specific implementation process, the three LED light-emitting chips in each group of LED light-emitting chips can be composed of three color light-emitting chips of R, G, and B, or three blue light-emitting chips can be made of light-color conversion materials (such as phosphor, Quantum dots, etc.) to obtain three luminescent colors of red, green and blue. the

In a specific implementation process, the driver chip 5 may be a customized driver chip, and the output signal of each driver output port of the driver chip 5 is a current value or a voltage value. In order to facilitate the drive chip for each drive output port, a current regulator or voltage regulator can be provided in it, and the current regulator or voltage regulator adjusts the output current value or output voltage value of each drive input port. Or the voltage regulator can realize independent adjustment of the output current value or output voltage value of each drive output port, for example, the adjustment range of the current value can be 0-2mA. When working, the output current or voltage of the drive output port drives the LED light-emitting chipset in a certain proportion. At the same time, the current value or voltage value can be adjusted in stages or fine-tuned in the same stage, so that the LED light-emitting chips can obtain good luminous brightness and color consistency. The drive output port can supply power to the LED light-emitting chip for a full time period to realize static drive; at the same time, the problem of increased power consumption caused by the increase in the time of the drive chip 5 used in the utility model can be solved by adopting a sleep power-saving mode, that is, the LED can be powered The light-emitting chip provides time-sharing power supply, and enters the sleep state part of the time to save power consumption of the device. the

In the specific implementation process, the LED packaging device in this specific embodiment is a chip-type (CHIP) surface mount device (SMD), and the CHIP-type SMD device is suitable for small-pitch high-density LED display screens. Processed by SMT technology. The matrix of the above structure is usually made on a PCB, and then cut into individual LED package devices (LED lamp beads). the

In the specific implementation process, the anode and cathode connections of each LED light-emitting chip can be connected in the following ways:

The anode of each LED light-emitting chip is connected to the drive output port of the driver chip 5 , and the cathode of each LED light-emitting chip is connected to the packaging substrate 6 to share the ground. Alternatively, the cathode of each LED light emitting chip is connected to the driving output port of the driving chip 5 , and the anode of each LED light emitting chip is connected to the package substrate 6 with a common power supply.

In the specific implementation process, the signal port of the driver chip 5 in this embodiment is connected to the corresponding port contact of the packaging substrate 6 through the front-mounting process (wired bonding) or flip-chip process (wireless bonding). Similarly, the LED light-emitting chipset and the driver The connection between the chips 5 and the welding between the LED light-emitting chip and the packaging substrate can also be realized through the front-mounting process (wired bonding) or the flip-chip process (wireless bonding). As shown in Figure 3 and Figure 4, one of the methods can be selected for connection according to the actual application. The connection line can be saved by using the flip-chip process, so that the pitch of the light-emitting pixels and the light-emitting unit can be made smaller, achieving higher resolution. the

In the specific implementation process, the packaging substrate 6 is a printed circuit board, the upper surface of which carries the driver chip 5 and the LED light-emitting chip, and provides the external electrical connection between the driver chip 5 and the LED light-emitting chip, and the lower surface is provided with device pads, pads It is connected with the driver chip 5 and provides an external interface for the device. the

In a specific implementation process, the driving output port on the driving chip 5 is preferably a constant current output port, but not limited to using a constant current output port, and other forms of driving output ports may also be used. Correspondingly, the external interface includes: grayscale data interface electrode 12, grayscale clock interface electrode 13, PWM clock interface electrode 14, data latch signal interface electrode 15, grayscale data loop output interface electrode 16, power interface electrode 17, grounding interface electrode 18 . In the traditional LED packaging device, there are 16 external interface electrodes for 4 pixels. Even if the chip direct mounting (COB) process is used, 13 external interface electrodes are required for 4 pixels, but the LED packaging device of the present invention has only 7 external interface electrodes greatly reduce the difficulty of wiring, the process difficulty of PCB board, and the cost, which is more conducive to the realization of high-resolution display. the

In the specific implementation process, the encapsulating colloid is a transparent or translucent colloid, and the encapsulating colloid covers the upper surface of the entire LED packaging device. It can be epoxy resin colloid, silica gel colloid, silicone resin colloid, etc., and can also be filled with melanin or dye. , to improve the contrast of the device. the

In this embodiment, the driver chip 5 and four sets of R, G, and B light-emitting chips 2, 3, and 4 of three different colors are fixed on the PCB board, and are mounted on the PCB through a front-mounting process (wired bonding) or a flip-chip process (wireless bonding). ) Connect the electrodes of the fixed driver chip 5 and three different colors of R, G, BLED light-emitting chips 2, 3, and 4 to the PCB board to form a path, and then use the encapsulation glue to seal the driver chip 5 and the three electrodes on the PCB board. R, G, BLED light-emitting chips 2, 3, 4 of different colors are sealed and protected. When the drive chip 5 in this luminous unit is powered and data signal input and other operations, it can control its four groups of twelve different colors of R, G, BLED light-emitting chips 2, 3, 4 to emit light, the drive chip 5 Each drive output port only drives one LED light-emitting chip, so the brightness of the LED light-emitting chip can be adjusted by adjusting the current value of the corresponding drive output port, without sacrificing the gray scale of the display and reducing the refresh rate, thus achieving a better effect static display. Traditionally packaged LED display devices have 16 external interface electrodes for 4 pixels. Even if COB technology is used, 13 external interface electrodes are required for 4 pixels, while the LED packaging device of the present invention has only 7 external interface electrodes. It greatly reduces the wiring difficulty between the traditional LED light-emitting chip and the driver chip, reduces the process difficulty of the PCB board, and is more conducive to the realization of high-resolution display, and integrates 4 light-emitting pixels into one LED lamp bead. The method can also save materials, improve efficiency and reduce costs. the

Example 2

Because the LED lamp bead in Example 1 contains four groups of R, G, and B light-emitting chips, the distance between each group of light-emitting chips is small and there is no shielding, which is easy to cause light intrusion. To solve this problem, each group of light-emitting chips on the surface of the LED lamp bead A shield is arranged inside the packaging colloid between the light-emitting chips. Specifically, as shown in Figures 6 and 7, a cross channel 19 can be made on the encapsulant part to isolate four groups of light-emitting chips and the channel can be blackened. The shape of the channel can be square or "V" shape, etc. The manufacturing method It can be directly produced by modifying the mold in the molding process. This method solves the problem of light invasion and increases the contrast of individual pixels.

Other structures of this embodiment are similar to those of Embodiment 1, and will not be repeated here. the

Example 3

Different from Embodiment 1, in order to solve the problem of light intrusion in Embodiment 1, on the basis of Embodiment 1, this embodiment provides shielding objects inside the encapsulant between each group of light-emitting chips. During the specific production, as shown in Figures 8 and 9, a barrier 20 can be made on the surface of the LED lamp bead before it is sealed with glue, and then the device can be protected by encapsulating the gel. The barrier 20 can be a relatively viscous opaque For the dam glue structure or the colloid mixed with melanin, etc., the production method can use a glue dispenser to directly draw lines on the surface of the unsealed device with the opaque glue to directly make the barrier 20 .

Other structures of this embodiment are similar to those of Embodiment 1, and will not be repeated here. the

Example 4

On the basis of Embodiment 1 or Embodiment 2 or Embodiment 3, in order to enhance the display effect of the device of the present invention, in this embodiment, the encapsulating colloid at the light-emitting part of the light-emitting chipset is set in the shape of a lens. Specifically, as shown in Figures 10 and 11, four corresponding lenses 21 can be made on the four pixels on the LED lamp bead 1, and the lenses 21 can be made at one time during sealing, and only the original Modification of the Molding mold. This method can enhance the luminous uniformity of the LED lamp bead of the utility model and improve its luminous angle.

Other structures of this embodiment are similar to those of Embodiment 1 or Embodiment 2 or Embodiment 3, and will not be repeated here. the

The same or similar reference numbers correspond to the same or similar components;

The terms describing the positional relationship in the drawings are only for illustrative purposes and cannot be interpreted as limitations on this patent;

Apparently, the above-mentioned embodiments of the present utility model are only examples for clearly illustrating the present utility model, rather than limiting the implementation manner of the present utility model. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. It is not necessary and impossible to exhaustively list all the implementation manners here. All modifications, equivalent replacements and improvements made within the spirit and principles of the utility model shall be included in the protection scope of the claims of the utility model.

Claims (10)

1. A LED packaging device with integrated lamp driving, comprising a driving chip, an LED light-emitting chip, a packaging substrate and a packaging colloid, characterized in that a driving chip and 4 groups of LED light-emitting chips are correspondingly installed on the packaging substrate, and the driving chip is installed on In the center of the upper surface of the rectangular packaging substrate, 4 groups of LED light-emitting chips are distributed on the four corners of the upper surface of the packaging substrate. Each group of LED light-emitting chips includes three LED light-emitting chips that form three colors of red, green and blue. The packaging colloid covers the entire surface. The upper surface of the encapsulating device is encapsulated by encapsulating colloid to form an LED light-emitting device with a fixed pixel pitch; The driving chip includes 12 individually adjustable driving output ports, and the driving output ports are connected to the LED light-emitting chip in a 1-to-1 manner. 2 . The LED packaged device with integrated lamp and driver according to claim 1 , characterized in that opaque channels are opened on the surface of the encapsulant between each group of light-emitting chips. 3 . 3 . The LED packaging device with integrated lamp and driver according to claim 1 , wherein a shield is arranged inside the encapsulating gel between each group of light-emitting chips. 4 . 4 . The LED packaging device with integrated lamp and driver according to claim 1 , wherein the packaging colloid at the light-emitting part of the light-emitting chipset is set in the shape of a lens. 5 . The LED packaged device with integrated light driving according to claim 1 , wherein the output signal of each driving output port of the driving chip is a current value or a voltage value. 6 . 6. The LED packaged device with integrated light drive according to claim 1, characterized in that, the anode of each LED light-emitting chip is connected to the drive output port of the driver chip, and the cathode of each LED light-emitting chip is connected to the package substrate to share the ground ; or the cathode of each LED light-emitting chip is connected to the driving output port of the driver chip, and the anode of each LED light-emitting chip is connected to the package substrate to share the power supply. 7. The LED packaging device with integrated lamp and driver according to claim 1, characterized in that, the packaging substrate is a printed circuit board, and the surface of the printed circuit board carries a driver chip and an LED light-emitting chip, and provides the driver chip and the LED light-emitting chip. The external electrical connection of the light-emitting chip; the device pad is provided on the lower surface to provide an external interface for the device. 8. The LED packaged device with integrated light drive according to claim 7, wherein the drive output port is a constant current output port, and the external interface includes a gray-scale data interface, a gray-scale clock interface, a PWM clock interface, data latch signal interface, gray scale data loop output interface, power interface and ground interface. 9 . The LED packaged device with integrated lamp and driver according to claim 1 , wherein the LED packaged device is a chip-type surface mount device. 10. The LED package device with integrated lamp and driver according to any one of claims 1 to 9, wherein the signal port of the driver chip is connected to the corresponding port contact of the package substrate through a front-mount process or a flip-chip process.